NXP LPC2131, LPC2132, LPC2134, LPC2136, LPC2138 User Manual

UM10120
LPC2131/2/4/6/8 User manual
Rev. 02 — 25 July 2006 User manual LPC213x
Document information
Info Content Keywords LPC2131, LPC2132, LPC2134, LPC2136, LPC2138, LPC2131/01,
LPC2132/01, LPC2134/01, LPC2136/01, LPC2138/01, LPC2000, LPC213x, LPC213x/01, ARM, ARM7, embedded, 32-bit, microcontroller
Abstract LPC213x and LPC213x/01 User manual
Philips Semiconductors
UM10120
LPC213x and LPC213x/01 UM
Revision history
Rev Date Description
02 20060725 Updated edition of the User Manual covering both LPC213x and LPC213x/01 devices. For
detailed list of enhancements introduced by LPC213x/01 see Sectio n 1–2 “
introduced with LPC213x/01 devices” on page 3
Other changes applied to Rev 01:
Enhancements
ECC information in Section 20–6 “Flash content protection mechanism” corrected
The SSEL signal description corrected for CPHA = 0 and CPHA = 1 (Section 12–2.2
“SPI data transfers”)
Bit SPIE description corrected in Section 12–4.1 “SPI Control Register (S0SPCR -
0xE002 0000)”
Details on V
01 20050624 Initial version
setup added in Section 18–5 “RTC usage notes”
BAT
Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, please send an email to: sales.addresses@www.semiconductors.philips.com
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1. Introduction

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Chapter 1: Introductory information

Rev. 02 — 25 July 2006 User manual LPC213x
The LPC213x and LPC213x/01 microcontrollers are based on a 16/32 bit ARM7TDMI-S CPU with real-time emulation and embedded trace support that combines the microcontroller with embedded high speed Flash memory r anging from 32 kB to 512 kB. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb Mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options of 8/16/32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit 8 channel ADC(s), 10-bit DAC, PWM channels and 47 fast GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.
Important: The term “LPC213x“ in the following text will be used both for devices with and without /01 suffix. Only when needed “LPC213x/01” will be used to identify the latest ones: LPC2131/01, LPC2132/01, LPC2134/01, LPC2136/01, and/or LPC2138/01.

2. Enhancements introduced with LPC213x/01 devices

Fast GPIO ports enable pin toggling up to 3.5x faster than the original LPC213x. Also,
Enhanced parallel ports allow for a port pin to be read at any time regardless of the function selected on it. For details see GPIO chapter on page 78.
Dedicated result registers for AD converter(s) reduce interrupt overhead. For details
see ADC chapter on page 211.
UART0/1 include Fractional Baudrate Generator, auto-bauding capabilities and
handshake control fully implemented in hardware. For more details see UART0 chapter on page 92 and UART1 chapter on page 108.
Enhanced BOD control enables further reduction of power consumption. For det ails
see Table 4–30 “Power Control register (PCON - address 0xE01F C0C0) bit
description” on page 41

3. Features

16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package
8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip Flash program
memory. 128 bit wide interface/accelerator enables high speed 60 MHz operation.
In-System/In-Application Programming (ISP/IAP) via on-chip boot-loader software.
Single Flash sector or full chip erase in 400 ms and 256 bytes programming in 1 ms.
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EmbeddedICE and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high speed tracing of instruction execution.
One (LPC2131/2) or two (LPC2134/6/8) 8 channel 10-bit A/D converters provide a
total of up to 16 analog inputs, with conversion times as low as 2.44 µs per channel.
Single 10-bit D/A converter provides variable analog output. (LPC2132/4/6/8 only).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-time clock with independent power and dedicated 32 kHz clock input.
Multiple serial interfaces including two UARTs (16C550), two Fast I
and SSP with buffering and variable data length capabilities.
Vectored interrupt controller with configurable priorities and vector addresses.
Up to 47 of 5 V tolerant general purpose I/O pins in a tiny LQFP64 package.
Up to nine edge or level sensitive external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip Phase-Locked
Loop (PLL) with settling time of 100 µs.
On-chip integrated oscillator operates with external crystal from 1 MHz to 25 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
Processor wake-up from Power-down mode via external interrupt or Real-time Clock.
Single power supply chip with Power-On Reset (POR) and Brown-Out Detection
(BOD) circuits: – CPU operating voltage range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O
pads
UM10120
Chapter 1: Introductory information
2
C (400 kbit/s), SPI

4. Applications

Industrial control
Medical systems
General purpose applications
Communication gateway
Embedded soft modem
Access control
Point-of-sale
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5. Device information

UM10120
Chapter 1: Introductory information
Table 1. LPC213x and LPC213x/01 device information
Device Pins SRAM FLASH Number of
LPC2131 64 8 kB 32 kB 8 LPC2131/01 64 8 kB 32 kB 8 + + + LPC2132 64 16 kB 64 kB 8 1 LPC2132/01 64 16 kB 64 kB 8 1 + + + LPC2134 64 16 kB 128 kB 16 1 + LPC2134/01 64 16 kB 128 kB 16 1 + + + + + LPC2136 64 32 kB 256 kB 16 1 + LPC2136/01 64 32 kB 256 kB 16 1 + + + + + LPC2138 64 32 kB 512 kB 16 1 + LPC2138/01 64 32 kB 512 kB 16 1 + + + + +
10-bit ADC channels
Number of 10-bit DAC channels
UART1 with modem interface
UARTs with BRG and autobaud
UART1 with hw auto CTS/RTS
Fast GPIOs
ADC with individual result registers

6. Architectural overview

The LPC213x consists of an ARM7TDMI-S CPU with emulation support, the ARM7 Lo ca l Bus for interface to on-chip memory controllers, the AMBA Advanced High-performance Bus (AHB) for interface to the interrupt controller, and the VLSI Peripheral Bus (APB, a compatible superset of ARM’s AMBA Advanced Peripher al Bus) for connection to on-chip peripheral functions. The LPC213x configures the ARM7TDMI-S processor in little-endian byte order.
AHB peripherals are allocated a 2 megabyte range of addresses at the very top of the 4 gigabyte ARM memory space. Each AHB peripheral is allocate d a 16 kB address space within the AHB address space. LPC213x peripheral functions (other than the interrupt controller) are connected to the APB bus. The AHB to APB bridge interfaces the APB bus to the AHB bus. APB peripherals are also allocated a 2 megabyte range of addresses, beginning at the 3.5 gigabyte address point. Each APB peripheral is allocated a 16 kB address space within the APB address space.
The connection of on-chip peripherals to device pins is controlled by a Pin Connect Block (see chapter "Pin Connect Block" on page 72). This must be configured by softwa re to fit specific application requirements for the use of periph er al functions and pins.

7. ARM7TDMI-S processor

The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core.
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Pipeline techniques are employed so that all part s of the pro cessing and memory systems can operate continuously. T ypically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as THUMB, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue.
The key idea behind THUMB is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets:
The standard 32-bit ARM instruction set.
A 16-bit THUMB instruction set.
The THUMB set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because THUMB code operates on the same 32-bit register set as ARM code.
THUMB code is able to provide up to 65% of the code size of ARM, and 160% of the performance of an equivalent ARM processor connected to a 16-bit memory system.
UM10120
Chapter 1: Introductory information
The ARM7TDMI-S processor is described in detail in the ARM7TDMI-S Datasheet that can be found on official ARM website.

8. On-chip Flash memory system

The LPC213x incorporates a 32, 64, 128, 256 or 512 kB Flash memory system. This memory may be used for both code and dat a stor age. Progra mming of the Fl ash memory may be accomplished in several ways: over the serial builtin JTAG interface, using In System Programming (ISP) and UART0, or by means of In Application Programming (IAP) capabilities. The application program, using the IAP functions, may also erase and/or program the Flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. When the LPC213x on-chip bootloader is used, 32/64/128/256/500 kB of Flash memory is available for user code and/or data storage.
The LPC213x Flash memory provides minimum of 100,000 erase/write cycles and 20 years of data-retention.

9. On-chip Static RAM (SRAM)

On-chip Static RAM (SRAM) may be used for code and/or data storage. The on-chip SRAM may be accessed as 8-bits, 16-bits, and 32-bits. The LPC213x provide 8/16/32 kB of static RAM.
The LPC213x SRAM is designed to be accessed as a byte-addressed memory. Word and halfword accesses to the memory ignore the alignment of the address and access the naturally-aligned value that is addressed (so a memory access ignores address bits 0 and 1 for word accesses, and ignores bit 0 for halfword accesses). Therefore valid reads and writes require data accessed as halfwords to originate from addresses with address line 0 being 0 (addresses ending with 0, 2, 4, 6, 8, A, C, and E in hexadecimal nottaion) and
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data accessed as words to originate from adresses with address lines 0 and 1 being 0 (addresses ending with 0, 4, 8, and C in hexadecimal notation). This rule applies to both off and on-chip memory usage.
The SRAM controller incorporates a write-back buffer in order to prevent CPU stalls during back-to-back writes. The write-back buffer always holds the last data sent by software to the SRAM. This data is only written to the SRAM when another write is requested by software (the data is only written to the SRAM when software does another write). If a chip reset occurs, actual SRAM contents will not reflect the most recent write request (i.e. after a "warm" chip reset, the SRAM does not reflect the last wr ite operation). Any software that checks SRAM contents after reset must take this into account. Two identical writes to a location guarantee that the data will be present after a Reset. Alternatively, a dummy write operation before entering idle or power-down mode will similarly guarantee that the last data written will be present in SRAM after a subsequent Reset.
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Chapter 1: Introductory information
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10. Block diagram

UM10120
Chapter 1: Introductory information
P0[31:0]
P1[31:16]
EINT[3:0]
8 × CAP
8 × MAT
AD0[7:0]
AD1[7:0]
AOUT
P0[31:0]
P1[31:16]
PWM[6:1]
TRST
(3)
TMS
(3)
TCK
(3)
TDI
(3)
TDO
(3)
trace
signals
XTAL1
XTAL2
RESET
LPC2131, LPC2131/01 LPC2132, LPC2132/01 LPC2134, LPC2134/01 LPC2136, LPC2136/01 LPC2138, LPC2138/01
FAST GENERAL
PURPOSE I/O
ARM7 local bus
INTERNAL
SRAM
CONTROLLER
8/16/32 kB
SRAM
TIMER 0/TIMER 1
A/D CONVERTERS
(1)
(2)
D/A CONVERTER
INTERNAL
FLASH
CONTROLLER
32/64/128/
256/512 kB
FLASH
EXTERNAL
INTERRUPTS
CAPTURE/ COMPARE
(1)
0 AND 1
GENERAL
PURPOSE I/O
PWM0
(2)
TEST/DEBUG
INTERFACE
ARM7TDMI-S
AHB BRIDGE
AHB TO APB
BRIDGE
PLL
system
EMULATION
clock
TRACE MODULE
(Advanced High-performance Bus)
APB (ARM
peripheral bus)
AMBA AHB
APB
DIVIDER
2
C SERIAL
I
INTERFACES 0 AND 1
SPI AND SSP
SERIAL INTERFACES
UART0/UART1
REAL TIME CLOCK
WATCHDOG
TIMER
SYSTEM
FUNCTIONS
VECTORED INTERRUPT
CONTROLLER
AHB
DECODER
SCL0,1
SDA0,1
SCK0,1 MOSI0,1 MISO0,1 SSEL0,1
TXD0,1 RXD0,1
DSR1 RTS1 DCD1
RTCX1
RTCX2 V
BAT
(1)
(1)
(1)
,CTS1
, DTR1
, RI1
(1)
(1)
(1)
SYSTEM
CONTROL
002aab067
(1) Not available on LPC2131 and LPC2131/01. (2) Not available on LPC2131, LPC2131/01, LPC2132, and LPC2132/01. (3) Pins shared with GPIO.
Fig 1. LPC213x block diagram.
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1. Memory maps

The LPC213x incorporates several distinct memory regions, shown in the following figures. Figure 2–2 program viewpoint following reset. The interrupt vector area supports address remapping, which is described later in this section.
UM10120

Chapter 2: Memory maps

Rev. 02 — 25 July 2006 User manual LPC213x
shows the overall map of the entire address space from the user
4.0 GB
3.75 GB
3.5 GB
3.0 GB
2.0 GB
1.0 GB
AHB PERIPHERALS
APB PERIPHERALS
RESERVED ADDRESS SPACE
BOOT BLOCK
(12 kB REMAPPED FROM ON-CHIP FLASH MEMORY)
RESERVED ADDRESS SPACE
32 kB ON-CHIP STATIC RAM
(LPC2136, LPC2136/01, LPC2138, LPC2138/01)
16 kB ON-CHIP STATIC RAM
(LPC2132, LPC2132/01, LPC2134, LPC2134/01)
8 kB ON-CHIP STATIC RAM
(LPC2131, LPC2131/01)
0xFFFF FFFF
0xF000 0000
0xE000 0000
0xC000 0000
0x8000 0000
0x7FFF D000
0x4000 8000 0x4000 7FFF
0x4000 4000 0x4000 3FFF
0x4000 2000 0x4000 1FFF
0x4000 0000
RESERVED ADDRESS SPACE
0x0008 0000 0x0007 FFFF
0x0004 0000 0x0003 FFFF
0x0002 0000 0x0001 FFFF
0x0001 0000 0x0000 FFFF
0x0000 8000 0x0000 7FFF
0x0000 0000
0.0 GB
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2138, LPC2138/01)
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2136, LPC2136/01)
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2134, LPC2134/01)
TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2132, LPC2132/01)
TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2131, LPC2131/01)
Fig 2. System memory map
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UM10120
Chapter 2: Memory maps
4.0 GB
4.0 GB - 2 MB
3.75 GB
0xFFFF FFFF
AHB PERIPHERALS
0xFFE0 0000 0xFFDF FFFF
RESERVED
0xF000 0000 0xEFFF FFFF
RESERVED
3.5 GB + 2 MB
APB PERIPHERALS
3.5 GB
AHB section is 128 x 16 kB blocks (totaling 2 MB). APB section is 128 x 16 kB blocks (totaling 2MB).
0xE020 0000 0xE01F FFFF
0xE000 0000
Fig 3. Peripheral memory map
Figure 2–3 through Figure 2–4 and Table 2–2 show different views of the peripheral
address space. Both the AHB and APB peripheral areas are 2 megabyte spaces which are divided up into 128 peripherals. Each peripheral space is 16 kilobytes in size. This allows simplifying the address decoding for each peripheral. All peripheral register
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addresses are word aligned (to 32-bit boundaries) regardless of their size. This eliminates the need for byte lane mapping hardware that would be required to allow byte (8-bit) or half-word (16-bit) accesses to occur at smaller boundaries. An implication of this is that word and half-word registers must be accessed all at once. For example, it is not p ossible to read or write the upper byte of a word register separately.
UM10120
Chapter 2: Memory maps
VECTORED INTERRUPT CONTROLLER
(AHB PERIPHERAL #126)
(AHB PERIPHERAL #125)
(AHB PERIPHERAL #124)
0xFFFF F000 (4G - 4K)
0xFFFF C000
0xFFFF 8000
0xFFFF 4000
0xFFFF 0000
0xFFE1 0000
(AHB PERIPHERAL #3)
0xFFE0 C000
(AHB PERIPHERAL #2)
0xFFE0 8000
(AHB PERIPHERAL #1)
0xFFE0 4000
(AHB PERIPHERAL #0)
0xFFE0 0000
Fig 4. AHB peripheral map
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Table 2. APB peripheries and base addresses
APB peripheral Base address Peripheral name
0 0xE000 0000 Watchdog timer 1 0xE000 4000 Timer 0 2 0xE000 8000 Timer 1 3 0xE000 C000 UART0 4 0xE001 0000 UART1 5 0xE001 4000 PWM 6 0xE001 8000 Not used 7 0xE001 C000 I 8 0xE002 0000 SPI0 9 0xE002 4000 RTC 10 0xE002 8000 GPIO 11 0xE002 C000 Pin connect block 12 0xE003 0000 Not usef 13 0xE003 4000 10 bit AD0 14-22 0xE003 8000 -
23 0xE005 C000 I 24 0xE006 0000 10 bit AD1 25 0xE006 4000 Not used 26 0xE006 8000 SSP 27 0xE006 C000 DAC 28 - 126 0xE007 0000 -
127 0xE01F C000 System control block
0xE005 8000
0xE01F 8000
2
C0
Not used
2
C1
Not used
UM10120
Chapter 2: Memory maps

2. LPC213x memory re-mapping and boot block

2.1 Memory map concepts and operating modes

The basic concept on the LPC213x is that each memory area has a "natural" location in the memory map. This is the address range for which code residing in that area is written. The bulk of each memory space remains permanently fixed in the same location, eliminating the need to have portions of the code designed to run in different address ranges.
Because of the location of the interrupt vectors on the ARM7 processor (at addresses 0x0000 0000 through 0x0000 001C, as shown in Table 2–3 Boot Block and SRAM spaces need to be re-mapped in order to allow alternative uses of interrupts in the different operating modes described in Table 2–4 interrupts is accomplished via the Memory Mapping Contro l feature (Section 4–7 “
mapping control” on page 32).
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below), a small portion of the
. Re-mapping of the
Memory
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Table 3. ARM exception vector locations
Address Exception
0x0000 0000 Reset 0x0000 0004 Undefined Instruction 0x0000 0008 Software Interrupt 0x0000 000C Prefetch Abort (instruction fetch memory fault) 0x0000 0010 Data Abort (data access memory fault) 0x0000 0014 Reserved
0x0000 0018 IRQ 0x0000 001C FIQ
Table 4. LPC213x memory mapping modes
Mode Activation Usage
Boot Loader mode
User Flash mode
User RAM mode
Hardware activation by any Reset
Software activation by Boot code
Software activation by User program
UM10120
Chapter 2: Memory maps
Note: Identified as reserved in ARM documentation, this location is used
by the Boot Loader as the Valid User Program key. This is descibed in detail in "Flash Memory System and Programming" chapter on page 237.
The Boot Loader always executes after any reset. The Boot Block interrupt vectors are mapped to the bottom of memory to allow handling exceptions and using interrupts during the Boot Loading process.
Activated by Boot Loader when a valid User Program Signature is recognized in memory and Boot Loader operation is not forced. Interrupt vectors are not re-mapped and are found in the bottom of the Flash memory.
Activated by a User Program as desired. Interrupt vectors are re-mapped to the bottom of the Static RAM.

2.2 Memory re-mapping

In order to allow for compatibility with future derivatives, the entire Boot Block is mapped to the top of the on-chip memory space. In this manner, the use of larger or smaller flash modules will not require changing the location of the Boot Block (which would require changing the Boot Loader code itself) or changing the mapping of the Boot Block interru pt vectors. Memory spaces other than the interrupt vectors remain in fixed locations.
Figure 2–5
The portion of memory that is re-mapped to allow interrupt processing in different modes includes the interrupt vector area (32 bytes) and an additional 32 bytes, for a total of 64 bytes. The re-mapped code locations overlay addresses 0x0000 0000 through 0x0000 003F. A typical user program in the Flash memory can place the entire FIQ handler at address 0x0000 001C without any need to consider memory boundaries. The vector contained in the SRAM, external memory, and Boot Block must contain branches to the actual interrupt handlers, or to other instructions that accomplish the branch to the interrupt handlers.
There are three reasons this configuration was chosen:
1. To give the FIQ handler in the Flash memory the advantage of not having to take a
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shows the on-chip memory mapping in the modes defined above.
memory boundary caused by the remapping into account.
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2. Minimize the ne ed to for the SRAM and Boot Block vectors to deal with arbitrary boundaries in the middle of code space.
3. To provide space to store constant s for jumping beyond the range of single word branch instructions.
Re-mapped memory areas, including the Boot Block and interrupt vectors, continue to appear in their original location in addition to the re-mapped address.
UM10120
Chapter 2: Memory maps
Details on re-mapping and examples can be found in Section 4–7 “
control” on page 32.
Memory mapping
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UM10120
Chapter 2: Memory maps
2.0 GB
2.0 GB - 12 kB
1.0 GB
(RE-MAPPED FROM ON-CHIP FLASH MEMORY)
12 kB BOOT BLOCK
BOOT BLOCK INTERRUPT VECTORS
RESERVED FOR ON-CHIP MEMORY
32 kB ON-CHIP SRAM
(SRAM INTERRUPT VECTORS)
0x8000 0000
0x7FFF FFFF
0x7FFF D000 0x7FFF CFFF
0x4000 8000 0x4000 7FFF
0x4000 0000 0x3FFF FFFF
RESERVED FOR ON-CHIP MEMORY
0x0008 0000
0.0 GB
12 kB BOOT BLOCK RE-MAPPED TO HIGHER ADDRESS RANGE
512 kB ON-CHIP NON-VOLATILE MEMORY
ACTIVE INTERRUPT VECTORS
(FROM FLASH, SRAM, BOOT ROM, OR EXT MEMORY)
0x0007 FFFF
0x0000 0000
Fig 5. Map of lower memory is showing re-mapped and re-mappable areas (LPC2138 and
LPC2138/01 with 512 kB Flash)
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3. Prefetch abort and data abort exceptions

The LPC213x generates the appropriate bus cycle abort exception if an access is attempted for an address that is in a reserved or unassigned address region. The regions are:
Areas of the memory map that are not implemented for a specific ARM derivative. Fo r
the LPC213x, this is: – Address space between On-Chip Non-Volatile Memory and On-Chip SRAM,
labelled "Reserved Address Space" in Figure 2–2 device this is memory address range from 0x0000 8000 to 0x3FFF FFFF, for 64 kB Flash device this is memory address range from 0x0001 0000 to 0x3FFF FFFF, for 128 kB Flash device this is memory address range from 0x0002 0000 to 0x3FFF FFFF, for 256 kB Flash device this is memory address range from 0x0004 0000 to 0x3FFF FFFF while for 512 kB Flash device this range is from 0x0008 0000 to 0x3FFF FFFF.
– Address space between On-Chip Static RAM and the Boot Block. Labelled
"Reserved Address Space" in Figure 2–2 address range from 0x4000 2000 to 0x7FFF CFFF, for 16 kB SRAM device this is memory address range from 0x4000 4000 to 0x7FFF CFFF, while for 32 kB SRAM device this range is from 0x4000 8000 to 0x7FFF CFFF.
– Address space between 0x8000 0000 and 0xDFFF FFFF, labelled "Reserved
Adress Space".
Reserved regions of the AHB and APB spaces. See Figure 2–3
Unassigned AHB peripheral spaces. See Figure 2–4.
Unassigned APB peripheral spaces. See Table 2–2.
UM10120
Chapter 2: Memory maps
and Figure 2–5. For 32 kB Flash
. For 8 kB SRAM device this is memory
.
For these areas, both attempted data acce ss and in struction fetch genera te an exception. In addition, a Prefetch Abort exception is generated for any instruction fetch that maps to an AHB or APB peripheral address.
Within the address space of an existing APB peripheral, a data abort exception is not generated in response to an access to an undefined address. Address decoding within each peripheral is limited to that needed to distinguish defined registers within the peripheral itself. For example, an access to address 0xE000 D000 (an undefined address within the UART0 space) may result in an access to the register defined at address 0xE000 C000. Details of such address aliasing within a peripheral space are not defined in the LPC213x documentation and are not a supported feature.
Note that the ARM core stores the Prefetch Abort flag along with the associated instruction (which will be meaningless) in the pipeline and processes the abort only if an attempt is made to execute the instruction fetched from the illegal address. This prevents accidental aborts that could be caused by prefetches that occur when code is executed very near a memory boundary.
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1. Introduction

2. Operation

UM10120

Chapter 3: Memory Acceleration Module (MAM)

Rev. 02 — 12 July 2006 User manual LPC213x
The MAM block in the LPC213x maximizes the performance of the ARM processor when it is running code in Flash memory but does so using a single Flash bank.
Simply put, the Memory Accelerator Module (MAM) attempts to have the next ARM instruction that will be needed in its latches in time to prevent CPU fetch stalls. The LPC213x uses one bank of Flash memory, compared to the two banks used on predecessor devices. It includes three 128-bit buffers called the Prefetch Buffer, the Branch Trail Buf fer and the data b uffer. When an Instruction Fetch is not satisfied by either the Prefetch or Branch Trail Buffer, nor has a prefetch been initiated for that line, the ARM is stalled while a fetch is initiated for the 128-bit line. If a prefetch has been initiated but not yet completed, the ARM is stalled for a shorter time. Unless aborted by a da ta access, a prefetch is initiated as soon as the Flash has completed the previous access. The prefetched line is latched by the Flash module, but the MAM does not capture the line in its prefetch buffer until the ARM core present s the address from which the prefetch has been made. If the core presents a different address from the one from which the prefetch has been made, the prefetched line is discarded.
The Prefetch and Branch Trail buffers each include four 32-bit ARM instructions or eight 16-bit Thumb instructions. During sequential code execution, typically the Prefetch Buf fe r contains the current instruction and the entire Flash line that contains it.
The MAM differentiates betwee n in str uction and data accesses. Code and data acce sse s use separate 128-bit buffers. 3 of every 4 sequential 32- bit code or data accesses "hit" in the buffer without requiring a Flash access (7 of 8 sequ ential 16-bit accesses, 15 of eve ry 16 sequential byte accesses). The fourth (eighth, 16th) sequential data access must access Flash, aborting any prefetch in progress. When a Flash data access is concluded, any prefetch that had been in progress is re-initiated.
Timing of Flash read operat ions is programmable and is described later in this section. In this manner , there is no code fetch penalty for sequential instruction execution when the
CPU clock period is greater than or equal to one fourth of the Flash access time. The average amount of time spent doing program branches is relatively small (less than 25%) and may be minimized in ARM (rather than Thumb) code through the use of the conditional execution feature present in all ARM instructions. This conditional execution may often be used to avoid small forward branches that would otherwise be necessary.
Branches and other program flow changes cause a break in the sequential flow of instruction fetches described above. The Branch Trail Buffer captures the line to which such a non-sequential break occurs. If the same branch is taken again, the next instruction is taken from the Branch Trail Buffer. When a branch outside the contents of the Prefetch and Branch T rail Buffer is taken, a st all of several clocks is needed to load the Branch Trail buffer. Subsequently, there will typically be no further instructionfetch delays until a new and different branch occurs.
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3. MAM blocks

The Memory Accelerator Module is divided into several functional blocks:
A Flash Address Latch and an incrementor function to form prefetch addresses
A 128-bit Prefetch Buffer and an associated Address latch and comparator
A 128-bit Branch Trail Buffer and an associated Address latch and comparator
A 128-bit Data Buffer and an associated Address latch and comparator
Control logic
Wait logic
UM10120
Chapter 3: MAM Module
Figure 3–6
paths. In the following descriptions, the term “fetch” applies to an explicit Flash read request from
the ARM. “Pre-fetch” is used to denote a Flash read of instructions beyond the current processor fetch address.
shows a simplified block diagram of the Memory Accelerator Module dat a

3.1 Flash memory bank

There is one bank of Flash memory with the LPC213x MAM. Flash programming operations are not controlled by the MAM, but are handled as a
separate function. A “boot block” sector contains Flash programming algorithms that may be called as part of the application program, and a loader that may be run to allow serial programming of the Flash memory.
MEMORY ADDRESS
FLASH MEMORY BANK
ARM LOCAL BUS
BUS
INTERFACE
BUFFERS
Fig 6. Simplified block diagram of the Memory Accelerator Module (MAM)

3.2 Instruction latches and data latches

Code and Data accesses are treated separately by the Memory Accelerator Module. There is a 128-bit Latch, a 15-bit Address
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Latch, and a 15-bit comparator associated with each buffer (prefetch, branch trail, and data). Each 128-bit latch holds 4 words (4 ARM instructions, or 8 Thumb instructions). Also associated with each buffer are 32 4:1 Multiplexers that select the requested word from the 128-bit line.
Each Data access that is not in the Data latch causes a Flash fetch of 4 words of data, which are captured in the Data latch. This speeds up sequential Data operations, but has little or no effect on random accesses.

3.3 Flash programming issues

Since the Flash memory does not allow accesses during programming and erase operations, it is necessary for the MAM to force the CPU to wait if a memory access to a Flash address is requested while the Flash module is busy. (This is accomplished by asserting the ARM7TDMI-S local bus signal CLKEN.) Under some conditions, this delay could result in a Watchdog time-out. The user will need to be aware of this possibility and take steps to insure that an unwanted Watchdog reset does not cause a system failure while programming or erasing the Flash memory.
In order to preclude the possibility of stale data being read from the Flash memory, the LPC213x MAM holding latches are automatically invalidated at the beginnin g of any Flash programming or erase operation. Any subsequent read from a Flash address will cause a new fetch to be initiated after the Flash operation has completed.
UM10120
Chapter 3: MAM Module

4. MAM operating modes

Three modes of operation are defined for the MAM, trading off performance for ease of predictability:
Mode 0: MAM off. All memory requests result in a Flash read operation (see note 2 below). There are no instruction prefetches.
Mode 1: MAM partially enabled. Sequential instruction accesses are fulfilled from the holding latches if the data is present. Instruction prefetch is enabled. Non-sequential instruction accesses initiate Flash read operations (see note 2 below). This means that all branches cause memory fetches. All data operations cause a Flash read because buffered data access timing is hard to predict and is very situation dependent.
Mode 2: MAM fully enabled. Any memory request (code or data) for a value that is contained in one of the corresponding holding latches is fulfilled from the latch. Instruction prefetch is enabled. Flash read operations are initiated for instruction prefetch and code or data values not available in the corresponding holding latches.
T able 5. MAM responses to program accesses of various types
Program Memory Request Type MAM Mode
Sequential access, data in latches Initiate Fetch
Sequential access, data not in latches Initiate Fetch Initiate Fetch Non-sequential access, data in latches Initiate Fetch
Non-sequential access, data not in latches Initiate Fetch Initiate Fetch
0 1 2
[2]
Use Latched
[1]
Data
[1]
[2]
Initiate Fetch
[1][2]
[1]
Use Latched
[1]
Data Initiate Fetch Use Latched
[1]
Data Initiate Fetch
[1]
[1]
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[1] Instruction prefetch is enabled in modes 1 and 2. [2] The MAM actually uses latched data if it is available, but mimics the timing of a Flash read operation. This
saves power while resulting in the same execution timing. The MAM can truly be turned off by setting the fetch timing value in MAMTIM to one clock.
T able 6. MAM responses to data and DMA accesses of various types
Data Memory Request T ype MAM Mode
Sequential access, data in latches Initiate Fetch
Sequential access, data not in latches Initiate Fetch Initiate Fetch Initiate Fetch Non-sequential access, data in latches Initiate Fetch
Non-sequential access, data not in latches Initiate Fetch Initiate Fetch Initiate Fetch
[1] The MAM actually uses latched data if it is available, but mimics the timing of a Flash read operation. This
saves power while resulting in the same execution timing. The MAM can truly be turned off by setting the fetch timing value in MAMTIM to one clock.
UM10120
Chapter 3: MAM Module
0 1 2
[1]
Initiate Fetch
[1]
Initiate Fetch
[1]
[1]
Use Latched Data
Use Latched Data

5. MAM configuration

After reset the MAM defaults to the disabled state. Software can turn memory access acceleration on or off at any time. This allows most of an application to be run at the highest possible performance, while certain functions can be run at a somewhat slower but more predictable rate if more precise timing is required.

6. Register description

All registers, regardless of size, are on word address boundaries. Details of the registers appear in the description of each function.
T able 7. Summary of MAM registers
Name Description Access Reset
MAMCR Memory Accelerator Module Control Register.
Determines the MAM functional mode, that is, to what extent the MAM performance enhancements are enabled. See Table 3–8.
MAMTIM Memory Accelerator Module Timing control.
Determines the number of clocks used for Flash memory fetches (1 to 7 processor clocks).
[1] Reset value reflects the data stored in used bits only. It does not include reserved bits content.
Address
[1]
value
R/W 0x0 0xE01F C000
R/W 0x07 0xE01F C004

7. MAM Control Register (MAMCR - 0xE01F C000)

Two configuration bits select the three MAM operating modes, as shown in Table 3–8. Following Reset, MAM functions are disabled. Changing the MAM operating mode causes the MAM to invalidate all of the holding latches, resulting in new reads of Flash information as required.
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T able 8. MAM Control Register (MAMCR - address 0xE01F C000) bit description
Bit Symbol Value Description Reset
1:0 MAM_mode
_control
7:2 - - Reserved, user software should not write ones to reserved
00 MAM functions disabled 0 01 MAM functions partially enabled 10 MAM functions fully en abled 11 Reserved. Not to be used in the application.
bits. The value read from a reserved bit is not defined.

8. MAM Timing register (MAMTIM - 0xE01F C004)

The MAM Timing register determines how many CCLK cycles are used to access the Flash memory. This allows tuning MAM timing to match the processor operating frequency. Flash access times from 1 clock to 7 clocks are po ssib le . Sing le cloc k Fla sh accesses would essentially remove the MAM from timing calculations. In this case the MAM mode may be selected to optimize power usage.
T able 9. MAM Timing register (MAMTIM - address 0xE01F C004) bit description
Bit Symbol Value Description Reset
2:0 MAM_fetch_
cycle_timing
7:3 - - Reserved, user software should not write ones to reserved
000 0 - Reserved. 07
001 1 - MAM fetch cycles are 1 processor clock (CCLK) in
duration 010 2 - MAM fetch cycles are 2 CCLKs in duration 011 3 - MAM fetch cycles are 3 CCLKs in duration 100 4 - MAM fetch cycles are 4 CCLKs in duration 101 5 - MAM fetch cycles are 5 CCLKs in duration 110 6 - MAM fetch cycles are 6 CCLKs in duration 111 7 - MAM fetch cycles are 7 CCLKs in duration Warning: These bits set the duration of MAM Flash fetch operations
as listed here. Improper setting of this value may result in incorrect operation of the device.
bits. The value read from a reserved bit is not defined.
UM10120
Chapter 3: MAM Module
value
NA
value
NA

9. MAM usage notes

When changing MAM timing, the MAM must first be turned off by writing a zero to MAMCR. A new value may then be written to MAMTIM. Finally, the MAM may be turned on again by writing a value (1 or 2) corresponding to the desired operating mode to MAMCR.
For system clock slower than 20 MHz, MAMTIM can be 001. For system clock between 20 MHz and 40 MHz, Flash access time is suggested to be 2 CCLKs, while in systems with system clock faster than 40 MHz, 3 CCLKs are proposed.
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UM10120

Chapter 4: System control block

Rev. 02 — 25 July 2006 User manual LPC213x

1. Summary of system control block functions

The System Control Block includes several system features and control registers for a number of functions that are not related to specific peripheral devices. These include:
Crystal Oscillator
External Interrupt Inputs
Miscellaneous System Controls and Status
Memory Mapping Control
PLL
Power Control
Reset
APB Divider
Wakeup Timer
Each type of function has its own register(s) if any are required and unneeded bits are defined as reserved in order to allow future expansion. Unrelated functions never share the same register addresses

2. Pin description

Table 4–10 shows pins that are associated with System Control block functions.
Table 10. Pin summary
Pin name Pin
XTAL1 Input Crystal Oscillator Input - Input to the oscillator and internal clock
XTAL2 Output Crystal Oscillator Output - Output from the oscillator amplifier EINT0 Input External Interrupt Input 0 - An active low/high leve l or
EINT1 Input External Interrupt Input 1 - See the EINT0 descri ption above.
Pin description
direction
generator circuits
falling/rising edge general purpose interrupt input. This pin may be used to wake up the processor from Idle or Power-down modes.
Pins P0.1 and P0.16 can be selected to perform EINT0 function.
Pins P0.3 and P0.14 can be selected to perform EINT1 function. Important: LOW level on pin P0.14 immediately after reset is
considered as an external hardware request to start the ISP command handler. More details on ISP and Serial Boot Loader can be found in "Flash Memory System and Programming" chapter on page 237.
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Table 10. Pin summary
Pin name Pin
EINT2 Input External Interrupt Input 2 - See the EINT0 descri ption above.
EINT3 Input External Interrupt Input 3 - See the EINT0 descri ption above.
RESET

3. Register description

All registers, regardless of size, are on word address boundaries. Details of the registers appear in the description of each function.
T able 11. Summary of system control registers
Name Description Access Reset
External Interrupts
EXTINT External Interrupt Flag Register R/W 0 0xE01F C140 INTWAKE External Interrupt Wakeup Register R/W 0 0xE01F C144 EXTMODE External Interrupt Flag register R/W 0 0xE01F C148 EXTPOLAR External Interrupt Wakeup Register R/W 0 0xE01F C14C
Memory Mapping Control
MEMMAP Memory Mapping Control R/W 0 0xE01F C040
Phase Locked Loop
PLLCON PLL Control Register R/W 0 0xE01F C080 PLLCFG PLL Configuration Register R/W 0 0xE01F C084 PLLSTAT PLL Status Register RO 0 0xE01F C088 PLLFEED PLL Feed Register WO NA 0xE01F C08C
Power Control
PCON Power Control Register R/W 0 0xE01F C0C0 PCONP Power Control for Peripherals R/W 0x03BE 0xE01 F C0C4
APB Divider
APBDIV APB Divider Control R/W 0 0xE01F C100
Reset
RSID Reset Source Identification Register R/W 0 0xE01F C180
Code Security/Debugging
CSPR Code Security Protection Register RO o 0xE01F C184
Syscon Miscellaneous Registers
SCS System Controls and Status R/W 0 0xE01F C1A0
UM10120
Chapter 4: System control block
Pin description
direction
Pins P0.7 and P0.15 can be selected to perform EINT2 function.
Pins P0.9, P0.20 and P0.30 can be selected to perform EINT3 function.
Input External Reset input - A LOW on this pin resets the chip, causing
I/O ports and peripherals to take on their default states, and the processor to begin execution at address 0x0000 0000.
[1]
value
[2]
Address
[1] Reset value relects the data stored in used bits only. It does not include reserved bits content. [2] Available in LPC213x/01devices only.
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4. Crystal oscillator

While an input signal of 50-50 duty cycle within a frequency range from 1 MHz to 50 MHz can be used by the LPC213x if supplied to its input XTAL1 pin, this microcontroller’s onboard oscillator circuit supports external crystals in the range of 1 MHz to 30 MHz only. If the on-chip PLL system or the boot-loader is used, the input clock frequency is limited to an exclusive range of 10 MHz to 25 MHz.
UM10120
Chapter 4: System control block
The oscillator output frequency is called F referred to as CCLK for purposes of rate equations, etc. elsewhere in this document. F
and the ARM processor clock frequency is
OSC
OSC
and CCLK are the same value unless the PLL is running and connected. Refer to the
Section 4–8 “
Phase Locked Loop (PLL)” on page 33 for details and frequency limitations.
The onboard oscillator in the LPC213x can operate in one of two modes: slave mode and oscillation mode.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (C
in Figure 4–7, drawing a), with an amplitude of at least 200 mVrms. The X2 pin in this
C
configuration can be left not connected. If slave mode is selected, the F
signal of
OSC
50-50 duty cycle can range from 1 MHz to 50 MHz. External components and models used in oscillation mode are shown in Figure 4–7
drawings b and c, and in Table 4–12 only a crystal and the capacitances C
. Since the feedback resistance is integrated on chip,
and CX2 need to be connected externally in case
X1
of fundamental mode oscillation (the fundamental frequency is represented by L, C R
). Capacitance CP in Figure 4–7, drawing c, represents the parallel package
S
capacitance and should not be larger than 7 pF. Parameters F
, CL, RS and CP are
C
,
and
L
supplied by the crystal manufacturer. Choosing an oscillation mode as an on-board oscillator mode of operation limits F
OSC
clock selection to 1 MHz to 30 MHz.
LPC213x LPC213x
XTAL1 XTAL2
C
C
Clock
a) b) c)
XTAL1 XTAL2
C
X1
Xtal
L
< = >
C
X2
C
L
R
S
C
Fig 7. Oscillator modes and models: a) slave mode of operation, b) oscillation mode of operation, c) external
crystal model used for C
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evaluation
X1/X2
P
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T able 12. Recommended values for C
Fundamental oscillation frequency F
C
1 MHz - 5 MHz 10 pF NA NA
5 MHz - 10 MHz 10 pF < 300 18 pF, 18 pF
10 MHz - 15 MHz 10 pF < 300 18 pF, 18 pF
15 MHz - 20 MHz 10 pF < 220 18 pF, 18 pF
20 MHz - 25 MHz 10 pF < 160 18 pF, 18 pF
25 MHz - 30 MHz 10 pF < 130 18 pF, 18 pF
components parameters)
Crystal load capacitance C
20 pF NA NA 30 pF < 300 58 pF, 58 pF
20 pF < 300 38 pF, 38 pF 30 pF < 300 58 pF, 58 pF
20 pF < 220 38 pF, 38 pF 30 pF < 140 58 pF, 58 pF
20 pF < 140 38 pF, 38 pF 30 pF < 80 58 pF, 58 pF
20 pF < 90 38 pF, 38 pF 30 pF < 50 58 pF, 58 pF
20 pF < 50 38 pF, 38 pF 30 pF NA NA
Chapter 4: System control block
in oscillation mode (crystal and external
X1/X2
Maximum crystal
L
series resistance R
External load capacitors C
S
UM10120
X1, CX2
Fig 8. F
f
selection
OSC
true
true
MIN f
= 10 MHz
OSC
MAX f
= 25 MHz
OSC
mode a and/or b mode a mode b
selection algorithm
OSC
on-chip PLL used
in application?
false
ISP used for initial
code download?
false
external crystal
oscillator used?
false
MIN f
= 1 MHz
OSC
MAX f
= 50 MHz
OSC
true
MIN f
MAX f
= 1 MHz
OSC
= 30 MHz
OSC
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5. External interrupt inputs

The LPC213x includes four External Interrupt Inputs as selectable pin functions. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode.

5.1 Register description

The external interrupt function has four registers associated with it. The EXTINT register contains the interrupt flags, and the EXTWAKEUP register contains bits that enable individual external interrupts to wake up the microcontroller from Power-down mode. The EXTMODE and EXTPOLAR registers specify the level and edge sensitivity parameters.
Table 13. External interrupt registers
Name Description Access Reset
EXTINT The External Interrupt Flag Register contains
interrupt flags for EINT0, EINT1, EINT2 and EINT3. See Table 4–14
INTWAKE The Interrupt Wakeup Register contains four
enable bits that control whether each external interrupt will cause the processor to wake up from Power-down mode. See Table 4–15
EXTMODE The External Interrupt Mode Register controls
whether each pin is edge- or levelsensitive.
EXTPOLAR The External Interrupt Polarity Register controls
which level or edge on each pin will cause an interrupt.
UM10120
Chapter 4: System control block
Address
[1]
value
R/W 0 0xE01F C140
.
R/W 0 0xE01F C144
.
R/W 0 0xE01F C148
R/W 0 0xE01F C14C
[1] Reset value relects the data stored in used bits only. It does not include reserved bits content.

5.2 External Interrupt Flag register (EXTINT - 0xE01F C140)

When a pin is selected for its external interrupt function, the level or edge on that pin (selected by its bits in the EXTPOLAR a nd EXTMODE registers) will set its interrupt fla g in this register. This asserts the corresponding interrupt request to the VIC, which will cause an interrupt if interrupts from the pin are enabled.
Writing ones to bits EINT0 through EINT3 in EXTINT register clears the corre sp onding bits. In level-sensitive mode this action is efficacious only when the pin is in its inactive state.
Once a bit from EINT0 to EINT3 is set and an appropriate code star ts to execute (hand ling wakeup and/or external interrupt), this bit in EXTINT register must be cleared. Otherwise the event that was just triggered by activity on the EINT pin will not be recognized in the future.
Important: whenever a change of externa l interrupt operating mode (i.e. active level/edge) is performed (including the initialization of an external interrupt), the corresponding bit in the EXTINT register must be cleared! For details see Section
4–5.4 “External Interrupt Mode register (EXTMODE - 0xE01F C148)” and Section 4–5.5 “External Interrupt Polarity register (EXTPOLAR - 0xE01F C14C)”.
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UM10120
Chapter 4: System control block
For example, if a system wakes up from power-down using a low level on external interrupt 0 pin, its post-wakeup code must reset the EINT0 bit in order to a llow future entry into the power-down mode. If the EINT0 bit is left set to 1, subsequent attempt(s) to invoke power-down mode will fail. The same goes for external interrupt handling.
More details on power-down mode will be discussed in the following chapters.
Table 14. External Interrupt Flag register (EXTINT - address 0xE01F C140) bit description
Bit Symbol Description Reset
0 EINT0 In level-sensitive mode, this bit is set if the EINT0 function is selected for its pin, and the pin is in
1 EINT1 In level-sensitive mode, this bit is set if the EINT1 function is selected for its pin, and the pin is in
2 EINT2 In level-sensitive mode, this bit is set if the EINT2 function is selected for its pin, and the pin is in
3 EINT3 In level-sensitive mode, this bit is set if the EINT3 function is selected for its pin, and the pin is in
7:4 - Reserved, user software should not write ones to reserved bits. The value read from a reserved
value
0 its active state. In edge-sensitive mode, this bit is set if the EINT0 function is selected for its pin, and the selected edge occurs on the pin.
Up to two pins can be selected to perform the EINT0 function (see P0.1 and P0.16 description in "Pin Configuration" chapter page 64.)
This bit is cleared by writing a one to it, except in level sensitive mode when the pin is in its active state (e.g. if EINT0 is selected to be low level sensitive and a low level is present on the corresponding pin, this bit can not be cleared; this bit can be cleared only when the signal on the pin becomes high).
0 its active state. In edge-sensitive mode, this bit is set if the EINT1 function is selected for its pin, and the selected edge occurs on the pin.
Up to two pins can be selected to perform the EINT1 function (see P0.3 and P0.14 description in "Pin Configuration" chapter on page 64.)
This bit is cleared by writing a one to it, except in level sensitive mode when the pin is in its active state (e.g. if EINT1 is selected to be low level sensitive and a low level is present on the corresponding pin, this bit can not be cleared; this bit can be cleared only when the signal on the pin becomes high).
0 its active state. In edge-sensitive mode, this bit is set if the EINT2 function is selected for its pin, and the selected edge occurs on the pin.
Up to two pins can be selected to perform the EINT2 function (see P0.7 and P0.15 description in "Pin Configuration" chapter on page 64.)
This bit is cleared by writing a one to it, except in level sensitive mode when the pin is in its active state (e.g. if EINT2 is selected to be low level sensitive and a low level is present on the corresponding pin, this bit can not be cleared; this bit can be cleared only when the signal on the pin becomes high).
0 its active state. In edge-sensitive mode, this bit is set if the EINT3 function is selected for its pin, and the selected edge occurs on the pin.
Up to three pins can be selected to perform the EINT3 function (see P0.9, P0.20 and P0.30 description in "Pin Configuration" chapter on page 64.)
This bit is cleared by writing a one to it, except in level sensitive mode when the pin is in its active state (e.g. if EINT3 is selected to be low level sensitive and a low level is present on the corresponding pin, this bit can not be cleared; this bit can be cleared only when the signal on the pin becomes high).
NA bit is not defined.
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5.3 Interrupt Wakeup register (INTWAKE - 0xE01F C144)

Enable bits in the INTWAKE register allow the external interrupts to wake up the processor if it is in Power-down mode. The related EINTn function must be mapped to the pin in order for the wakeup process to take place. It is not necessary for the interrupt to be enabled in the V ectored Interr upt Controller for a wake up to t ake place. T his arra ngement allows additional capabilities, such as having an external interrupt input wake up the processor from Power-down mode without causing an interrupt (simply resuming operation), or allowing an interrupt to be enabled during Power-down without waking the processor up if it is asserted (eliminating the need to disable the interrupt if the wakeup feature is not desirable in the application).
For an external interrupt pin to be a source that would wake up the microco ntroller from Power-down mode, it is also necessary to clear the corresponding bit in the External Interrupt Flag register (Section 4–5.2 on page 26
Table 15. Interrupt Wakeup register (INTWAKE - address 0xE01F C144) bit desc ription
Bit Symbol Description Reset
0 EXTWAKE0 When one, assertion of EINT0 will wake up the processor from
1 EXTWAKE1 When one, assertion of EINT1 will wake up the processor from
2 EXTWAKE2 When one, assertion of EINT2 will wake up the processor from
3 EXTWAKE3 When one, assertion of EINT3 will wake up the processor from
13:4 - Reserved, user software should not write ones to reserved bits.
14 BODWAKE When one, a BOD interrupt will wake up the processor from
15 RTCWAKE When one, assertion of an RTC interrupt will wake up the
UM10120
Chapter 4: System control block
).
value
0
Power-down mode.
0
Power-down mode.
0
Power-down mode.
0
Power-down mode.
NA
The value read from a reserved bit is not defined.
0
Power-down mode.
0
processor from Power-down mode.

5.4 External Interrupt Mode register (EXTMODE - 0xE01F C148)

The bits in this register select whether each EI NT pin is le vel- or edge- sensitive. Only pins that are selected for the EINT function (see chapter Pin Connect Block on page 72) and enabled via the VICIntEnable register (Section 5–4.4 “Interrupt Enable register
(VICIntEnable - 0xFFFF F010)” on page 53) can cause interrupts from the External
Interrupt function (though of course pins selected for other functions may cause i nterrupt s from those functions).
Note: Software should only change a bit in this register when its interrupt is disabled in the VICIntEnable register, and should write the corresponding 1 to the EXTINT register before enabling (initializing) or re-enabling the interrupt, to clear the EXTINT bit that could be set by changing the mode.
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Table 16. External Interrupt Mode register (EXTMODE - address 0xE01F C148) bit
Bit Symbol Value Description Reset
0 EXTMODE0 0 Level-sensitivity is selected for EINT0. 0
1 EXTMODE1 0 Level-sensitivity is selected for EINT1. 0
2 EXTMODE2 0 Level-sensitivity is selected for EINT2. 0
3 EXTMODE3 0 Level-sensitivity is selected for EINT3. 0
7:4 - - Reserved, user software should not write ones to reserved

5.5 External Interrupt Polarity register (EXTPOLAR - 0xE01F C14C)

In level-sensitive mode, the bits in this register select whether the corresponding pin is high- or low-active. In edge-sensitive mode, they select whether the pin is rising- or falling-edge sensitive. Only pins that are selected for the EINT function (see "Pin Connect Block" chapter on page 72) and enabled in the VICIntEnable register (Section 5–4.4
“Interrupt Enable register (VICIntEnable - 0xFFFF F010)” on page 53) can cause
interrupts from the External Interrupt function (though of course pins selected for other functions may cause interrupts from those functions).
UM10120
Chapter 4: System control block
description
value
1 EINT0 is edge sensitive.
1 EINT1 is edge sensitive.
1 EINT2 is edge sensitive.
1 EINT3 is edge sensitive.
NA
bits. The value read from a reserved bit is not defined.
Note: Software should only change a bit in this register when its interrupt is disabled in the VICIntEnable register, and should write the corresponding 1 to the EXTINT register before enabling (initializing) or re-enabling the interrupt, to clear the EXTINT bit that could be set by changing the polarity.
Table 17. External Interrupt Polarity register (EXTPOLAR - address 0xE01F C14C) bit
description
Bit Symbol Value Description Reset
value
0 EXTPOLAR0 0 EINT0 is low-active or falling-edge sensitive (depending on
EXTMODE0 selection).
1 EINT0 is high-active or rising-edge sensitive (depending on
EXTMODE0 selection).
1 EXTPOLAR1 0 EINT1 is low-active or falling-edge sensitive (depending on
EXTMODE1 selection).
1 EINT1 is high-active or rising-edge sensitive (depending on
EXTMODE1 selection).
2 EXTPOLAR2 0 EINT2 is low-active or falling-edge sensitive (depending on
EXTMODE2 selection).
1 EINT2 is high-active or rising-edge sensitive (depending on
EXTMODE2 selection).
0
0
0
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Table 17. External Interrupt Polarity register (EXTPOLAR - address 0xE01F C14C) bit
Bit Symbol Value Description Reset
3 EXTPOLAR3 0 EINT3 is low-active or falling-edge sensitive (depending on
7:4 - - Reserved, user software should not write ones to reserved

5.6 Multiple external interrupt pins

Software can select multiple pins for each of EINT3:0 in the Pin Select registers, which are described in chapter Pin Connect Block on page 72. The external interrupt logic for each of EINT3:0 receives the state of all of its associated pins from the pins’ receivers, along with signals that indicate whether each pin is selected for the EINT function. The external interrupt logic handles the case when m ore than one pin is so selected, dif ferently according to the state of its Mode and Polarity bits:
UM10120
Chapter 4: System control block
description
value
0
EXTMODE3 selection).
1 EINT3 is high-active or rising-edge sensitive (depending on
EXTMODE3 selection).
NA
bits. The value read from a reserved bit is not defined.
In Low-Active Level Sensitive mode, the states of all pins selected for the same EINTx
functionality are digitally combined using a positive logic AND gate.
In High-Active Level Sensitive mode, the states of all pins selected for the same
EINTx functionality are digitally combined using a positive logic OR gate.
In Edge Sensitive mode, regardless of polarity, the pin with the lowest GPIO port
number is used. (Selecting multiple pins for an EINTx in edge-sensitive mode could be considered a programming error.)
The signal derived by this logic is the EINTi signal in the following logic schematic
Figure 4–9
For example, if the EINT3 function is selected in the PINSEL0 and PINSEL1 registers for pins P0.9, P0.20 and P0.30, and EINT3 is configured to be low level sensitive, the inputs from all three pins will be logically ANDed. When more than one EINT pin is logically ORed, the interrupt service routine can read the states of the pins from the GPIO port using the IO0PIN and IO1PIN registers, to determine which pin(s) caused the interrupt.
.
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