NXP BCW69, BCW70 Schematic [ru]

DATA SH EET

DISCRETE SEMICONDUCTORS

BCW69; BCW70

PNP general purpose transistors

Product data sheet
Supersedes data of 1999 Apr 19

2004 Feb 06

NXP Semiconductors Product data sheet

PNP general purpose transistors BCW69; BCW70

FEATURES

• Low current (max. 100 mA)

• Low voltage (max. 45 V).

APPLICATIONS

• General purpose switching and amplification.

DESCRIPTION

PNP transistor in a SOT23 plastic package.

complements: BCW71 and BCW72.

NPN

MARKING

T YPE NUMBER MARKING CODE

BCW69 H1*
BCW70 H2*

Note

1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.

(1)

PINNING

PIN DESCRIPTION

1 base
2 emitter
3 collector

handbook, halfpage

Top view

3

21

MAM256

Fig.1 Simplified outline (SOT23) and symbol.

3

1

2

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

BCW69 − plastic surface mounted package; 3 leads SOT23
BCW70

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
V
I
I
I
P
T
T
T

CBO
CEO

EBO
C
CM
BM

tot

stg
j
amb

collector-base voltage open emitter − −50 V
collector-emitter voltage open base; IC = −2 mA − −45 V
emitter-base voltage open collector − −5 V
collector current (DC) − −100 mA
peak collector current − −200 mA
peak base current − −200 mA
total power dissipation T

≤ 25 °C − 250 mW

amb

storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C

2004 Feb 06 2

NXP Semiconductors Product data sheet

PNP general purpose transistors BCW69; BCW70

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

Note

1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

Tj = 25 °C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

CBO

I

EBO

h

FE

V

CEsat

V

BEsat

V

BE

C

c

f

T

F noise figure IC = −200 μA; VCE = −5 V;

thermal resistance from junction to ambient note 1 500 K/W

collector cut-off current IE = 0; VCB = −20 V − − −100 nA

IE = 0; VCB = −20 V; Tj = 100 °C − − −10 μA
emitter cut-off current IC = 0; VEB = −5 V − − −100 nA
DC current gain IC = −10 μA; VCE = −5 V

BCW69 − 90 −
BCW70 − 150 −

DC current gain IC = −2 mA; VCE = −5 V

BCW69 120 − 260
BCW70 215 − 500

collector-emitter saturation
voltage

IC = −10 mA; IB = −0.5 mA − −80 −300 mV

IC = −50 mA; IB = −2.5 mA; note 1 − −150 − mV
base-emitter saturation voltage IC = −10 mA; IB = −0.5 mA − −720 − mV

IC = −50 mA; IB = −2.5 mA; note 1 − −810 − mV
base-emitter voltage IC = −2 mA; VCE = −5 V −600 − −750 mV
collector capacitance IE = Ie = 0; VCB = −10 V;

f

= 1 MHz

transition frequency IC = −10 mA; VCE = −5 V;

= 100 MHz

f

− 4.5 − pF

100 − − MHz

− − 10 dB

R

= 2 kΩ; f = 1 kHz; B = 200 Hz

S

Note

1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.

2004 Feb 06 3

NXP Semiconductors Product data sheet

3

PNP general purpose transistors BCW69; BCW70

PACKAGE OUTLINE

Plastic surface-mounted package; 3 leads SOT2

D

3

A

A

1

12

e

1

b

p

e

w

M

B

E

H

E

detail X

AB

Q

L

p

X

v

M

A

c

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

1

UNIT

A

1.1

mm

0.9

OUTLINE
VERSION

SOT23 TO-236AB

max.

0.1

b

cD

p

0.48

0.15

0.38

0.09

IEC JEDEC JEITA

3.0

2.8

E

1.4

1.2

REFERENCES

1.9

e

e

0.95

H

L

Qwv

1

2.5

2.1

p

E

0.55

0.45

0.15

0.45

0.2

0.1

EUROPEAN

PROJECTION

ISSUE DATE

04-11-04
06-03-16

2004 Feb 06 4

NXP Semiconductors Product data sheet

PNP general purpose transistors BCW69; BCW70

DATA SHEET STATUS

DOCUMENT

STATUS

Objective data sheet Development This document contains data from the objective specification for product

Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at

http://www.nxp.com.

URL

DISCLAIMERS
General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.

Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .

(1)

PRODUCT

STATUS

(2)

DEFINITION

development.

above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveya nce or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.

Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions

2004 Feb 06 5

60134) may cause permanent damage to

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [e-mail]

© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this documen t d oes not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property right s.

Printed in The Netherlands R75/04/pp6 Date of release: 2004 Feb 06 Document order number: 9397 750 12405