NXP BFG410W Schematic [ru]

DISCRETE SEMICONDUCTORS
BFG410W
NPN 22 GHz wideband transistor
Product specification Supersedes data of 1997 Oct 29 File under Discrete Semiconductors, SC14
1998 Mar 11
NPN 22 GHz wideband transistor BFG410W

FEATURES

Very high power gain
Low noise figure
High transition frequency
Emitter is thermal lead
Low feedback capacitance.

APPLICATIONS

RF front end
Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
Radar detectors
Pagers
Satellite television tuners (SATV)
High frequency oscillators.

DESCRIPTION

NPN double polysilicon wideband transistor with buried layer for low voltage applications in a plastic, 4-pin dual-emitter SOT343R package.

PINNING

PIN DESCRIPTION
handbook, halfpage
Marking code: P4.
1 emitter 2 base 3 emitter 4 collector
43
21
Top view
MSB842
Fig.1 Simplified outline SOT343R.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
C
re
f
T
G
max
F noise figure I
collector-base voltage open emitter −−10 V collector-emitter voltage open base −−4.5 V collector current (DC) 10 12 mA total power dissipation Ts≤ 110 °C −−54 mW DC current gain IC= 10 mA; VCE=2V; Tj=25°C 5080120 feedback capacitance IC= 0; VCB= 2 V; f = 1 MHz 45 fF transition frequency IC= 10 mA; VCE= 2 V; f = 2 GHz; T maximum power gain IC= 10 mA; VCE= 2 V; f = 2 GHz; T
= 1 mA; VCE= 2 V; f = 2 GHz; ΓS= Γ
C
=25°C 22 GHz
amb
=25°C 21 dB
amb
opt
1.2 dB
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1998 Mar 11 2
NPN 22 GHz wideband transistor BFG410W

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
s

THERMAL CHARACTERISTICS

collector-base voltage open emitter 10 V collector-emitter voltage open base 4.5 V emitter-base voltage open collector 1V collector current (DC) 12 mA total power dissipation Ts≤ 110 °C; note 1; see Fig.2 54 mW storage temperature 65 +150 °C operating junction temperature 150 °C
is the temperature at the soldering point of the emitter pins.
SYMBOL PARAMETER VALUE UNIT
R
th j-s
handbook, halfpage
(mW)
thermal resistance from junction to soldering point 750 K/W
120
MGD960
Ts (°C)
60
P
tot
40
20
0
0
40 80 160
Fig.2 Power derating curve.
1998 Mar 11 3
NPN 22 GHz wideband transistor BFG410W

CHARACTERISTICS

T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
h
FE
C
c
C
e
C
re
f
T
G
max
S
21
F noise figure I
P
L1
ITO third order intercept point I
collector-base breakdown voltage IC= 2.5 µA; IE=0 10 −−V collector-emitter breakdown
IC= 1 mA; IB= 0 4.5 −−V
voltage emitter-base breakdown voltage IE= 2.5 µA; IC=0 1 −−V collector-base leakage current IE= 0; VCB= 4.5 V −−15 nA DC current gain IC= 10 mA; VCE= 2 V; see Fig.3 50 80 120 collector capacitance IE=ie= 0; VCB=2V; f=1MHz 220 fF emitter capacitance IC=ic= 0; VEB= 0.5 V; f = 1 MHz 400 fF feedback capacitance IC= 0; VCB= 2 V; f = 1 MHz;
45 fF
see Fig.4
transition frequency IC= 10 mA; VCE= 2 V; f = 2 GHz;
T
=25°C; see Fig.5
amb
maximum power gain; note 1 IC= 10 mA; VCE= 2 V; f = 2 GHz;
T
=25°C; see Figs 7 and 8
amb
insertion power gain I
2
= 10 mA; VCE= 2 V; f = 2 GHz;
C
T
=25°C; see Fig.8
amb
= 1 mA; VCE=2V;
C
f = 900 MHz; ΓS= Γ I
= 1 mA; VCE= 2 V; f = 2 GHz;
C
output power at 1 dB gain compression
ΓS= Γ
IC= 10 mA; VCE= 2 V; f = 2 GHz; ZS=Z
C
ZS=Z
; see Fig.13
opt
; ZL=Z
S opt
= 10 mA; VCE= 2 V; f = 2 GHz;
; ZL=Z
S opt
; see Fig.13
opt
; note 2
L opt
; note 2
L opt
22 GHz
21 dB
18 dB
0.9 dB
1.2 dB
5 dBm
15 dBm
Notes
1. G
is the maximum power gain, if K > 1. If K < 1 then G
max
2. ZS is optimized for noise; ZL is optimized for gain.
1998 Mar 11 4
= MSG; see Figs 6, 7 and 8.
max
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