74ABT245Octal transceiver with direction pin (3-State)
FEATURES
•Octal bidirectional bus interface
•3-State buffers
•Output capability: +64 mA/–32 mA
•Latch-up protection exceeds 500 mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 833 Method 3015
and 200 V per Machine Model
DESCRIPTION
The 74ABT245 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT245 device is an octal transceiver featuring non-inverting
3-State bus compatible outputs in both send and receive directions.
The control function implementation minimizes external timing
requirements. The device features an Output Enable (OE
easy cascading and a Direction (DIR) input for direction control.
•Power-up 3-State
•Live insertion/extraction permitted
•Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
C
I
CCZ
IN
I/O
Propagation delay
An to Bn or Bn to An
CL = 50 pF; VCC = 5 V
Input capacitance DIR, OEVI = 0 V or V
I/O pin capacitanceOutputs disabled; VO = 0 V or V
Total supply currentOutputs disabled; VCC =5.5 V50µA
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGEPART NUMBERDWG NUMBER
20-Pin plastic SO–40 °C to +85 °C74ABT245DSOT163-1
20-Pin Plastic SSOP Type II–40 °C to +85 °C74ABT245DBSOT339-1
20-Pin Plastic TSSOP Type I–40 °C to +85 °C74ABT245PWSOT360-1
74ABT245Octal transceiver with direction pin (3-State)
LOGIC SYMBOL
DIR
A0
A1
A2
A3
A4
A5
A6
A7
LOGIC SYMBOL (IEEE/IEC)
1
19
OE
2
18
3
4
5
6
7
8
9
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
11
B7
SA00122
19
1
2
3
4
5
6
7
8
9
G3
3 EN1 (BA)
3 EN2 (AB)
1
2
18
17
16
15
14
13
12
11
SA00123
FUNCTION TABLE
INPUTSINPUTS/OUTPUTS
OEDIRAnBn
LLAn = BnInputs
LHInputsBn = An
HXZZ
H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance “off” state
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
I
IK
V
I
I
OK
V
OUT
I
OUT
T
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
–1.2 to +7.0V
output in Off or High state–0.5 to +5.5V
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2003 Feb 06
3
Page 4
Philips SemiconductorsProduct data
SYMBOL
PARAMETER
UNIT
I
g
74ABT245Octal transceiver with direction pin (3-State)
RECOMMENDED OPERATING CONDITIONS
LIMITS
MinMax
V
CC
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rate05ns/V
T
amb
DC ELECTRICAL CHARACTERISTICS
SYMBOLPARAMETERTEST CONDITIONST
V
IK
V
OH
V
OL
I
OFF
IPU/I
IIH + I
IIL + I
I
CEX
I
O
I
CCH
I
CCL
I
CCZ
∆I
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4 V.
3. This parameter is valid for any V
transition time of up to 100 µsec is permitted.
Waveform 2. Waveforms showing the 3-State Output Enable
T
= –40 °C to +85 °C
amb
VCC = +5.0 V ±0.5 V
4.1
4.2
4.8
5.8
6.2
5.8
1.0
1.0
1.3
2.3
1.0
1.0
V
M
V
M
and Disable times
UNIT
4.6
4.6
5.3
6.3
7.2
6.3
V
M
t
PLZ
t
PHZ
ns
ns
ns
3.5V
VOL + 0.3V
V
OL
V
OH
– 0.3V
V
OH
0V
SA00024
TEST CIRCUIT AND WAVEFORMS
From Output
Under Test
DEFINITIONS
C
L
2003 Feb 06
C
= 50 pF
L
t
=Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
500 Ω
500 Ω
Load Circuit
TESTS1
t
pd
t
PLZ/tPZL
PHZ/tPZH
open
7 V
open
7 V
S1
Open
GND
SA00012
5
Page 6
Philips SemiconductorsProduct data
74ABT245Octal transceiver with direction pin (3-State)
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
2003 Feb 06
6
Page 7
Philips SemiconductorsProduct data
74ABT245Octal transceiver with direction pin (3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
2003 Feb 06
7
Page 8
Philips SemiconductorsProduct data
74ABT245Octal transceiver with direction pin (3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
2003 Feb 06
8
Page 9
Philips SemiconductorsProduct data
74ABT245Octal transceiver with direction pin (3-State)
REVISION HISTORY
RevDateDescription
_320030206Product data (9397 750 11087); ECN 853-1447 29305 of 17 December 2002;
_2199801 16Product specification (9397 750 03467) 1998 Jan 16; ECN 853-1447 18867 of 16 January 1998.
Data sheet status
Level
I
Data sheet status
Objective data
Supersedes Product specfication (9397 750 03467) of 1998 Jan 16.
Modifications:
•Delete all references to N package. DIP20 package option discontinued.
Supersedes data of 1996 Sep 10.
[1]
Product
[2] [3]
status
Development
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
III
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Preliminary data
Product data
http://www.semiconductors.philips.com.
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com .Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:9397 750 11087
Koninklijke Philips Electronics N.V. 2003
All rights reserved. Printed in U.S.A.
Date of release: 01-03
2003 Feb 06
9
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