Connection Diagrams
Pin Descriptions
LSGATE (Pin 1): Gate drive for the low-side N-channel
MOSFET. This signal is interlocked with HSGATE (Pin 20) to
avoid a shoot-through problem.
BOOTV (Pin 2): Power supply for high-side N-channel
MOSFET gate drive. The voltage should be at least one gate
threshold above the converter input voltage to properly operate the high-side N-FET.
PGND (Pin 3): Ground for high current circuitry. It should be
connected to system ground.
SGND (Pin 4): Ground for signal level circuitry. It should be
connected to system ground.
V
CC
(Pin 5): Power supply for the controller.
SENSE (Pin 6): Converter output voltage sensing. It pro-
vides input for power good, fast dual comparator control
loop, and over-voltage protection circuitry. It is recommended that a 0.1 µF capacitor be connected between this
pin and ground to avoid potential noise problems.
IMAX (Pin 7): Current limit threshold setting. It sinks a fixed
180 µA current. By connecting a resistor between the high
side MOSFET drain and this pin, a fixed voltage drop can be
built across the resistor. This voltage drop is compared with
the V
DS
of the high-side N-MOSFET to determine if an over-
current condition has occurred.
IFB (Pin 8): High-side N-MOSFET source voltage sensing.
This pin is one V
DS
below drain voltage. When this voltage is
lower than that of IMAX pin during the time the high-side FET
is on, it means V
DS
is higher than the preset voltage across
the IMAX resistor, which can be interpreted as an overcurrent condition.
V
REF
(Pin 9): Bandgap reference voltage. This voltage is
mainly for use by other power supplies on the motherboard
which need a reference.
EA_OUT (Pin 10): Output of the error amplifier. The voltage
level on this pin is compared with an internally generated
ramp signal to determine the duty cycle. This pin is necessary for compensating the primary control loop.
FB (Pin 11): Inverting input of the error amplifier.A pin necessary for compensating the control loop.
FREQ_ADJ (Pin 12): Switching frequency adjustment.
Switching frequency can be adjusted by changing the
grounding resistance on this pin.
PWRGD (Pin 13): Power Good. There are two windows
around the DAC output voltage that are associated with
PWRGD pin, the
±
10%window and the±8%window. If
PWRGD is initially high (open drain state) and output voltage
travels out of
±
10%window, PWRGD goes to low (low impedance to ground). If PWRGD is initially low and output
voltage travels into the
±
8%window and has stayed within
the window for at least 10 ms, PWRGD goes to high. A
PWRGD high means the output voltage is at least within the
±
10%window whereas a PWRGD low indicates the output
voltage is definitely outside the
±
8%window.
VID4:0 (Pins 14, 15, 16, 17, 18): Voltage Identification
Code. The five pins accept an open-ground pattern 5-bit binary code from outside the chip (typically from the CPU) for
generating the desired output voltage. Each VID pin is internally pulled up to V
CC
via a 90 µA current source.
Table 1
shows the code table.
OUTEN (Pin 19): Output Enable. The output voltage is dis-
abled when this pin is pulled low. It is internally pulled up to
V
CC
via a 90 µA current source.
HSGATE (Pin 20): Gate drive for the high-side N-channel
MOSFET. This signal is interlocked with LSGATE (Pin 1) to
avoid a shoot-through problem.
TABLE 1. VID Code and DAC Output
V
ID4VID3VID2VID1VID0
Rated Output
Voltage (V)
01111 1.30
01110 1.35
01101 1.40
01100 1.45
01011 1.50
01010 1.55
01001 1.60
01000 1.65
00111 1.70
00110 1.75
00101 1.80
00100 1.85
00011 1.90
00010 1.95
00001 2.00
TOP VIEW
DS100834-3
Plastic SO-20
Order Number LM2636M
See NS Package Number M20B
TOP VIEW
DS100834-3
Plastic TSSOP-20
Order Number LM2636MTC
See NS Package Number MTC20
LM2636
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