NSC ADC10064CIWM, ADC10062CIWM, ADC10061CIWM Datasheet

June 1999
ADC10061/ADC10062/ADC10064 10-Bit 600 ns A/D Converter with Input Multiplexer and Sample/Hold
ADC10061/ADC10062/ADC10064 10-Bit 600 ns A/D Converter with Input Multiplexer and
Sample/Hold
General Description
Using an innovative, patented multistep*conversion tech­nique, the 10-bit ADC10061, ADC10062, and ADC10064 CMOS analog-to-digital converters offer sub-microsecond conversion times yet dissipate a maximum of only 235 mW. The ADC10061, ADC10062, and ADC10064 perform a 10-bit conversion in two lower-resolution “flashes”, thus yielding a fast A/D without the cost, power dissipation, and other problems associated with true flash approaches. The ADC10061 is pin-compatible with the ADC1061 but much faster, thus providing a convenient upgrade path for the ADC1061.
The analog input voltageto the ADC10061, ADC10062, and ADC10064 is sampled and held by an internal sampling cir­cuit. Input signals at frequencies from dc to over 200 kHz can therefore be digitized accurately without the need for an external sample-and-hold circuit.
The ADC10062 and ADC10064 include a “speed-up” pin. Connecting an external resistor between this pin and ground reduces the typical conversion time to as little as 350 ns with only a small increase in linearity error.
For ease of interface to microprocessors, the ADC10061, ADC10062, and ADC10064 have been designed to appear as a memory location or I/O port without the need for exter­nal interface logic.
*
U.S. Patent Number 4918449
Simplified Block Diagram
Features
n Built-in sample-and-hold n Single +5V supply n 1, 2, or 4-input multiplexer options n No external clock required n Speed adjust pin for faster conversions (ADC10062
and ADC10064). See ADC10662/4 for high speed guaranteed performance.
Key Specifications
n Conversion time to 10 bits 600 ns typical, n 900 ns max over temperature n Sampling Rate 800 kHz n Low power dissipation 235 mW (max) n Total unadjusted error n No missing codes over temperature
±
1.0 LSB (max)
Applications
n Digital signal processor front ends n Instrumentation n Disk drives n Mobile telecommunications
*
ADC10061 Only
**
ADC10062 and ADC10064 Only
***
ADC10064 Only
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
© 1999 National Semiconductor Corporation DS011020 www.national.com
DS011020-1
Ordering Information
Industrial (−40˚C TA≤ +85˚C) Package
Connection Diagrams
Top View
ADC10061CIWM M20B Small Outline ADC10062CIWM M24B Small Outline ADC10064CIWM M28B Small Outline
DS011020-11
DS011020-12
Top View
Top View
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DS011020-13
Pin Descriptions
DVCC,AVCCThese are the digital and analog positive sup-
INT
S/H This is the Sample/Hold control input. When
RD
CS
S0, S1 On the multiple-input devices (ADC10062 and
V
REF−
V
REF+
ply voltage inputs. They should always be con­nected to the same voltage source, but are brought out separately to allow for separate bypass capacitors. Each supply pin should be bypassed with a 0.1 µF ceramic capacitor in parallel with a 10 µF tantalum capacitor to ground.
This is the active low interrupt output. INT goes low at the end of each conversion, and returns to a high state following the rising edge of RD.
this pin is forced low (and CS is low), it causes the analog input signal to be sampled and ini­tiates a new conversion.
This is the active low Read control input. When this RD and CS are low, any data present in the output registers will be placed on the data bus.
This is the active low Chip Select control input. When low, this pin enables the RD and S/H pins.
ADC10064), these pins select the analog input that will be connected to the A/D during the conversion. The input is selected based on the state of S0 and S1 when S/H makes its High-to-Low transition (See the Timing Dia­grams). The ADC10064 includes both S0 and S1. The ADC10062 includes just S0, and the ADC10061 includes neither.
,
These are the reference voltage inputs. They may be placed at any voltage between GND and V
, but V
CC
V
. An input voltage equal to V
REF−
duces an output code of 0, and an input volt­age equal to (V put code of 1023.
must be greater than
REF+
− 1 LSB) produces an out-
REF+
REF−
pro-
V
,
IN,VIN0
V
IN1,VIN2
V
IN3
These are the analog input pins. The ADC10061 has one input (V
,
has two inputs (V ADC10064 has four inputs (V and V
). The impedance of the source
IN3
should be less than 500for best accuracy
and V
IN0
), the ADC10062
IN
), and the
IN1
IN0,VIN1,VIN2
and conversion speed. For accurate conver­sions, no input pin (even one that is not se­lected) should be driven more than 50 mV
GND, AGND, DGND
above V These are the power supply ground pins. The
ADC10061 has a single ground pin (GND),
or 50 mV below ground.
CC
and the ADC10062 and ADC10064 have separate analog and digital ground pins (AGND and DGND) for separate bypassing of the analog and digital supplies. The ground pins should be connected to a stable, noise-free system ground. For the devices with two ground pins, both pins should be re­turned to the same potential.
DB0–DB9 These are the TRI-STATE
®
output pins.
SPEED ADJ (ADC10062 and ADC10064 only). This pin is
normally left unconnected, but by connecting a resistor between this pin and ground, the con­version time can be reduced. See the Typical Performance Curves and the table of Electri­cal Characteristics.
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Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
+
=
Supply Voltage (V Voltage at Any Input or Output −0.3V to V Input Current at Any Pin (Note 3) 5 mA Package Input Current (Note 3) 20 mA Power Dissipation (Note 4) 875 mW ESD Susceptability (Note 5) 2000V Soldering Information (Note 6)
Vapor Phase (60 Sec) Infrared (15 Sec)
AV
=
) −0.3V to +6V
DV
CC
CC
+
+ 0.3V
215˚C 220˚C
Storage Temperature Range −65˚C to +150˚C Junction Temperature 150˚C
Operating Ratings (Notes 1, 2)
Temperature Range T
ADC10061CIWM, ADC10062CIWM, ADC10064CIWM −40˚C T
Supply Voltage Range 4.5V to 5.5V
MIN
TA≤ T
+85˚C
A
MAX
Converter Characteristics
The following specifications apply for V otherwise specified. Boldface limits apply for T
+
=
+5V, V
A
REF(+)
=
=
+5V, V
REF(−)
=
T
to T
T
J
Min
Max
Symbol Parameter Conditions
Resolution 10 Bits Integral Linearity Error R
=
18 k
SA
Offset Error Full-Scale Error Total Unadjusted Error All Suffixes, R
=
SA
Missing Codes 0 (max)
+
=
Power Supply Sensitivity V
THD Total Harmonic Distortion f
SNR Signal-to-Noise Ratio f
Effective Number of Bits f
R R V V V V V V
REF
REF REF(+) REF(−) REF(+) REF(−) IN IN
Reference Resistance 650 400 (min) Reference Resistance 650 900 (max) V
Input Voltage V++ 0.05 V (max)
REF(+)
V
Input Voltage GND − 0.05 V (min)
REF(−)
V
Input Voltage V
REF(+)
V
Input Voltage V
REF(−)
Input Voltage V++ 0.05 V (max) Input Voltage GND − 0.05 V (min) OFF Channel Input Leakage Current
ON Channel Input Leakage Current
±
5V
+
=
±
5V
V
=
10 kHz, 4.85 V
IN
=
f
160 kHz, 4.85 V
IN
=
10 kHz, 4.85 V
IN
=
f
160 kHz, 4.85 V
IN
=
10 kHz, 4.85 V
IN
=
f
160 kHz, 4.85 V
IN
+
CS=V
,V
CS=V+,V
5%,V 10%,V
=
IN
=
IN
REF
REF
+
V
+
V
=
GND, and Speed Adjust pin unconnected unless
; all other limits T
18 k
=
4.5V
=
4.5V
P-P
P-P
P-P
P-P
P-P
P-P
=
A
Typical
(Note 7)
±
0.5
±
0.5
±
1/16
0.06
0.08 61
60
9.6
9.4
0.01
±
1
=
T
+25˚C.
J
Limit
(Note 8)
±
1.0/±1.5 LSB (max)
±
1 LSB (max)
±
1 LSB (max)
±
1.5/±2.0 LSB (max)
3
±
8
REF(−)
REF(+)
3
−3
Units
(Limit)
LSB
LSB (max)
% %
dB dB
Bits Bits
V (min)
V (max)
µA (max) µA (max)
DC Electrical Characteristics
The following specifications apply for V wise specified. Boldface limits apply for T
+
=
+5V, V
=
5V V
REF(+)
=
=
T
A
T
J
MIN
to T
REF(−)
MAX
Symbol Parameter Conditions
+
V
IN(1)
V
IN(0)
I
IN(1)
I
IN(0)
V
OUT(1)
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Logical “1” Input Voltage V Logical “0” Input Voltage V Logical “1” Input Current V Logical “0” Input Current V Logical “1” Output Voltage V
=
5.5V 2.0 V (min)
+
=
4.5V 0.8 V (max) =
5V 0.005 3.0 µA (max)
IN(1)
0V −0.005 −3.0 µA (max)
IN(0) +
=
4.5V, I
+
=
4.5V, I
V
OUT OUT
= =
=
GND, and Speed Adjust pin unconnected unless other-
; all other limits T
−360 µA
−10 µA
=
=
T
+25˚C.
A
J
Typical
(Note 7)
Limit
(Note 8)
2.4
4.25
Units
(Limit)
V (min) V (min)
DC Electrical Characteristics (Continued)
+
The following specifications apply for V wise specified. Boldface limits apply for T
=
+5V, V
=
A
Symbol Parameter Conditions
V I
OUT
DI
AI
OUT(0)
CC
CC
Logical “0” Output Voltage V TRI-STATE®Output Current V
DVCCSupply Current CS=S/H=RD=0, R
AVCCSupply Current CS=S/H=RD=0, R
=
5V V
REF(+)
=
T
T
J
+
=
4.5V, I =
OUT
=
V
OUT
MIN
5V 0V
REF(−)
to T
; all other limits T
MAX
=
1.6 mA 0.4 V (max)
OUT
CS=S/H=RD=0, R
CS=S/H=RD=0, R
=
GND, and Speed Adjust pin unconnected unless other-
=
SA
=
18 k
SA
=
SA
=
18 k
SA
=
=
T
+25˚C.
A
J
Typical
(Note 7)
0.1
−0.1
1.0
1.0 30
30
Limit
(Note 8)
50
−50 2
45
Units
(Limit)
µA (max) µA (max)
mA (max) mA (max)
mA (max) mA (max)
AC Electrical Characteristics
The following specifications apply for V nected unless otherwise specified. Boldface limits apply for T
Symbol Parameter Conditions
t
CONV
t
CRD
t
ACC1
t
ACC2
t
SH
t
1H,t0H
t
INTH
t
P
t
MS
t
MH
C
VIN
C
OUT
C
IN
Note 1: Absolute Maximum Ratingsindicatelimitsbeyondwhich damage to the device may occur.Operating Ratings indicate conditions for which the device is func­tional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditons.
Note 2: All voltages are measured with respect to GND, unless otherwise specified. Note 3: When the input voltage (V
to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation at any temperature is P the maximum derated power dissipation will be reached only during fault conditions. For these devices, T tables below:
Mode 1 Conversion Time from Rising Edge of S/H to Falling Edge of INT
Mode 2 Conversion Time R
Access Time (Delay from Falling Edge of RD to Output Valid)
Access Time (Delay from Falling Edge of RD to Output Valid)
Minimum Sample Time ( TRI-STATE Control (Delay from
Rising Edge of RD to High-Z State) Delay from Rising Edge of RD to
Rising Edge of INT Delay from End of Conversion to
Next Conversion Multiplexer Control Setup Time 10 75 ns (max) Multiplexer Hold Time 10 40 ns (max) Analog Input Capacitance 35 pF (max) Logic Output Capacitance 5 pF (max) Logic Input Capacitance 5 pF (max)
) at any pin exceeds the power supply rails (V
IN
+
=
D
+5V, t
=
(T
=
t
r
f
R
SA
R
SA
SA
Mode 2, R Mode 1; C
Mode 2; C
Figure 1
R
L
C
L
=
20 ns, V
=
=
18k
=
); (Note 8) 250 ns (max)
=
1k, C
=
100 pF
SA L
L
L
A
=
=
REF(+)
=
T
=
100 pF
100 pF
=
10 pF
J
18k
=
5V, V
=
T
MIN
REF(−)
to T
MAX
(Note 7)
=
GND, and Speed Adjust pin uncon-
; all other limits T
Typical
600
=
A
Limit
(Note 8) 750/900
375
850
1400 ns(max)
530
30 60 ns (max)
900 t
+50 ns (max)
CRD
30 60 ns (max)
25 50 ns (max)
50 ns (max)
<
IN
)/θJAor the number given in the Absolute Maximum Ratings, whichever is lower. In most cases,
JMAX−TA
GND or V
>
V+) the absolute value of current at that pin should be limited
IN
, θJAand the ambient temperature, TA. The maximum
JMAX
for a board-mounted device can be found from the
JMAX
=
T
+25˚C.
J
Units
(Limit)
ns(max)
ns
ns
Device θJA(˚C/W)
ADC10061CIWM 54 ADC10062CIWM 48 ADC10064CIWM 44
Note 5: Human body model, 100 pF discharged through a 1.5 kresistor. Note 6: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National Semicon-
ductor Linear Data Book for other methods of soldering surface mount devices. Note 7: Typicals are at +25˚C and represent must likely parametric norm.
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