NSC 54F521LMQB, 54F521DMQB, 54F521DM Datasheet

TL/F/9545
54F/74F521 8-Bit Identity Comparator
May 1995
54F/74F521 8-Bit Identity Comparator
General Description
The ’F521 is an expandable 8-bit comparator. It compares two words of up to eight bits each and provides a LOW output when the two words match bit for bit. The expansion input I
AeB
also serves as an active LOW enable input.
Features
Y
Compares two 8-bit words in 6.5 ns typ
Y
Expandable to any word length
Y
20-pin package
Commercial Military
Package
Package Description
Number
74F521PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line
54F521DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F521SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC
74F521SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ
74F521MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ type II
Note 1: Devices also available in 13×reel. Use suffixeSCX, SJX and MSAX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB.
Logic Symbols
TL/F/9545– 1
IEEE/IEC
TL/F/9545– 4
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
A0–A
7
Word A Inputs 1.0/1.0 20 mA/b0.6 mA
B
0–B7
Word B Inputs 1.0/1.0 20 mA/b0.6 mA
I
AeB
Expansion or Enable Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA
O
AeB
Identity Output (Active LOW) 50/33.3
b
1 mA/20 mA
Truth Table
Inputs Output
I
AeB
A, B O
AeB
LA
e
B* L
LA
i
BH
HA
e
B* H
HA
i
BH
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
*A
0
e
B0,A
1
e
B1,A
2
e
B2, etc.
Connection Diagrams
Pin Assignment for DIP, SOIC, SSOP and Flatpak
TL/F/9545– 2
Pin Assignment
for LCC
TL/F/9545– 3
Logic Diagram
TL/F/9545– 5
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
b
65§Ctoa150§C
Ambient Temperature under Bias
b
55§Ctoa125§C
Junction Temperature under Bias
b
55§Ctoa175§C
Plastic
b
55§Ctoa150§C
V
CC
Pin Potential to
Ground Pin
b
0.5V toa7.0V
Input Voltage (Note 2)
b
0.5V toa7.0V
Input Current (Note 2)
b
30 mA toa5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATEÉOutput
b
0.5V toa5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating Conditions
Free Air Ambient Temperature
Military
b
55§Ctoa125§C
Commercial 0
§
Ctoa70§C
Supply Voltage
Military
a
4.5V toa5.5V
Commercial
a
4.5V toa5.5V
DC Electrical Characteristics
Symbol Parameter
54F/74F
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1.2 V Min I
IN
eb
18 mA
V
OH
Output HIGH 54F 10% V
CC
2.5 I
OH
eb
1mA
Voltage 74F 10% V
CC
2.5 V Min I
OH
eb
1mA
74F 5% V
CC
2.7 I
OH
eb
1mA
V
OL
Output LOW 54F 10% V
CC
0.5 V Min
I
OL
e
20 mA
Voltage 74F 10% V
CC
0.5 I
OL
e
20 mA
I
IH
Input HIGH 54F 20.0
mA Max V
IN
e
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100
mA Max V
IN
e
7.0V
Breakdown Test 74F 7.0
I
CEX
Output HIGH 54F 250
mA Max V
OUT
e
V
CC
Leakage Current 74F 50
V
ID
Input Leakage
74F 4.75 V 0.0
I
ID
e
1.9 mA
Test All Other Pins Grounded
I
OD
Output Leakage
74F 3.75 mA 0.0
V
IOD
e
150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current
b
0.6 mA Max V
IN
e
0.5V
I
OS
Output Short-Circuit Current
b
60
b
150 mA Max V
OUT
e
0V
I
CCH
Power Supply Current 21 32 mA Max V
O
e
HIGH
3
AC Electrical Characteristics
74F 54F 74F
T
A
ea
25§C
T
A,VCC
e
Mil TA,V
CC
e
Com
Symbol Parameter V
CC
ea
5.0V C
L
e
50 pF C
L
e
50 pF
Units
C
L
e
50 pF
Min Typ Max Min Max Min Max
t
PLH
Propagation Delay 3.0 7.0 10.0 3.0 14.0 3.0 11.0
ns
t
PHL
Anor Bnto O
AeB
4.5 7.0 10.0 4.0 15.0 4.0 11.0
t
PLH
Propagation Delay 3.0 5.0 6.5 3.0 8.5 3.0 7.5
ns
t
PHL
I
AeB
to O
AeB
3.5 6.5 9.0 3.5 13.5 3.5 10.0
Applications
Ripple Expansion
TL/F/9545– 6
Parallel Expansion
TL/F/9545– 7
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows:
74F 521 S C X
Temperature Range Family Special Variations
74F
e
Commercial QBeMilitary grade device with
54F
e
Military environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13×reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0§Ctoa70§C)
D
e
Ceramic DIP
M
e
Military (b55§Ctoa125§C)
F
e
Flatpak
NOTE:
S
e
Small Outline SOIC JEDEC
Not required for MSA package code
SJ
e
Small Outline SOIC EIAJ
MSA
e
Shrink Small Outline (EIAJ SSOP)
4
Physical Dimensions inches (millimeters)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
20-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M20B
5
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M20D
20-Lead (0.300×Wide) Molded Dual-In-Line Package (P)
NS Package Number N20A
6
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300×Wide) Molded Shrink Outline Package, EIAJ, Type II (MSA)
NS Package Number MSA20
7
54F/74F521 8-Bit Identity Comparator
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user.
National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd.
2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16 P.O. Box 58090 D-82256 F4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia
Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999
Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998 Fax: (043) 299-2500
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
Loading...