NXP PRTR 5V0U2X NXP Datasheet

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

Rev. 02 — 14 January 2008 Product data sheet

1. Product proﬁle

1.1 General description

Ultra low capacitance rail-to-rail ElectroStatic Discharge (ESD) protection diode in a small SOT143B Surface-Mounted Device (SMD) plastic package designed to protect two Hi-Speed data lines or high-frequency signal lines from the damage caused by ESD and other transients.

PRTR5V0U2X incorporates two pairs of ultra low capacitance rail-to-rail diodes as well as an additional ESD protection diode to ensure signal line protection even if no supply voltage is available.

1.2 Features

n ESD protection of two Hi-Speed data lines or high-frequency signal lines n Ultra low input/output to ground capacitance: C n ESD protection up to 8 kV n IEC 61000-4-2, level 4 (ESD) n Very low clamping voltage due to an integrated additional ESD protection diode n Very low reverse current n Small SMD plastic package

(I/O-GND)

=1pF

1.3 Applications

n USB 2.0 ports n Digital Video Interface (DVI) / High Deﬁnition Multimedia Interface (HDMI) interfaces n Mobile and cordless phones n Personal Digital Assistants (PDA) n Digital cameras n Wide Area Network (WAN) / Local Area Network (LAN) systems n PCs, notebooks, printers and other PC peripherals

NXP Semiconductors

1.4 Quick reference data

Table 1. Quick reference data

=25°C unless otherwise speciﬁed.

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

RWM

(I/O-GND)

sup

[1] Measured from pin 2 and 3 to ground. [2] Measured from pin 4 to ground.

2. Pinning information

Table 2. Pinning

Pin Symbol Description Simpliﬁed outline Graphic symbol

1 GND ground 2 I/O 1 input/output 1 3 I/O 2 input/output 2 4V

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

reverse standoff voltage - - 5.5 V input/output to ground

capacitance supply pin to ground

capacitance

supply voltage

f = 1 MHz; V

(I/O-GND)

f = 1 MHz; V

=0V

[1]

- 1 1.5 pF

[2]

-16-pF

3. Ordering information

Table 3. Ordering information

Type number Package

PRTR5V0U2X - plastic surface-mounted package; 4 leads SOT143B

4. Marking

Table 4. Marking codes

Type number Marking code

PRTR5V0U2X *R1

[1] * = -: made in Hong Kong

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

006aaa482

Name Description Version

[1]

Product data sheet Rev. 02 — 14 January 2008 2 of 11

NXP Semiconductors

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per device

amb

stg

Table 6. ESD standards compliance

Standard Conditions

Per diode

IEC 61000-4-2; level 4 (ESD) > 8 kV (contact)

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

ambient temperature −40 +85 °C storage temperature −55 +125 °C

001aaa631

100 %

90 %

10 %

tr = 0.7 ns to 1 ns

30 ns

60 ns

Fig 1. ESD pulse waveform according to IEC 61000-4-2

Product data sheet Rev. 02 — 14 January 2008 3 of 11

NXP Semiconductors

6. Characteristics

Table 7. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

RWM

(I/O-GND)

(I/O-I/O)

sup

[1] Measured from pin 2, 3 and 4 to ground. [2] Measured from pin 4 to ground. [3] Measured from pin 2 and 3 to ground. [4] Measured from pin 2 to pin 3.

Ultra low capacitance double rail-to-rail ESD protection diode

=25°C unless otherwise speciﬁed.

reverse standoff voltage - - 5.5 V reverse current VR=3V breakdown voltage input/output to ground

capacitance input/output to input/output

capacitance supply pin to ground

capacitance forward voltage - 0.7 - V

f = 1 MHz; V

(I/O-GND)

f = 1 MHz; V

(I/O-I/O)

=0V

f = 1 MHz; V

=0V

PRTR5V0U2X

[1]

- < 1 100 nA

[2]

6- 9V

[3]

- 1 1.5 pF

[4]

- 0.6 - pF

[2]

-16-pF

006aaa483

(I/O-GND)

(V)

(I/O-GND)

(pF)

2.0

1.6

1.2

0.8

0.4

054231

f = 1 MHz; T

=25°C f = 1 MHz; T

amb

Fig 2. Input/output to ground capacitance as a

function of input/output to ground voltage; typical values

006aaa484

(I/O-I/O)

(V)

(I/O-I/O)

(pF)

1.0

0.8

0.6

0.4

0.2

054231

amb

=25°C

Fig 3. Input/output to input/output capacitance as a

function of input/output to input/output voltage; typical values

Product data sheet Rev. 02 — 14 January 2008 4 of 11

NXP Semiconductors

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

ESD TESTER

IEC 61000-4-2 network

= 150 pF; RZ = 330 Ω

GND

unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network)

450 Ω

DUT

Device

Under

Test

vertical scale = 200 V/div horizontal scale = 50 ns/div

RG 223/U 50 Ω coax

GND

clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network)

10×

ATTENUATOR

4 GHz DIGITAL

OSCILLOSCOPE

50 Ω

vertical scale = 10 V/div horizontal scale = 50 ns/div

GND

vertical scale = 200 V/div horizontal scale = 50 ns/div

unclamped −1 kV ESD voltage waveform (IEC 61000-4-2 network)

Fig 4. ESD clamping test setup and waveforms

GND

clamped −1 kV ESD voltage waveform (IEC 61000-4-2 network)

vertical scale = 10 V/div horizontal scale = 50 ns/div

006aab112

Product data sheet Rev. 02 — 14 January 2008 5 of 11

NXP Semiconductors

7. Application information

Handling data rates up to 480 Mbit/s, USB 2.0 interfaces require ESD protection devices with an extremely low line capacitance in order to avoid signal distortion.

With a capacitance of only 1 pF, the PRTR5V0U2X offers IEC 61000-4-2, level 4 compliant ESD protection.

The PRTR5V0U2X integrates two pairs of ultra low capacitance rail-to-rail ESD protection diodes and an additional ESD protection diode.

The additional ESD protection diode connected between ground and VCC prevents charging of the supply.

To achieve the maximum ESD protection level, no additional external capacitors are required.

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

USB controller

common mode

choke

D+

D−

Fig 5. Application diagram: USB 2.0

BUS

protected IC/device

D+

D−

GND

006aaa485

BUS

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended:

1. Place the PRTR5V0U2X as close to the input terminal or connector as possible.

2. The path length between the PRTR5V0U2X and the protected line should be minimized.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.

Product data sheet Rev. 02 — 14 January 2008 6 of 11

NXP Semiconductors

8. Package outline

Fig 6. Package outline SOT143B

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

3.0

2.5

2.1

1.4

1.2

0.88

0.78

2.8

1.9

1.7

0.45

0.15

0.48

0.38

1.1

0.9

0.15

0.09

04-11-16Dimensions in mm

9. Packing information

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

PRTR5V0U2X SOT143B 4 mm pitch, 8 mm tape and reel -215 -235

[1] For further information and the availability of packing methods, seeSection 13.

[1]

3000 10000

Product data sheet Rev. 02 — 14 January 2008 7 of 11

NXP Semiconductors

10. Soldering

Fig 7. Reﬂow soldering footprint SOT143B

0.60 (4x)

2.70

Dimensions in mm

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

3.25

0.60 (3x)

0.50 (3x) solder lands

solder resist

3.00

1.30

0.90

1.00

2.50

msa441

occupied area

solder paste

4.45

1.20 (3×)

1.00

3.40

Fig 8. Wave soldering footprint SOT143B

4.60

4.00

1.15

solder lands solder resist occupied area

Dimensions in mm

preferred transport direction during soldering

msa422

Product data sheet Rev. 02 — 14 January 2008 8 of 11

NXP Semiconductors

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

11. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PRTR5V0U2X_2 20080114 Product data sheet - PRTR5V0U2X_1 Modiﬁcations:

PRTR5V0U2X_1 20050922 Product data sheet - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Table 1: parameter for C

(I/O-GND)

• Table 1 “Quick reference data”: maximum value for C

• Table 7: parameter for C

(I/O-GND)

• Table 7 “Characteristics”: maximum value for C

• Table 7: parameter for C

(I/O-I/O) sup

redeﬁned to input/output to ground capacitance

(I/O-GND)

redeﬁned to input/output to ground capacitance

(I/O-GND)

redeﬁned to input/output to input/output capacitance

redeﬁned to supply pin to ground capacitance

added

• Section 10 “Soldering”: added

• Section 12 “Legal information”: updated

Product data sheet Rev. 02 — 14 January 2008 9 of 11

NXP Semiconductors

12. Legal information

12.1 Data sheet status

PRTR5V0U2X

Ultra low capacitance double rail-to-rail ESD protection diode

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may havechanged since this document waspublished and may differ in case of multiple devices. The latestproduct status

information is available on the Internet at URL

[1][2]

Product status

12.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein andshallhave no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same producttypenumber(s) and title. A short data sheet is intended for quick referenceonly and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However,NXP Semiconductors does not give any representations or warranties, expressedor implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.nxp.com.

Deﬁnition

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at

http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.

12.4 Trademarks

Notice: All referencedbrands, product names, service names andtrademarks are the property of their respective owners.

13. Contact information

For additional information, please visit: http://www.nxp.com For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

Product data sheet Rev. 02 — 14 January 2008 10 of 11

NXP Semiconductors

Ultra low capacitance double rail-to-rail ESD protection diode

14. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Application information. . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Packing information. . . . . . . . . . . . . . . . . . . . . . 7

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13 Contact information. . . . . . . . . . . . . . . . . . . . . 10

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

PRTR5V0U2X

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 January 2008

Document identifier: PRTR5V0U2X_2

NXP PRTR 5V0U2X NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Characteristics

7. Application information

8. Package outline

9. Packing information

10. Soldering

11. Revision history

12. Legal information

12.1 Data sheet status

12.3 Disclaimers

12.4 Trademarks

13. Contact information

14. Contents