Nokia 8210 Service Bulletin 013

CONFIDENTIAL 1 (1)

Nokia Mobile Phones Service Bulletin No. SB-013/15.02.00
Technical Support, Europe & Africa

NSM-3

HARDWARE CHANGES

HW version changed from HW1120 to HW1210
New PCB version RM7L_12 has been released for NSM-3, this improves the

fitting of PCB to phone mechanics.

HW version changed from HW1210 to HW1220

- C132 is changed from ceramic to tantalum type (reduces the possibility of
noise caused by mechanical vibration of ceramic capacitor)

- C861 is added and L505 is changed to improve GSM1800 band TX
quality

CODE ITEM DESCRIPTION
Deleted 2310793 C132 CHIPCAP X5R 2U2 K 10V 0805
Added 2611741 C132 CHIPTCAP 4U7 M 10V 2.0X1.3X1.2
Added 2320621 C861 CHIPCAP NPO 0P5 C 50V 0402
Added 3646051 L505 CHIP COIL 3N9+-0N3 Q28/800M 0402
Deleted 3646053 L505 CHIP COIL 4N7+-0N3 Q28/800M 0402

Note: No changes are needed for phones coming to service.

NSM-3 SB-013