NSC 5962-8855001SA, 5962-8855001RA, 5962-88550012A Datasheet

TL/F/9511
54F/74F273 Octal D Flip-Flop
May 1995
54F/74F273 Octal D Flip-Flop
General Description
The ’F273 has eight edge-triggered D-type flip-flops with in­dividual D inputs and Q outputs. The common buffered Clock (CP) and Master Reset (MR
) inputs load and reset
(clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D in­put, one setup time before the LOW-to-HIGH clock tran­sition, is transferred to the corresponding flip-flop’s Q out­put.
All outputs will be forced LOW independently of Clock or Data inputs by a LOW voltage level on the MR
input. The device is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements.
Features
Y
Ideal buffer for MOS microprocessor or memory
Y
Eight edge-triggered D flip-flops
Y
Buffered common clock
Y
Buffered, asynchronous Master Reset
Y
See ’F377 for clock enable version
Y
See ’F373 for transparent latch version
Y
See ’F374 for TRI-STATEÉversion
Y
Guaranteed 4000V minimum ESD protection
Commercial Military
Package
Package Description
Number
74F273PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line
54F273DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F273SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC
74F273SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ
54F273FM (Note 2) W20A 20-Lead Cerpack
54F273LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13×reel. Use suffixeSCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbols
TL/F/9511– 3
IEEE/IEC
TL/F/9511– 5
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
TL/F/9511– 1
Pin Assignment
for LCC
TL/F/9511– 2
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
D0–D
7
Data Inputs 1.0/1.0 20 mA/b0.6 mA
MR
Master Reset (Active LOW) 1.0/1.0 20 mA/b0.6 mA
CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 mA/
b
0.6 mA
Q0–Q
7
Data Outputs 50/33.3
b
1 mA/20 mA
Mode Select-Function Table
Operating Mode
Inputs Output
MR CP D
n
Q
n
Reset (Clear) L X X L
Load ‘1’ H L hH
Load ‘0’ H L lL
H
e
HIGH Voltage Level steady state
h
e
HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition
L
e
LOW Voltage Level steady state
I
e
LOW Voltage Level one setup time prior to the LOW-to-HIGH clock transition X
e
Immaterial
L
e
LOW-to-HIGH clock transition
Logic Diagram
TL/F/9511– 4
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
b
65§Ctoa150§C
Ambient Temperature under Bias
b
55§Ctoa125§C
Junction Temperature under Bias
b
55§Ctoa175§C
Plastic
b
55§Ctoa150§C
V
CC
Pin Potential to
Ground Pin
b
0.5V toa7.0V
Input Voltage (Note 2)
b
0.5V toa7.0V
Input Current (Note 2)
b
30 mA toa5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATE Output
b
0.5V toa5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
ESD Last Passing Voltage (min) 4000V
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating Conditions
Free Air Ambient Temperature
Military
b
55§Ctoa125§C
Commercial 0
§
Ctoa70§C
Supply Voltage
Military
a
4.5V toa5.5V
Commercial
a
4.5V toa5.5V
DC Electrical Characteristics
Symbol Parameter
54F/74F
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1.2 V Min I
IN
eb
18 mA
V
OH
Output HIGH Mil 2.5 I
OH
eb
1mA
Voltage 10% V
CC
2.5 V Min
5% V
CC
2.7
V
OL
Output LOW Mil 0.5 I
OL
e
20 mA
Voltage 10% V
CC
0.5 V Min
5% V
CC
0.5
I
IH
Input HIGH 54F 20.0
mA Max
V
IN
e
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100
mA Max
V
IN
e
7.0V
Breakdown Test 74F 7.0
I
CEX
Output HIGH 54F 250
mA Max
V
OUT
e
V
CC
Leakage Current 74F 50
V
ID
Input Leakage
74F 4.75 V 0.0
I
ID
e
1.9 mA
Test All other pins grounded
I
OD
Output Leakage
74F 3.75 mA 0.0
V
IOD
e
150 mV
Circuit Current All other pins grounded
I
IL
Input LOW Current
b
0.6 mA Max V
IN
e
0.5V
I
OS
Output Short-Circuit Current
b
60
b
150 mA Max V
OUT
e
0V
I
CCH
Power Supply Current 44
mA Max
CPeL
I
CCL
56 D
n
eMRe
HIGH
3
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