NXP PRTR 5V0U2X NXP Datasheet

PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
Rev. 02 — 14 January 2008 Product data sheet
1. Product profile

1.1 General description

Ultra low capacitance rail-to-rail ElectroStatic Discharge (ESD) protection diode in a small SOT143B Surface-Mounted Device (SMD) plastic package designed to protect two Hi-Speed data lines or high-frequency signal lines from the damage caused by ESD and other transients.
PRTR5V0U2X incorporates two pairs of ultra low capacitance rail-to-rail diodes as well as an additional ESD protection diode to ensure signal line protection even if no supply voltage is available.

1.2 Features

n ESD protection of two Hi-Speed data lines or high-frequency signal lines n Ultra low input/output to ground capacitance: C n ESD protection up to 8 kV n IEC 61000-4-2, level 4 (ESD) n Very low clamping voltage due to an integrated additional ESD protection diode n Very low reverse current n Small SMD plastic package
(I/O-GND)
=1pF

1.3 Applications

n USB 2.0 ports n Digital Video Interface (DVI) / High Definition Multimedia Interface (HDMI) interfaces n Mobile and cordless phones n Personal Digital Assistants (PDA) n Digital cameras n Wide Area Network (WAN) / Local Area Network (LAN) systems n PCs, notebooks, printers and other PC peripherals
NXP Semiconductors

1.4 Quick reference data

Table 1. Quick reference data
T
=25°C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
RWM
C
(I/O-GND)
C
sup
[1] Measured from pin 2 and 3 to ground. [2] Measured from pin 4 to ground.

2. Pinning information

Table 2. Pinning
Pin Symbol Description Simplified outline Graphic symbol
1 GND ground 2 I/O 1 input/output 1 3 I/O 2 input/output 2 4V
CC
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
reverse standoff voltage - - 5.5 V input/output to ground
capacitance supply pin to ground
capacitance
supply voltage
f = 1 MHz; V
(I/O-GND)
f = 1 MHz; V
=0V
CC
=0V
[1]
- 1 1.5 pF
[2]
-16-pF
34
1
21
4

3. Ordering information

Table 3. Ordering information
Type number Package
PRTR5V0U2X - plastic surface-mounted package; 4 leads SOT143B

4. Marking

Table 4. Marking codes
Type number Marking code
PRTR5V0U2X *R1
[1] * = -: made in Hong Kong
* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
32
006aaa482
Name Description Version
[1]
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 2 of 11
NXP Semiconductors

5. Limiting values

Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per device
T
amb
T
stg
Table 6. ESD standards compliance
Standard Conditions
Per diode
IEC 61000-4-2; level 4 (ESD) > 8 kV (contact)
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
ambient temperature 40 +85 °C storage temperature 55 +125 °C
001aaa631
I
PP
100 %
90 %
10 %
tr = 0.7 ns to 1 ns
30 ns
60 ns
t
Fig 1. ESD pulse waveform according to IEC 61000-4-2
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 3 of 11
NXP Semiconductors

6. Characteristics

Table 7. Characteristics
T
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
RWM
I
R
V
BR
C
(I/O-GND)
C
(I/O-I/O)
C
sup
V
F
[1] Measured from pin 2, 3 and 4 to ground. [2] Measured from pin 4 to ground. [3] Measured from pin 2 and 3 to ground. [4] Measured from pin 2 to pin 3.
Ultra low capacitance double rail-to-rail ESD protection diode
=25°C unless otherwise specified.
reverse standoff voltage - - 5.5 V reverse current VR=3V breakdown voltage input/output to ground
capacitance input/output to input/output
capacitance supply pin to ground
capacitance forward voltage - 0.7 - V
f = 1 MHz; V
(I/O-GND)
f = 1 MHz; V
(I/O-I/O)
=0V
f = 1 MHz; V
=0V
CC
=0V
PRTR5V0U2X
[1]
- < 1 100 nA
[2]
6- 9V
[3]
- 1 1.5 pF
[4]
- 0.6 - pF
[2]
-16-pF
006aaa483
V
(I/O-GND)
(V)
C
(I/O-GND)
(pF)
2.0
1.6
1.2
0.8
0.4
0
054231
f = 1 MHz; T
=25°C f = 1 MHz; T
amb
Fig 2. Input/output to ground capacitance as a
function of input/output to ground voltage; typical values
006aaa484
V
(I/O-I/O)
(V)
C
(I/O-I/O)
(pF)
1.0
0.8
0.6
0.4
0.2
0
054231
amb
=25°C
Fig 3. Input/output to input/output capacitance as a
function of input/output to input/output voltage; typical values
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 4 of 11
NXP Semiconductors
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
ESD TESTER
R
Z
C
Z
IEC 61000-4-2 network
= 150 pF; RZ = 330
C
Z
GND
unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network)
450
DUT
Device
Under
Test
vertical scale = 200 V/div horizontal scale = 50 ns/div
RG 223/U 50 coax
GND
clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network)
10×
ATTENUATOR
4 GHz DIGITAL
OSCILLOSCOPE
50
vertical scale = 10 V/div horizontal scale = 50 ns/div
GND
vertical scale = 200 V/div horizontal scale = 50 ns/div
unclamped 1 kV ESD voltage waveform (IEC 61000-4-2 network)
Fig 4. ESD clamping test setup and waveforms
GND
clamped 1 kV ESD voltage waveform (IEC 61000-4-2 network)
vertical scale = 10 V/div horizontal scale = 50 ns/div
006aab112
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 5 of 11
NXP Semiconductors

7. Application information

Handling data rates up to 480 Mbit/s, USB 2.0 interfaces require ESD protection devices with an extremely low line capacitance in order to avoid signal distortion.
With a capacitance of only 1 pF, the PRTR5V0U2X offers IEC 61000-4-2, level 4 compliant ESD protection.
The PRTR5V0U2X integrates two pairs of ultra low capacitance rail-to-rail ESD protection diodes and an additional ESD protection diode.
The additional ESD protection diode connected between ground and VCC prevents charging of the supply.
To achieve the maximum ESD protection level, no additional external capacitors are required.
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
USB controller
common mode
choke
D+
D
Fig 5. Application diagram: USB 2.0
V
BUS
protected IC/device
D+
D
GND
006aaa485
V
BUS
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended:
1. Place the PRTR5V0U2X as close to the input terminal or connector as possible.
2. The path length between the PRTR5V0U2X and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 6 of 11
NXP Semiconductors

8. Package outline

Fig 6. Package outline SOT143B
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
3.0
2.5
2.1
1.4
1.2
0.88
0.78
2.8
1.9
1.7
34
0.45
0.15
21
0.48
0.38
1.1
0.9
0.15
0.09
04-11-16Dimensions in mm

9. Packing information

Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number Package Description Packing quantity
PRTR5V0U2X SOT143B 4 mm pitch, 8 mm tape and reel -215 -235
[1] For further information and the availability of packing methods, seeSection 13.
[1]
3000 10000
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 7 of 11
NXP Semiconductors

10. Soldering

Fig 7. Reflow soldering footprint SOT143B
0.60 (4x)
2.70
Dimensions in mm
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
3.25
0.60 (3x)
0.50 (3x) solder lands
solder resist
43
3.00
1.30
21
0.90
1.00
2.50
msa441
occupied area
solder paste
4.45
1.20 (3×)
34
12
1.00
3.40
Fig 8. Wave soldering footprint SOT143B
4.60
4.00
1.15
solder lands solder resist occupied area
Dimensions in mm
preferred transport direction during soldering
msa422
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 8 of 11
NXP Semiconductors
PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode

11. Revision history

Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PRTR5V0U2X_2 20080114 Product data sheet - PRTR5V0U2X_1 Modifications:
PRTR5V0U2X_1 20050922 Product data sheet - -
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 1: parameter for C
(I/O-GND)
Table 1 “Quick reference data”: maximum value for C
Table 7: parameter for C
(I/O-GND)
Table 7 “Characteristics”: maximum value for C
Table 7: parameter for C
Table 7: parameter for C
(I/O-I/O) sup
redefined to input/output to ground capacitance
(I/O-GND)
redefined to input/output to ground capacitance
(I/O-GND)
redefined to input/output to input/output capacitance
redefined to supply pin to ground capacitance
added
added
Section 10 “Soldering”: added
Section 12 “Legal information”: updated
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 9 of 11
NXP Semiconductors

12. Legal information

12.1 Data sheet status

PRTR5V0U2X
Ultra low capacitance double rail-to-rail ESD protection diode
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may havechanged since this document waspublished and may differ in case of multiple devices. The latestproduct status
information is available on the Internet at URL
[1][2]
Product status
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein andshallhave no liability for the consequencesof use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same producttypenumber(s) and title. A short data sheet is intended for quick referenceonly and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and
reliable. However,NXP Semiconductors does not give any representations or warranties, expressedor implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
[3]
http://www.nxp.com.
Definition
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.

12.4 Trademarks

Notice: All referencedbrands, product names, service names andtrademarks are the property of their respective owners.

13. Contact information

For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PRTR5V0U2X_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 14 January 2008 10 of 11
NXP Semiconductors
Ultra low capacitance double rail-to-rail ESD protection diode

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 7
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Contact information. . . . . . . . . . . . . . . . . . . . . 10
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PRTR5V0U2X
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 January 2008
Document identifier: PRTR5V0U2X_2
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