Electrical Characteristics (Continued)
Limits in standard typeface are for T
J
=
25˚C, bold typeface applies over the −40˚C to +125˚C temperature range. Limits
are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise noted: V
IN
=
6V, I
L
=
1 mA, C
L
=
2.2 µF.
Symbol Parameter Conditions Typical 2954AI 2954I Units
Min Max Min Max
Additional Specifications for the Adjustable Device (LP2954AIM and LP2954IM)
V
REF
Reference Voltage (Note 10) 1.230 1.215
1.205
1.245
1.255
1.205
1.190
1.255
1.270
V
∆V
REF
/
V
REF
Reference Voltage
Line Regulation
V
IN
=
2.5V to
VO(NOM)+1V
0.03 0.1 0.2
V
IN
=
2.5V to
VO(NOM)+1V to 30V
(Note 11)
0.2 0.4
∆V
REF
/∆T Reference Voltage
Temperature
Coefficient
(Note 3) 20 ppm/˚C
I
B
(FB) Feedback Pin Bias
Current
20 40
60
40
60
nA
I
GND
Ground Pin Current
at Shutdown (Note
6)
V
SHUTDOWN
≤1.1V 105 140 140 µA
I
O
(SINK) Output ″OFF″
Pulldown Current
(Note 12) 30
20
30
20
mA
Dropout Detection Comparator
I
OH
Output ″HIGH″
Leakage Current
V
OH
=
30V 0.01 1
2
1
2
µA
V
OL
Output ″LOW″
Voltage
V
IN
=
V
O
(NOM)−0.5V
I
O
(COMP)=400µA
150 250
400
250
400
mV
V
THR
(MAX) Upper Threshold
Voltage
(Note 13) −60 −80
−95
−35
−25
−80
−95
−35
−25
mV
V
THR
(MIN) Lower Threshold
Voltage
(Note 13) −85 −110
−160
−55
−40
−110
−160
−55
−40
mV
HYST Hysteresis (Note 13) 15 mV
Shutdown Input
V
OS
Input Offset Voltage (Referred to V
REF
)
±
3 −7.5
−10
7.5
10
−7.5
−10
7.5
10
mV
HYST Hysteresis 6 mV
I
B
Input Bias Current VIN(S/D)=0V to 5V 10 −30
−50
30
50
−30
−50
30
50
nA
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, T
J
(MAX), the junction-to-ambient thermal resistance, θ
J-A
,
and the ambient temperature, T
A
. The maximum allowable power dissipation at any ambient temperature is calculated using:
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will gointothermal shutdown.The junction-to-ambient
thermal resistance of the TO-220 (without heatsink) is 60˚C/W, 73˚C/W for the TO-263, and 160˚C/W for the SO-8. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50˚C/W; with
1 square inch of copper area, θ
JA
is 37˚C/W; and with 1.6 or more square inches of copper area, θJAis 32˚C/W. The junction-to-case thermal resistance is 3˚C/W.
If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the junction-to-case resistance (3˚C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:
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