Nokia 7710, rm-12 Troubleshooting Instruction

Customer Care Solutions

Technical Documentation

6-Troubleshooting Instructions

Issue 1 11/2004 COMPANY CONFIDENTIAL 1

CCS Technical Documentation

RM-12

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2 COMPANY CONFIDENTIAL Issue 1 11/2004

Introduction to RM-12 troubleshooting .........................................................................2

General guidelines for RM-12 troubleshooting ............................................................. 2

Tools needed for troubleshooting ............................................................................... 2

General guidelines .......................................................................................................2

RF Troubleshooting ....................................................................................................... 3

Introduction to RF troubleshooting .............................................................................3

RF Key component placement ....................................................................................4

RF Measurement points .............................................................................................. 5

EGSM900, GSM1800 & GSM1900 Transmitter .......................................................... 6

General instructions for Tx troubleshooting ...............................................................6

Additional information for EDGE troubleshooting ..................................................12

EGSM900, GSM1800 and GSM1900 Receiver .......................................................... 21

General instructions for Rx troubleshooting ............................................................. 21

Synthesizer .................................................................................................................. 28

General instructions for synthesizer troubleshooting ................................................ 28

Baseband troubleshooting ........................................................................................... 33

Partially damaged device ..........................................................................................33

Most common symptoms reported by customer .......................................................33

Dead or jammed device troubleshooting .................................................................. 35

ASIC is changed ........................................................................................................ 40

Test points .................................................................................................................40

Selftests / “Contact service” on display ....................................................................40

Flashing troubleshooting ........................................................................................... 44

Power troubleshooting .............................................................................................. 47

Audio troubleshooting ............................................................................................... 53

Display troubleshooting ............................................................................................60

Pixel defects ..............................................................................................................65

Backlight troubleshooting (1) ................................................................................... 67

Backlight troubleshooting (2) ................................................................................... 68

Backlight troubleshooting (3) ................................................................................... 69

Hall sensor troubleshooting ......................................................................................70

Keyboard troubleshooting ......................................................................................... 71

Camera Module Troubleshooting ............................................................................. 72

Camera construction .................................................................................................79

Camera fault finding diagrams .................................................................................. 86

FM Radio troubleshooting ........................................................................................ 89

USB Problems (1) .....................................................................................................93

USB Problems (2) .....................................................................................................94

BC3 Bluetooth Troubleshooting ............................................................................... 95

MMC Troubleshooting (1) ........................................................................................ 99

MMC Troubleshooting (2) ...................................................................................... 100

Accessory troubleshooting ...................................................................................... 101

SIM troubleshooting ...............................................................................................102

Vibra Troubleshooting ............................................................................................106

Clocks and Reset troubleshooting ........................................................................... 107

RM-12

CCS Technical Documentation

Introduction to RM-12 troubleshooting

This document is intended to be a guide for localising and repairing electrical faults in the RM12 device. First there is a brief guide for fault localising. Then fault repairing is divided into troubleshooting paths.

Before any service operation you must be familiar with the RM-12 product and module level architecture. You have to also be familiar with the RM-12 specified service tools such as the Phoenix service software, flashing tools and software.

General guidelines for RM-12 troubleshooting

Tools needed for troubleshooting

• Service tools (as listed at service tools chapter in service manual)

• Laboratory power supply with current indicator

• Oscilloscope

• Digital multimeter etc. normal equipments

General guidelines

If the device cannot be turned on by any means, see “Dead device” troubleshooting. Current consumption (missing consumption) gives an idea whether the device is able to start

up. Dropping supply voltage or very large current consumption indicates a short circuit. Check whether the connection with Phoenix works and what can be discovered with Phoenix

(ADC-readings, baseband selftest, bb-calibrations etc.). Check display, keyboard and rocker faults visually. Force phone to LOCAL mode and make keyboard test by Phoenix.

NOTE! If liquid damage, stop repairing.

Flash phone before disassembling it if fault is not obvious and Phoenix connection is OK. Continue with specific troubleshooting procedure for the current fault. If flashing does not work go to “Flashing” troubleshooting. Due to CSP packages short circuits or broken solder joints are not easily seen. If the examined

signal seems to be continuously in low or high level, then measure for possible short circuit to ground (signal low) or to supply voltage (signal high). Note that if a problem is not found from any visible contact/component, it can be under CSPs where the signal is connected.

Care must be taken when assembling and disassembling the transceiver. Failure to do this may result in unnecessary damage to the device.

NOTE! If an ASIC is changed, see “ASIC Changed” troubleshooting flow chart.

Issue 1 11/2004 COMPANY CONFIDENTIAL 2

RM-12

CCS Technical Documentation

RF Troubleshooting

Introduction to RF troubleshooting

Measurements should be done using Spectrum analyzer with high-frequency high-impedance passive probe (LO-/reference frequencies and RF power levels) and Oscilloscope with a 10:1 probe (DC-voltages and low frequency signals).

The RF-section is build around one RF-ASIC (HELGO N7300). For easier troubleshooting, this RF troubleshooting document is divided into sections.

Before changing HELGO, please check the following things: supply voltages are OK and serial communication coming from baseband to HELGO.

Please note that the grounding of the PA module is directly below PA-module so it is difficult to check or change. Most RF semiconductors are static discharge sensitive! So ESD protection must be taken care of during repair (ground straps and ESD soldering irons). HELGO and PA are moisture sensitive so parts must be pre-baked prior to soldering.

Apart from key components described in this document, here are a lot of discrete components (resistors, inductors and capacitors) the troubleshooting of which is done by checking if sold ering of the component is done properly (for factory repairs checking if it is missing from PWB). Capacitor can be checked for shortening and resistors for value by means of an ohmmeter, but be aware that in-circuit measurements should be evaluated carefully.

Please be also aware that all measured voltages or RF levels in this document are rough figures. Especially RF levels vary due to different measuring equipment or different grounding of the used probe. When using RF probe, usually a good way is to use metallic tweezers to connect probe ground to PWB ground as close to measurement point as possible.

Note! If the measurement values of RM-12 are as mentioned in this RF troubleshooting guide, but there are still difficulties making calls with the device, then check the antenna contacts in PWB.

3 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

RF Key component placement

1900 RX SAW

900 RX SAW

CCS Technical Documentation

1900 LNA 1900 RX balun

4GHz VCO

Antenna Switch Module

Power Amplifier

900 TX SAW

VCO balun

1800 RX SAW

Helgo86 RF ASIC

26 MHz VCTCXO

1800/1900 TX balun

Figure 1: Component placement 1

Issue 1 11/2004 COMPANY CONFIDENTIAL 4

CCS Technical Documentation

RF Measurement points

RM-12

VANT_3

ASM_in_900TX

To antenna

VANT_2

VANT_1

ASM_in_1800/1900TX

Mode

Iref_900

VTXB_900

PA_in_900

VPCTRL_900

ASM_out_1900RX

ASM_out_1800RXASM_out_900RX

VPCTRL_1800/1900

PA_in_1800/1900

VBAT

RX_1900_saw _out

LNA_P

1900_RX_In

Iref_1800_1900

VTXB

_1800_1900

LNA_VCC

1800_RX_In

VPECTRL3(ALC)

900_RX_In

VR7

RFBusEna1/J7306

VR4

TXC

VR5

VR6

RXQ/J7303

RXI/J7302

TXP/J7300

TXA/J7301

TXQP/QN

TXIN/TXIP

VR1

VR2

VR3

26MHz to BB

VCTCXO

26Mhz out

RFBusReset/J7307 RFBusData/J7304

RFBusClk/J7305

Figure 2: Measurement points

5 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

CCS Technical Documentation

EGSM900, GSM1800 & GSM1900 Transmitter

General instructions for Tx troubleshooting

Kindly refer to the Service Software Section, Service Concept diagram. Connect test jig to computer with DAU-9S cable or to FPS-8 Flash Prommer with XCS-4 mod-

ular cable. Make sure that you have PKD-1 dongle connected to computer’s parallel port. Connect DC power supply to module test jig with FLC-2 cable.

NOTE! When repairing or tuning transmitter use external DC supply with at least 3A current capability. Set the DC supply voltage to 4.2V.

Connect an RF-cable to the module test jig (MJ-32) RF connector and to measurement equipment or at least a 10dB attenuator, otherwise the PA may be damaged. Normally a spectrum analyzer is used as measurement equipment.

NOTE! Normally Spectrum analyzer maximum input power is +30dBm. It is recommended to use 10dB attenuator on Spectrum analyzer input to prevent damage.

Set the phone module to test jig and start Phoenix service sofware. Initialize connection to phone. (Use FBUS driver when using DAU9S, COMBOX driver when

using FPS-8.) Select product from the menu:

File -> Choose product -> RM-12

From toolbar, set operating mode to "Local" Activate RF controls window from the menu:

Testing -> RF Controls

From the RF controls window:

• Select band "GSM900" or "GSM 1800" or "GSM1900" (Default = "GSM900")

• Set Active unit to "Tx" (Default = "Rx")

• Set Operation mode to "Burst" (Default = "Burst")

• Set Tx data type to "Random" (Default = "All1")

• Set Rx/Tx channel to 37 on GSM900 band or 700 on GSM1800 band or 661 on GSM1900 (Defaults)

• Set Tx PA mode to "Free" (Default)

• Set power level to 5 (Default = 19) on GSM900 or to 0 (Default = 15) on GSM1800 or GSM1900

Issue 1 11/2004 COMPANY CONFIDENTIAL 6

CCS Technical Documentation

g

p

Transmitter troubleshooting diagrams

Yes

Yes No

Check output signal level: +32…+33dBm@897.4MHz(GSM900) +29…+30dBm@1747.8 and 1880MHz (GSM1800&1900) OK?

No No Yes

Yes No

Check with RF probe signal level on PA input: ~ -1…+5dBm OK?

No

Yes

Start TX power level tuning and check tuned coefficient values: Highest level ~0.655…0.831(GSM900); ~0.567…0.782(GSM1800&1900)

Yes

Lowest level ~0.166…0.196(GSM900); ~0.176…0 .225(GSM1800&1900) Base level ~0.137…0.166(GSM900); ~0.132…0.161(GSM1800&1900)

Major differences?

No

Check control voltage with

Yes

oscilloscope: PA Ctrl voltage >1.5V peak

No

OK?

Yes No

TX Troubleshooting

TX signal found?

PA & Antenna Switch troubleshooting

Figure 3: Transmitter troubleshooting

TX OK

Check all power levels, OK?

Check output signal on 500MHz span Signal found on incorrect frequency?

Helgo troubleshootin

Yes

Check control loop components OK?

Replace faulty com

onents

Tune TX power levels, OK?

Yes

No

Synthesizer troubleshootin

Tune TX coefficient values

Replace Helgo

RM-12

7 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

CCS Technical Documentation

Figure 4: HELGO IC troubleshooting

Check with oscilloscope:

-TXI/TXQ signals

No

-VR1, VR2, VR4, VR5, VR6 =2.8V

-VrefRF01 = 1.35V

-Helgo serial interface

-TXP & TXC signals OK?

Yes

Check with RF probe: 4G VCO signal output:

No

-3589.6MHz (GSM900)

-3495.6MHz (GSM1800)

-3760MHz (GSM1900) Level > - 10dBm OK?

Yes

Check modulator output components OK?

No

HELGO IC troubleshooting

Replace faulty component(s)

Baseband troubleshooting

Synthesizer troubleshooting

Replace HELGO

Issue 1 11/2004 COMPANY CONFIDENTIAL 8

CCS Technical Documentation

p

)

p

RM-12

Check with RF probe signal level on PA

Yes Yes

input ~ -1…+5 dBm OK?

Yes No

Check with oscilloscope:

-VBATT ~4V

-VTXB = 2.8V pulsed

-VPCTRL_900/1800/1900 OK?

Yes

PA & Antenna Switch troubleshooting

No

Check component s around PA OK?

No

Replace faulty

onent(s)

com

Figure 5: PA and Antenna Switch troubleshooting

Check with oscilloscope:

-VANT1 (GSM900)

-VANT2 (GSM1800)

-VANT3 (GSM1900) OK?

Check VANT line components OK?

Yes No

Replace faulty

onent(s

com

Replace PA

Replace HELGO

Replace ant. switch

9 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Pictures of transmitter signals

CCS Technical Documentation

Figure 6: Transmitter signals, VPCTRL

VPCTRL900 power level high at R7003 VPCTRL1800/1900 power level high at R7007

Figure 7: Transmitter signals

200mV/div

TX I/Q at R7304/7305 power level high Random data

100us/div

Issue 1 11/2004 COMPANY CONFIDENTIAL 10

CCS Technical Documentation

RM-12

500mV/div 100us/div

VANT_1 / GSM900 TX at C7100 VANT_2 / GSM1800 TX at C7102

VANT_3 / GSM1900 TX at C7101 OV (no signal/ Flatline on Oscilloscope screen)

500mV/div 100us/div

TXC at R7303

1

VTXB_900 at C7013 VTXB_1800_1900 at C7014

500mV/div 100us/div

TXP at J7300

11 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

m

A

CCS Technical Documentation

Figure 8: Tx out signal, 900 band, burst mode, channel 37

Ref Lvl

34 dBm

34

21 dB Offset

30

20

10

0

-10

-20

-30

-40

-50

Marker 1 [T1]

28.46 dBm

897.38997996 MHz

RBW 100 kHz

VBW 100 kHz

SWT 2 s

1

RF Att 40 dB

Unit dB

A

1M

-60

-66

Center 897.4 MHz Span 2 MHz200 kHz/

Date: 28.APR.2003 15:09:42

Additional information for EDGE troubleshooting

EDGE mode troubleshooting differs slightly from basic GSM troubleshooting

Establish connection to the phone normally (see GSM900/1800/1900 troubleshooting instructions).

Select product from the menu:

File -> Choose Product -> RM-12

From toolbar, set operating mode to “Local” Activate RF controls window from the menu:

Testing -> RF Controls

From the RF controls window:

• Select Band “GSM900” or “GSM1800” or “GSM1900” (Default=”GSM900”)

Issue 1 11/2004 COMPANY CONFIDENTIAL 12

CCS Technical Documentation

• Set Active unit to “Tx” (Default=”Rx”)

• Set Edge “On” (Default=”Off”)

• Set Operation mode to “Burst” (Default=”Burst”)

• Set Tx data type to “Alternate PN9” (Default=”All1”)

• Set Rx/Tx channel to 37 on GSM900 or 700 on GSM1800 or 661 on GSM1900 (Defaults)

• Set power level to 8 (Default = 19) on GSM900 or to 2 (Default = 15) on GSM1800 or GSM1900

NOTE! For GSM900, Edge power levels 5, 6 and 7 are not in use, and for GSM1800&1900, Edge power levels 0 and 1 are not in use.

RM-12

13 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

g

p

CCS Technical Documentation

Figure 9: Transmitter EDGE troubleshooting

TX EDGE Troubleshooting

Yes

Yes No

Check output signal level: +24…+30dBm@897.4MHz(GSM900) +22…+29dBm@1747.8 and 1880MHz (GSM1800&1900) OK?

No No Yes

Yes No

No

Yes

No

Yes No

TX signal found?

Check with RF probe signal level on PA input: ~-8dBm@PCL=8 (GSM900) ~-10dBm@PCL=2 (GSM1800&1900) OK?

Start TX Edge power level tuning and check tuned coefficient values: Highest level ~0.684…0.841(GSM900); ~0.763…0.860(GSM1800&190 0) Lowest level ~0.333…0. 420(GSM900); ~0.323…0. 362(GSM1800&1900) Base level ~0.273…0.313(GSM900); ~0.244…0.313(GSM1800&1900)

Major differences?

Check control voltages with oscilloscope: Pa Iref ~2V peak (GSM900) Pa Iref ~2.1V peak (GSM1800@1900) Mode ~1.8V OK?

PA & ant switch EDGE troubleshooting

Yes

TX OK

Check all power levels, OK?

Check output signal on 500MHz span Signal found on incorrect frequency?

Helgo EDGE troubleshootin

Check EDGE control loop components OK?

Replace faulty com

onents

Yes

Tune TX power levels, OK?

Synthesizer troubleshootin

Tune TX coefficient values

No

Replace Helgo

Issue 1 11/2004 COMPANY CONFIDENTIAL 14

CCS Technical Documentation

Figure 10: Helgo EDGE troubleshooting

Check with oscilloscope:

-TXI/TXQ signals

No

-VR1, VR2, VR4, VR5, VR6 =2.8V

-VrefRF01 = 1.35V

-Helgo serial interface

-TXP & TXC & TXA OK?

Yes

Check with RF probe: 4G VCO signal output:

No

-3589.6MHz (GSM900)

-3495.6MHz (GSM1800)

-3760MHz (GSM1900) Level > - 10dBm OK?

Yes

Check modulator output components and VPECTRL3 signal

No

Helgo EDGE troubleshooting

Replace faulty component(s)

Baseband troubleshooting

Synthesizer troubleshooting

Replace HELGO

RM-12

15 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

p

)

p

)

CCS Technical Documentation

Figure 11: Pa & ant switch EDGE troubleshooting

PA & ant switch EDGE troubleshooting

Check with RF probe signal level on PA input: ~ -8dBm@PCL=8 (GSM900) ~ -10dBm@PCL=2 (GSM1800&1900) OK?

Yes No

Check with oscilloscope:

-VBATT ~4V

-Iref _900 ~2V peak

-Iref_1800_1900 ~2.1V peak

-VTXB = 2.8V pulsed

-Mode = ~1.8V OK?

No

Check components around PA OK?

Yes No

Yes

Replace PA

Yes Yes

Yes

Check with oscilloscope:

-VANT1 (GSM900)

-VANT2 (GSM1800)

-VANT3 (GSM1900) OK?

Check VANT line components OK?

Replace HELGO

Replace faulty

onent(s

com

Replace ant. switch

No

Replace faulty

onent(s

com

Issue 1 11/2004 COMPANY CONFIDENTIAL 16

CCS Technical Documentation

Pictures of EDGE transmitter signals

Figure 12: I_ref_900 power level 8 at R7019/C7001

RM-12

Figure 13: VTXB 900 power level 8 at C7013

17 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

CCS Technical Documentation

Figure 14: I_ref_1800/1900 power level 2 at R7017/C7000

Figure 15: VTXB 1800/1900 power level 2 at C7014

Issue 1 11/2004 COMPANY CONFIDENTIAL 18

Figure 16: TXA 900/1800/1900 at C7309

Figure 17: TXI/TXQ signal at C7311/C7312/R7304/R7305

Figure 18: VPECTRL3 (ALC) signal at C7309

RM-12

CCS Technical Documentation

EGSM900, GSM1800 and GSM1900 Receiver

General instructions for Rx troubleshooting

Connect test jig to computer with DAU-9S cable or to FPS-8 Flash Prommer with XCS-4 modular cable.

Make sure that you have PKD-1 dongle connected to the computer’s parallel port. Connect DC power supply to module test jig with FLC-2 cable. Set the DC supply voltage to 4.2V. Connect an RF-cable to the module test jig (MJ-32) RF connector and to RF signal generator. Set the phone module to test jig and start Phoenix service sofware. Initialize connection to phone. (Use FBUS driver when using DAU-9S, COMBOX driver when

using FPS-8.) Choose product from the menu:

File -> Choose product -> RM-12

From toolbar, set operating mode to "Local" Activate RF controls window from the menu:

Testing -> RF Controls

From the RF controls window:

• Select band "GSM900", "GSM 1800" or “GSM1900” (Default = "GSM900")

• Set Active unit to "Rx" (Default = "Rx")

• Set Operation mode to "Burst" (Default = "Burst")

For continuous mode:

• Set Operation mode to "Continuous"

• Set AGC to "12: FEG_ON + DTOS_ON + BB_30=Vgain60” (maximum gain setting used in normal mode)

(Default = "14: FEG_ON + DTOS_ON + BB_42=Vgain72")

• Set Rx/Tx channel to 37 on GSM900 band, 700 on GSM1800 band or 661 on GSM1900 (Defaults)

Apply 942.46771 MHz (channel 37 + 67.710 kHz offset), 1842.86771 MHz (channel 700 +

67.710 kHz offset) or 1960.06771 MHz (channel 661 + 67.71 kHz) –90 dBm signal to the RFconnector (remember to compensate for cable attenuation).

Issue 1 11/2004 COMPANY CONFIDENTIAL 21

RM-12

CCS Technical Documentation

Measuring with an oscilloscope on "RXI" or "RXQ" following screens should be seen on a working GSM900, GSM1800 or GSM1900 receiver:

Figure 1: RX I/Q signal, burst mode, input level –90dBm

Receiver I or Q burst mode signal (channel 37) measured from testpoint RXI or RXQ with

942.46771 MHz signal, input level –90dBm at RF-connector. Correct signal amplitudes approximately:

• GSM900~170mVpp

• GSM1800~140mVpp

• GSM1900~160mVpp

Signal part frequency 67.7kHz sine. DC level of signal part is 1.35V. DC level can variate about +/-100mV between I and Q signals

and between different bands as well.

22 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

CCS Technical Documentation

Figure 2: GSM1900 RX I or Q signal (trace2), burst mode

GSM1900 receiver burst mode I or Q signal at ch 661 with input signal 1960.067MHz, level – 90 dBm at RF-connector.

Trace2: With wider time scaling both monitoring and own RX bursts are seen, 1

nd

is monitoring and 2

burst (longer) is own RX burst.

st

burst (shorter)

Trace1: External LNA VCC supply voltage at burst mode, input level –90 dBm. Measured from testpoint LNA_VCC.

Issue 1 11/2004 COMPANY CONFIDENTIAL 23

CCS Technical Documentation

Figure 3: RX I&Q, phase difference 90 deg between signals

RM-12

Detailed view of GSM900 continuous mode RX I and Q signals measured from testpoints RXI and RXQ simultaneously.

Used channel 37, input signal 942.46771 MHz, level –90 dBm at antenna port, AGC setting 12. Phase difference should be 90 degrees between RX I and Q signals at all bands.

24 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

A

q

A

–

A

)

A

Troubleshooting diagram for GSM900 receiver

Phone in “Continuous” mode, AGC setting “12”..

CCS Technical Documentation

pply –90dBm

942.46771MHz signal from generator to antenna connector

Osilloscope at RX_I signal 170mVpp DC offset 1.35*** Fre

uency 67.7kHz

Rx 900 chain functional

Check L809,L810

L7104, L7103

Figure 4: GSM900 receiver troubleshooting

Note! Generator level can be set higher if needed. Just note that levels will be different in whole chain respectively.

Spectrumanalyzer:

ntenna Switch

output GSM900

88dBm

Spectrumanalyzer: HELGO inputs GSM900 –89dBm

Oscilloscope VANT_1…3 0V

Check Antenna Switch Z800

Spectrumanalyzer:

ntenna Switch

input –88dBm

Z7100

Oscilloscope:Check HELGO serial interface (burst mode

Check C809

X7100

Check Baseband

Check SAW Z809

Z7101

Check SAW filter output

Oscilloscope: VR1,3…6 2.7V Check HELGO serial interface (burst mode)

Spectrumanalyzer: 4G VCO output

3769.6MHz ~-30dBm*

Check HELGO N500

N7300

Check Baseband

Synthesizer troubleshooting

Check HELGO N500

N7300

reading values are measured with 1 kohm passive probe (use tweezers to connect the probe ground to the nearest PWB ground). Reading value is represented without +26 dB compensation.

* Spectrumanalyzer reading with 1 kohm passive probe (right value add +26dB)

*** DC-level of RXI/RXQ in continuous mode will decrase slowly. The original level can be rest ored by rewriting gain set

ll spectrumanalyzer

Issue 1 11/2004 COMPANY CONFIDENTIAL 25

CCS Technical Documentation

A

q

A

)

A

Troubleshooting diagram for GSM1800 receiver

Phone in “Continuous” mode, AGC setting “12”.

RM-12

pply –90dBm

1842.86771MHz signal from generator to antenna connector

Osilloscope at RX_I signal 170mVpp DC offset 1.35*** Fre

uency 67.7kHz

Rx 1800 chain functional

Z7102,

Check Z808, L838,L839

L7105, L7106

Figure 5: GSM1800 receiver troubleshooting

Note! Generator level can be set higher if needed.

Spectrumanalyzer

ntenna Switch

output, GSM1800

-88dBm

Spectrumanalyzer HELGO inputs GSM1800 –88dBm

Just note that levels will be different in whole chain respectively.

Spectrumanalyzer input –84dBm

Oscilloscope VANT_1…3 0V

Check Antenna

Z7100

Switch Z800

ntenna Switch

Oscilloscope:Check HELGO serial interface (burst mode

Check C809

X7100

Check Baseband

Check Z808

Z7102

Check SAW filter output

Oscilloscope VR1,3…6 2.7V Check HELGO serial interface (burst mode)

Spectrumanalyzer 4G VCO output

3685.6MHz ~-30dBm*

Check HELGO N500

N7300

Check Baseband

Synthesizer troubleshooting

Check HELGO N500

N7300

ll spectrumanalyzer reading values are measured with 1 kohm passive probe (use tweezers to connect the probe ground to the nearest PWB ground). Reading value is represented without +26 dB compensation.

* Spectrumanalyzer reading with 1 kohm passive probe (right value add +26dB)

*** DC-level of RXI/RXQ in continuous mode will decrase slowly. The original level can be restored by rewriting gain set

26 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

A

q

A

p

A

)

A

Troubleshooting diagram for GSM1900 receiver

Phone in “Continuous” mode, AGC setting “12”.

Figure 6: GSM1900 receiver troubleshooting

pply –90dBm

1960.06771MHz signal from generator to antenna connector

Note! Generator level can be set higher if needed. Just note that levels will be different in whole chain respectively.

CCS Technical Documentation

Osilloscope at RX_I signal 160mVpp DC offset 1.35***

uency 67.7kHz

Fre

Rx 1900 chain functional

Spectrumanalyzer: HELGO inputs GSM1900 –88dBm

Check LNA output from C829 –84dBm

Check Balun T701 output

Z7104

C808, C807

C7111, C7112

C7110

Spectrumanalyzer:

ntenna Switch

outputs, GSM1900

ut -88dBm

SAW in

Oscilloscope: VANT_3 2.7V VANT_1/2 0V

Spectrumanalyzer: RX_SAW_out – 90dBm (C826)

(C7108)

Oscilloscope: LNA_VCC 2.6 LNA_P 0V

Check Antenna Switch Z800

Z7100

Spectrumanalyzer:

ntenna Switch

input –84dBm

Oscilloscope:Check HELGO serial interface (burst mode

Check Z806

Oscilloscope: Check R800,

R7100

R810, L800

R7101, L7107

VR1,3…6 2.7V Check HELGO serial interface (burst mode)

Z7103

Check C809

X7100

Check Baseband

Check HELGO N500

N7300

Check Baseband

Oscilloscope: VR1,3…6 2.7V Check HELGO serial interface (burst mode)

Spectrumanalyzer: 4G VCO output 3920 MHz ~-30dBm*

Check HELGO N500

N7300

Check Balun

Check Baseband

Synthesizer troubleshooting

C7111,

Check C808, L805, C807

L7108, C7112

Check HELGO N500

N7300

ll spectrumanalyzer reading values are measured with 1 kohm passive probe (use tweezers to connect the probe ground to the nearest PWB ground). Reading value is represented without +26 dB compensation.

* Spectrumanalyzer reading with 1 kohm passive probe (right value add +26dB)

*** DC-level of RXI/RXQ in continuous mode will decrase slowly. The original level can be restored by rewriting gain set

Issue 1 11/2004 COMPANY CONFIDENTIAL 27

RM-12

CCS Technical Documentation

Synthesizer

General instructions for synthesizer troubleshooting

Connect test jig to computer with DAU9S cable or to FPS-8 Flash Prommer with XCS-4 modular cable.

Make sure that you have PKD-1 dongle connected to the computer’s parallel port. Connect DC power supply or FPS-8 to module test jig with PCS-1 cable. Set the DC supply voltage to 4.2V. Set the phone module to test jig and start Phoenix service sofware. Initialize connection to phone. (Use FBUS driver when using DAU9S, COMBOX driver when

using FPS-8.) Select product from the menu:

File -> Choose product -> RM-12

From toolbar, set operating mode to "Local" Activate RF controls window from the menu:

Testing -> RF Controls

From the RF controls window:

• Select band "GSM900", "GSM 1800" or "GSM1900" (Default = "GSM900")

• Set Active unit to "Rx" (Default = "Rx")

• Set Operation mode to "Continuous" (Default = "Burst")

• Set Rx/Tx channel to 37 on GSM900 band, 700 on GSM1800 band, 661 on GSM1900 band (Defaults)

28 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Synthesizer

troubleshooting

Yes

CCS Technical Documentation

Figure 7: Synthesizer troubleshooting diagram

*(When 2.5kOhm passive probe is used, correct the measurement by +34 dB

Set with RF controls: Active Unti = Rx Operation mode = Continuous

Check with RF probe:

-4G VCO out signal

- 3589.6 MHz (GSM900)

-3495.6 MHz (GSM1800)

- 3760 MHz (GSM1900) Level >-10dBm (*

OK ?

No

VCO out signal level<-10dBm

No

Check output signal on 1 GHz span Signal found on incorrect frequency ?

Yes

Synthesizer OK

Yes

Check with oscilloscope:

-4G VCO Vcc = 2.7V

No

Check balun output levels and solder joints OK ?

No

Replace faulty component(s)

OK ?

No

Yes

Baseband troubleshooting

Replace VCO

Check with oscilloscope: VCO control voltage from VCO pin

0V ?

No

Check with oscilloscope: VCO control voltage

from VCO pin >4.0 V ?

Yes

Check balun output levels and solder joints OK ?

Yes

Check VCO control loop components

Yes

OK ?

Replace VCO

No

Replace faulty component(s)

No

Issue 1 11/2004 COMPANY CONFIDENTIAL 29

CCS Technical Documentation

Pictures of synthesizer signals

Figure 8: 26MHz at G7200 pin out

RM-12

Figure 9: 26MHz RFCLK at R2902/C2902

30 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

CCS Technical Documentation

Figure 10: 1800 TX, channel 512, burst mode

Figure 11: 1900 RX, channel 810, continuous mode

Issue 1 11/2004 COMPANY CONFIDENTIAL 31

CCS Technical Documentation

g

Figure 12: VCO output, 1800 band, ch700, RX on, continuous output

RM-12

RF test points

Signal Test Point Parameter Characteristics Note Function

TXP J7300 "1" and "0" 1.8/0 V digital signal Power amplifier enable TXA J7301 "1" and "0" 1.8/0V digital signal Power control loop enable RXI/RXQ J7302/J7303 voltage swing (static) 1.4Vpp DC level 1.4V Received demodulated I -and Q sign als RFBus Data J7304 "1" and "0" 1.8/0V digital signal data frequency max. 10MHz RFBUs data; read/write RFBusClk J7305 "1" and "0" 1.8/0V digital signal data frequency max. 10MHz RF Bus clock RFBus Ena1 J7306 "1" and "0" 1.8/0V digital signal RFBus enable RESET J7307 "1" and "0" 1.8/0V digital signal Reset to Helgo

RF GSM component alignment

Helgo (N7300) YES YES YES YES YES YES PA (N700) NO NO NO NO YES YES ASM (Z7100) NO YES YES YES YES YES VCO (G7201) NO NO NO NO YES NO TX SAW (Z7000) NO NO NO NO NO NO RX LNA (V7100) NO YES YES NO NO NO RX SAW (Z7101,Z7102,Z7103) NO YES YES NO NO NO

32 COMPANY CONFIDENTIAL Issue 1 11/2004

RX Channel Select Filter CalRX Cal RX Band Filter Response Cal RX DtoS Balance Cal TX IQ Tuning TX Power Level Tunin

RM-12

Nokia Customer Care

Baseband troubleshooting

Partially damaged device

If the device is working, but some functionality is missing, try to localise the problem(s) and see a relevant part of this manual. For example, if audio is not working see “Audio Troubleshooting”, if charging is not working see “Charging troubleshooting”, and so on.

Most common symptoms reported by customer

Here you can find some common symptoms reported by customers when the device is brought in for service. Some tips for locating the problem are also given. When troubleshooting, use these tips and follow the given troubleshooting path.

Most common symptoms for audio problems

• “Earpiece sound is missing”

• ”Handsfree sound is missing”

• ”Microphone is not working”

• ”Ringing tones do not work”

• ”Audio volume too low”

• “IHF does not work”

If the symptom is one of the above, see “Audio troubleshooting”.

Most common symptoms for Bluetooth problems

• ”Bluetooth does not work or connection cannot be established”

Follow “Bluetooth troubleshooting” guidelines.

Symptoms related to energy management

• “Phone does not stay on”

• ”Charging is not working”

• ”Time is lost during battery change”

• ”Charging takes too long”

• ”Operating time is very short”

With these symptoms, follow “Power troubleshooting”.

Issue 1 11/2004 COMPANY CONFIDENTIAL 33

CCS Technical Documentation

Problems related to UI-module

• “Touch Screen is not working”

• “Touch Screen is working unreliably”

• “Keypad is not working”

• ”Rocker is not working”

• ”Backlight is dim”

• ”Backlight not even”

• ”Backlight is blinking”

• ”Keypad or display backlight is not working”

RM-12

• ”Display-related problems”

See “UI troubleshooting”.

Most common RF-related symptoms

• “Call cannot be made”

• ”Phone does not find signal”

• ”Call is often dropped”

See “RF troubleshooting”.

Problems related to camera

• “Bad image quality”

• ”Picture cannot be taken”

See “Camera module troubleshooting”.

34 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Dead or jammed device troubleshooting

Dead phone

Place service

battery via ammeter=

Power On

Nokia Customer Care

Yes

Any image on

screen

Yes

Normal

operation

No No

No

Ammeter >> 0 mA

Yes

Connect PC to

Phone using DAU-

9S cable.

Scan product

RM-12

found

Yes

Normal

operation

No

Flash the phone Succeed

Go to/visit display

No

troubleshooting

Normal

operation

No

Go to power

troubleshooting

Go to OMAP1510

troubleshooting

Yes

End test

Issue 1 11/2004 COMPANY CONFIDENTIAL 35

CCS Technical Documentation

OMAP1510 (1)

Start

Booting

problems?

Yes

Visit APE Power

troubleshooting

APE Power

OK/fixed,

problem solved?

No

Check resistor

R4806, replace

if needed.

Problem solved?

RM-12

Yes

Yes End

No

Visit APE clock

troubleshooting

Vis it SDRAM

troubleshooting

Was it a

SDRAM

problem?

No

Yes

APE clocks/

reset OK/fixed,

problem solved?

No

Go to /(visit) APE

NAND

troubleshooting

Was it a NAND

problem?

Yes

End

Yes

End

No

Replace

engine board.

OMAP1510 D4800

36 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

SDRAM (1)

Start

Run

ST_APE_RAM_

TEST, with

Phoenix.

Result?

All signals in this

troubleshooting are in

range 0 - V18

Problem

Pass

occurs only in

heat or cold?

No

Use cold spray/ hot air to SDRAM device or customer feedback

Phone might been

dropped, solder

Yes

balls cracked,

replace D5080

Nokia Customer Care

Fail

Measure

SDRAM

voltage V18 at

C5083

Correct

Measure SDCLK

Measure

SDCLK

frequency at

R4808 = 75MHz,

R4808

(1.8V).

>70MHz?, level

0 - ~V18

No

Go to SDRAM

troubleshooting

page 2

Incorrect

Yes

Go to OMAP1510

troubleshooting

Check and replace

if needed C5083-

Check C5083 - C5089.

C5089, res ist ance

>>1Mohm

Correct

Phone might been

dropped, solder

balls cracked,

replace D5080

Measure

SDRAM

voltages V18

at C5083

Incorrect

Correct

Visit APE Power

troubleshooting

Measure

SDRAM

voltages V18

at C5083

Incorrect

Change SDRAM

D5080

Issue 1 11/2004 COMPANY CONFIDENTIAL 37

CCS Technical Documentation

SDRAM (2)

From SDRAM

troubleshooting

page 1

Replace

Inspect R4808

value, approx

22ohm

No

R4808 and

measure

SDCLK

frequency

>>70Mhz

Yes

Rerun

ST_APE_RAM_

TEST with

Phoenix

Fail

Change SDRAM

D5080

RM-12

Yes

No

Problem

occurs while

booting?

Yes

Go to Seija/NAND

troubleshooting

Pass

No

Go to OMAP1510

troubleshooting

38 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

APE flash

Nokia Customer Care

All signals in this

troubleshooting are in

range 0 - V18

Busy# signal rises

at latest after

1055us after

RSTIN# rises.

However, the Busy#

can be high before

RSTIN# rises, but this

is not taken into account.

Start

Measure MDOC Busy# at R4801 and

RSTIN# at

J4803

RSTIN# stays low

Measure

MPU_nReset at

R4802, low to

high transition?

Stays low

Yes

Backup user data before MDOC troubleshooting, if

Boot phone. Use oscilloscope.

Busy#

stays low

Go to OMAP1510

troubleshooting

possible

Check resistor

R4801

~10k

Yes

Check MDOC

core voltage at

C5000, V28

Correct

voltages

No

Replace resistor

R4801 and rerun

first test

Voltage levels

invalid

Check

resistors

R5000 and

R5001,

both ~10k

Yes

Measure

CS0# at J4805

and OE#

J4802,

toggling?

Yes

Memory

corrupted, reflash,

or replace MDOC

D5000

Replace damaged

No

Go to OMAP1510

No

Go to APE reset

troubleshooting

resistor(s)

troubleshooting

Check MDOC I/O voltage at

C5001,

V18

Correct

voltages

Check

resistors

R5000 and

R5001,

both ~10k

Yes

MDOC damaged,

replace D5000

Voltage

level

invalid

No

Go to APE Power

troubleshooting

Replace damaged

resistor(s)

Issue 1 11/2004 COMPANY CONFIDENTIAL 39

RM-12

CCS Technical Documentation

ASIC is changed

ASICs can be changed only at a defined service level.

• If UEM is changed

If UEM is changed, baseband calibrations should be made. IMEI must be prog rammed also.

• If UPP8M is changed

If UPP is changed, there is no need to flash the phone.

• If Zocus is changed

If Zocus is changed, it must be calibrated.

• Nor flash changed

If CMT Nor flash is changed, re-flash the phone. IMEI must be programmed also.

• SDRAM changed

If SDRAM is changed, there is no need to flash the phone.

• MDOC flash changed

If MDOC memory is changed, User data needs to be back-upped if possible. Re-flash the phone.

• Touch screen controller

If touch screen controller or display module is changed, calibrations should be made.

•BT

If BT chip is changed, there is no need to flash the phone.

Test points

Test point locations and possible signal levels are listed in the Schematics chapter of this Service Manual.

Selftests / “Contact service” on display

MCU selftest cases can be split into two categories: ones that are executed during power up and ones that are executed only with a PC connected.

“CONTACT SERVICE” on display means that software is able to run and thus the watchdog of UEM can be served. Selftest functions are executed when the phone is powered on a nd if one or more selftest functions fail, the message “Contact Service” is shown on the display.

40 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Nokia Customer Care

PC selftests are listed below:

Table 1: PC selftests

Test Description

ST_AUX_DA_LOOP_TEST This function tests the connection of

AuxDa and UemInt signals between UPP and UEM.

ST_EAR_DATA_LOOP_TEST This function tests the connection of

EarData and MicData signals between UPP and UEM.

ST_KEYBOARD_STUCK_TEST This function tests if some key is

stucked.

ST_MBUS_RX_TX_LOOP_TEST

ST_SIM_CLK_LOOP_TEST

ST_SIM_IO_CTRL_LOOP_TEST

ST_SLEEP_X_LOOP_TEST

ST_TX_IDP_LOOP_TEST

This function tests the connection of MBusTx and MBusRx signals between UPP and UEM.

This function tests the connection of SimClk and SimIODa signals between UPP and UEM. This test requires also that SimIOCtrl signal can be set to high state.

This function tests the connection of SimIOCtrl and SimIODa signals between UPP and UEM. This test requires also that SimClk signal can be switched.

This function tests the connection of SleepX and SleepClk signals between UPP and UEM.

This function tests the connection of TxIdp and RxIdp signals between UPP and UEM.

ST_TX_IQ_DP_LOOP_TEST

This function tests the connection of TxQdp and RxQdp signals between UPP and UEM.

ST_BACKUP_BATT_TEST

This function tests if the backup battery was ok during power-up.

ST_LPRF_IF_TEST

This test verifies, whether BT MCM internal selftests are o.k.

Issue 1 11/2004 COMPANY CONFIDENTIAL 41

CCS Technical Documentation

RM-12

Table 1: PC selftests

ST_CAMERA_IF_TEST

Purpose of this test is to verify the cam-

era data and I2C lines. I2C interface test and camera activation is done first and then camera sends test picture to the OMAP.

ST_WARRANTY_TEST

This function tests the Warranty Infor-

mation State.

ST_FLASH_CHECKSUM_TEST

This test computes the checksums over flash ROM areas and compares them to the pre-calculated checksums in flash header.

ST_RADIO_TEST

Purpose of this test is to check that radio data line is working properly.

ST_LPRF_AUDIO_LINES_TEST

This test verifies the LPRF audio lines.

ST_UEM_CBUS_IF_TEST This test verifies the CBUS connection

of CBUSCLK, CBUSDA, and CBUSENX

signals between UPP and UEM. ST_VIBRA_TEST This test verifies the vibra lines. ST_SLEEPCLK_FREQ_TEST Purpose of this test is to check the basic

functionality of

ST_SLEEPCLK_FREQ_TEST. ST_CURRENT_GAUGE_IF_TEST Purpose of this test is to check that

ST_CURRENT_GAUGE_IF_TEST is

working in real HW environment. Test

uses current gauge registers to verify,

that correct HW-module is in place and

working properly. ST_CMT_APE_WAKEUP_TEST Purpose of this test is to check that

ST_CMT_APE_WAKEUP_TEST is

working properly. ST_MAIN_LCD_IF_TEST Purpose of this test is to check that dis-

play interface (OMAP and LCD) is work-

ing properly. ST_TOUCH_STUCK_TEST Purpose of this test is to check that

touch interface is working properly. ST_APE_DAC_CTRL_IF_TEST Purpose of this test is to check connec-

tions (I2C lines) between APE and DAC.

Audio driver provides the test interface.

42 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Nokia Customer Care

Table 1: PC selftests

ST_APE_RAM_TEST Purpose of this test is to check that

ST_APE_RAM_TEST is working prop-

erly. Test starts RAM testing and loops

the result until response from APE boot-

code is received. ST_APE_POST_CODE_TEST Purpose of this test is to check that

ST_APE_POST_CODE_TEST is (boot-

code) working properly. ST_BT_WAKEUP_TEST Purpose of this test is to check that

UART interface from the OMAP to the

Bluetooth module. The Bluetooth ASIC

self-test runs automatically as part of the

boot-up sequence. It is based on the

assumption that UART communication

is required to successfully run the initiali-

sation sequence. It cannot be assumed

that if the connection works if a UART

command is sent to the Bluetooth ASIC.

Therefore, the Bluetooth ASIC must

send the status information (OK/Not OK)

to the test server in the boot sequence. ST_XABUS_TEST Purpose of this test is to check that

ST_XABUS_TEST is working in real HW

environment. Test checks the communi-

cation bus between CDSP and Applica-

tion DSP and therefore this test cannot

be executed in MOSIM environment.

Also ST_FAIL situation would be too dif-

ficult to simulate comparing to benefits. ST_PWR_KEY_TEST Purpose of this test is to check that pwr

key is working properly.

Issue 1 11/2004 COMPANY CONFIDENTIAL 43

CCS Technical Documentation

Flashing troubleshooting

Flashing does

not work

Check cables and

flashing adapter. Verify

that you have the right

data package

From APE flashing

troubleshooting

RM-12

From the CMT

flashing

troubleshooting

OK? No

Go to CMT

flashing

troubleshooting

RM-12

Check Nokia 7710

flashing

instructions

44 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

APE Flashing

From the CMT

flashing

troubleshooting

Flashing

stalls. "ADL ->

sending code: x%"

(x<100) ?

No

Yes

Nokia Customer Care

Go to NAND

troubleshooting

Run

ST_APE_POST_

CODE_TEST with

Phoenix

pass

Go to USB

troubleshooting

Reflash

Fail

Phone starts

to boot, but jams

after a while ?

No, totally dead device

Go to APE power

troubleshooting

Yes

CMT functionality

OK and automatically

ran self tests passed?

Yes

Go to OMAP1510

troubleshooting

No

Go to CMT

troubleshooting

Issue 1 11/2004 COMPANY CONFIDENTIAL 45

CCS Technical Documentation

CMT flashing

Note! OMAP, UEM and UPP are unchangeable.

From the top

level

Measure FBUS and BSI signals

while flashing

FBUS TX is HIGH during

flashing?

No

BSI pulse

exists during

flashing?

RM-12

Check BSI line

including X2020,

No

R2035, C2020,

R2201, C2225 and

R2202

Yes

IS FBUS TX set LOW

after it has been

HIGH

Yes

Check Phoenix

Prommer Tool

window

information

Wrong

Manufacturer

ID or

Device ID

No

Is FBUSTX

~1.8V during

flashing

Yes

No

Yes

No

Check R2025, if OK change UEM

Change UPP

(D2800)

Change flash

(D3000)

Go to APE flashing

troubleshooting

Reflash

46 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Power troubleshooting

Nokia Customer Care

Table 2: Power troubleshooting

Regulator

reference

Output

name

Output voltage

Test point Supply to

N4201 V15 1.57 C4214 D4800 Omap1510 core N4202 V18 1.8 C4212 D4800 Omap 1510 io, D5080

SDRAM, D5000, MDOC, camera

N4200 V28 2.8 C4202 D4800 Omap 1510 io, camera con-

verter, display module, N4400

touch controller N5200 VMMC 3 C5202 MMC N2000 Vout 2.8 C2000 Pop-port N2001 V33 3.3 C2005 D4800 Omap 1510 USB D4420 VLED 10..11V C4424 Backlight, keylight

Issue 1 11/2004 COMPANY CONFIDENTIAL 47

CCS Technical Documentation

CMT

Note! OMAP, UPP and UEM are unchangeable.

NO power

up

Connect service battery to phone

and measure current when

powering on

RM-12

Current rises

over 100mA but

drops down

NO

Current short

NO

Current 0mA all

the time

NO

Disassemble

phone

Check CMT

voltages: C2232=2.8V, C2202=2.8V, C2204=1.8V,

C2205=1.5V

All Voltages ok

w he n power

button pressed

YES

YES Flash phone SW

NO

YES

Disassemble

phone and check

visually possible shortcircuits and

YES

damaged or over

heated

components

Check Battery

YES

NO

connector

C2232=2.8V to

RF, C2202=2.8V

to R2201 and

N4201,

C2204=1.8V to

D2800 and D3000,

C2205=1.5V to

D2800

Current rises

over 100mA but

drops down

Any damaged

component found

and changed

Remowe RF VBAT

NO

Change damaged

component on

voltage not in

spec.

YES

filter L7000

Perform EM

calibration with

Phoenix and

JBV-1

All Voltages ok

w he n power

button pressed

Current short Goto RF checkingNO

YES

Change R2036,

Current short

YES

CSP compone n t

on VBATT: N2000, N2070, N2100, N2200, N4200, N4201,

N4202, N5200

Change UEM

NO

D2200

Check CMT Res e t

and clocks.

YES

48 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Charging

Not

charging

Connect

service battery

and read BSI

by Phoenix

75kohm

100kohm

YES

Connect charger

and read Vchar

voltage by

Phoenix ACP-12

5.7V

NO

Note! OMAP, UEM and UPP are unchangeable.

Perform EM

calibration by

NO

YES Flash phone SW

Phoenix and

JBV-1

Charging OK

Read BSI b y

Phoenix. With

servce battery

100kohm

75kohm

YES

Flash phone SWNO

Read BSI b y

Phoenix. With

servce battery

75kohm

100kohm

YES

Change R2201

and R2202

Nokia Customer Care

Disassemble

NO

phone and check

Battery contacts .

R2202, Norma l

NO

Phone in jig.

Measure

voltage on

mode 1.3V

Perform EM calibration by Phoenix and

JBV-1

Connect charger

and read Vchar

voltage by

Phoenix ACP-12

5.7V

NO

Flash phone SW

Charging OK

NO

Charging OKYES

Charging OK

Disassemble

phone and change

NO Charging OK

Measure Vchar

from fuse F2020

5.7V

YES

R2200

NO

Measure Vchar

from fuse F2020

calibration by

Change fuse

F2020

5.7V

NO

Perform EM

Phoenix and

JBV-1

NO

Change UEM

D2200

Charging OK

Disassemble

phone. Check

charger connector.

Measure Vchar

from L2020 5.7V

Change fuse

F2020 and V2020.

NO

YES

Change L2020

Issue 1 11/2004 COMPANY CONFIDENTIAL 49

CCS Technical Documentation

APE

RM-12

Power on

Supply voltage

drops(or current

is large)?

NO

Measure VBAT

from input filters

C4200, C4209,

L4203(both sides)

OK?

YES

Check

V28(~2.8V),

OK?

YES

Visit APE reset

troubleshooting

YES

NO

Note! OMAP, UEM and UPP are unchangeable.

Short circuit in

VBAT line

Failure on VBAT

line, check

components and

connectors

Check

enable(VIO),

high (1.8V)?

NO

UEM fault

YES

Change V28

regulator(N4200)

and retest, OK?

NO

Shortcut in V28

line

Check SYNC/

MODE fr o m R4202 (both sides), High

(>2V)?

YES

Check

V15(~1.57V),

OK?

YES

Check V18

(~1.8V), OK?

YES

END

R4200 or

Faulty V1600 or

NO

NO NO

R4202, change

and retest

V15 > 1.62V ?

V18 >1.89V ?NO

No

Check

enable (VIO),

high (1.8V)?

NO

UEM fault

YES

NO

Check enable

(VFLASH1), high (2.8V)?

NO

UEM fault

Check

ref. voltage

at C4211,

1.35V ?

NO

Ref .

voltage found

at either end of

L4200 ?

YES

Check voltage at L4201 (both sides low),

~0V ?

Change coil and

retest V15

YES

Check voltage at L4202 (both sides low),

<1V ?

Change filter

(L4200)

NO

YES

NO

Change coil and

retest V18

Change SMPS

chip(N4201) and

retest, OK?

Shortcut in V15

YES

NO

line

Change SMPS

chip (N4202)

and retest, OK?

NO

Shortcut in

V18 line

50 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

APE Clocking

APE clocks

trouble

shooting

Clk32k (J4815):

Voh ~ 2.8V &

f ~ 32.768kHz ?

(Figure 1)

Nokia Customer Care

Reflash the phone

SleepClk ( J2802):

No

Voh ~ 1.8V &

f ~ 32.768kHz ?

(Figure 2)

first and check that

Clk32k is not shorted

to GND or some

Yes

power line. If Clk32k

still doesn't w ork,

change UEM

Yes

12Mhz clock

(C4800, OSC1_IN):

Vpp ~ 1.7V & f ~ 12.0MHz ?

(Figure 3)

Yes

Check that

(C4800, OSC1_IN)

DC-offset ~ 720mV

(C4802, OSC1_OUT)

DC-offset ~760mV

(Figures 3&4)

Yes

Solder joints of C4800, C4801,

C4802 and B4800

OK ?

Yes

Measure

resistance over

C4801.

R >>1M ?

Yes

NoNo

No

Go to CMT clock s

troubleshooting

Solder joints of

OMAP151 0

damaged

Fix solder joints

Check solder joints

of V6031 and

replace the

component, if

necessary.

No

Change B4800. If

Check completed

this doesn't help,

change C4800,

C4801 and C4802.

Issue 1 11/2004 COMPANY CONFIDENTIAL 51

CCS Technical Documentation

APE Reset

APE reset

trouble

shooting

Switch power on

by connecting

power to battery

terminals of the

phone

Low to

high transition

on PURX

(N4800, pin #3) &

Voh ~ 1.8V ?

(Fig. 5)

No

Go to CMT

troubleshooting

RM-12

Yes

Low to

high transition on MPU_nRes e t (N4800, pin #1) &

Voh ~ 2.8V ? PURX to

MPU_nReset delay should

be 65-195ms!

(Fig. 5)

Yes

Check completed

Note!!! Only probes having input impedance of 10Mohm or greater should be used when measuring MPU_nRese t.

R4802 ~100k

No Yes

& solder joints

OK ?

No

Fix solder joints or

change R4802

Check the solder

joints of N4800 and change the

chip, if necessary.

52 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Audio troubleshooting

Earpiece

Earpiece doesn't work

Nokia Customer Care

STAR T

Check that ear piece

adapter module is held

by 4 snaps properly.

Is it OK?

YES

Check connector X 100

on A- frame assembly .

Is it OK?

YES

Set Phoenix Audio Routing

to earpiece (HpEar) f rom a

working audio input MIC1

(HpMic) or MIC2 (HdMic).

Ensure that suitable MIC

Bias is set on.

YES

Note! OMAP, UEM and UPP are unchangeable.

NO

Change earpiece

adapter module . Check

and clean also contact

pads f or the earpiece.

Change new A-f rame

assembly .

Is DC bias

(~1.3Vdc at B100)

OK?

Are audio signals

from UEM to the

earpiece p ads ok?

Does the audio work

in a call?

YES

END

NO

Check L100, R100,

R101, C100, R2101.

Change com ponent s if

needed.

Chec k L100, R100,

R101, C100, R2101.

Change component s if

needed.

Change UPP

Is DC bias

(~1.3Vdc at B100)

OK?

YESYES

Are audio signals from UEM to the earpiece p ads ok?

YESYES

NONO

Change UEM

Issue 1 11/2004 COMPANY CONFIDENTIAL 53

CCS Technical Documentation

Headset Microphone

External MIC doesn't work

START

RM-12

Check sy stem

connector and PWB

contacts .

Are they OK?

YES

Connect a working

Pop-Port headset to

the system connector

Set Phoenix Audio

Routing f r om MIC2 (Hd MIC) to a working audio output (HpEar or

XEar). Ensure MIC

Bias (MICB2) i s set

on.

YES

Is MIC Bias 2.1V

present at R 2130?

NO

Clean c ont acts

and replace

system

connec t or

(X2021)

Check R2005, R2122, R2123, R2130, C2022, C2012, C2013, C2128,

C2129 and C2137.

Change component s if

needed.

Is MIC Bias 2.1V

present at R2130?

YESYES

NONO

Change UEM

Check audio path through

Are audio signals

fro m system

connector to UEM

OK?

YES

Does the audio work

during a call?

NO

L2003, R2005, R2125,

C2022, C2013, C2012,

C2124. Check also Hookint

route trough R2121 and C2120. Change needed

com ponent s.

Change UPP

Are audio signals

fro m sys tem

connector to UEM

OK?

YES

NONO

Change UEM

YES

END

54 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

P

Headset speaker (1)

External Earpiece doesn't work

Nokia Customer Care

STAR T

Chec k system connector

and PWB contacts.

Ar e t he y O K ?

YES

Connect a working

Pop-Port headset to the

system connect or

Play MIDI, AAC or

MP3 playback fi le fr o m Headset (HS). Ensure that volume

level is high enough.

Is HS speaker

working?

YES

NO

Note! OMAP, UEM and UPP are unchangeable.

Clean contacts

and replace

system

connec t or

(X2021)

Check audio path from the

Is the DC bias

f rom Audio PA to

system connect or

OK? (~1.8Vdc at

X2021's pin 11,12,13, 14)

YES

NO

system connector to th e

Audio PA (L2004, L2005, R2026, R 2027, R 20 32, R 2033, C2036, C 2027, C 20 11, C 2010, C2009, C 2008, R 20 28, R 2029,

R2030, R 2031).

Change components if

needed.

Is the DC bias from Audio PA to system connect or

OK? (~1.8Vdc at

X2021's pin 11,12,13, 14)

NO

Change Audio

(N2100)

ee the following flow chart,

Is the DC bias from CODEC to

Audio PA

(~1.4Vdc at C2104

and C2105)

OK?

YES

Is digital audio signal from OMAP to CO DEC present

at J4100?

YES

Change audio

CODEC (N4100)

NO

Change OMAP

(D4800)

Are the CODEC

Control-s ignals

(at R4800) OK?

YES

Change Audio

CODEC (N4100)

NONO

Change OMAP

(D4800)

Issue 1 11/2004 COMPANY CONFIDENTIAL 55

CCS Technical Documentation

Headset speaker (2)

See the previous flow chart

RM-12

YES

Set Phoenix Audio Routing

from a working MIC input

MIC1 (HpMic) or MIC2

(HdMic) to XEAR. Ensure

the correct MIC bias is on.

Is the DC bias

seen at XEAR

output of the

UEM?

(at C4104)

YES

Are audio signals

fr o m UE M O K ?

(at C4104, R4100,

C4105)

YES

Note! OMAP, UEM and UPP are unchangeable.

NO

Change

UEM

Change

UEM

Does audio work in

a call?

YES

END

NO

Change

UPP

56 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

P

Internal Hands Free Speaker (1)

IHF doesn't work

Nokia Customer Care

START

Check I H F spe aker ,

contacts and PWB pads

Are they OK?

YES

Pl a y MI D I , A A C o r

MP3 play back fi l e from

IHF. Ensure that

vo l u m e lev el is high

enough.

Is IHF speaker

working?

NO

Note! OMAP, UEM and UPP are unchangeable.

Clean contacts an d replace IHF speaker

(B2120)

Is the DC bias from Audio PA to IHF-speaker pads OK? (~1.8Vdc at

B2120)

NO

Check audio path from the

IHF-speake r to the Audio PA

(L2101, R2102, C2134, C 2148).

Change component s if needed.

Is the DC bias

from Audio PA to

IHF-speaker pads

OK? (~1.8Vdc at

B2120)

NO

Change Audio

(N2100)

YES

Is the DC bias

from CODE C to

Audio PA (~ 1.4Vdc

at C2107)

OK?

YES

Is digital audio

signal from OMAP

to CO DEC present

at J4100?

YES

Change audio

CODEC

(N4100)

YES

NO

Change OMAP

(D4800)

Ar e the CO DEC

Cont rol-s ignals

(at R4800) OK?

YES

Change Audio

CODEC (N4100)

NONO

Change OMAP

(D4800)

See the following flow chart,

Issue 1 11/2004 COMPANY CONFIDENTIAL 57

CCS Technical Documentation

Internal Hands Free Speaker (2)

See the previous flow chart

Set Phoenix Audio Routing

(HdMic) to XEAR. Ensure

YES

from a working MIC input

MIC1 (HpMic) or MIC2 the correct MIC bias i s

on.

Is the DC bias

seen at XEAR

output of the

UEM?

(at C4104)

Note! OMAP, UEM and UPP are unchangeable.

NO

Change

UEM

RM-12

YES

Are audio signals

fr o m UE M O K ?

(at C4104, R4100,

C4105)

YES

Does audio work in

a call?

YES

END

NO

Change

UEM

Change

UPP

58 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Microphone

Microphone doesn't work

Nokia Customer Care

START

Check MIC module and

PWB contact s.

Are they OK?

YES

Set Phoeni x Audio

Routing from MIC1

(HpMic) to a w orking

audio output (HpEar or

XEAR). Ens ure MIC

Bias (M ICB1) is set on.

YES

Is MIC Bias 2.1V

present at R 2128?

Note! OMAP, UEM and UPP are unchangeable.

NO

Clean contacts

and replace MIC module

(B2115)

Check R2126, R2124, R2128, R2129, C2122, C2125, C2126, C2127,

C2133. Change

com ponent s if needed.

Is MIC Bias 2.1V present at R2128?

NONO

Change UEM

YESYES

Check R2126, R2124,

Are audio signals

from MI C to UEM

OK?

YES

Does the audio work

in a call?

NO

R2128, R2129, C2122, C2125, C2126, C2127,

C2133. Check als o

R2127. Change

com ponent s if needed.

Change UPP

Are audio signals from MIC to UEM

OK?

YES

NONO

Change UEM

YES

END

Issue 1 11/2004 COMPANY CONFIDENTIAL 59

CCS Technical Documentation

Display mod

ule

Display troubleshooting

Display module

troubleshooting.

Main level

Main level.

Start

RM-12

Blank display. Wrong colors. Chancing

colors, lines or areas. Backlight OK.

Display electrical problems,

connection problems

Goto Blank Display

Troubleshooting

Touchscreen

is not working.

Goto Touchscreen

Troubleshooting

Problem type?

Display optical problems.

Illumination is not working,

partially working or not even.

Pixel defects.

Goto Faulty Display

Troubleshooting

Display is dimm,

key leds not ok

Goto Backlight

Troubleshooting

60 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Blank Display (1)

Start

Check for bad

connections/

broken

connector.

Fault in

connectors

Nokia Customer Care

Connections

OK

Clean/replace

connector from

phone.

Working?

Yes

End

Measure V28

No

from L4427. Voltage OK?

Check

C4439-C4440,

L4427

components

OK?

Replace

broken

components.

Display

working?

Yes

No

L4427 = 0V

No

Go to Power

troubleshooting

No

Try with another display module. Display

working?

No

Inspect EMI

components

Z4421-Z4423 and

display clock

filtering capacitor

C4444 for poor

soldering.

Yes

Use oscilloscope and tap touchscreen before measuring (clock is not active in partial mode)

display module.

Change new

Calibrate

touchscreen

End

Yes

No

Goto OMAP

troubleshooting

Flash phone.

Display OK?

Yes

End

No clock

Measure

display clock

from C4444.

12.5MHz clock detected

Go to blank

display

troubleshooting

Issue 1 11/2004 COMPANY CONFIDENTIAL 61

CCS Technical Documentation

Blank Display (2)

Continues from

blank display

troubleshooting

page1

Start phone with

display flex

disconnected.

Measure

X4423 pins #9

#10 #11 with

oscilloscope

RM-12

Toggling

Start phone again with display flex connected and retest.

No toggling

Replac e

Z4421 EMI

filter.

Display

working?

Yes

No

Measure

X4423 pins

#15 and

#30 w ith

oscilloscope

No toggling

Replace

Z4422 and

Z4423 EMI

filter. Display

working?

Pins are display data lines. There should be data toggling if phone is working ok

Reflash phone.

No

Display

working?

Toggling

display connector

No

Change X4423

End

Goto OMAP

troubleshooting

Yes

End

Yes

62 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Touchscreen

Nokia Customer Care

Start

Try new display

module. Calibrate

touchscreen.

Is

touchscreen

working?

Yes

Change display

module and

calibrate

touchscreen

Phone is working normally.

Display and backlight ok.

Image in screen. Only

touchscreen is not working.

Check A-cover and A-frame

that they are ok and do not

press touchscreen.

No

Check V28/

VTouch from

L4400. OK?

Yes

Check touchscreen

connector X4421,

filtering components

R4440 L4420 L4423-

L4425 C4402-C4409

R4460-R4463.

Check controller ChipSelect from

R4400

N

No

Check L4400

o

C4400 C4401

components.

Not OK

Change faulty

components. Touchscreen

working?

Press touchscreen

when measuring this

No activity

O

K

Y

e

s

Goto Power

Troubleshooting

Check touchscreen

calibration and

recalibrate if not ok.

End

Toggling

Reflash phone

Touchscreen

working?

Yes

Calibrate

touchscreen.

No

Change

N4400.

Working?

Yes

No

Phone already

reflashed?

No

Reflash phone

Touchscreen

working?

No

Go to OMAP

troubleshooting

Yes

Issue 1 11/2004 COMPANY CONFIDENTIAL 63

CCS Technical Documentation

Faulty Display

Phone is functional but

image shown

is not good

RM-12

See own chapter about pixel defects.

Is the phone

returned because

of pixel defects?

N o

Is backlight

brightness

ok?

Yes

= other visual

defect

Y

e

Use full brightness setting to check backlight problems

N

o

defects than pixel

s

Is backlight power ok,

voltage from C4443 =

11.5 - 12.5V?

Is there more

defect criteria

specifies?

Change display

Yes End

Go Backlight

N

o

troubleshooting

module, calibrate

touchscreen

No action. Check

touchscreen

calibration and re-

calibrate if needed

EndNo

-Display background color is clearly too

-Backlight is not even, left side remarkable

yellowish or bluish

brighter than right side of the display

module, calibrate

Change display

End

touchscreen

64 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Pixel defects

Terms: Dot/pixel versus subpixel

• Dot means a combination of red, green and blue subpixels.

• One subpixel can be an individual red, green or blue pixel.

Vertical Direction

Horizontal Direction

640 dots

Nokia Customer Care

GBGR

BR

320×RGB dots

FPC

Pixel defect criteria

• Bright dots: 3 or less or

• Black dots: 3 or less

Number of Dots Active Area Dot Pitch Pixel Per Inch Color Arrangement

Figure 1: RM-12 dots and pixels

B R GB R G B R

BR

: 640 × RGB × 320 : 40.32 × 80.64 (mm) : 0.042 × 0.126 (mm) : 201.59 : RGB Stripe

B R GR G B

GG

Total max 3

• No line defects

Issue 1 11/2004 COMPANY CONFIDENTIAL 65

CCS Technical Documentation

.

RM-12

Figure 2: Definition of 1 dot defect = 1 or 2 defected horizontal sub-pixels (bright/black)

66 COMPANY CONFIDENTIAL Issue 1 11/2004

RM-12

Backlight troubleshooting (1)

Nokia Customer Care

Issue 1 11/2004 COMPANY CONFIDENTIAL 67

RM-12

Backlight troubleshooting (2)

Start

Use partial mode or

adjust brightness period

to lowest value to disable

display backlight. Verify

functionality with working

Disable backlight

from Control Panel

D4420 pin #8 = 0V Backlight OK?

Check VBAT availability through

current path from following points.

1. L4426

2. C4420 & C4421

3. R4423 & L4421 & V4420

4. C4443 & C4424

5. L4422 & C4428 & C4429 & C4425 & R4430

Replace series components

before point where VBAT

voltage is lost. Start from battery

side VBAT.

Check also C4423 and

R4446 (value = 27R) soldering.

Check X4421 pin soldering.

display unit.

D4420 pin #8

= 2.78V

Enable backlight

from Control Panel.

Full brightness

No

Replace D4420. Check also with

another display unit

after component

change.

Backlight OK?

Nokia Customer Care

Y

e

s

e

Y

s

END

C4425 =

VBAT?

No

PWB failure

Yes

No

PWB failure

Issue 1 11/2004 COMPANY CONFIDENTIAL 68

CCS Technical Documentation

Backlight troubleshooting (3)

Start

RM-12

Enable backlight

and try with

another display

module

Backlight OK?

No

Check current mirror

components:

V4421, R4436, N4421, R4443

and backlight power

components:

R4441, R4442, R4446

V28 should be found from

C4438.

Check connector X4421

soldering.

Backlight OK?

Yes

Y

e

s

END

Replace display

module. Calibrate

touchscreen.

If upper backlight leds

are not working / are

dimm, but lower are bright => problem in

current mirror circuitry

END

No

R4446 =

0.50-0.51V & R4442 =

1.50-1.51V?

Yes

R4441 should have also

0.50-051V. If not, replace 1st V4421, 2nd N4421 3rd R4436 & R4443 &

R4435

Backlight OK?

No

PWB failure

No

Y

e

s

Goto backlight

power troubleshooting

page 2

END

69 COMPANY CONFIDENTIAL Issue 1 11/2004

Hall sensor troubleshooting

Start

Check pull-up resistor

and hall sensor

soldering. Resolder if

needed

Check battery cover

that magnet is present

Battery cover pull-up resistor

R4449

Check V28 from hall sensor pin 1

2.78V

Check pull-up

resistor

connection to V28

2.78V

Check hall

sensor output

from pin 3

0V

2.78V

0V

Goto Power

Troubleshooting

Goto Power

Troubleshooting

No magnets nearby / battery cover

Replace

Hall sensor

removed

Check again hall

sensor output

from pin 3

0V

Check hall sensor

output from pin 3

with magnet

0V

Goto OMAP

Troubleshooting

2.78V End

Input line shortcircuited. P WB or

OMAP failure.

Keyboard troubleshooting

Start

Problem

type

Power button

don´t work

Power button is loose

or missing

No

Yes

Replace

button

End

One or more rocker,

front or top buttons

don´t work

Is keypad flex broken or connector disconnected

from flex?

No

Check engine connector that

is is properly assembled.

OK?

No

Yes

Change A-frame

assembly

Change connector

Problem in

Baseband

Goto BB

troubleshooting

Check components

Z4420, R4451 & R4452

OK?

Yes

No

Replace

End

RM-12

Nokia Customer Care

Camera Module Troubleshooting

Background, tools and terminology

A fault or complaint associated to camera operation can be roughly categorized to three subgroups:

1 Camera is not functional at all, no image can be obtained

2 Images can be taken but there is nothing recognizable in them

3 Images can be taken and they are recognizable but for some reason the quality of

images is seriously degraded, or customer complains about image quality

Image quality is very hard to measure quantitatively, and even comparative measure ments are difficult (comparing two images) if the difference is small. Especially if the user is not satisfied with his/her devices' image quality, and tells e.g. that the images are not sharp, it is fairly difficult to accurately test the device and get an exact figure which then would tell if the device is OK or not.

Most often, subjective evaluation has to be used for finding out if a certain property of the camera is acceptable or not. Some training or experience of a correctly operating reference device may be needed in order to detect what actually is wrong, or is there anything wrong at all. It is easy for the user to take bad looking images in bad conditions; thus the cam era operation has to be checked always in constant conditions (lighting, temperature) or by using a second, known to be good device as a reference. Experience significantly helps in analyzing image quality.

Terms

Dynamic range: camera's ability to capture details in dark and bright areas of the scene si-

multaneously. See Image which has been taken against light. The actual object is dark for example.

Exposure time: camera modules use silicon sensor to collect light and for forming an image.

The imaging process roughly corresponds to traditional film photography, in which exposure time means the time during which the film is exposed to light coming through optics. Increasing the time will allow for more light hitting the film and thus results in brighter image. The operation principle is exactly the same with silicon sensor, but the shutter functionality is handled electronically i.e. there is no mechanical moving parts like in film cameras.

Flicker: Phenomenon, which is caused by pulsating in scene lighting, typically appearing as

wide horizontal stripes in image.

Noise: Variation of response between pixels with same level of input illumination. See e.g.

Noisy image taken in +70 degrees Celsius for example of noisy image.

Resolution: Usually the amount of pixels in the camera sensor, e.g. this product has 1152 x

864 pixel sensor resolution. In some occasions the term resolution is used for describing the sharpness of the images.

Sensitivity: camera module's sensitivity to light. In equivalent illumination conditions, a less

sensitive camera needs longer exposure time to gather enough light for forming a good image. Analogous to ISO speed in photographic film.

RM-12

Nokia Customer Care

Sharpness: good quality images are 'sharp' or 'crisp', meaning that image details are well vis-

ible in the picture. However, certain issues like non-idealities in optics, cause ima ge blurring, making objects in picture to appear 'soft'. Each camera type typically has it's own level of performance.

Image taking conditions effect to image quality

This chapter lists some of the factors, which may cause poor image quality if not taken into account by end user when shooting pictures, and thus may result in complaints.

items are normal to camera operation and do not cause a need for e.g. changing the camera module.

The listed

1 Distance to target: the lens in the module is specified to operate satisfactorily

from 40 cm to infinite distance of scene objects. In practice, the operation is such that close objects may be noticed to get more blurred when distance to them is shortened from 40 cm. Lack of sharpness will be first visible in full resolution (1152 x 864) images. If observing just the viewfinder, even very close objects may seem to appear sharp. This is normal behavior, do not change the

camera module.

Figure 1: Image blurred due to too close distance to target

2 Amount of light available: in dim conditions camera runs out of sensitivity. Expo-

sure time is long (especially in night mode) and the risk of getting shaken (= blurred) images grows. Image noise level grows. The maximum exposure time in night mode is ¼ seconds, so images need to be taken with extreme care and by supporting the phone when the amount of light reflected from the target is low. Due to longer exposure time and larger gain value noise level is increasing under low light conditions. Sometimes blurring may even happen at daytime if image is taken very carelessly. See Handshake has caused blurring of this image for exam-

Nokia Customer Care

ple. This is normal behavior, do not change the camera module.

RM-12

Figure 2: Handshake has caused blurring of this image

3 Movement in bright light: If pictures of moving objects are taken or if the device

is used in a moving car, object 'skewing' or 'tilting' will occur. This phenomenon is fundamental to most CMOS camera types and normal, and can’t be avoided. Movement of camera or object will usually cause blurring in inside or dim lighting conditions due to long exposure time. This is normal behavior, do not change

the camera module.

Figure 3: Near objects in image get skewed when shooting from a moving car

4 Temperature: high temperatures inside the mobile phone will cause more noise

RM-12

Nokia Customer Care

to appear in images, e.g. in +70 degrees of celsius the noise level may be very high, and it further grows if the conditions are dim. If phone processor has been heavily loaded for a long time before image taking inside of the phone might have considerably higher temperature than neighbourhood temperature. This is also normal to camera operation. This is normal behavior, do not change the cam-

era module.

Figure 4: Noisy image taken in +70 degrees Celsius

5 Phone display: if the display contrast is set too dark, the image quality degrades

quite much: the images may be very dark, naturally depending on the setting. If display contrast is set too bright, image contrast appears bad and "faint". This flaw is easily cured by setting the display contrast to correct value. This is normal

behavior, do not change the camera module.

6 Basic rules of photography, especially shooting against light: due to dynamic

range limitations taking image against bright light might cause either saturated image or actual target to look too dark. In practice this means that when taking a picture inside e.g. having a window behind object, will produce poor results.

Nokia Customer Care

This is normal behavior, do not change the camera module.

RM-12

Figure 5: Image which has been taken against light. The actual object is dark

7 Flicker: in some occasions a bright fluorescent light may cause flicker to be seen

in the viewfinder and captured image. This phenomenon may also result if pictures are taken indoors under mismatch of 50/60 Hz electricity network frequency. The used electricity frequency will be detected automatically by the camera module. In some very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon grows. Flickering occurs also under high artificial illumination level. This is normal behavior, do not change the

camera module.

Figure 6: Flicker in image of white, uniform object illuminated by strong fluorescent light

RM-12

Nokia Customer Care

8 Bright light outside of image view: Especially sun can cause clearly visible lens

glare phenomenon and poor contrast in images. This happens due to unwanted reflections inside camera optics. Generally this kind of reflections are common in all optical systems. This is normal behavior, do not change the camera module.

Figure 7: A lens reflection effect caused by sun shining above the scene

Figure 8: A good picture taken indoor

Nokia Customer Care

RM-12

Figure 9: A good picture taken outdoors

RM-12

Nokia Customer Care

Camera construction

In this chapter, some information of the actual construction of the camera module is given for getting understanding of the actual mechanical structure of the module.

Figure 10: Cross section of the camera module and assembly principle

Figure 11: Bottom view including camera module serial numbering

RM-12

Nokia Customer Care

The camera module as a component is not a repairable part i.e. components in the module may not be changed. Cleaning dust from the front face is the only allowable operation, do this by using clean

Figure Cross section of the camera module and assembly principle shows the cross section view of the camera module. The main parts of the module are

compressed air.

• Lens unit including lens aperture

• Infrared filter, which is used to prevent infrared light from contaminating the image colors. IR filter is glued to the EMI shielded camera body

• Camera body, which is made of conductive metallized plastic and attached to PWB by glue

• Sensor array including DSP functions is glued and wire bonded to PWB

• PWB, FR-4 type

• Socket type connecting is used

• Laser marked serial numbering on PWB is used for versioning

• Passive components

• Camera protection window is part of phone cover mechanics

• Dust gasket between lens unit and camera protection window

Image quality analysis

Possible faults in image quality

When checking for possible errors in camera functionality, knowing what error is suspected will significantly help the testing by narrowing down the amount of test cases. The following types of image quality problems may be expected to appear

• Dust (black spots)

• Lack of sharpness

• Bit errors

In addition, there are many other kinds of possibilities for getting bad im age quality, but th ose are ruled out from the scope of this document since probability of their appearance is going to be minimized by production testing.

Testing for dust

For detecting this kind of problems, take an image of uniform white surface and analyze it in full resolution. Good quality PC monitor is preferred for analysis. Search carefully since finding these defects is not always easy. Figure Effects of dust on optical path is an example of image containing easily detectable dust problems.

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For taking a white image uniformly lightened white paper or white wall can be used. One possibility is to use uniform light but make sure that came ra image is not flickering when taking test image. In case flickering happens try to reduce illumination level. JPEG image format can be used for analyzing but image quality parameter should be set to ‘High Quality’.

Black spots in image are caused by dirt particles trapped in side the optical system. Clearly visible and sharp edged black dots in image are typically dust particles on image sensor. The se spots are searched for in manufacturing phase, but it is possible that the camera body cavity contains a particle, which may move onto the image sensor active surface, e.g. when the phone is dropped. Thus it is also possible that the problem will disappear before the phone is brought to service. The camera should be replaced if the problem is present when the service technician analyses the phone.

If dust particle is lying on infrared filter surface on either side, they are much harder to locate because they will be out of focus, and appear in image as large, grayish and fading-edge 'blobs'. Sometimes they will be very hard to find, and thus the user probably will not notice them at all since they do no harm. But it is possible that a larger particle disturbs the user, causing need for service.

Figure 12: Effects of dust on optical path

If large dust particles get trapped on top of the l ens surface in the cavity between camera window and lens, they will cause image blurring and poor contrast (see also item 'sharpness'). The dust gasket between the window and lens should prevent any particles from getting into the cavity after manufacturing phase.

If dust particles are found on sensor, this is classified as a manufacturing error of the mod ule and thus the camera should be replaced. Any particles inside the cavity between protection window and lens have most probably been trapped there in assembly phase at Nokia fa ctory. Unauthorized disassembling of product can also be root cause for the problem. However, in most cases it should be possible to remove the particle(s) by using clean compressed air. Nev-

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er wipe the lens surface before trying compressed air; the possibility of damaging the lens is substantial. Always check the image sharpness after removing dust.

Testing of sharpness

If pictures taken with some device are claimed to be blurry, there are four possible so urces for the claim:

1 Protection window is fingerprinted, soiled, dirty, visibly scratched or broken.

2 User has tried to take a picture of a too close object – lens operates with dis-

tances from 40 cm to infinity. This is no cause to replace camera module.

3 User has tried to take pictures in too dark conditions and images are blurred due

to handshake or movement. This is no cause to replace camera module.

4 There is dirt between protection window and camera lens.

5 The protection window is defective This can be either manufacturing failure or

caused by user. Window should be changed.

6 Camera lens is misfocused due to manufacturing error.

Quantitative analysis of sharpness is very difficult to conduct in other than optics laborato ry environment. Thus subjective analysis should be used.

If no visible defects (items 1-4) can be found, a couple of test images should be taken and checked. Generally, a well illuminated typical indoor office scene, such as the one in F igure A good picture taken indoor, can be used as a target. The main consideration s are:

• The protection window has to be clean

• Amount of light: 300 – 600 lux (bright office lighting) is sufficient

• The scene should contain e.g. small objects for checking sharpness and distance to them should be in order of 1 – 2 meters

• If possible, compare the image to another image of the same scene, taken by different device. Note that comparison device has to be similar Nokia cellular phone.

The taken images should be analyzed on PC screen at 100% scaling simultaneously with re ference image. Pay attention to the computer display settings; at least 65000 colors (16 bit) have to be used. 256 (8-bit) color setting is not sufficient, and true color (24 bit, 16 million colors) or 32 bit (full color) setting is recommended.

If there appears to be a clearly noticeable difference between the reference image and the test images, the module might have misfocused lens. In this case, the module should be changed. Always re-check the resolution after changing the camera. same result, the fault is probably in camera window. Check the window by looking carefully through it when replacing the module. As a reference image A good picture taken indoor and

If a different module produces the

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A good picture taken outdoors can be used. Another possibility is to use service point comparison phone if available.

Effects of dirty or defective protection window

The following series of images demonstrates the effects of fingerprints on the camera protection window.

It should be noted that the effects of any dirt in images can vary very much; it may be difficult to judge if the window has been dirty when some image has been taken or if something else has been wrong. That is why the cleanness of the protection window should always be checked and the window should be wiped clean with a suitable cloth.

Figure 13: Image taken with clear protection window

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RM-12

Figure 14: Image taken with a greasy protection window

Bit errors

Bit errors are defects in image caused by data transmission error between camera and phone baseband or inside camera module. Bit errors can be typically seen in images taken of any object, and they should be most visible in full resolution images. A good practice is to use uniform white test target when analyzing this kind of errors.

The errors will be clearly visible as colorful sharp dots or lines in camera images. See Example about bit errors caused by JPEG compression. One type of bit erro r is lack of bit depth. In that case image is almost totally black under normal conditions sensing something only unde r very high illumination.

Typically this is a contact problem between the camera module and phone main PWB. Check camera assembly and connector contacts.

If fault is in the camera module typically bit error is visible only when using some specific im age resolution. E. g. in viewfinder fault might exist but not in full size image.

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Figure 15: Example about bit errors caused by JPEG compression

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N

j

Camera fault finding diagrams

Hardware failure message

RM-12

Start

Is Camera module properly fixed

Yes

Check X4420 solder

oints and flex

connection. Is it OK?

Yes

Run ST_CAMERA_IF self test in Phoenix. Is the result pass?

Yes

No

o

Fix properly. Is it working now?

No

Change X4420. Is it working now?

No

Change Camera. Re-run the test. Is it pass?

No

Yes

Go to Camera baseband HW troubleshooting.

No

Change N

Change 4434. Rerun the test. Is it pass?

Yes

Is the Camera working now?

Yes

No

End

RM-12

Camera baseband HW troubleshooting

Start

Start camera application

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Measure V25_CAM at C4435. Should be 2.5V nominal. Is it 2.4V to

2.6V?

Yes

Measure V15_CAM at C4434. Nominal 1.5V. Is it 1.4V to 1.6V?

Yes

Check Vctrl by measuring voltage from pin 4 of D4405. Is it 2.4V to 2.6V?

Yes

Measure ExtClk wav eform at D4405 pin 6 against ground. Is frequency

9.6MHz and amplitude 1.7V to 2.6V?

Yes

Measure I2C waveform at connector X4420 10 and 11. Both signals operating and amplitude

1.8V nominal?

No

Measure Vbat at C4223. Should be

3.7V. Is it 3.4V to 4.2V?

Measure Vbat at C4221. Nominal 3.7. Is it 3.4V to 4.2V?

Measure voltage from pin 3 of D4405. Is it

2.7V to 2.9V?

Measure ExtClk

No

waveform at D4405 pin 1 against ground. Is frequency 9.6MHz and amplitude 2.7 to 2.9V?

Check I2C waveforms and operation at R4800. Both signals operating and amplitude is 2.8V nominal?

Yes No

Yes

No

Flash the phone. Is the camera working now?

Yes

Change

D4405

Change

R4800

No

Change

N4203

Change

N4204

Yes

Measure CCP waveforms over R4424 and R4431. Both signals operating, amplitude

min

150mV, differential

±

min

amplitude 300mV, common mode voltage 0.9V nominal.

(Use viewfinder mode and oscilloscope. AC mode for amplitude and DC mode for common mode voltage)

Yes

Camera OK

amplitude

No

Check R4424 and R4431. Are they ok?

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Bad image quality

RM-12

FM Radio troubleshooting

FM radio component layout

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Trace Layout

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R6101, R6103,

o

start now?

A

r

Set radio and RF

FM radio troubleshooting diagram

Set phone into local mode.

Start FM radio

Does the

radio start?

Yes

Connect RF test signal (note 1)

Set radio channel to 98.0 MHz

ri vlm m

No

xim

m.

Measure

audio signal

from J6128 and J6129. Is it 1 kHz 0.5 –

0.8 Vp-p ?

No

Check C2032, C2033, C2037, C2039, L2026, C6104, C6109, C6115, L6102. Measure signal from J6128 and J6129.

Is it 1kHz 0.5–0.8

Vp-p?

No

Check R6101,

R6103, V6100,

V6101, L6100, L6101, C6100,

C6101 and C6102.

Measure signal

from J2023 and

No

Change N6100.

Measure signal from J2023 and J2024. Is it OK?

No

Check Baseband

side

Notes to “FM radio troubleshooting diagram”:

Yes

Check C6105,

C6113, R6102 and

R6100 and

measure 32kHz clock signal from J6103 and retest

starting. Does it

Check R2028,

R2029, R2030,

R2031, L2004 and

L2005. Measure signal from J2023

and J2024. Is it

0.015-0.3Vp-p?

Yes Yes

OK, retest

No

Measure

voltages from

pins 7 and 34, is

it ~2.7V? Retest starting. Does it

start now?

OK, retest

N

Yes Yes Yes

generator to 87.5 and

108.0 MHz. Measure

audio from J6128 and

J6129. Are both cases

1kHz 0.5-0.8 Vp-p?

N

Check

V6100, V6101, L6100,

L6101, C6100, C6101

and C6102. Test again

with 87.5 and 108.0MHz.

Measure audio from

J6128 and J6129. Are

N

Change V6100,

V6101 (BOTH!).

Test again with 87.5

and 108.0 MHz.

Measure audio from

J6128 and J6129.

Are both cases OK?

N

Check N6100

soldering, (pins

5,6,7,8,9,11,12,

13,17,33,34,35,3

6,37) Does it

start?

Yes

No

Change N6100. Does the radio start now?

No

Baseband digital

failure (UPP)

udio amplifier o

DAC failure

RM-12

Use 1MHz 1X probe when measuring audio and clock signals with oscilloscope. Use active RF probe when measuring frequencies with spectrum analyser.

FM radio RF test signal is connected from FM signal generator to FM radio antenna production test point J2027.

RF test signal parameters:

• Amplitude, A, -67.0 dBm

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• Carrier frequency, fc, 98,000 MHz

• Deviation, Df, 75 kHz

• Modulating frequency, fm, 1,000 kHz (RF generator internal)

• FM stereo, mode R=L, pilot state ON

Pictures of FM radio signals

Figure 16: Audio output from FM radio test points J6128 and J6129 or J2023 and J2024, with FM test signal

Figure 17: FM radio clock from test point J6103, 32 kHz frequency clock signal, when radio is on.

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Figure 18: FM frequency from FM radio pin 37, the other end of L6102, with FM test signal

15:51:49 03 JUL 2002

PEAK LOG

10 dB/

RM-12

#AT 0 dBREF -20.0 dBm

MKR 97.9280 MHz

-71.03 dBm SWEEP

CONT SGL

FREE RUN

VIDEO

LINE

WA SB

CORR

SC FS

CENTER 98.0000 MHz SPAN 300.0 kHz

#RES BW 10 kHz VBW 10 kHz #SWP 1.00 sec

EXTERNAL

SYNC CRD

TV TRIG

Figure 19: VCO frequency from FM radio pins 3 and 4, the other ends of V6100 and V6101, with FM test signal

10:46:24 03 JUL 2002

#AT 10 dBREF .0 dBm

PEAK LOG

10 dB/

WA SB

CORR

SC FS

CENTER 196.450 MHz SPAN 1.000 MHz

#RES BW 10 kHz #VBW 10 kHz #SWP 20.0 msec

MKR

196.440 MHz

-9.40 dB

MEAS UNCAL

SWEEP

CONT SGL FREE RUN

VIDEO

LINE

EXTERNAL

SYNC CRD

TV TRIG

RM-12

USB Problems (1)

Start with

phone with battery.

Connect the phone to

PC via USB with known

good DKU2 cable

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PC recognizes

the phone as USB

device

No

Connect a service battery to phone.

Check that the startup mode selection is NORMAL. Connec t to PC with service battery USB plug,

inspect also production test pattern

(where the service battery connects) for damage/litter

Yes

Customer’s cable

broken, end

PC recognizes

the phone as

USB device

No

Yes

Inspect system

connector X2021

visually and check

solder joints

Undamaged

Goto USB

troubleshooting

page 2

Damaged

Replace damaged

connector or re-

sold er broken

connections

PC recognizes

the phone as USB

device

No

Yes

End

Nokia Customer Care

USB Problems (2)

Continued from

USB

troubleshooting

page 1

Measure

resistance to GND

from D+(pin #6)

and D-(pin #7) on

X2021 .

>> 1M?

Yes

RM-12

Check APE

GPIO3 from

R2004, ~2.8V

Yes

Measure

voltage V33 at

C2005

Incorrect

volta ge

Measure

voltage VBUS

at C2006 when

connecting the

USB cable

No, but

APE GPIO3

~V28

Incorrect

volta ge

No

Check R2004

value .

Damaged

Change

resistor. PC

recognizes the

phone as USB

device?

Yes

End

Change L2002,

PC recognizes

the phone as

USB device?

No,

APE GPIO3

still 0V

Correct voltage

No

Undamaged

Go to OMAP1510

troubleshooting

No

Yes

~5V

Change USB

regulator N2001

and capacitors

C2005-C2007 and

resistor R2004

End

PC recognizes

the phone as

USB device?

Yes

End

No

Measure USB+ (pin #6) and USB- (pin

#7) on X2021

with

oscilloscope

Toggling

Voltage leve ls ~0V and ~3.3V

No

toggling

Replace

EMI filter R2003

PC recognizes the

phone as USB

device?

No

Go to OMAP1510

troubleshooting

Yes End

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BC3 Bluetooth Troubleshooting

Introduction

The following describes the BC3 Bluetooth solution troubleshooting for CCS/AMS.

Bluetooth Settings for Phoenix

General setup:

• Connect phone to Phoenix in ‘local’ mode (select product from the product menu)

• Choose: Testing > Bluetooth locals

• Run BER test when JBT-9 box in close to BT antenna (in 10 centimeters)

Figure 20: An example of Phoenix settings for Bluetooth troubleshooting

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Bluetooth Troubleshooting Diagram

BT

FAULT?

Figure 21: Bluetooth troubleshooting diagram for RM-12

RM-12

Connection to JBT9, OK?

NOK

Check Vreg in

-2.8V from C6036 capasitor.

Is it OK?

OK

Check VDD_ANA

1.8V from capasitor C6031

OK

NOK

BER <=0.1%

Check regulator: ~2.8V from C4202 and N4200 from APE power checking sheet

Change BC3

NOK

Check RF path components (L6031, L6032, C6046) soldering/resolder

BT OK

Repeat BER test

Repeat BER Test, OK?

NOK

Replace Filter& balun (Z6030)

Repeat BER Test, OK?

OK NOK

Check BC3 Xtal_in: freq.12MHZ swing=400900mV (R6043), ok?

NOK

Check BT clock path from APE clock sheet

OK

General Assumptions

Visual check and measurement of other passive components if needed.

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Figure 22: Bluetooth problems (1)

Figure 23: Bluetooth problems (2)

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RM-12

Figure 24: Bluetooth assembly drawing)

Nokia 7710, rm-12 Troubleshooting Instruction

Specifications and Main Features

Frequently Asked Questions

User Manual

6-Troubleshooting Instructions

Introduction to RM-12 troubleshooting

General guidelines for RM-12 troubleshooting

Tools needed for troubleshooting

General guidelines

RF Troubleshooting

Introduction to RF troubleshooting

RF Key component placement

RF Measurement points

EGSM900, GSM1800 & GSM1900 Transmitter

General instructions for Tx troubleshooting

Transmitter troubleshooting diagrams

Pictures of transmitter signals

Additional information for EDGE troubleshooting

EDGE mode troubleshooting differs slightly from basic GSM troubleshooting

Pictures of EDGE transmitter signals

EGSM900, GSM1800 and GSM1900 Receiver

General instructions for Rx troubleshooting

Troubleshooting diagram for GSM900 receiver

Troubleshooting diagram for GSM1800 receiver

Troubleshooting diagram for GSM1900 receiver

Synthesizer

General instructions for synthesizer troubleshooting

Pictures of synthesizer signals

RF test points

RF GSM component alignment

Baseband troubleshooting

Partially damaged device

Most common symptoms reported by customer

Most common symptoms for audio problems

Most common symptoms for Bluetooth problems

Symptoms related to energy management

Problems related to UI-module

Most common RF-related symptoms

Problems related to camera

Dead or jammed device troubleshooting

OMAP1510 (1)

SDRAM (1)

SDRAM (2)

APE flash

ASIC is changed

Test points

Selftests / “Contact service” on display

Flashing troubleshooting

APE Flashing

CMT flashing

Power troubleshooting

Charging

APE Clocking

APE Reset

Audio troubleshooting

Earpiece

Headset Microphone

Headset speaker (1)

Headset speaker (2)

Internal Hands Free Speaker (1)

Internal Hands Free Speaker (2)

Microphone

Display troubleshooting

Blank Display (1)

Blank Display (2)

Touchscreen

Faulty Display

Pixel defects

Terms: Dot/pixel versus subpixel

Pixel defect criteria

Backlight troubleshooting (1)

Backlight troubleshooting (2)

Backlight troubleshooting (3)

Hall sensor troubleshooting

Keyboard troubleshooting

Camera Module Troubleshooting

Background, tools and terminology

Terms

Image taking conditions effect to image quality

Camera construction