The PN533 hardware implements a demodulator and decoder for signals from
ISO/IEC 14443A compatible cards and transponders. The PN533 hardware handles the
complete ISO/IEC 14443A framing and error detection and upper layers of this protocol
(i.e. ISO/IEC 14443-4) are implemented in firmware.
The PN533 supports all MIFARE products (e.g. MIFARE crypto method). It supports
contactless communication using higher transfer speeds up to 848 kbit/s in both
directions.
The PN533 hardware supports layers 2 and 3 of the ISO/IEC 14443B Reader/Writer
communication scheme, except anticollision. Anticollision is implemented in firmware as
well as upper layers (i.e. ISO/IEC 14443-4).
The PN533 can demodulate and decode FeliCa coded signals. The PN533 handles the
FeliCa framing and error detection. It supports contactless communication using FeliCa
Higher transfer speeds up to 424 kbit/s in both directions.
Compliant to ECMA 340 and ISO/IEC 18092 NFCIP-1 Passive and Active co mmunication
modes, the PN5331B3HN/C270 offers the possibility to communicate to another NFCIP-1
compliant device, at transfer speeds up to 424 kbit/s. The PN533 handles the complete
NFCIP-1 framing and error detection.
1.2Interfaces
The PN533 supports USB 2.0 full speed interface (bus powered or host powered mode).
PN533 also has a master I
2
C interface enabling the drive of following peripherals:
• An external EEPROM
• A TDA8029 smart card reader
NXP Semiconductors
1.3Standards compliancy
PN533 offers commands in order for application s to be compliant in reader mode with
“Paypass-ISO/IEC 14443 Implementation v1.1”.
PN533 supports RF protocols ISO/IEC 14443A and B such as compliancy with Smar t eID
standard can be achieved at application level.
A dedicated command is implemented in PN533 firmware to support NFC secure
applications in accordance with “NFC sec Security layer for NFC” specification in order to
enable USB wireless or BT enabler applications in a host baseband.
2. Features and benefits
80C51 microcontroller core with 45056 bytes ROM and 1224 bytes RAM
Highly integrated demodulator and decoder
Buffered output drivers to connect an antenna with minimum number of external
components
Integrated RF level detector
Integrated data mode detector
Supports ISO/IEC 14443A Reader/Writer mode up to 848 kbit/s
Supports ISO/IEC 14443B Reader/Writer mode up to 848 kbit/s
Su pp or ts MIFARE encryption in Reader/Writer mode and high er tran sf er spee d
communication at 212 kbit/s, 424 kbit/s and 848kbit/s
Supports contactless communication according to the FeliCa protocol at 212 kbit/s and
424 kbit/s
Typical operating distance in Reader/Writer mode for communication to
ISO/IEC 14443A/MIFARE, ISO/IEC 14443B or FeliCa cards up to 50 mm depending
on antenna size and tuning
Su pp or t NF CIP- 1 mo d e up to 424 kbit /s
Typical operating distance in NFCIP-1 mode up to 5 0 mm dep ending on ante nna size ,
tuning and power supply
Su pp or te d USB 2. 0 full sp ee d int er fa ce
Restricted I
card reader
Lo w- po we r m od es
Hard-Power-Down mode
Soft-Power-Down mode
27.12 MHz Crystal oscillator
On-Chip PLL to generate internally 96 MHz for the USB interface
Power modes
USB bus power mode
2.5 V to 3.6 V power supply operating range in non-USB bus power mode
Dedicated IO ports for external device control
PN533
Near Field Communication (NFC) controlle r
2
C master interface to control an external I2C EEPROM or TDA8029 smart
analog supply voltage0.5+4V
digital supply voltage0.5+4V
TVDD supply voltage0.5+4V
PVDD supply voltage0.5+4V
SVDD supply voltage0.5+4V
bus supply voltage0.5+5.5V
total power dissipation-500mW
SVDD supply currentmaximum current in
CDMCharge Device Model
CRCCyclic Redundancy Check
EEPROMElectrically Erasable Programmable Read-Only Memory
HBMHuman Body Model
HPDHard Power Down
MMMachine Model
NFCNear Field Communication
SPDSoft Power-Down Mode
PN533_SDS v.3.320120716Product short data sheet-PN533_SDS v.3.2
Modifications:Section 9.4 “
PN533_SDS v.3.220120202Product short data sheet-PN5331B3HN_ SDS_N_1
Modifications:
PN5331B3HN_SDS_N_1 20081231Product short data sheet
Objective [short] data sheetDevelopmentThis document contains data from the objective specification for product development.
Preliminary [short] data sheet QualificationThis document contains data from the preliminary specification.
Product [short] data sheetProductionThis document contains the product specificatio n.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this docu ment may have change d since this d ocument was p ublished and may dif fe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
[1][2]
Product status
[3]
Definition
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to co nt ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the cust omer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default ,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third part y
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
, unless otherwise
158233 7 of 9
NXP Semiconductors
PN533
Near Field Communication (NFC) controlle r
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed produ ct claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-E nglish (translated) version of a document is for
reference only. The Engl ish version shall prevail in case of any discrepancy
between the translated and English versions.
10. Contact information
9.4 Licenses
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
This NXP Semiconductors IC is ISO/IEC 14443 T ype B
software enabled and is licensed under Innovatron’s
Contactless Card patents license for ISO/IEC 14443 B.
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481
does not convey an implied license under any patent right infringed by
implementation of any of those standards.
9.5 Trademarks
Notice: All referenced brands, prod uct names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
2
I
C-bus — logo is a trademark of NXP B.V.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.