NXP LFBGA487 User Manual
NXP Semiconductors |
PC board footprint |
Footprint information for reflow soldering of LFBGA487 package |
SOT1077-1 |
Hx
P 
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
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solder land |
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solder paste deposit |
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solder land plus solder paste |
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SL |
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occupied area |
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SP |
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solder resist |
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SR |
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detail X |
DIMENSIONS in mm |
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P |
SL |
SP |
SR |
Hx |
Hy |
0.40 |
0.250 |
0.275 |
0.350 |
12.400 |
12.400 |
SOT1077-1_fr |
© NXP B.V. 2008 . All rights reserved. |
29 April 2008 |
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