Absolute Maximum Ratings (Notes 6, 8)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Positive Supply Voltage +8V
Negative Supply Voltage −8V
Peak Output Current 20 mA
Differential Input Voltage
±
5V
Input Voltage V
+
≥ VIN≥ V
−
ESD Tolerance (Note 9) 1600V
Operating Temperature Range
LM160 −55˚C to +125˚C
LM360 0˚C to +70˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
(Soldering, 10 sec.) 260˚C
Soldering Information
Dual-In-Line Package
Soldering (10 seconds) 260˚C
Small Outline Package
Vapor Phase (60 seconds) 215˚C
Infrared (15 seconds) 220˚C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Electrical Characteristics
(T
MIN
≤ TA≤ T
MAX
)
Parameter Conditions Min Typ Max Units
Operating Conditions
Supply Voltage V
CC
+
4.5 5 6.5 V
Supply Voltage V
CC
−
−4.5 −5 −6.5 V
Input Offset Voltage R
S
≤ 200Ω 25mV
Input Offset Current 0.5 3 µA
Input Bias Current 520µA
Output Resistance (Either Output) V
OUT
=
V
OH
100 Ω
Response Time T
A
=
25˚C, V
S
=
±
5V (Notes 2, 7) 13 25 ns
T
A
=
25˚C, V
S
=
±
5V (Notes 3, 7) 12 20 ns
T
A
=
25˚C, V
S
=
±
5V (Notes 4, 7) 14 ns
Response Time Difference between Outputs
(t
pd
of +V
IN1
)−(tpdof −V
IN2
)T
A
=
25˚C (Notes 2, 7) 2 ns
(t
pd
of +V
IN2
)−(tpdof −V
IN1
)T
A
=
25˚C (Notes 2, 7) 2 ns
(t
pd
of +V
IN1
)−(tpdof +V
IN2
)T
A
=
25˚C (Notes 2, 7) 2 ns
(t
pd
of −V
IN1
)−(tpdof −V
IN2
)T
A
=
25˚C (Notes 2, 7) 2 ns
Input Resistance f=1 MHz 17 kΩ
Input Capacitance f=1 MHz 3 pF
Average Temperature Coefficient of R
S
=
50Ω 8 µV/˚C
Input Offset Voltage
Average Temperature Coefficient of 7 nA/˚C
Input Offset Current
Common Mode Input Voltage Range V
S
=
±
6.5V
±
4
±
4.5 V
Differential Input Voltage Range
±
5V
Output High Voltage (Either Output) I
OUT
=
−320 µA, V
S
=
±
4.5V 2.4 3 V
Output Low Voltage (Either Output) I
SINK
=
6.4 mA 0.25 0.4 V
Positive Supply Current V
S
=
±
6.5V 18 32 mA
Negative Supply Current V
S
=
±
6.5V −9 −16 mA
Note 2: Response time measured from the 50%point of a 30 mVp-p 10 MHz sinusoidal input to the 50%point of the output.
Note 3: Response time measured from the 50%point of a 2 Vp-p 10 MHz sinusoidal input to the 50%point of the output.
Note 4: Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic threshold.
Note 5: Typical thermal impedances are as follows:
Cavity DIP (J): θ
jA
135˚C/W Header (H) θ
jA
165˚C/W (Still Air)
Molded DIP (N): θ
jA
130˚C/W 67˚C/W (400LF/min Air Flow)
θ
jC
25˚C/W
Note 6: The device may be damaged if used beyond the maximum ratings.
Note 7: Measurements are made in AC Test Circuit, Fanout=1
Note 8: Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.
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