Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage −26V to +0.3V
ESD Susceptibility (Note 2) 2 kV
Power Dissipation (Note 3) Internally limited
Junction Temperature (T
Jmax
) 125˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature (Soldering, 10 sec.) 230˚C
Operating Ratings (Note 1)
Junction Temperature Range (T
J
) −40˚C to +125˚C
Maximum Input Voltage (Operational) −26V
Electrical Characteristics
V
IN
=
−10V, V
O
=
−3V, I
O
=
1A, C
O
=
47 µF, R1=2.7k, T
J
=
25˚C, unless otherwise specified. Boldface limits apply over
the entire operating junction temperature range.
Parameter Conditions Typical Min Max Units
(Note 4)
Reference Voltage 5 mA ≤ I
O
≤ 1A −1.210 −1.234 −1.186 V
5mA≤I
O
≤1A, −1.27 −1.15 V
V
O
−1V≥VIN≥ −26V
Output Voltage −2 −3 V
Range V
IN
=
−26V −25 −24 V
Line Regulation I
O
=
5 mA, V
O
−1V≥VIN≥ −26V 0.004 0.04
%
/V
Load Regulation 50 mA ≤ I
O
≤ 1A 0.04 0.4
%
Dropout Voltage I
O
=
0.1A, ∆V
O
≤ 100 mV 0.1 0.2 V
0.3
I
O
=
1A, ∆V
O
≤ 100 mV 0.6 0.8 V
1
Quiescent Current I
O
≤ 1A 0.7 5 mA
Dropout Quiescent V
IN
=
V
O,IO
≤1A 16 50 mA
Current
Ripple Rejection V
ripple
=
1 Vrms,
f
ripple
=
1 kHz, 60 50 dB
I
O
=
5mA
Output Noise 10 Hz − 100 kHz, I
O
=
5 mA 200 450 µV
ON /OFF Input
(V
OUT
: ON) 1.2 0.8 V
Voltage (V
OUT
: OFF) 1.3 2.4
ON /OFF Input
V
ON/OFF
=
0.8V (V
OUT
: ON) 0.1 10 µA
Current V
ON/OFF
=
2.4V (V
OUT
: OFF) 40 100
Output Leakage V
IN
=
−26V, V
ON/OFF
=
2.4V
60 250 µA
Current V
OUT
=
0V
Current Limit V
OUT
=
0V 2 1.5 A
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the deivce is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 3: The maximum power dissipation is a function of T
Jmax
, θJAand TA. The maximum allowable power dissipation at any ambient temperature is P
D
=
(T
Jmax
−TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 125˚C and the LM2991 will go into thermal shutdown. For the LM2991, the
junction-to-ambient thermal resistance is 53˚C/W for the TO-220, 73˚C/W for the TO-263, and junction-to-case thermal resistance is 3˚C. If the TO-263 package is
used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area,
θ
JA
is 50˚C/W; with 1 square inch of copper area, θJAis 37˚C/W; and with 1.6 or more square inches of copper area, θJAis 32˚C/W.
Note 4: Typicals are at T
J
=
25˚C and represent the most likely parametric norm.
www.national.com3