Nokia 9500 Service Manual 06 ra2 BB

Nokia Customer Care

6 - Baseband Description

and T roubleshooting

Issue 1 09/04 COMPANY CONFIDENTIAL

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

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RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Table of Contents

Page No

Abbreviations ......................................................................................................5

Baseband Top-Level Description ......................................................................7

Operating conditions.......................................................................................... 8

Functional Description of CMT........................................................................ 10

Interfaces between CMT and APE................................................................... 11

Functional Description of APE ........................................................................12

Audio................................................................................................................ 12

Audio control signals........................................................................................ 13

Audio modes.................................................................................................... 13

Internal interfaces ............................................................................................ 14

External interfaces........................................................................................... 15

UI interfaces..................................................................................................... 15

Functional Description of WLAN..................................................................... 20

WLAN medium access controller..................................................................... 20

WLAN – OMAP host interface ......................................................................... 21

WLAN baseband processor............................................................................. 21

WLAN energy management............................................................................. 23

Energy Management.........................................................................................26

CMT EM........................................................................................................... 28

APE EM ........................................................................................................... 28

Battery.............................................................................................................. 29

Charging .......................................................................................................... 30

Backup battery and RTC.................................................................................. 30

Display and keypad illumination....................................................................... 30

Power up and system states............................................................................ 30

System Connector ............................................................................................ 32

Universal Serial Bus (USB).............................................................................. 33

Accessory Control Interface (ACI) ................................................................... 34

HookInt............................................................................................................. 34

After Sales Interface ......................................................................................... 35

User Interface .................................................................................................... 36

Component placement and FPWB outline of 1BV........................................... 37

Hinge connector............................................................................................... 38

PDA display ..................................................................................................... 40

CMT display..................................................................................................... 42

CMT keypad..................................................................................................... 43

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Bluetooth.......................................................................................................... 46

Baseband Troubleshooting.............................................................................. 47

Top level flowchart........................................................................................... 48

UI failure troubleshooting................................................................................. 50

Phone is dead troubleshooting ........................................................................ 54

IR troubleshooting............................................................................................ 55

WLAN BB troubleshooting............................................................................... 56

Bluetooth troubleshooting................................................................................ 57

USB troubleshooting........................................................................................ 59

Flash faults....................................................................................................... 60

Camera module troubleshooting...................................................................... 61

Audio faults troubleshooting............................................................................. 63

MMC troubleshooting....................................................................................... 69

Accessory detection troubleshooting ............................................................... 70

Charging troubleshooting................................................................................. 71

CMT troubleshooting........................................................................................ 72

APE troubleshooting........................................................................................ 73

SIM card error.................................................................................................. 75

APE memory troubleshooting.......................................................................... 76

MDOC troubleshooting .................................................................................... 77

Appendix A: BB Troubleshooting Measurement Points by Troubleshooting Tree 78

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RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Abbreviations

ACI Accessory Interface APE Application Processor Engine ASIC Application Specific Integrated Circuit BB Baseband BT Bluetooth (Low range radio link standard) CCS Customer Care Solution CMT Cellular Mobile Telephone CSR Cambridge Silicon Radio DAC Digital to Analog Converter DC/DC Switched mode power supply DCT4.x Digital Core Technology, fourth.x generation DSP Digital Signal Processing EEPROM Electrically Erasable Programmable Read Only Memory EM Energy Management EMC Electro Magnetic Compatibility EMIFF External Memory Interface Fast EMIFS External Memory Interface Slow ESD Electro Static Discharge FBUS Serial bus FM Frequency Modulation GSM G lobal System for Mobile communications HSCSD High Speed Circuit Switched Data HW Hardware IC Integrated Circuit IMEI International Mobile Equipment Identity IO Input / Output JTAG Joint Test Action Group – a standard trace and debugging interface LDO Low Drop Out MBUS Serial bus

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RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

MCU MicroController Unit MMC Multi-Media Card NAND Flash memory cell type OMAP Open Multimedia Architecture Platform OSP Organic Solderable Preservative PA Power Amplifier PWB Printed Wiring Board (same than PCB) RF Radio Frequency RTC Real Time Clock SDRAM Synchronous Dynamic Random Access Memory SPR Standard Product Requirements SW SoftWare UEM Universal Energy Management Asic (DCT4 EM asic) UI User Interface UPP Universal Phone Processor ASIC (DCT4 processor asic) USB Universal Serial Bus WLAN Wireless LAN

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Baseband Top-Level Description

RA-2/3 HW is based on a platform with a WLAN subsystem. RA-2/3 HW architecture consists of:

• Two colour displays

• QWERTY keyboard

• Cover keyboard

• Engine PWB

There are three PWBs: main engine board, QWERTY PWB and lid fle x. Both displays and the cover keyboard are connected to the engine via the lid flex. The QWERTY keyboard is connected to the engine through a QWERTY controller. Camera is located directly on the engine PWB.

RA-2/3 engine PWB architecture consists of four main building blocks:

• Application Processor Engine (APE)

• Cellular Mobile Telephone (CMT)

• WLAN and

•CMT RF

The APE part is constructed using OMAP1510 processor with external SDRAM and NAND based flash memory as the core. Other major parts for APE are power supplies, UI interfaces, audio support, Bluetooth and camera.

The WLAN subsystem is connected to the OMAP1510 flash interface. WLAN baseband is based on T TNETW1100B Medium Access Controller / Baseband Processor IC. The 2.4GHz radio part is based on zero-IF transceiver and PA. Bluetooth and W LAN share the same antenna and cannot be active simultaneously.

APE and CMT parts are connected together by serial communication buses and by a few control lines. The APE part reset and power control comes from the CMT side. Audio control is mostly on the APE side. APE and CMT operate with no clear master-slave nomination.

The diagram below shows a high level block diagram of RA-2/3.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Figure 1:Simplified RA-2/3 block diagram

CMT

RF

Batte ry

VBAT

Flash 32Mb

UEM

UPP8M

ARM7

Lead3

BB

Regulators

CODEC

SIM I/F

LPRFUART

DSPSIO

Bluetooth

Han ds -fre e In

Han d s-fre e O ut

SIM

MDOC NAND 128MB

SDRAM 64MB

WLAN

Enable

NAND/ NOR IF

Adapter

DAC

APE

REGULATORS

I2C

McBSP1

GP IO I/F

UART2

McBSP2

MCSI2

McBSP3

MCSI1

Flash I/F

SDRAM I/F

Back cover

PA

Hall sw

OMAP1510

ARM925T

LEAD3ph3

LCD I/F CLKM

ARMIO

Botto m C o n n e c to r

MIC ACI

IHF

Camera

USB

UART3 /

PWT/PWL

UART1

SD-MMC

uWire

ARMIO

Keyboard

12MHz

I2C

OUTL

OUTR USB

IrDA

MMC

CBA keys

Backlights Keylights

UEM control

COP8

Cover

keys &

PDA display

Lid Hall

sw

Lid Flex

QWERTY

Cover

display

QWERTY PWB

PWRkey

■ Operating conditions

Absolute maximum ratings

Table 1: Absolute maximum ratings

Signal Note

Battery Vo ltage (Idle) -0.3V - 5.5V Battery Vo ltage (Call) Max 4.8V Charger Input Voltage -0.3V - 16V

Battery voltage maximum values are specified during active charging.

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DC characteristics

Table 2: Battery voltage range

Signal Min Nom Max Note

VBAT 3.1V 3.6V 4.2V (charging high limit voltage) 3.4V SW RF cut off

Battery maximum voltage is specified when charging switch is disconnected after/between charging pulses.

Temperature conditions

Full functionality is achieved in the ambient temperature range -15 oC to +55 oC. Reduced functionality between -25

The required storage temperature is -40

o

C to -10 oC and +55 oC to +70 oC.

o

C to +85 oC.

ESD immunity

SPR limits are 8kV for galvanic contact and 15kV for air discharge with normal and reversed polarity.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Functional Description of CMT

The CMT architecture of RA-2/3 is based on DCT4 Common Baseband. The main functionality of the CMT baseband is implemented into two ASICs: UPP (Universal Phone Processor) and UEM (Universal Energy Management).

32Mbit NOR flash is used to store the program code. For a simplified block diagram of the RA2/3 CMT baseband, see Figure 2, “Simplified CMT baseband block diagram” on page 11.

System clock for the CMT is derived from the RF circuits. For GSM it is 26 MHz. The low frequency sleep clock is generated in the UEM using an external 32.768 kHz crystal. The I/O voltage of the CMT baseband is 1.8V and the analog parts are powered from 2.8V power rails. The core voltage of UPP can be altered with SW depending on the prevailing processing power requirements.

UEM is a dual voltage circuit. The digital parts are running from the baseband supply (1.8V) and the analog parts are running from the analog supply (2.8V). So me blocks of UEM are also connected directly to the battery voltage (VBAT). UEM includes 6 linear LDO (low drop-out) regulator for the baseband and 7 regulators for the RF. It also includes 4 current sources for biasing purposes and internal usage.

Some parts of the SIM interface have been integrated into UEM. The SIM interface supports only 1.8V and 3V SIM cards. Data transmission betwe en the UEM and UPP is handled via two serial buses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP and the audio codec is in UEM.

The analog interface between the baseband and the RF sections has been implemented into UEM. UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and supplies the analog TXC and AFC signals to RF section under the UPP DSP control. The digital RF-BB interface, consisting of a dedicated RFIC control bus and a group of GenIO pins, is located in the UPP.

The baseband side supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is performed in the UEM according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to UEM for decoding.

RA-2/3 has two galvanic serial control interfaces for CMT: FBUS and MBUS. Communication between the APE and CMT parts is handled through 2 serial buses: XBUS and

XABUS. XBUS is the main communication channel for general use, and XABUS is intended mainly for audio data transfer. Also the system reset (PURX) and SleepClk for APE are taken from the CMT side. The PURX is delayed approximately 130ms to fulfil OMAP1510 reset timing requirements. One of UEM’s IR level shifters is used for SleepClk level shifting both to APE and WLAN.

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Figure 2:Simplified CMT baseband block diagram

CMT - APE interface

Prod/AS

Test IF

FBUS

UEMKUPP 8M

UEM

MBUS

32kH

z

CHRG current sense

1.8V/3V

PWR on key

SIM

EAR

MIC

RF-BB

IF

JTAG

RFConv

RFIC

Control

RF

Control

RFClk

XBUS XABUS

PUR delay

+ lvl shift

PURX

RFConvIF

Internal SIM IF

SleepClk

Audio IF

MBUS

FBUS

DBUS

CBUS

Zocus

BATT. IF CHRG. IF

Control

from APE

IHF

Memory

32Mb Flash

PWREn

Accessory

regulator

MIC+ACI

L+R

System Connector

XEAR

Audio

DAC

Audio

AMP

L+R

■ Interfaces between CMT and APE

XBUS

XBUS is the main communication interface between the CMT and APE parts of RA-2/3. This 6-pin interface is implemented using UART2 of OMAP1510 (APE), LPRFUART of UPP (CMT) and 2 general purpose I/O pins from both ASICs.

XABUS

XABUS is a synchronous serial interface which is used for uncompressed PCM audio data transfer between the DSPs of UPP (CMT) and OMAP1510 (APE). This interface utilises the DSPSIO of UPP and the MCSI_2 of OMAP1510. In addition to these one UPP GenIO and two dedicated pins of OMAP1510 are needed for XABUS clock generation and control.

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Functional Description of APE

APE term includes not only the processor itself but also the peripherals around it, clocking, resetting and power management for these parts.

APE is based around OMAP1510 (Open Multimedia Application Platform) processor. Peripherals attached to OMAP1510 include:

• Audio DAC

• Camera

• Bluetooth

• Cover display

•PDA display

• Memory card

•IrDA

• Cover keypad & CBA buttons

• QWERTY controller

• External SDRAM

• Flash memories

•WLAN

APE acts as a system slave compared to the CMT side. CMT holds the master reset and power management logic. APE and CMT are connected through a serial link called XBUS.

■ Audio

Figure 3:RA-2/3 Audio architecture

DSP_SIO

XABUS

4

PCM

CSR

BT

XBUS

control

BT

UPP

UART2

MCSI2

MCSI1

UART1

1

Ringtones

Streaming

engine

OMAP1510

MP3 decoder

Entertainment

effects

D

A

McBSP1

I2CI/F

McBSP2

A

UEM

L P

Stereo or mono

digital audi o

MIC1 MIC2 MIC3

EARP/EARN

HF/HFCM

XEAR

I2S, Digital Audio;

4

I2C

Control

2

Mic_In

TLV320AIC23B

R_Line_In

L_Line_In

R_HP_Out

L_HP_Out

R_Out

~10dB

Attenuator

L_Out

McBSP Contro l , S PI Mode;

3

2

IHFIn

Phone HS

1

RIn

Lin

1

LM4855

IHFOut

ROut

LOut

2

Tomahawk

As RA-2/3 is based on a dual-processor architecture, audios are also divided into APE and CMT parts. Audio control is mostly on the APE side. Phone audio is routed from the CMT side

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to APE in analog form. On the CMT side, audio HW is integrated into the UEM ASIC. On the APE side, the most important parts are OMAP1510, audio DAC and audio power amplifier.

The stereo output of this amplifier is designed for use with the ext ended Pop-port

TM

connector.

It also has a differential mono output for driving the handsfree speaker. The battery voltage (VBAT) is used directly as a supply voltage for the audio amplifier. The type of DAC used is TLV320AIC23B and the supply voltage for this is coming from V28.

■ Audio control signals

Audio DAC is controlled via I2C bus by OMAP1510. Digital audio data from OMAP1510 to DAC is coming via MCBSP1.

The audio amplifier is controlled through a 3-wire SPI bus (MCBSP2 of OMAP1510). Audio mode of the amplifier and gain values are controlled via SPI bus.

The HEADINT signal is needed for recognising the external device (e.g. headset) connected to system. The recognition is based on the ACI-pin of the system connector, which is shorted to ground inside the external device.

The button of the external device generates HOOKINT interrupt and is used to answer or end a phone call.

■ Audio modes

HP call

The basic audio mode is the hand portable mode. This is entere d whe n no audio accessories are connected and handsfree mode is not selected by opening the cover.

The call is created by CMT. The internal earpiece is driven by the CMT engine for voice calls. The internal microphone is driven by the CMT for voice calls and voice recording. The internal microphone is enabled and uses the MICB1 bias voltage from UEM.

IHF call

This mode can be entered by user selection (opening the cover). The call is created by CMT. The internal microphone is driven by the CMT for voice calls and

voice recording. The internal microphone is enabled and uses the MICB1 bias voltage from UEM as in HP mode.

XEAR output of UEM is used to drive mono output signal is connected to the APE Audio DAC. Signal is then routed to the Phone_In_IHF input of the LM4855. This drives the internal speaker via the SPKRout driver.

Accessory call

This mode is used when accessory is connected to the system connector. The call is created by CMT. The uplink signal is generated by external microphone and trans-

ferred to UEM MIC2 input (via XMIC signals from Pop-port bias voltage and MIC2P/N inputs are enabled on UEM.

As in IHF call down link audio signal is routed through the single ended XEAR output driver in UEM. The mono XEAR output is connected to the DAC and then signal is routed to the L

Issue 1 09/04 COMPANY CONFIDENTIAL 13

TM

connector). Hence the MIC2B

IN

and

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

RIN inputs of the LM4855. Accessories are driven via Pop-portTM connector using the L

OUT

driver of LM4855.

APE audio

This mode is entered when user starts the multimedia application (e.g. MP3, AAC etc.), which is played via IHF speaker or Pop-port

Audio data from MMC is sent by OMAP1510 to the external audio DAC through the I nection. The DAC performs the digital to analog audio conversion.

For playback via the internal speaker signal from DAC is routed to Phone_in_IHF input on LM4855.

For playback via the stereo/ mono headset or other Pop-port is routed to the L

/RIN inputs of the LM4855. In case of mono accessory OMAP1510 will pro-

IN

duce monophonic signal to DAC.

TM

accessories.

2

S con-

TM

accessories signal from DAC

■ Internal interfaces

In practice, all APE internal interfaces consist of interfaces connected from OMAP1510 to peripheral devices. All UI related interfaces, memory interfaces, USB and MMC are covered in separate sections of this document.

McBSP interfaces

OMAP1510 can support maximum of three independent Multi-channel Buffer Serial Ports (McBSPs) interfaces. However, these ports are slightly different and particularly suitable for different purposes. McBSP1 supports I2S protocol and is connected to external audio codec. McBSP#2 and #3 can be used as general purpose SPI interface supporting bit rates up to 5Mbits/s. McBSP2 is used to control the audio PA. McBSP3 clock output is used as audio codec master clock. Other McBSP3 signals cannot be used because they are multiplexed with uWire signals.

MCSI interfaces

The MCSI is a serial interface with multi-channels transmission capability. MCSI1 is used to interface with Bluetooth and MCSI2 is used as XABUS (DSP-DSP bus between CMT and APE)

UART interfaces

OMAP1510 has three UART interfaces capable of 1.5Mbit/s data rates. UART1 is used as Bluetooth control interface, UART2 is used as XBUS (MCU-MCU bus between CMT and APE), UART3 includes 115.2 kbit/s IrDA modulation support, and is used to communicate with external IrDA device.

UWire interface

The uWire interface is a standard serial synchronous bus protocol with two chip select lines. Interface is used as PDA LCD control bus (CS3) and as a unidirectional data bus for the Cover display (CS0).

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I2C

The I2C is a half-duplex serial port using two lines, data and clock, for data communications with software addressable external devices. I control bus. External keyboard controller COP8 is also connected to APE via I

2

C is used as audio codec and camera module

2

C.

ARMIO

ARMIO provides 5 ARM processor controllable GPIOs by default, and 5 more are available with different multiplexing scheme. ARMIOs also include a keyboard interface. The GPIOs consists programmable debouncing circuit but can be accessed directly only by the ARM processor. Both ARMIOs and keyboard interface signals can wake-up OMAP1510 from deep sleep and big sleep states.

GPIO

14 General Purpose Input/ Output External pins are multiplexed between ARM/DSP. Multiplex logic is programmed and controlled by ARM and supports pin-by-pin configuration.

■ External interfaces

Back cover switch

A hall switch is used for back cover removal detection. A magnet is attached to the back cover. A sensor gives a warning to prevent data loss or corruption when writing to the MMC card.

Lid hall switch

A hall switch is used to detect the lid position. The switch is located on QWERTY PWB and is connected to COP8 controller. The magnet is in the lid.

MMC

The MMC Interface in OMAP1510 is fully compliant with the MultiMediaCard system specification version 3.1. RA-2/3 MMC interface voltage is 3 V.

USB

The OMAP1510 USB Controller is a Full Speed Device (12 Mb/s) fully compliant with the Universal Serial Bus specification Revision 2.0. The USB Client (a mobile terminal) is connected to the USB Host (a PC) through the system connector.

■ UI interfaces

Displays

S80 display interface

S80 display utilizes the 16-bit synchronous LCD interface of OMAP1510, and uWire for control data.

Cover display interface

RA-2/3 has a separate small 65k colours display connected to OMAP1510 via uWire interface. There is an unidirectional level shifter between OMAP and the display, so no da ta can be read from the display.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Figure 4:Display interfaces

OMA P1510

DOUT

U

w

e

DIN

I

Cs0

r

CLK

RST

Cs3

RST

Level

Shifte rs

CMT Disp la y

Da ta

L

CS Clock Re s e t

PDA Display

Din

Dout Clk CS

Re s e t

O

S S

i

Vid e o data

Vid e o

data

Keyboards

Cover keyboard and CBA buttons

The cover keyboard and the four CBA buttons are directly connected to the OMAP1510 keyboard matrix.

QWERTY

An external keyboard controller is used for the QWERTY keyboard. COP8 is connected via I2C bus to OMAP1510 with an additional interrupt line to OMAP1510.

Power button

The power button is connected directly to UEM in the DCT4 engine. See Chapter Power up and system states for further details on the power button operation.

Camera

8-bit parallel camera interface connects OMAP1510 chip to the camera module. I2C bus is used for controlling the camera module.

Main features

Imaging and resolution:

• VGA resolution 640x480

• 1/4" sensor area

• 16bit colours (5+6+5 / R+G+B)

• Frame rate 15fps in all modes (30fps for QVGA, QQVGA, QCIF and subQCIF)

• Three different exposure modes: normal, long (frame rate / 4) and extra long mode.

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• Automatic image features: luminance level control, white balance control, blemish detection and control, fluorescent flicker frequency detection

Optics:

• Fixed focus (from 30cm to infinity)

• Two plastic lenses with antireflection coating

• Viewing angle 50.7 degrees

•F 2.8

Interface

The camera module contains a CMOS image sensor, image processing functions, camera image data IF (8-bit parallel data interface + sync and clock signals) and control IF blocks. The camera is connected to the camera interface of the OMAP1510. I2C interface is used for camera control (slave address 78H). Control IF supports transfer rate up to 400kbit/s (Fast mode I2C bus). Parallel image data stream is conformity with CCIR656. OMAP1510 contains camera interface block, which contains the buffer, the clock divider, the interrupt generator, and Rhea registers.

The camera module is connected to OMAP1510 processor on Nokia engine PWB via flex and a 20-pin connector. Description and order of the signals are shown in Table 3, “Interface signals of camera module with 20-pin connector”. All the signals go through the camera flex.

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Table 3: Interface signals of camera module with 20-pin connector

Pin #Signal name

(Camera)

1 GND1 GND - Ground line corresponding to VDDI 2 D0 CAM_D0 O Digital output data (LSB) 3 SDA SDA I/O

4 D1 CAM_D1 O Digital output data 5 SCL SCL O

6 D2 CAM_D2 O Digital output data 7 VDDI V18 - Supply volt age to a ca mera module (for

8 D3 CAM_D3 O Digital output data 9 Extclk CAM_EXCLK I System clock from Nokia engine to the

Signal name

(Engine)

I/O/Z Description

Serial data line of I2C bus

Serial clock line of I2C bus

digital)

camera module. Typical value for camera is 1.0 V.

10 D4 CAM_D4 O Digital output data 11 GND3 GND - Ground line corresponding to Extclk 12 D5 CAM_D5 O Digital output data 13 HD CAM_HS O Horizontal synchronization data 14 D6 CAM_D6 O Digital output data 15 VD CAM_VS O Vertical synchronization data 16 D7 CAM_D7 O Digital output data (MSB) 17 VDD V28 - Supply voltage to camera module (for

analog and I/O) 18 Dclk CAM_LCLK O Data clock synchronization pulse 19 Vctrl CAM_RSTZ I Activating signal for the camera module

(active HIGH). The min. high level of

Vctrl must be 1.5 V. Voltage divider

used.

20 GND2 GND - Ground line corresponding to VDD

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Bluetooth

A single chip Bluetooth solution, BC02, is used in RA-2/3. The chip contains radio and baseband parts as well as MCU and on-chip ROM memory. Together with some external components (filter, balun etc.) and the antenna, it forms the Bluetooth system, which is attached to the host (OMAP1510). Bluetooth components are mounted directly to the PWB. Bluetooth antenna and filter are shared with WLAN.

IrDA

RA-2/3 design includes a small (height 2.2 mm) metal shielded module. The modules use speeds up to 115.2kbps.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Functional Description of WLAN

RA-2/3 has an integrated 11Mbps 802.11b capable WLAN radio. WLAN power supply is based on a set of linear regulators and a load switch. A 22MHz crystal oscillator supplies main WLAN clock. Bluetooth shares the same physical antenna with WLAN.

The TNETW1100B MAC/BPP is connected to OMAP1510 flash memory interface via 16 data bits and 4 address bits, plus some control lines.

Figure 5:RA-2/3 WLAN block diagram

V28V18

RF

2.4GHz WLAN

22MHz

BBP/MAC

VBAT

2.8V

1.8V2.8V

CORE

A_IO/A_AFE

IO/D_AFE A_AFE

RF Ctrl

EEPROM

A/D

D/A D/A

BBP

MAC

Host

IF

ARM7

64kB

SRAM

BT

RF5117

MAX2821

VCO/PLL

■ WLAN medium access controller

TNETW1100B

TNETW1100B implements basic IEEE802.11 functionality. The system is built on Arm7 and a dedicated DMA controller. Dedicated hardware accelerators for MAC protocol processing and WEP offload the processor. The chip integrates SRAM for storing both data and code.

DMA controller connects data memory and host interface with processor and baseband processor interface. Transmit and receive data buffers are implemented as linked lists of memory blocks. The DMA engine is capable of handling the lists without intervention from embedded Arm.

Clocking, reset and wake-up

WLAN uses a 22 MHz reference clock CMOS level signal. The reference oscillator has logic level enable signal and low-power sleep mode. The reference oscillator is controlled by a TNETW chip.

The sleep clock is derived from the GSM engine and it is constantly running. UEM generates 32 kHz sleep clock at 1.8 V signal level. UEM internal level converter is used to raise the sleep clock level to 2.8 V. The same sleep clock is used for both Helen and TNETW.

A Helen GPIO controls TNETW reset. Another GPIO controls the main power supplies to the WLAN hardware.

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Power up sequence

1. Helen enables the WLAN power regulators with a GPIO.

2. 50 ms delay to enable the WLAN powers to stabilize.

3. Helen takes the WLAN out of reset with a GPIO.

4. Helen configures EMIF_CS.

5. Helen activates TNETW1100B interface delay logic and enables the enhan ced slave mode.

6. Helen checks if the EEPROM is empty, and if it is empty, Helen programs a default content to it.

7. Helen downloads the WLAN firmware to the TNETW1100B and initializes it.

8. Power up sequence is complete.

■ WLAN – OMAP host interface

TNETW1100B is connected to Helen external memory interface (EMIFS). The interface is shared with RA-2/3 flash system consisting of NAND flash + controller on the same die (MDOC).

Figure 6:TNETW1100B and NAND Flash share Helen EMIFS interface

2.8 V TNETW1100B

Helen EMI FS

2.8 V

1Gb MDOC

TNETW1100B host interface I/O voltage is 2.8 V. Therefore the MDOC host interface also runs at 2.8V

Two GPIOs from Helen are used for controlling the WLAN hardware. One GPIO controls the main power supply regulators for WLAN, and the other is used for resetting the TNETW. One Helen Armio is used to generate interrupt from WLAN when Helen is in sleep. Helen can go to deep sleep while WLAN is active, ARMIO is capable of waking it up.

■ WLAN baseband processor

Baseband processor part of TNETW1100B implements signal processing required for transmission and reception of the IEEE802.11b signal. BBP includes mixed-signal interface to the radio (analog front-end, AFE).

Receiver portion of BBP controls the radio receive AGC and DC offset compensation circuitry. The receiver is capable of processing both long and short preambles and supports Barker and CCK modulations as well as proprietary 22 Mb/s PBCC mode.

Transmitter RF-BB interface

Transmitter RF-BB interfaces are shown in Figure 7, “Transmitter RF-BB interfaces” . TNETW has on-chip current mode differential output dual DAC for generating transmitted I/Q signals.

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The converters are clocked at 44 MHz. Current mode output is converted to differential voltage mode signals by means of resistive bias network (Q signal shown, I signal bias network identical). I/Q signals are fed into Maxim MAX2821 RFIC where they are modulated onto 2.4 GHz carrier.

Power amplifier is RF5117, which requires external OpAmp for transmit power detection, see Transmitter RF-BB interfaces.

Figure 7:Transmitter RF-BB interfaces

TNETW1100B

D/A

A/D

TX I TX Q

VGA_BIAS_CTL

TX_AGC

TX_PWR_DET

TX (RCTL_A1) RX (RCTL_A2) PA_EN (GPIO6) S_DATA, S_CLK, SER_EN

MAX2821

Mod

RF5117

Balun

TX RF

Receiver RF-BB interface

Receiver RF-BB interface is shown in Figure 8, “Receiver RF-BB interfaces” . Incoming RF signal is converted to differential signal in a balun. After balun there is a switchable LNA with high gain and low gain modes. The mode of the LNA is controlled by the TNETW based on the signal level on I/Q ADC output.

RX AGC control signal has a similar switchable resistive bias network as the transmitter chain. The switch is shared with TX AGC bias network.

Figure 8:Receiver RF-BB interfaces

RX RF

Balun

MAX2821

Demod

VGA_BIAS_CTL

TX (RCTL_A1)

RX (RCTL_A2)

RX I

RX Q

RX_AGC

AGC_STAT

ATT_SW

TNETW1100B

A/D

D/A

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■ WLAN energy management

WLAN regulators

Figure 9:WLAN EM block diagram

VBAT

3.0...4.2V

OMAP1510

WLAN

Power

Control

ORgate

V18

LM2708H

DC/DC Converter

1.8V@450mA

15mA in Linear

Mode

V28_WLAN_RF

LP3985

Regulator

2.8V @ 150mA

V28_WLAN_SYN

LP3985

Regulator

2.8V @ 150mA

GPIO7 GPIO 10

LOW_POWER

V18_WLAN_ANA

LP2985LV Regulator

1.8V @ 150mA

V28_WLAN_DIG

LP3985

Regulator

2.8V @ 150mA

V18_WLAN_DIG

FDG6331L

Power Switch

1.8V@100mohm

REFCLK_ENA

MAX2821

Zero_IF Transceiver

22MHz

Osc

TNETW1100B

BB/MAC

V30AAFE

V30AIO

V18AAFE

V33DAFE

V33DIO

V18DOSC

V18DCORE

V18DRAM

VDPCI

RFMD 5117 PA

V28

LP3981

Regulator

2.8V@300mA

Level shifted 32kHz Sleep Clock from

UEM (2.8V)

The 1.8V voltage for TNETW core and internal RAM is taken from DC-DC converter that is already present for powering Helen, SDRAM, etc. Helen controls the 1.8V voltage to TNETW by a load switch. The same Helen GPIO is used for controlling the 2. 8V linear regulator powering WLAN RF, TNETW analog IOs and AFE (analog front end). Another Helen controlled 2.8V linear regulator supplies TNETW digital IOs and D_AFE (digital parts of analog front end).

WLAN controls the DC-DC converter LDO mode together with APE. When WLAN is in active mode (i.e. Not in poweroff, doze or sleep), the REFCLK_ENA signal from TNETW1100B forces the DC-DC converter to active mode.

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TNETW controls two regulators to minimize current consumption during sleep mode. The 1.8V regulator supplies the A_AFE (analog parts of analog front end). The 2.8V regulator supplies the synthesizer part of MAX2821.

WLAN RF power amplifier is powered directly from VBAT. VBAT voltage is nominally 3.6 V, but reaches 4.8 V momentarily at the end of the charging. After charging the battery voltage can reach 4.2 V.

The 22 MHz reference oscillator has an enable signal and therefore it has no dedicated regulator.

WLAN EM concept and battery capacity

WLAN engine has two major power management modes: sleep and active. It is also possible to shut down the WLAN for reduced power but the wake-up time is in the order of seconds. Shutting down the WLAN is used when the user chooses to deactivate the WLAN by selecting Bluetooth.

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Table 4: WLAN power modes

Mode Description Current

Power Off

WLAN is powered down. Entering active mode requires firmware download and

~ 0 µA ~ 1 s

configuration of the WLAN engine. Wakeup can only be initiated by the host.

Deep Sleep

Deep Sleep is physically the same mode as Doze. Logical connection to network is

53µA 2-3 ms

not (yet) established. This is the state after firmware download and issuing sleep command. WLAN runs from 32 kHz sleepclock and 22 MHz reference clock is turned off. Radio is in low current standby mode. Analog 1.8V supply to TNETW and 2.8V synthesizer supply are turned off by TNETW to further reduce current consumption.

Doze Doze mode is similar to Deep Sleep

53 µA 2-3 ms mode. Wake-up time is dominated by the 22 MHz reference oscillator start-up time.

Wake-up

time

Active In active mode the WLAN system is

either in receive or transmit mode.

Note1: Values roughly estimated

~220 mA RX,

~270 mA TX.

1)

-

WLAN MAC takes care of the transitions between Doze and Active mode. It also automatically controls the radio active modes (transmit and receive). These transitions are initiated by MAC protocol state machine. For example, mode change is initia ted when the host starts data transfer or when the MAC decides to listen for incoming beacons.

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Energy Management

Energy Management covers both CMT and APE sides. WLAN energy management is considered to be part of WLAN subsystem. Battery and charging functions are integrated into CMT Universal Energy Management (UEM) ASIC. UEM includes also all needed regulators for CMT BB and RF. APE side has its own discrete power supplies.

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Figure 10:Power distribution diagram

Measurement resi stor

BATTERY

LM38 20

UEM

VR1..7

VSIM

VANA VFLASH1 VFLASH2

VCORE

LP3985-2.8

2.8V

GENIO28

Tomahawk

USB

LP3981-2.8

2.8V

LM2708H-1.57

1.57V

LM2708H-1.8

1.8V

LP3985-3.0

3.0V

GPIO15

LP3985

2.8V

GPIO7

LP3985

2.8V

LP2985LV

1.8V

LP3985

2.8V

GPIO7

TK11851L

Call LED1

VIO

Vout

Vbus

V28

V15

V18

VMMC

7

LO AD SW ITCH

GPIO7

U P P CORE I/O

OM A P1510

I/O (2 .8 V ) USB I/O (1 .8 V ) CORE

Tom ahaw k

Vout

LP2985-3.3

3.3V

GPIO3

QWERTY

I/O + COR E

RF PA Various

SIM

CMT FLASH

VCC I/O

AUDIO PA

BT

CORE

V33

I/O

AUDIO DAC

NAND FLASH+S eija

CORE+I/O

SDRAM

I/O CORE

MMC

WLAN

PA

MAX2820

Zero_IF Transceiver

GPIO10

Re fCLK ENA

TNETW1100B

V27AFE

V27IO V18AAFE V30DAFE

V30IO

V18DOSC

V18DCORE

V18DRAM

V30PCI

Camera

I/O CORE

BB/MAC

S80

VDDI VDD Backlight

CMT display

+ keypad

VDDI VDD Backlight

Battery line Power line

Control signal

Measurem ent signal

Dli ght

Klight

Cu rren t

m irror / Switch

Switch

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■ CMT EM

UEM includes following blocks:

• Baseband regulators (6 different LDOs)

• RF regulators (6 different 2.78V LDOs, 4.75V LDO and two current regulators)

• Power up/down logic (state machine).

• Charger switch and control

LM3819

(=Zocus-C) is the current measurement chip used for phone and charging current measurement. It can be used to estimate the battery charge level presented as battery bars on the display. Results are read with CBUS interface to the UPP.

VBAT

Charger

UEM

Cbus

PWB track

sense resistor

LM3819

To UPP

Battery

■ APE EM

APE side EM HW consists of several discrete regulators (listed shortly below):

• Two DC/DC converters for generating 1.57V and 1.8V to OMAP1510 and SDRAM and WLAN core.

• One linear regulator for 2.8V APE side logic, NAND, etc.

• One 3.0V linear regulator for powering of MMC card.

• One 3.3V linear regulator for powering the USB block of OMAP1510.

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■ Battery

1300 mAh Li-Po battery pack BP-5L is used in RA-2/3.

Table 5: BP-5L characteristics

Description Value

Nominal discharge cut-off voltage 3.1V Nominal battery voltage 3.6V Nominal charging voltage 4.2V

Table 6: Pin numbering of battery pack

Signal

name

VBAT 1 Positive battery terminal BSI 2 Battery capacity measurement (fixed resistor inside the

GND 3 Negative/common battery terminal

Temperature and capacity information is needed for charge control. The BSI fixed resistor value indicates type and default capacity of a battery. NTC-resistor that measures the battery temperature is located inside the phone on th e engine

PWB. This resistor is connected to the UEM BTEMP –line.

number

Function

battery pack)

Figure 11:Battery pack contacts

BSI resistor is connected to the battery connector pin. Phone has 100 kOhm pull-up resistor for the line so that it can be read by A/D input in the phone.

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Table 7: BSI Resistor Values

Parameter Min Typ Max Unit Notes

Battery size indicator resistor BSI

NTC thermistor BTEMP (inside phone)

100 kOhm Battery size indicator for 1300 mAh

battery (BP-5L), Tolerance +/- 1%

47 kOhm Battery temperature indicator (NTC

pulldown) 47kOhm +/- 5% @ 25C

4000 Ohm Beta value (B).

Tolerance ”5%, 25C / 85C

■ Charging

RA-2/3 supports all DCT4 chargers. 3-wire chargers are supported, but 3-wire charging is not. In practice, this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers. 1Hz PWM signal is used to control UEM's charge switch.

■ Backup battery and RTC

Rechargeable backup battery is used for keeping real time clo ck running in case the main battery is either removed or the power level is below the cutoff limit.

Real Time Clock (RTC), crystal oscillator and backup battery circuitry are inside UEM. Two regulators are used to provide needed voltages for external backup supply and backup battery charging: VRTC for internal clock circuitry and VBU for backup battery charging. The backup battery has voltage range VBACK = 2.0V charged down to 2.0V).

min

– 3.2V

– 3.3V

typ

(charged to 3.2V and dis-

max

■ Display and keypad illumination

One DC-DC converter generates the voltage for displays and keypad illumination. The conve rter is able to supply cover display and keypad OR PDA display, but both cannot be active at the same time. UEM controls the DC-DC converter and selection of cover/PDA display under APE control. The brightness of both cover and PDA display can be adjusted with UEM PWM output. For further details, see RA-2/3 flex section.

■ Power up and system states

System starts automatically after the battery is inserted. The power button is connected to UEM PWRONX pin on the CMT side. This power button is only used for selecting operating mode and switching the RF part of the device ON and OFF when needed. APE is started when UEM releases a PURX-signal, which controls OMAP1510 processor reset input.

Power off happens in the lowest SW cutoff limit when UEM watchdog is not updated anymore by SW and after that PURX goes to reset and system power supplies are switched OFF. However also in this power OFF mode (BACK_UP mode in UEM) part of UEM is powered ON but for user the device is dead. Only way to wake up from this mode is to plug in the charger or replace empty battery with the charged one.

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Operating modes

• NO_SUPPLY mode means that the main battery is not present or its voltage is too low (below UEM master reset threshold limit) and back-up battery voltage is too low.

• In BACK_UP mode the main battery is disconnected or empty but back-up battery has sufficient charge in it

• IN POWER_OFF mode the main battery is present and its voltage is over UEM master threshold limit. All regulators are disabled. Device can enter in Power Off – mode e.g. due to thermal shutdown or watchdog elapsing or VBAT falling below VCOFF-.

• RESET mode is a synonym for start-up sequence and contains in fact several modes. In this mode certain regulators and system oscillators are enabled and after they have stabilized, the system reset (PURX) is released and PWR ON mode entered.

• In POWER_ON mode SW is running and controlling the system

• SLEEP mode is entered only from PWR ON mode when system activity is low. CMT and APE sides can be in sleep mode independently from each other.

Power up sequence

RESET mode can be entered in three ways: by inserting the battery or charger, or by RTC alarm.

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System Connector

RA-2/3 supports usage of Pop-PortTM bottom connector. This means support for Pop-PortTM stereo and mono headsets with and without ACI, USB cable.

Pop-Port consists of a charging plug socket and system connector. The Pop-Port is a featurebased interface. The accessory contains information about its features (ACI ASIC) and it is detected with a fully digital detection procedure.

FBUS accessories are not supported. Pop-Port

voltages are: 2.43V(min.) and 2.86V(max.). In RA-2/3 2.8V linear regulator is used to supply accessories. Regulator output current capability is 150mA.

Four new functions are introduced with the system connector interface:

TM

connector includes VOUT pin, which is 2.78V/70mA output to accessories. VOUT

• Accessory control interface (ACI)

• Power out

• Stereo audio output

• Universal serial bus (USB)

Table 8: Pop-port

Function Note

Charging Pads for 2-wire charging in cradles Audio 4-wire fully differential stereo audio output Power supply for

accessories ACI (Accessory Con-

trol Interface) FBUS Standard FBUS, Fast FBUS

USB (default) USB v.2.0 device mode (full speed 12M)

2.78V/70mA output to accessories

Accessory detection/removal & controlling

Note! RA-2/3 does not support accessories using FBUS serial interface.

TM

functions

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Figure 12:Pop-PortTM connections

PWB

Charge

Shielding GND

Charge GND

Table 9: Pop-port

ACI

Vout

USB D-

USB D+

USB VBUS

TM

connections

DATA GND

XMIC N

XMIC

HSEAR N

HSEAR

HSEAR R N

HSEAR R P

Shielding GND

Pin # Signal Note

1 VCHAR 2 GND Charge ground 3 ACI Insertion & removal detection /Serial data bi-directional 1

kbit/s 4 Vout 200mW 5 USB VBUS 6 USB D+/FBUS RX 7 USB D-/FBUS TX 8 USB data GND Data ground 9 XMIC N Negative audio in signal 10 XMIC P Positive audio in signal 11 HSEAR N Negative audio out signal.

Max bandwidth from the phone 12 HSEAR P Positive audio out signal.

Max bandwidth from the phone 13 HSEAR R N Not connected or grounded in mono. 14 HSEAR R P Not connected or grounded in mono.

■ Universal Serial Bus (USB)

The USB interface of OMAP1510 supports the implementation of a full speed device, fully compliant to USB2.0 standard. RA-2/3 uses an integrated USB transceiver.

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■ Accessory Control Interface (ACI)

ACI (Accessory Control Interface) is a point-to-point, bi-directional serial bus. ACI has two main features: 1) detecting the insertion and/or removal of an accessory device 2) acting as a data bus. A third function provided by ACI is to identify and authenticate a specific accessory which is connected to the system connector interface.

All accessories cause headint interrupt when connected to or disconnected from the system connector. The insertion of an accessory generates a Headint interrupt by pulling the ACI line

down. When no accessory is present, the UEM’s internal Headint pull-up resistor keeps the line

high

.

All accessories have common detection start sequence, when phone gets headint interrupt from high to low transition in ACI pin.

VOUT (Accessory Voltage Regulator)

An external LDO Regulator is needed for accessory power supply purposes. All ACI-accessories require this power supply. Regulator input is connected to the battery voltage VBAT and output is connected to the Vout pin. Regulator is controlled via UPP (On/Off-function).

■ HookInt

The hook signal is generated by creating a short circuit between the headset microphone signals. An LP-filter is needed on the HookInt input to filter the audio signal. In this mode, the earpiece signal on the HF and HFCM pins is in the opposite phase. The earpiece is driven differentially.

DC-plug

RA-2/3 uses a 3.5mm DC-plug. 3-wire chargers are supported, but 3-wire charging is not. In practice this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers. 1Hz PWM signal is used to control UEM's charge switch.

VCHAR pins of system connector

The VCHAR and ChargeGND pin are directly connected to the normal charger lines of the DCplug.

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After Sales Interface

Test pads are placed on engine PWB on battery side for service flashing and testing purposes.

Figure 13: Pin assignment in test pattern

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User Interface

1BV is the UI flex module of RA-2 & RA-3 (US variant) communicators locating on the upper lid and connecting the following functional blocks to phone engine:

•PDA display

•CMT display

• CMT keypad

• Power key

• Illumination

• Earpiece

In addition to the actual components to provide the needed functionality, there are some components to filter out possible EMI/ESD disturbance. Figure 14, “Block Diagram of UI HW” shows a block diagram of the UI HW of RA-2/3.

The HW UI is based on APE chip (OMAP1510).

Figure 14:Block Diagram of UI HW

LCD IF uWire Reset

OMAP1510

uWire Reset

2

C

I

2

C

I Camera IF

Level

shifter

Keyboard IF

COP8

UI HW

PDA display

CMT display Illumination

Keypad

QWERTY

Camera

Power key

Earpiece

Upper Lid

Lower Lid

UPP

Klight, Dlight, CalLED1

UEM

PWRONX

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■ Component placement and FPWB outline of 1BV

1BV FPWB board size is 150x70mm. It has a double-layer structu re. Hinge part is single layer. All the components are placed on one side of the 1BV FPWB. Figure 15, “Main components of 1BV” shows the main components and all the test points of the 1BV module.

Figure 15:Main components of 1BV

Figure 16:Test points of 1BV module

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■ Hinge connector

Hinge connector (NMP code 546Y131) is a 60-pin board-to-board type connector with 0,5mm pitch, which connects flex module to the engine module. Table 10, “Interface signals of hinge connector” shows all the signals through hinge area of the flex.

Table 10: Interface signals of hinge connector

Signal

Pin #

1WIRE_nSCS00 – 2.8V I Uwire chip select for CMT display (active

2 KBC5 0 - 2.8V I Keyboard interface column line 3 KBC4 0 - 2.8V I Keyboard interface column line 4 KBC3 0 - 2.8V I Keyboard interface column line

name

(Engine)

Voltage level I/O/Z Description

low)

5 KBC2 0 - 2.8V I Keyboard interface column line 6 GND 0V - Ground 7 GND 0V - Ground 8 GND 0V - Ground 9 GND 0V - Ground 10 KBC1 0 - 2.8V I Keyboard interface column line 11 LCD_PCLK 0 - 2.8V I Display interface pixel clock for PDA dis-

play 12 LCD_PXL11 0 - 2.8V I Display interface data for PDA display 13 LCD_PXL12 0 - 2.8V I Display interface data for PDA display 14 LCD_PXL13 0 - 2.8V I Display interface data for PDA display 15 LCD_PXL14 0 - 2.8V I Display interface data for PDA display 16 GND 0V - Ground 17 GND 0V - Ground 18 LCD_PXL15 0 - 2.8V I Display interface data for PDA display 19 LCD_PXL5 0 - 2.8V I Display interface data for PDA display 20 LCD_PXL6 0 - 2.8V I Display interface data for PDA display 21 LCD_AC 0 - 2.8V I Display interface data enable for PDA

display 22 LCD_HSYNC0 - 2.8V I Display interface horizontal synchroniza-

tion for PDA display

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23 GND 0V - Ground 24 GND 0V - Ground 25 GND 0V - Ground 26 LCD_VSYNC0 - 2.8V I Display interface horizontal synchroniza-

tion for PDA display 27 WIRE_SDI 0 – 2.8V O Uwire serial data output from PDA dis-

play 28 WIRE_SDO 0 – 2.8V I Uwire serial data input for both displays 29 WIRE_nSCS30 – 2.8V I Uwire chip select for PDA display (active

low) 30 GPIO13 0 - 2.8V I Reset for PDA display 31 GND 0V - Ground 32 LCD_PXL4 0 - 2.8V I Display interface data for PDA display 33 LCD_PXL3 0 - 2.8V I Display interface data for PDA display 34 LCD_PXL2 0 - 2.8V I Display interface data for PDA display 35 LCD_PXL1 0 - 2.8V I Display interface data for PDA display 36 LCD_PXL0 0 - 2.8V I Display interface data for PDA display 37 LCD_PXL10 0 - 2.8V I Display interface data for PDA display 38 LCD_PXL9 0 - 2.8V I Display interface data for PDA display 39 LCD_PXL8 0 - 2.8V I Display interface data for PDA display 40 LCD_PXL7 0 - 2.8V I Display interface data for PDA display 41 V28 2.716 – 2.884V - Supply voltage for CMT display 42 KBR4 0 - 2.8V O Keyboard interface row line 43 WIRE_SCLK0 – 2.8V I Uwire serial clock for both displays

44 GNDKBC0 0V0 - 2.8V -I GroundKeyboard interface column line 45 KLIGHT 0 - 3.6V I Enable for CMT illumination 46 DLIGHT 0 - 3.6V I Enable for PDA display illumination 47 CALLED1 0 - 2.8V I On/off for LED driver 48 VBAT 3.0 – 4.2V - Battery voltage for illumination 49 KBR3 0 - 2.8V O Keyboard interface row line 50 KBR2 0 - 2.8V O Keyboard interface row line 51 PWRONX 0 - 2.8V O Power key output

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52 KBR0 0 - 2.8V O Keyboard interface row line 53 GPIO12 0 - 2.8V I Reset for CMT display 54 EARP 1.4V DC, 35-

222mV(rms) AC

55 EARN 1.4V DC, 35-

222mV(rms) AC 56 KBR1 0 - 2.8V O Keyboard interface row line 57 V18 1.71 – 1.89V - Supply voltage for CMT display and level

58 V28 2.716 – 2.884V - Supply voltage for CMT display 59 GND 0V - Ground 60 GND 0V - Ground

I Audio for earpiece

shifters

■ PDA display

PDA display is an S80L display module, 640(H) x RGB(H) x 200(V) transflective active matrix colour LCD. It is capable of showing 65536 colours (5xR, 6xG, 5xB). It incorporates a backlight system with 2x3 white LEDs connected in series.

The display has the following on-chip features: contrast control, DC/DC converter, temperature compensation and N-line inversion for low cross talk CMOS compatible inputs/outputs.

The complete display module includes LCD glass, flex cable (FPWB), driver IC and illumination system.

Interface

The PDA display has two interfaces: 16 data lines parallel video RGB interface ViSSI and optional 3-wire 9-bit serial interface LoSSI. Video interface is used for image data transfer (video and still) and serial interface is used for sending commands. GPIO13 is reset signal for PDA display.

The display is connected to the LCD interface of the OMAP1510 chip. The interconnection between the LCD module and engine is implemented with a 40-pin board-

to-board connector (NMP code 546B033). All the signals go through the hinge flex and are filtered by EMI filters.

Table 11: Interface signals of PDA display.

Signal

Pin #

1 GND GND 0V - Ground 2 VLED+ Vovp (LED Driver) Variable

name (LCD)

Signal name

(Engine)

Voltage

level

~12V

I/O/Z Description

- Voltage for LEDs

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3 VLED1- Vfb1 (LED Driver) 12 / 1V - Return line for LEDs 1 4 VLED2- Vfb2 (LED Driver) 12 / 1V - Return line for LEDs 2 5 GND GND 0V - Ground 6 VDDI V28 2.8V I,

PSU 7 GND GND 0V - Ground 8 GND GND 0V - Ground 9 VDD V28 2.8V I,

PSU 10 !RES GPIO13 0 – 2.8V I Reset signal 11 !CS WIRE_nSCS3 0 – 2.8V I Chip select signal 12 GND GND 0V - Ground 13 SCLK WIRE_SCLK 0 – 2.8V I Serial clock 14 DIN WIRE_SDO 0 – 2.8V I Serial data input 15 DOUT WIRE_SDIN 0 – 2.8V O Serial data output 16 GND GND 0V - Ground 17 Vsync LCD_VSYNC 0 – 2.8V I Vertical synchronization

Logic power supply voltage

Analog power supply voltage

signal

18 Hsync LCD_HSYNC 0 – 2.8V I Horizontal synchronization

signal 19 DE LCD_AC 0 – 2.8V I Data enable 20 GND GND 0V - Ground 21 PCLK LCD_PCLK 0 – 2.8V I Pixel clock signal 22 GND GND 0V - Ground 23 R0 LCD_PXL11 0 – 2.8V I Image data input red, LSB 24 R1 LCD_PXL 12 0 – 2.8V I Image data input red 25 R2 LCD_PXL 13 0 – 2.8V I Image data input red 26 R3 LCD_PXL 14 0 – 2.8V I Image data input red 27 R4 LCD_PXL 15 0 – 2.8V I Image data input red, MSB 28 GND GND 0V - Ground 29 G0 LCD_PXL 5 0 – 2.8V I Image data input green,

LSB 30 G1 LCD_PXL 6 0 – 2.8V I Image data input green

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RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

31 G2 LCD_PXL 7 0 – 2.8V I Image data input green 32 G3 LCD_PXL 8 0 – 2.8V I Image data input green 33 G4 LCD_PXL 9 0 – 2.8V I Image data input green 34 G5 LCD_PXL 10 0 – 2.8V I Image data input green,

MSB 35 GND GND 0V - Ground 36 B0 LCD_PXL 0 0 – 2.8V I Image data input blue, LSB 37 B1 LCD_PXL 1 0 – 2.8V I Image data input blue 38 B2 LCD_PXL 2 0 – 2.8V I Image data input blue 39 B3 LCD_PXL 3 0 – 2.8V I Image data input blue 40 B4 LCD_PXL 4 0 – 2.8V I Image data input blue, MSB

■ CMT display

This section outlines the 128 x 128 transflective active matrix LCD with 65536 colours. The display module includes:

• FPWB foil including connector and required passive components

• Display panel (glass) with COG drivers including display controller and 132 x132 x16 bit RAM

• Illumination system: light guide, optical sheets and LEDs

Interface

The display module is equipped with a DCT4 compatible LCD controller (Driver) with bi-directional 9-bit serial interface. The CMT LCD is connected to the uWire interface of the OMAP1510 chip. The maximum clock frequency of the OMAP1510 uWire is 3.0 MHz. GPIO12 is the reset signal for the CMT display.

Because of different logic levels of OMAP (2,8 V) and display (1,8 V), level shifters are used in the following signal lines: SDA, CSX, RESX and SCL.

The interconnection between the LCD module and engine is implemented with a 12-pin boardto-board connector (NMP code 546B047).

All the signals go through the hinge flex and are filtered by EMI filters.

Table 12: interface signals of CMT display.

Signal

Pin #

1 VLED- Vfb (LED

42 COMPANY CONFIDENTIAL Issue 1 09/04

name

(LCD)

Signal name

(Engine)

Driver)

Voltage level I/O/Z Description

12 / 0.4V - LED power supply (cath-

ode)

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

2 VDDI V18 1.8V I,

PSU 3 GND GND 0V - Ground 4 SDA WIRE_SDO 0 – 1.8V (LCD) I/O Bi-directional serial inter-

0 – 2.8V (OMAP1510)

5 CSX WIRE_nSCS0 0 – 1.8V (LCD) I Chip select (active low)

0 – 2.8V

(OMAP1510) 6 GND GND 0V - Ground 7 TE - 0 – 1.8V O Tearing Effect signal 8 RESX GPIO12 0 – 1.8V (LCD) I Reset signal (active low)

0 – 2.8V

(OMAP1510)

Supply voltage for digital circuits

face data but only used as unidirectional.1)

1)

9 SCL WIRE_SCLK 0 – 1.8V (LCD) I Serial interface clock

1)

0 – 2.8V

(OMAP1510) 10 GND GND 0V - Ground 11 VDD V28 2.8V I,

PSU

12 VLED+ Vovp (LED

Driver)

Note! Level shifter used.

Variable ~12V - LED power supply (anode)

Power supply for analogue circuits

■ CMT keypad

The amount of keys in RA-2/3 on the lid side is 276. The keys are connected to the OMAP1510 keyboard interface, except the power key (NMP code 520B009), which is connected to PWRONX pin of UEM. Keyboard interface in OMAP1510 has a 6x5 matrix. The total amount of the keypad signals through hinge flex is 1211. Keyboard matrix can be seen in Table 13, “Keypad placement matrix.” Keys are divided into CMT keys and CBA Soft Command keys that are also called PDA keys (NMP code 520B009). CMT keys are on the topside of the lid and PDA keys are on the bottom side, next to the PDA display. All the signals go through EMI filters.

Issue 1 09/04 COMPANY CONFIDENTIAL 43

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Table 13: Keypad placement matrix.

Col 0 Col 1 Col 2 Col 3 Col 4 Col 5 Row 0 Row 1 Row 2 Row 3 Row 4

From Signal Pin(s) To Signal Pin(s) Levels Description

OMAP1510 APE_KEYB(10

Keyboard Matrix

Special key

:0) Row (4:0) OMAP1510 APE_KEYB(10

UP CMT 1 CMT 2 CBA 1 CBA 2 PUSH SEND END CBA 3 CBA 4 DOWN 1 2 3 * LEFT 4 5 6 0 RIGHT 7 8 9 #

Table 14: OMAP1510 keypad interface

Keyboard Matrix

Column(5:0) 0-2.8V Keyboard control:

Column

0-2.8V Keyboard control:

:0)

Row with external pullup

Description of operation

A keyboard Interface in OMAP1510 consists of specific I/O pins, dedicated for the 6 columns X 5 rows keyboard connection.

The keyboard interface is composed of six column lines (output), KBC (5:0); and five row lines (input), KBR (4:0) with the capability to detect multiple key pressing.

When no key is pressed, KBD_INT remains high because of external pull up, once key(s) is (are) pressed, the corresponding row(s) and column(s) are shorted together, since KBC is set to low initially, therefore, KBD_INT is changed to low state and interrupt is generated that CPU will perform a scanning process to tell which key(s) are pressed.

In case of a determined key press SW must ensure is the key pressed or not by multi-read operation.

Illumination and drivers

The illumination includes:

•PDA display

•CMT display

• CMT keypad illumination

44 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Block diagram

Figure 17: Block diagram of illumination.

UI HW

CalLED1

UEM

EN

TK11851L

Dlight

PDA display

Backlight: 2 x 3 LEDs in series, 2 x 13mA

CMT display: 3 LEDs in series, 13mA CMT keypad: 3 LEDs, 2 x 10mA

Klight

• S80L backlight

• Keypad backlight

• TK11851L: white LED driver for backlight

• UEM PWM signals Dlight and Klight are to turn on/off white LED circuits

Description of operation

There are 6 white LEDs for illumination built in S80L module. There are two LED chains connected in parallel. Each of these chains consists of three LEDs in series. Since the forward voltage drop, Vf, of each white LED is typically about 3.6 to 4V; a white LED driver is required to drive the LEDs for the desired performance. A current mirror (TBD) is used to ensure matched current for both LED chains. In the CMT display there are three LEDs connected in series. Common TK11851L driver is used for S80L display and for CMT display + keypad.

Issue 1 09/04 COMPANY CONFIDENTIAL 45

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ Bluetooth

Figure 18:RA-2/3 bluetooth component assembly (BT is on the bottom layout layer, but

Z6400, N6403, N6404, C6400, C6403, C6422 are on the top layout layer(WLAN partition)

46 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Baseband Troubleshooting

This section is intended to be a guide for localizing and repairing electrical faults in RA-2/3 baseband.

Before any service operation you must be familiar with the RA-2/3 product and module level architecture. You have to be also familiar with the RA-2/3 specific service tools such as the Phoenix service software, flashing tools and software.

Issue 1 09/04 COMPANY CONFIDENTIAL 47

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ Top level flowchart

Phone comes

to service

Go UI failure

troubleshooting

No

Yes

Go to Phone is

dead

troubleshooting

Go to UI failure troubleshooting

Phone is

dead

No

Display is

distorted/colors

look strange

No

Yes

Does pc

recogniz e it when

connected with

usb?

Yes

No IR

connection

No

WLAN

seems to be

mute

No

Bluetooth is

not working

No

Backlight

does not

work

No

USB seems

to be

missing

Yes

Open WLAN

configuration in

Phoenix

Some error appeared

Yes

No errors

Go to IR

troubleshooting

Go to WLAN RF

troubleshooting

section in Chapter

7.

Go to WLAN BB

troubleshooting

Go to Bluetoo th

troubleshooting

Go to UI failure troubleshooting

Go to USB

troubleshooting

No

If the connector is

OK, see Camera

troubleshooting

Keyboard is not

responding

No

Try another

keyboard

Yes

Next page please

No change

48 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Continued

from page

1

Camera does not

work, or the picture

quality is worse

than usual

No

The phone is

silent, or

speaks

unclearly

No

MMC and phone are not talking to

each other

No

Phone does not

recognize

Accessory

Yes

Visit Camera

troubleshooting

Go to appropriate

Audio faults

troubleshooting

section

Go to MMC

troubleshooting

Go to Accessory

detection

troubleshooting

No

Charging problems

No

Phone does

not stay on

Yes

Go to Charging troubleshooting

Visit the Phone

does not stay on

troubleshooting

section

Issue 1 09/04 COMPANY CONFIDENTIAL 49

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ UI failure troubleshooting

Display backlight dim or no backlight

Power on

When lid open,

are all LEDs

illumanated in

PDA display?

YES

NO

Half of the LEDs

are illuminated and the devic e

doesn't b oot up?

NO

Measure Voltage

from R115 9. Is it

high or is there a

PWM sign al?

YES

Try again with

known good PDA

display. OK?

Are all LEDs

dead?

YES

Possible s hort

circuit in V28

either on flex or on

engine PW B.Visit

also APE Power

troubleshoot.

NO

Change N 1152.

OK?

Measure LED

driver output from

J1169. Voltage

YES NO

signal from J1167 with oscilloscope.

between 10-

YES

Measure dl ight

Is it high o r is there a PWM

signal?

NO

Check conn ector

X1150 pi n 46.

NO

12V?

YES

Measure voltage

from J1184.

Voltage b etween

10-12V?

OK?

YES

NO

Measure voltage

in J1155. ~1.8V?

YES

N1151 failu re.

Change

component (or

flex).

YES

N1153 failu re.

Change

component (or

flex).

Change flex.NO

UEM fault.

Possible problem with conn ector or

NO

flex trace. Change

Check X1152

connecto r pins

2,3 and 4. OK?

YES

Change flex.

Try again with

known good PDA

display. OK?

NO

flex. OK?

NO

UEM fault.

NO

Put a magnet next to

the hall s ensor an d press some key on cover, is CMT s ide

illuminated as it should?

YES

END

NO

Change V1150.

Is the PDA side still

NO

Change flex. NO

illuminated?

Possible Hall

reader faul t. Visit

QWERTY

troubleshoot.

UEM fault. YES

OK?

YES

NO

YES

Change V1150.

OK?

Change flex.

Keypad an d displa y

is dark?

YES

Measure voltage

from J1 156. Is it

high?

NO

Check conn ector

X1150 pi n 45. OK?

CMT display is

illuminated and the

keypad is not?

NO

One of th e LEDs i s

broken. C hange

the fault LED. OK?

NO

YES

NO

Change fl ex.

Change the CMT

display.

Change flex.

NO

The keypad is

illuminated and the

display is not?

Check conn ector

X1151 pins 1 and

NO

YES

12. OK?

YES

50 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

PDA display troubleshooting

PDA

display

check

No

Display physica lly

Yes

Blank di splay?

broken?

No

Check

connectors

X1150/X1152.

OK?

No

Change U I

module.

No

Picture

disturbed?

Yes

Yes No

Change LCD.

LCD working?

No

(X26-9) voltage

Yes

WIRE_SCLK (X27-10),

WIRE_SDO (X25-4) and

PDA_!RES

reasonable?

(>10us low time)

VS (pin26),

DE (pin21) and

PCLK (pin11)

lines wor king

properly? *PICT

Is

PDA_V28

level.

~2.8V?

Are

PDA_!CS

(X26-4),

WIRE_SDI

(X27-5)

lines working

properly? *PICT

Yes

Is

(X27-4)

signal

Yes

Are

HS (pin22)

Fix connector. No

Fix connector.

Fix connector.NoNo

No

Check

flex co nnector

X4402

on engine PWB.

OK?

Yes

Check

flex co nnector

X4402

on engine PWB.

OK?

Check

flex co nnector

X4402

on engine PWB.

OK?

Check

flex co nnector

X4402

on engine PWB.

OK?

Yes End

Go to EM trouble

Yes

shooting

Change

adequate EMI

filter(s)

Z4400...4403.

Signals OK?

Yes

No

Change O MAP.

LCD working?

Yes

No

Strange co lors or

other effects?

No

End

Yes

X25...27 :

Are

data lines

R0...4,

G0...5 and

B0...4

working

properly? *PICT

Fix connector. No

flex co nnector

No

on engine PWB.

Check

X4402

OK?

Issue 1 09/04 COMPANY CONFIDENTIAL 51

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

CMT display troubleshooting

CMT

display

check

Yes

Display physically

broken?

No

Check

connect ors

X1150/X1151.

OK?

No

Change UI

module.

Are

CMT_V28

(X25-20) an d

CMT_V18

(X27-19)

voltage levels

~2.8 and ~1 .8V?

Yes

Are

CSX (J1165),

SCL (J1164)

and SDA (J1163)

lines work ing

properly? *PICT

Yes

Is

RESX (J1166)

signal

reasonable?

(low time >10u s)

Yes

Check level shifter

Change UI module

Check level shifter

Change UI module

Change LCD. LCD working?

No

Fix connec tor. No

No

D1150.

if needed.

No

D1150.

if needed.

No

Check

flex co nnector

X4402

on engine PWB.

OK?

Yes

Are

Yes

CMT_CSX

(X27-17),

WIRE_SCLK

(X27-10)

and WIRE_SDO

(X25-4)

lines work ing

properly

before level

shifter? *PIC T

Yes

Is CMT_RESX (X26-18) signal

reasonable

before level

shifter?

(low time >10u s)

Yes

No

Go to EM trouble

shooting

Change

adequate EMI

filter(s)

Z4400...4 401.

Signals O K?

No

End

No

Yes

Change O MAP.

LCD working?

No

Yes

LCD working?

Yes

End

52 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Keyboard malfunction

Keyboard is not

working

Check that the

connector

X4401 is ok

Try another

keyboard

Still no signs of life

Use the original

one. Take a look at

R4800, voltage level something else than 2.8V?

No

Reflash

Cover keys/

CBA keys are

not working

They seem to

be

mechanically

ok?

Yes

Keys work

on another UI

module?

No

Connector

X4402 is

ok?

Yes

Replace flex

Yes

change OMAP

No, still dead

Yes

Change Z4400

and Z4401

No change

See that

R4424-4427,

R4428, and

4429 are ok.

Still dead

If reflashing does not

help, change OMAP

Issue 1 09/04 COMPANY CONFIDENTIAL 53

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ Phone is dead troubleshooting

Phone is in

flash ji g,

powered from

laboratory

power

Yes

Change Battery

No

Short is probably

in N7700 (RF PA)

Does it

boot now?

No

Phone takes

more than

600mA current

when

powered?

No

Does it take

any current at

all?

Yes

Try to flash

Did not help

Yes

No

Unsuccessful

Short circuit somewhere,

disassemble phone. Continue testing in jig with

engine PWB only.

Battery

connector is

ok?

Yes

CMT

troubleshooting

Flash

troubleshooting

Does phone still

take too much

current?

No

Connect lid

module, does

current

consumption

increase more

than 200mA?

No

Connect qwerty

module, is the

current

consumption

about the same

as in the first

measure ment?

Yes

Current limit to

1A or more. Does

some part feel hot after 10s?

Try another lid module, does

situation change?

Yes

No

You found the short,

Yes

component and test

Yes

qwerty mo dule

Short comes

from mechanics

change the

again.

Short/

component fail

in lid module.

Check flex

connector

and

surrounding

components

Change

Is it a display

problem?

54 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ IR troubleshooting

Phone is in flash jig, or

powered from

battery

Try IR

connection

to pc

No

Try again in

module jig

No

IR module

N4490 seems to

be properly

soldered?

Yes

Look with a

camera phone

viewfinder to

phones IR

window

Yes

Try to send a

contact with

phones IR

No

ok

Change IR

window

Inspect R4490, C4490, C4492,

C4493

All ok

I can see blinking light

Reflash the

phone

One is pulsing,

another is not

Change IR

module

Check if pulses can

be seen during

transmission at pins

3 and 4

Yes

No

If reflash does

not help,

change omap

Issue 1 09/04 COMPANY CONFIDENTIAL 55

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ WLAN BB troubleshooting

WLAN BB Troubleshooting

Change

D4800

No

Change

N6300

Change

D6300

No help

Check R6331and

V6311

Is

V28_WLAN_RF

~2.8V?

Yes

Is

V18_WLAN_ANA

~1.8V

Check N6300, C6302,

No No help

L6300, C6300 and C6303

Check N6302, C6307,

C6308 and C6306

No helpNo

Regulator

ENABLE

(N6300 p in 3)

~2.8V?

Regulator

ENABLE

(N6302 p in 3)

~2.8V?

Yes

No

Yes

Is

V28_WLA N_DIG

~2.8V?

Yes

Is

V18_WLAN_DIG

~1.8V?

Yes

Is the Main

22MHz CLK

frequency OK

and high signa l

level ~1.8V ?

Yes

Any traffic i in

EEPROM lines

when WLAN

Configuration

enabled fro m

Phoenix?

Check N6303, C6310,

No

C6311 and C6309

Check V6300, L6302,

C6312, C6314, R6332 and

Check L6 405, R6 302 and

No

R6326

6305

Change

D6300

No help

Regulator

ENABLE

(N6303 p in 3)

~2.8V?

SWITCH

ENABLE

(V6300 pin 5)

~2.8V?

Change

G6300

Yes

No

Change

N6302

Change

D4800

Change

N6303

No

Change

D4800

Change

V6300

Change D6310

Yes

NOTE: you will lose

tuning data a nd MAC

address.

Change D6310No help

56 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Bluetooth troubleshooting

Bluetooth settings for Phoenix

General setup:

1. Connect the phone to Phoenix in ‘local’ mode (From the File menu, choose Scan Product).

2. Choose: Testing --> Bluetooth LOCALS.

3. In the Bluetooth LOCALS window, set the JBT-9 box counterpart BT device address.

4. Place the JBT-9 box close to the BT antenna (within 10 cm) and click Run BER Test.

Figure 19:Example of Phoenix settings in Bluetooth troubleshooting

Issue 1 09/04 COMPANY CONFIDENTIAL 57

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Bluetooth troubleshooting

*If N6403 N6404, C6400, C6406, Z6400 are changed, WLAN tuning is also required.

Check and measure other passive components visually, if needed.

58 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ USB troubleshooting

No usb

connection

What is resistance from pop-port pin 6 to Prodtp4, and Prodtp9 to Pop-port pin7 (usb

D+ and D-)?

Both less

than 40 ohms

More than

40 ohms

Change R2003

Inspect Pop-port,

L2002, R2003,

C2005-2007, and

N2001 visually

At least 5V

Check voltage

from R2 004

(usb enable)

2,8V

Check voltage

from C2 005

(usb operating

voltage)

Undamaged

Measure voltage

VBUS at C2006

when connected

Not 2,8V

3.3V±7%

Damaged

to pc with usb

cable

Visit EM

section

Replace/re-solder

broken

connections/

components

Incorrect

voltage

No help

Replace omap D4800, if this does not help replace MDoc

D5000 also

Change L2002

clock section

No help

Visit APE

Incorrect

voltage

Change USB regulator

N2001 and capacitors

C2005-C2007

Issue 1 09/04 COMPANY CONFIDENTIAL 59

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ Flash faults

Flash

programming

fault

Double check that

you have correct

SW. Does reflashing

succeed?

No

Check that flash

adapter's pins are not

Measur e if BSI goes

damaged and phone is

low after flashing is

properly attached to

started?

adapter. Does reflashing

succeed?

No

Does reflashing

even start?

No

Yes

OKYes

on APE side

Phone fails to flash

on CMT side

Check for EM

troubles

No

Does the pc

recognize phone as

an usb devi ce?

Change CMT flash

memory D3000

No help

Yes

Check APE clocks

section

No help

Visit usb section

No help

SDRAM part

Wrong manufacturer

ID and device ID

No

Is the FBUS TX-line

high after startup?

This can be

measur ed from

module jig

Yes

Is PURX (J2800)

pulsed low?

Yes

Is the internal FBUS TX (J2809) set LOW

after PURX has

gone HIGH?

Yes

No

Change CMT flash

Measure if BSI

(batter y connector

middle pin)goes low

after flashing is

Measur e internal

FBUSTx-line

(J2809) during

flashing operation.

Is it ~1.8V all the

Change UEM

Change UPP D2800

memory D3000

started?

Yes

time?

Yes

D2200

Go to CMT

troubleshooting

No

Change UEM

Change UPP D2800

Try to flash again,

after a couple of

failed attempts go

to MDoc section

section

D2200

Yes

End (retest)

60 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Camera module troubleshooting

Start

Run

ST_CAMERA_

IF_TEST with

Phoenix

Fail

Check camera

connection to

phone

OK

Replace camera,

working?

No

Inspect resistors

and capacitors

around camera

connector visually,

replace if

necessary

Pass

Bad

No

Interface OK,

replace camera

module

Connect properly. Camera

working?

Yes

End

Camera working

still not working

Measure

camera

voltage. C4402~V28 C4400~V18

Yes

Measure Vctrl voltage from R4412,

~1.7V

Yes

Go to Camera

troubleshooting

page 2

No

Go to APE Power

troubleshooting

Replace R4409

and R4412

No Yes

Measure Vctrl voltage from R4412,

~1.7V

Yes

Camera

working?

No

Go to OMAP1510

troubleshooting

End

Issue 1 09/04 COMPANY CONFIDENTIAL 61

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

From Camera

troubleshooting

page 1

Replace

Check I2C twin

resistor R4800

OK

Measure with

oscilloscope

Extclk from R4418

when camera is

active

Damaged

broken

resistor,

camera

working?

Yes

No

Waveform is

12Mhz triangle

Vp-p >0.5V

Yes

No

R4415 one

end, 12Mhz

square Vp-p

~2.8V

No

If reflashing does not

help, replace OMAP

Yes

Replace

resistor

No Yes

R4415/R4418

if damaged.

Camera

working?

End

62 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Audio faults troubleshooting

Internal handsfree troubleshooting

START

Play MIDI/ AAC/ MP3

playback file from

headset with suitable

volume level (e.g 7).

Working?

NO

Play MIDI/ AAC/ MP3 playback file from IHF

with suitable volume

level (e. g 7).

Working?

YES

NO

Fault is between audio

PA (N2100) and IHF

speaker (B2120)

Are the DC bias (1.4V) and

audio signal from DAC to PA

(at C2107)

Is the AC amplitude of

the audio signal from

DAC to PA valid?

(at C2108)

Is the AC amplitude of

the audio signal from

PA valid at IHF

speaker?

OK?

YES

Check IHF speaker,

springs, contacts and

PWB pads.

Clean contacts/ replace

IHF speaker/ module

(B2120) if needed.

NO

Check also R4101; change

Check C2107, C2108,

R2104

Change audio PA

(N2100)

Retest by playing MIDI/ AAC/ MP3 file from IHF

speaker.

Working?

YES

Go to IHF2

Is HCLK (12MHz) from

OMAP to DAC present?

(at R4101; both sides)

resistor if needed.

YES

Check I2C twin resistor R4800.

Change resistor if

needed.

Is digi tal signal (high

level 2.8V) from

OMAP1510 to DAC

present at J4100

(MCBSP1_DOUT)?

YES

Change audio DAC (N4100)

NO

If reflashing doesn't help

NO

Does IHF speaker

working?

Are components

(L2120, L2121, C2134,

C2135, R2102) from PA to

speaker OK?

Change needed passives/

ESD components. Retest IHF

playback.

If reflashing doesn't help

change OMAP1510

chang e OMAP151 0

If reflashing doesn't help

NO

change OMAP1510

YES

Does IHF speaker

working?

YES

Go to IHF2

Does IHF audio

NO

work during a call?

YES

END

YES

Issue 1 09/04 COMPANY CONFIDENTIAL 63

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

IHF2

Set Phoenix Audio Routing from a known working MIC

input MIC1 (HP, Int) or

MIC2 (Ext. XMIC) to

XEAR. Ensure the correct

MIC bias is on.

Set gain of XEAR to -6dB.

Is the DC bias (1.4V)

seen at XEAR output of

UEM

(at C4104, R4100 and

C4105) Check also

passives and change

them if needed.

YES

NO

Change UEM

Are the audio signals from UEM (at C4104, R4100

and C4105)

OK?

YES

Does IHF audio

work during a call?

YES

END

NO

Change UEM

Change UPP

64 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3

p

6 - Baseband Description and Troubleshooting Nokia Customer Care

External speaker troubleshooting

START

Check system connector

and PW B contacts.

Are they OK?

YES

Connect a known working headset to the system connector

Play MIDI/ AAC/ MP3

playback file from HS

with suitable volume level

(e.g. 7)

Is HS speaker

working?

NO NO

Clean contacts/ replace

NO

system connector

Are the DC bias (1.4V) and

audio signal from DAC to PA

(at R2108 and R2106)

Are the DC bias

(~0.45V) and audio

signal OK at C2104

and C2105?

(X2021)

OK?

YES

Check R2108, R2109, C2105, R2106, R2107

NO

and C2104.

Change passives if

needed. Retest.

Is HCLK (12MHz) from

OMAP to DAC present?

(at R4101; both sides)

Check also R4101; change

resistor if needed.

YES

Check I2C twin

resistor R4800.

Change resistor if

needed.

Is digital signal (high

level 2.8V) from

OMAP1510 to DAC

present at J4100

(MCBSP1_DOUT)?

NO

If reflash doesn't help

change OMAP1510

If reflash doesn't help

change OMAP1510

YES

Go to Ext. Earp 2

NO

YES

Are the audio signals

from PA to system

connector OK?

YES

Does audio work

during a call?

YES

END

NO

Change audio DAC

Check audio path from PA to

system connector. Check serial resistors R2028, R2029, R2030,

R2031 and also L2004 and

L2005

Change components if

needed

Are the audio signals

from PA to system

connector OK?

YES

(N4100)

Change

NO

audio PA

(N2100)

Is IHF speaker

working?

NO

Go to IHF

troubleshooting

Issue 1 09/04 COMPANY CONFIDENTIAL 65

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Ext. Earp 2

Set Phoenix Audio Routing from a known working MIC

input MIC1 (HP, Int) or

MIC2 (Ext. XMIC) to

XEAR. Ensure that correct

MIC bias is on.

Set gain of XEAR -6dB

Is the DC bias (1.4V)

seen at XEAR output of

UEM

(at C4104, R4100 and

C4105). Check also

passives and change

them if needed.

YES

NO

Change UEM

Are the audio

signals from UEM

OK?

(at C4104, R4100,

C4105)

YES

Does audio work

during a call?

YES

END

NO

Change UEM

Change UPP

66 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

External mic troubleshooting

START

Does it work with a known

working headset?

?

NO

Check system connector

and PWB contacts.

Are they OK?

YES

Set Phoenix Audio Routing

from MIC2 (Ext. XMIC) to

known working audio output

(EARP/ HP or Ext, XEAR )

Ensure MIC Bias (MICB2)

is set on.

Is MIC Bias 2.1V

present at R2126?

YES

Are audio signals

from system

connector to UEM

OK?

Clean contacts/ replace

NO

MIC bias is present

NO

Check R2126, R2127,

Change components if

Check audio path trough L2003,

R2128, R2129, R2130, C2127.

Check also dual capacitor

Check also Hookint route trough

Change needed components.

system connector

(X2021).

C2124 and C2126 .

needed.

C2128.

R2125.

MIC bias not present.

Audio signals not OK

Change UEM

YES

Audio signals OK

Does the audio work

during a call?

YES

END

NO

Change UPP

Issue 1 09/04 COMPANY CONFIDENTIAL 67

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Earpiece troubleshooting

Earpiece doesn't work

Change upper lid

module. Working?

YES

Check earpiece (B50),

springs and PWB

contacts from original

upper lid. Check flex.

Change faulty part

(earpiece, flex).

Retest.

Working?

YES

Change original upper lid

module back.

Set Phoenix Audio

Routing from a known

NO

working MIC input MIC1

(HP, Int) or MIC2 (Ext.

XMIC) to HP OUT.

Ensure the correct MIC

bias is on.

Measure DC voltage

between earpiece

(B50) pads

and GND. Is it

~1.4V?

YES

Are audio signals

from UEM to

earpiece pads OK?

YES

Does audio work

during a call?

YES

END

Check audio path from UEM to earpiece pads. Check L4400 and dual

resistors R2120 and

R4416. Change

components if needed.

DC bias

OK

Check audio path from UEM to earpiece pads. Check L4400 and dual

NO

resistors R2120 and

R4416. Change

components if needed.

Audio signals

OK

Change UPPNO

Retest.

No DC voltage

seen.

No audio

signal

Change UEMNO

Change UEM

68 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ MMC troubleshooting

Start

Save picture to

known good MMC

card

Save and read

succeed?

No

Is the magnet

in the battery

cover in

place?

Yes

Connector, R5201,

R5200, C5200, C5201, N5200,

R5202, C5203, and

C5202 seem to be in

order

No MMC IF failure.

Yes

No

All measurements provide that the MMC is initializing

or some operation is being

tried to perform, since

MMC power is cut after 5

seconds idle time.

MMC card

corrupted or

damaged

Replace battery

cover

Format or replace

MMC card

Yes

Put a magnet close to N4400. Does voltage on R4422 change?

Yes

Measure voltage VMMC at C5200

or C5202

(dummy MMC

card with wires

can be used)

3V±5%

Measure

MMC_CLK and

MMC_CMD

from connector

No

Something

else

No

signals

Signals present

Replace N4400

replace R5200

Initialize MMC,

check voltage from

R5202. This can

be done by

soldering a wire to

the resistor.

2,8V

Change MMC

regulator N5200

and capacitors

C5203, C5201

Still no signals

at connector

If reflash does not

help, change OMAP

Not 2,8V

If reflash does not

help, change OMAP

MMC initialization is done at

boot, after ~5sec voltage

drops to zero, use

oscilloscope

Issue 1 09/04 COMPANY CONFIDENTIAL 69

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ Accessory detection troubleshooting

Headset Not

working

Insert the known working headset to the system connector (use

both basic and ACI

headset).

Does phone detect

headset?

NO

Does HEADINT

(R2001) toggle (high

-> low) when accessory is

connected?

YES

Check L2000, R2002,

NO

R2001 and C2003 and

system connector X2021

YES

Is headset earpiece

workin g

YES

Does headset

microphone work

during a call?

YES

Does the UEMINT

(J2803 ) toggle

(high -> low) when

accessory is

Change UEM

NO

connected?

NO

Follow the trouble-

shooting flow chart for

External earpiece faults

Follow the trouble-

shooting flow chart for

External MIC faults

YES

Vout

(system connector

X2021, pin#4)

~2.8V, after an ACI

accessory has been

connected?

NO

Change L2004

xmic N resistance high

YES

Check

X2021 and L2001.

Check also that Vout

is not shorted to

GND (e.g. via C2004, C2000, R2003, X2021).

No fault found.

VEN

(R2000) ~1.8V after

an ACI accessory

has been

connected?

YES Not shorted

Change N2000

and retest.

Fault found.

NO

Fix defect and

retest.

Shorted

Check that VEN

(R2000)

is not shorted to

GND.

Change UPP.

Check components C2126, C2125, C2124, C2128, C2127, C2037, C2038, R2127, R2128, R2129, R2130, R2126, R2125. If all ok change

UEM.

Does remote control

switch work?

YES

Change user's headset

END

NO

Measure HOOKINT at R2125 UEM side

Is it low (~1.1V)

when headset button

is pressed?

YES

Change UEM

NO

xmic P resistance high

Measure resistance from X2021 pin 9 to

C2037 (xmic N), and

X2012 pin 10 to

C2038 (xmic P).

Change L2003

Both low

70 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Charging troubleshooting

Charging fault

Battery bars are

scrolling?

No

Re-calibrate ADC,

charge current and voltage with Phoenix Energy Management

tuning. Calibration OK?

No

Connect charger

and measure

voltage from both

ends of L2020. Is it

> 3.0V?

Yes

Read BTEMP value with

Yes

Phoenix. Is it close to ambient temperature

Yes Retest

Check X2021,

No

X2022, F2020, L2020, V2020,

C2026 and C2030.

All components ok?

Change defect part,

re-calibrate charge

current and voltage.

(~25C)?

No

Retest

Re-calibrate ADC

with Phoenix Energy

No

Yes

Management

tuning. Retest OK?

Check R2021,

R2201, C2224 and

No

components OK?

Yes

R2203. All

No

Change UEM

D2200

Change defect part

and retest.

Check R2200. Is it

OK?

Yes

Change UEM

D2200

Change defect part,

No

re-calibrate charge

current. Retest.

Issue 1 09/04 COMPANY CONFIDENTIAL 71

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ CMT troubleshooting

Put main b oard to

module jig. Turn

switch to local

mode.

Check that both

ends of L2330-

L2335 have VBAT

voltage

Yes

Chech BSI-line

including X2020,

R2035, R2204,

C2225 and R2202.

Are they OK?

Yes

Measure voltages from

following components:

VANA C2210 2.78V

VIO C2204 1.8V

VCORE C2881 1.35V / 1.57V

VR3 C2232 2.78V

VFLASH1 C2202 2.78V

Voltages OK?

Yes

Measure 32.7kHz

SleepCl k J2802. Is it

OK?

Yes

Measure 26MHz

RFClk from R2902.

Is it OK?

Check L2330-

L2335. and C2330-

No

C2335 Are they

Replace defect

components

No

Measure sleep clock

from C2206. Is it

Measure 26MHz

RFClk from

VCTCXO G7501 pin

3. Is it OK?

OK?

Yes

Check if the voltage

lines have short

circuits to GND?

No

OK?

Yes

No

Yes

No

C2206 and C2207

Replace VCTCXO

No

Replace defect

components

Check VBAT lines

from battery

connectorX2020 to

L2330-L2335

Find and replace

short circuited

component

Replace UEM

D2200

Check B2200,

Replace UEM

D2200

G7501

Check R2902 and

Yes

Measure PURX

signal fr om R4802.

Is it ~2.8V?

Yes

Read phone info

with Phoenix. Is it

OK?

Yes

Change 1bt

module o r

retest

Measure PURX

No

signal from J2800.

Replace N4800 if it

properl y soldere d

Measure internal

FBusRx signal

No

during phone in fo

read from J2810. Is

Measure internal

FBusTx signal

during phone in fo

read from J2809. Is

Yes

No

Is it ~1.8V?

Yes

seems to be

No

it OK?

Yes

No

it OK?

C2902. If OK,

change Helgo

N7500

Replace UEM

D2200

Replace UEM

D2200

Replace UPP

D2800

72 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ APE troubleshooting

APE clocks troubleshooting

APE clocks

check

Clk32k (J4815):

Voh ~ 2.8V & f ~ 32.768kHz square wave ?

Yes

12Mhz clock

(C4800,

OSC1_IN):

12MHz signal

present ?

Yes

Check completed

No

SleepClk (J2802):

Voh ~ 1.8V &

f ~ 32.768kHz

square wave ?

Solder joints of C4800, C4801,

C4802 and B4800

OK ?

Yes

Measur e

resistance over

C4801.

R >>1M ?

No

Reflash the phone. If

Yes

No

Clk32k still doesn't

work, change UEM

V6031 and C6038 if

no faults are found.

D2200

Replace UEM

D2200

Check R6042, C6038, R6040, R6039, R6043,

R6044, V6030,

V6031. Change

Yes

Change B4800. If

this doesn't help,

change C4800,

C4801 and C4802.

Still not

working

Change OMAP

D4800. If that does

not help all is lost.

Issue 1 09/04 COMPANY CONFIDENTIAL 73

Nokia Customer Care 6 - Baseband Description and Troubleshooting

APE energy management troubleshooting

Phone is in

module jig

Faulty V4200, R4202,

Check SYNC/

MODE from R4202(both

sides), High?

YES

NO

D4420, or N4201. If all

these are connected,

replace first V4200 and

R4202, next D4420 and

N4201. If still doesn't help

change OMAP.

RA-2/3

Check V15(1.57V), OK? C4203

YES

Check

V18(1.8V),

OK? C4204

YES

Check

V28(2.8V),

OK? C4202

YES

END

NO

Check

enable(VFLASH1),

high C2202?

NO

UEM fault

Check enable(VIO), high C4819?

NO

UEM fault

Check enable(VIO), high? C4819

NO

YES

NO

YES

C4211, 1.35 V?

ref.voltage at

L4200(both

sides), OK?

If capacitors C4200-

C4202 seem to be ok

regulator(N4200) and

Check voltage at L4201(both

Change coil and

Check ref.

voltage at

NO

Check

change V28

retest, OK?

NO

sides), 0 V?

NO

retest V15

YES

filter(L4200)

Check voltage

at L4202(both

sides), 0 V?

Change

YES

NO

Change coil L4202

and retest V18

Change SMPS

chip(N4201) and

retest, OK?

NO

Shortcut in V15

line

YES

Change SMPS

chip(N4202)

and retest, OK?

NO

Shortcut in

V18 line

UEM fault

Shortcut in V28

line

74 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ SIM card error

SIM fault

Check that the SIM

cover is in place

properly

Check SIM

connector X2700

solderings and SIM

contacts. Problem

fixed?

Measure VSIM with

oscilloscope from X2700

pin 3. 1.8V and then 3.0V

No

pulses lasting about

30ms should be seen

right after power up

without SIM?

Yes

Change SIM asip

R2700. Problem fixed?

No

Change UEM D2200.

Problem fixed?

No

Change UPP D2800

Check VSIM line

including C2700 and

No

C2275. If OK,

change UEM

D2200.

Issue 1 09/04 COMPANY CONFIDENTIAL 75

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ APE memory troubleshooting

All signals in this

Start

troubleshooting are in

range 0 - V18

Use cold spray/ hot air to SDRAM device or customer feedback

Run

ST_APE_RA

M_TEST, with

Phoenix.

Result?

Fail

Measure

SDRAM

voltage V18 at

C5083

Correct

Measure

SDCLK

frequency at

R4808

>70MHz?,

level 0 - ~V18

No

Pass

Incorrect

Yes

Problem

occurs only in

heat or cold?

No

Go to MDOC

troubleshooting

Check and

replace if needed

C5083-C5089,

resistance >>1Mohm

Correct

Phone might have

been dropped, solder

balls cracked, replace

D5080

Yes

Phone might been

dropped, solder balls

cracked, replace

D5080

Measure

SDRAM

voltages V18

at C5083

Incorrect

Correct

Visit APE Power

troubleshooting

Measure

SDRAM

voltages V18

at C5083

Incorrect

Change SDRAM

D5080

Replace

Inspect R4808

value, approx

22ohm

Yes

No

Problem

occurs while

booting?

R4808 and

measure

SDCLK

frequency

>>70Mhz

No

Yes

No Pass

Replace OMAP

D4800

Rerun

ST_APE_RA

M_TEST with

Phoenix

Fail

End

Change SDRAM

D5080

76 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ MDOC troubleshooting

All signals in this

troubleshooting are in

range 0 - 2.8V

Busy# signal rises

at latest after

1055us after

RSTIN# rises.

However, the Busy#

can be high before

RSTIN# rises, but this

is not taken into account.

Check

resistors

R5000 and

R5001,

both ~10k

RSTIN# stays low

Replace damaged

No

Start

Measure MDOC Busy# at R4801 and

RSTIN# at

J4803

Measure

MPU_nReset

at R4802, low

to high

transition?

Stays low

Go CMT

troubleshooting

resistor(s)

Yes

Backup user data before

MDOC troubleshooting, if

Boot phone. Use oscilloscope.

Busy#

stays low

Replace OMAP

D4800

possible

Check resistor

R4801

~10k

Yes

Check MDOC

core voltage at

C5000, should

be ~2.8V

Correct

voltages

Check MDOC

I/O voltage at

C5001, is it

~2.8V?

Correct

voltages

No

Voltage

level

invalid

Replace resistor

R4801 and rerun

first test

Voltage levels

invalid

Go to EM

troubleshooting

Yes

Measure

CS0# at J4805

and OE#

J4802,

toggling?

Yes

Memory

corrupted, repl a ce

MDOC D5000

No

Replace OMAP

D4800

Check

resistors

R5000 and

R5001,

both ~10k

Yes

MDOC damaged,

replace D5000

Replace damaged

No

resistor(s)

Issue 1 09/04 COMPANY CONFIDENTIAL 77

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Appendix A: BB Troubleshooting Measurement Points by Troubleshooting Tree

Table 15: Flash faults

Signal Voltage Measurement point

PURX 2.8 J2800 FBUS TX J2809

Table 16: USB troubleshooting

Signal Voltage Measurement point

USB D+ - X2021 pin 6 to 4 (bottom side) USB D- - X2021 pin 7 to 9 (bottom side) VBUS 5 C2006 USB enable 2.8 R2004 USB operating volt-

age

Signal Voltage Measurement point

IR RX 2.8 N4490 pin 4 IR TX 2.8 N4490 pin 3

Signal Voltage Measurement point

V28_WLAN_RF 2.8 C6302 V28_WLAN_RF enable 2.8 N6300 pin 3

3.3 C2005

Table 17: IR troubleshooting

Table 18: WLAN troubleshooting

V18_WLAN_ANA 1.8 C6307 V18_WLAN_ANA enable 2.8 N6302 pin 3 V28_WLAN_DIG 2.8 C6310 V28_WLAN_DIG enable 2.8 N6303 pin 3 V18_WLAN_DIG 1.8 C6314 V18_WLAN_DIG switch 2.8 V6300 pin 5

78 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Main 22MHz clock 1.8 R6305 EEPROM serial IF 2.8 D6310 pins 5 and 6

Table 19: Bluetooth troubleshooting

Signal Voltage Measurement point

Vreg 2.8 C6036 VDD_ANA 1.8 C6031 12MHz clock ~400-900mV R6043

Table 20: Backlight troubleshooting

Signal Voltage Measurement point (all on flex)

LED driver output 10-12 C1151 Regulator enable 1.8 J55 dlight J56 LED voltage X1152 pins 2, 3 and 4 PWM X1150 pin 46 CMT display back-

light dlight X1150 pin 45

Table 21: PDA display troubleshooting

Signal Voltage Measurement point

Vdd for display 2.8 X50 pin 41 !CS 2.8 X50 pin 3 SCL 2.8 X50 pin 5 DIN 2.8 X50 pin 28

X1150 pin 1 and 12

DOUT 2.8 X50 pin 27 !RES 2.8 X50 pin 30 VS 2.8 X50 pin 26 HS 2.8 X50 pin 22 DE 2.8 X50 pin 21 PCLK 2.8 X50 pin 11

Issue 1 09/04 COMPANY CONFIDENTIAL 79

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

PXCL1-16 2.8 X50

Table 22: CMT display troubleshooting

Signal Voltage Measurement point (all on flex)

VDD X50 pin 57 VDDI X50 pin 58 CSX J65 SCL J64 SDA J63 CSX J61 SCL J60 SDA J59 RESX J66 RESX J62

Table 23: Keyboard malfunction troubleshooting

Signal Voltage Measurement point

I2C pull-up 2.8 R4800

Table 24: Camera troubleshooting

Signal Voltage Measurement point

power 2.8 C4402 power 1.8 C4400 Vctrl 1.7 R4412 ExtClk >0.5 R4418 clk 2.8 R4415

Table 25: IHF troubleshooting

Signal Voltage Measurement point

Audio to PA 1.4 C2107 HCLK R4101 Control signal 2.8 J4100

80 COMPANY CONFIDENTIAL Issue 1 09/04

RA-2/3 6 - Baseband Description and Troubleshooting Nokia Customer Care

Dac-PA C2108 Audio to speaker IHF pads XEAR output 1.4 C4104, R4100, 4105

Table 26: External speaker troubleshooting

Signal Voltage Measurement point

Audio dac-PA 1.4 R2106 HCLK R4101 Audio 0.45 C2104, C2105 Digital audio 2.8 J4100 Audio to pop-port Pop port (X2021) pins 11-14 (bottom) Audio to XEAR 1.4 C4104, R4100, C4105

Table 27: External microphone troubleshooting

Signal Voltage Measurement point

MIC bias 2.1 R2126 Audio from pop port Pop port (X2021) pins 9 and 10 (bottom)

Table 28: Earpiece troubleshooting

Signal Voltage Measurement point

Bias and audio to earpiece 1.4 B50 (flex), L4400, R2120, R4416

Table 29: MMC troubleshooting

Signal Voltage Measurement point (bottom)

Backcover switch R4422 VMMC 3 C5200 VMMC enable 2.8 R5202 MMC clk 2.8 MMC connector pin 5 MMC cmd 2.8 MMC connector pin 2

Issue 1 09/04 COMPANY CONFIDENTIAL 81

RA-2/3

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Table 30: Accessory detection troubleshooting

Signal Voltage Measurement point

headint R2001 (bottom) UEMInt J2803 VOUT 2.8 Pop port (X2021) pin 4 (bottom) VEN 1.8 R2000 HookInt 1.1 R2125 resistance X2021 pin 9 to C2037, (bottom) and X2021 pin 10 to

C2038 (bottom)

Table 31: CMT troubleshooting

Signal Voltage Measurement point

VBAT L2330 – L2335 VANA 2.78 C2210 VIO 1.8 C2204 VCORE 1.35/1.57 C2881 VR3 2.78 C2232 VFLASH1 2.78 C2202 32kHz sleepclk J2802, C2206 26MHz RF clk R2902, G7501 pin 3 PURX ~2.8/1.8 R4802, J2800 FBusRx J2810 FBusTx J2809

Table 32: Charging troubleshooting

Signal Voltage Measurement point

Charger voltage >3 L2020 (bottom)

Table 33: APE clocks troubleshooting

Signal Voltage Measurement point

32kHz sleep clock 2.8 J4815

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32kHz sleep clock 1.8 J2802 12Mhz clock in C4800 resistance Over C4801

Table 34: APE energy management troubleshooting

Signal Voltage Measurement point

Sync/mode R4202 (bottom) V15 1.57 C4203 V15 enable (Vflash1) C2202 V15 smps L4201 V18 1.8 C4204 V18, V28 enable (VIO) C4819 V18 ref voltage 1.35 C4211 V18 smps L4202 V28 2.8 C4202 (bottom)

Table 35: SIM troubleshooting

Signal Voltage Measurement point

VSIM X2700 pin 3 (bottom)

Table 36: APE memory troubleshooting

Signal Voltage Measurement point

SDRAM power 1.8 C5083 resistance C5083 to C5089 SDRAM clk 1.8 R4808 resistance Over R4808

Table 37: MDOC troubleshooting

Signal Voltage Measurement point

Busy R4801 RSTIN J4803

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resistance R4801 MDOC core voltage 2.8 C5000 resistance of R5000 and R5001 MDOC IO voltage 2.8 C5001 CS0 J4805 OE J4802

Table 38: Flex signal test connector pin arrangement

Pin X25 X26 X27

1 LCD_PXL3 LCD_PXL4 GND 2 LCD_PXL0 LCD_PXL1 LCD_PXL2 3 LCD_PXL8 LCD_PXL9 LCD_PXL10 4 WIRE_SDO WIRE_nSCS3 GPIO13 5 GND LCD_VSYNC WIRE_SDI 6 LCD_HSYNC GND GND 7 LCD_PXL5 LCD_PXL6 LCD_AC 8 GND GND LCD_PXL15 9 KBR4 V28 LCD_PXL7 10 KLIGHT KBC0 WIRE_SCLK 11 DLIGHT CALLED 1 VBAT 12 KBR3 KBR2 PWRONX 13 LCD_PXL14 LCD_PXL13 LCD_PXL12 14 LCD_PXL11 LCD_PCLK KBC1 15 GND GND GND 16 GND KBC2 KBC3 17 KBC4 KBC5 WIRE_nSCS0 18 KBR0 GPIO12 EARP 19 EARN KBR1 V18 20 V28 GND GND

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Figure 20:Flex signal test connector

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Nokia 9500 Service Manual 06 ra2 BB

Specifications and Main Features

Frequently Asked Questions

User Manual

Abbreviations

Baseband Top-Level Description

■ Operating conditions

Functional Description of CMT

■ Interfaces between CMT and APE

Functional Description of APE

■ Audio

■ Audio control signals

■ Audio modes

■ Internal interfaces

■ External interfaces

■ UI interfaces

Functional Description of WLAN

■ WLAN medium access controller

■ WLAN – OMAP host interface

■ WLAN baseband processor

■ WLAN energy management

Energy Management

■ CMT EM

■ APE EM

■ Battery

■ Charging

■ Backup battery and RTC

■ Display and keypad illumination

■ Power up and system states

System Connector

■ Universal Serial Bus (USB)

■ Accessory Control Interface (ACI)

■ HookInt

After Sales Interface

User Interface

■ Component placement and FPWB outline of 1BV

■ Hinge connector

■ PDA display

■ CMT display

■ CMT keypad

■ Bluetooth

Baseband Troubleshooting

■ Top level flowchart

■ UI failure troubleshooting

■ Phone is dead troubleshooting

■ IR troubleshooting

WLAN BB Troubleshooting

■ Bluetooth troubleshooting

■ USB troubleshooting

■ Flash faults

■ Camera module troubleshooting

■ Audio faults troubleshooting

■ MMC troubleshooting

■ Accessory detection troubleshooting

■ Charging troubleshooting

■ CMT troubleshooting

■ APE troubleshooting

■ SIM card error

■ APE memory troubleshooting

■ MDOC troubleshooting

Appendix A: BB Troubleshooting Measurement Points by Troubleshooting Tree