Electrical Characteristics for Fixed 5V Version (Continued)
VIN= 14V, IO= 10mA, TJ= 25˚C, C2 = 100 µF (unless otherwise specified) (Note 2)
Parameter Conditions LM2931A-5.0 LM2931-5.0 Units
Typ
Limit
(Note 3)
Typ
Limit
(Note 3)
Quiescent Current I
O
≤ 10mA, 6V ≤ VIN≤ 26V 0.4 1.0 0.4 1.0 mA
MAX
−40˚C ≤ TJ≤ 125˚C
I
O
= 100mA, VIN= 14V, TJ= 25˚C 15 30
5
15 mA
MAX
mA
MIN
Output Noise Voltage 10Hz -100kHz, C
OUT
= 100µF 500 500 µV
rms
Long Term Stability 20 20 mV/1000
hr
Ripple Rejection f
O
= 120 Hz 80 55 80 dB
MIN
Dropout Voltage IO= 10mA
I
O
= 100mA
0.05
0.3
0.2
0.6
0.05
0.3
0.2
0.6
V
MAX
Maximum Operational Input
Voltage
33 26 33 26 V
MIN
Maximum Line Transient RL= 500Ω,VO≤5.5V,
T = 1ms, τ≤100ms
70 60 70 50 V
MIN
Reverse Polarity Input
Voltage, DC
VO≥ −0.3V, RL= 500Ω −30 −15 −30 −15 V
MIN
Reverse Polarity Input
Voltage, Transient
T = 1ms, τ≤100ms, RL= 500Ω −80 −50 −80 −50 V
MIN
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: All limits are guaranteed for T
J
= 25˚C (standard type face) or over the full operating junction temperature range of −40˚C to +125˚C (bold type face).
Note 4: The maximum power dissipation is a function of maximum junction temperatureT
Jmax
, total thermal resistance θJA, and ambient temperature TA. The maxi-
mum allowable power dissipation at any ambient temperature is P
D
=(T
Jmax−TA
)/θJA. If this dissipation is exceeded, the die temperature will rise above150˚Cand
the LM2931 will gointothermalshutdown. For the LM2931 in the TO-92 package, θ
JA
is 195˚C/W; in the SO-8 package, θJAis 160˚C/W, and in the TO-220 package,
θ
JA
is 50˚C/W; in the TO-263 package, θJAis 73˚C/W; and in the 6-Bump micro SMD package θJAis 290˚C/W. If the TO-220 package is used with a heat sink, θ
JA
is the sum of the package thermal resistance junction-to-case of 3˚C/W and the thermal resistance added by the heat sink and thermal interface.
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square
inches of copper area, θ
JA
is 50˚C/W; with 1 square inch of copper area, θJAis 37˚C/W; and with 1.6 or more square inches of copper area, θJAis 32˚C/W.
Note 5: Human body model, 100 pF discharged through 1.5 kΩ.
Electrical Characteristics for Adjustable Version
VIN= 14V, V
OUT
= 3V, IO= 10 mA, TJ= 25˚C, R1 = 27k, C2 = 100 µF (unless otherwise specified) (Note 2)
Parameter Conditions Typ Limit Units
Limit
Reference Voltage 1.20 1.26 V
MAX
1.14 V
MIN
IO≤ 100 mA, −40˚C ≤ Tj≤ 125˚C, R1 = 27k 1.32 V
MAX
Measured from V
OUT
to Adjust Pin 1.08 V
MIN
Output Voltage Range 24 V
MAX
3V
MIN
Line Regulation V
OUT
+ 0.6V ≤ VIN≤ 26V 0.2 1.5 mV/V
MAX
Load Regulation 5 mA ≤ IO≤ 100 mA 0.3 1 %
MAX
Output Impedance 100 mADCand 10 mA
rms
, 100 Hz–10 kHz 40 mΩ/V
Quiescent Current I
O
= 10 mA 0.4 1 mA
MAX
IO= 100 mA 15 mA
During Shutdown R
L
= 500Ω 0.8 1 mA
MAX
Output Noise Voltage 10 Hz–100 kHz 100 µV
rms
/V
Long Term Stability 0.4 %/1000 hr
Ripple Rejection f
O
= 120 Hz 0.02 %/V
LM2931
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