Nokia 7650 Service Manual 3 nhl2 sys
NHL-2NA Series Transceivers
System Module LG4 and Grip
Module LS4
Issue 2 11/02 ¤Nokia Corporation
System Module LG4 and Grip Module LS4 CCS Technical Documentation
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CCS Technical Documentation System Module LG4 and Grip Module LS4
Table of Contents
Page No
Abbreviations ................................................................................................................. 6
LG4 System Module ...................................................................................................... 8
IIntroduction ................................................................................................................8
Technical overview ........................................................................................................ 8
LG4 features ................................................................................................................8
Component placement and PWB outline .....................................................................8
Block diagram .............................................................................................................. 12
UI Interface ................................................................................................................12
Baseband Technical Summary..................................................................................... 13
Functional Description................................................................................................. 14
BB Description ..........................................................................................................14
Memory Configuration............................................................................................ 14
Energy Management ............................................................................................... 14
Modes of Operation ...................................................................................................15
Voltage limits .......................................................................................................... 15
Clocking Scheme .......................................................................................................16
UPP_WD2 voltage/clock frequency adjusting........................................................ 16
Power Distribution, Control and Reset ......................................................................17
Power-up sequence (Reset mode) ........................................................................... 18
Powering off............................................................................................................ 18
Controlled powering off .......................................................................................... 18
Uncontrolled powering off ...................................................................................... 18
Watchdogs............................................................................................................... 18
Charging .................................................................................................................. 19
Chargers .................................................................................................................. 19
Battery ..................................................................................................................... 19
Back-up battery and real time clock ..........................................................................20
Baseband Measurement A/D Converter ....................................................................20
NHL-2NA BB Features & HW interfaces ................................................................... 21
NHL-2NA BB User interface ....................................................................................21
UI-Module Interface................................................................................................ 21
Power Key ............................................................................................................... 21
Grip Interface .......................................................................................................... 21
Bluetooth ....................................................................................................................23
IR ...............................................................................................................................23
SIM Interface .............................................................................................................23
NHL-2NA Audio Concept .........................................................................................24
Earpiece................................................................................................................... 24
Microphone ............................................................................................................. 25
IHF Amplifier and Speaker ..................................................................................... 25
External Audio interface ......................................................................................... 26
Camera Interface ........................................................................................................26
Proximity Sensor .......................................................................................................27
Proximity Detector components ................................................................................28
Lightguides.............................................................................................................. 28
IRED........................................................................................................................ 28
Photodiode............................................................................................................... 28
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
HW Implementation................................................................................................ 28
Ambient Light Sensor ................................................................................................30
Flashing ......................................................................................................................31
Connections to Baseband ........................................................................................ 31
Testing interfaces .......................................................................................................32
Extreme Voltages ......................................................................................................33
Temperature Conditions ............................................................................................33
Humidity and Water Resistance ................................................................................33
RF Module .................................................................................................................34
Functional block descriptions.................................................................................. 34
The Frequency synthesizer...................................................................................... 34
RF Frequency Plan .................................................................................................. 36
DC characteristics ................................................................................................... 37
Regulators................................................................................................................ 37
Power Distribution Diagram ................................................................................... 38
RF characteristics .................................................................................................... 39
RF Block Diagram .................................................................................................. 40
Voltage Supplies and References ..............................................................................41
Receiver .....................................................................................................................43
Transmitter .................................................................................................................44
AGC strategy........................................................................................................... 45
AFC function........................................................................................................... 47
DC-compensation.................................................................................................... 48
Power control with analog temperature compensation scheme .............................. 48
Grip Module................................................................................................................. 50
Abbreviations .............................................................................................................50
Introduction ................................................................................................................50
General Interface between Grip and Transceiver ......................................................53
Grip Keyboard ...........................................................................................................56
Electrical implementation ....................................................................................... 56
Unit limits................................................................................................................ 57
Vibra ..........................................................................................................................57
Electrical interface .....................................................................................................57
Current Gauge ............................................................................................................59
Interfacing the current gauge................................................................................... 59
Backlight ....................................................................................................................61
Electrical interface................................................................................................... 61
Hall Sensor and Magnet .............................................................................................62
Magnet..................................................................................................................... 62
DC Jack and Battery Connector ................................................................................63
Electrical interface................................................................................................... 63
Table of Schematic Diagrams
Page No
RF-BB connection diagram 1
Accessories interface diagaram 2
AEM diagram 3
Baseband Diagram 4
BB-RF Interface diagram 5
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SIM card interface diagram 6
CPU Diagram 7
IR module diagram 8
LPRF diagram 9
Memories diagram 10
Power Diagram 11
RF Diagram 12
Test Interface 13
UEM Diagram 14
User Interface Diagram 15
Parts Placement Diagram LG4_07 16
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
Abbreviations
ADC Analog-Digital Converter
AEM Auxiliary Energy Management ASIC
AFC Automatic Frequency Control
ALG Ambient Light Guide
ALS Ambient Light Sensor
ARM Processor architecture
ASIC Application Specific Integrated Circuit
BB Baseband
BLUETOOTH, BT Bluetooth
BSI Battery Size Indicator
CBus Control Bus connecting UPP_WD2 with AEM and UEM
CCI Camera Control Interface
CCP Compact Camera Port
CMT Cellular Mobile Telephone (MCU and DSP)
CPU Central Processing Unit
CSP Chip Scale Package
CTSI Clocking Timing Sleep Interrupt
DAC Digital-Analog Converter
DAI Digital Audio Interface
DBUS Data Bus
DCN Offset Cancellation contol signal
DIF Display InterFace
DLL Dynamic Link Library
DRC Dynamic Range Controller
DSP Digital Signal Processor
EFR Enhanced Full Rate
EGSM Extended – GSM
EQ Equalizer
EXT RF External RF
GPRS General Packet Radio Service
GSM Groupe Special Mobile/Global system mobile
HF Hands free
HFCM Handsfree Common
HS Handset
HSCSD High Speed Circuit Switched Data
I/O Input/Output
IHF Integrated hands free
IC Integrated Circuit
IR Infra red
IRED InfraRed Emitting Diode
IrDA Infrared Association
LCD Liquid Crystal Display
LG4 NHL-2NA Main PWB module
LNA Low Noise Amplifier
MCU Micro Controller Unit
MIC, mic Microphone
PA Transmit Power Amplifier
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CCS Technical Documentation System Module LG4 and Grip Module LS4
PC Personal Computer
PDA Pocket Data Application
PWB Printed Wiring Board
RF Radio Frequency
RFBUS Control Bus For RF
SDRAM Synchronous Dynamic Random Access Memory
SIM Subscriber Identity Module
UI User Interface
UEM Universal Enefry Management
VGA Video Graphic Array
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
VCM Voltage Controlled Module
VGA Video Graphics Array
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
LG4 System Module
IIntroduction
This is the module specification of LG4 which is the main electronics module in NHL-2NA
GSM dual band phone. NHL-2NA phone is also nick named as Nokia 7650. The sales
name is Nokia 7650.
Technical overview
LG4 features
• Dual band GSM tranceiver. EGSM900 and GSM1800 bands with GPRS class 6 and
HSCSD data capability
• BB release is Galaxy WD2, main ASIC UPP_WD2
• RF release is Gemini premium release for Lilly (but shrinked)
• Bluetooth, based on BT102 module
• IR, HW capable for 1Mbit data speed
• Proximity sensor for controlling integrated handsfree feature (IHF)
• Handsfree, headset and earpiece audio connections
• VGA camera module connected with spring connector to LG4
• Ambient light sensor for controlling display and keyboard backlights
• Color display interface
• Flex cable interface to LS4 Grip module
Component placement and PWB outline
Components are placed only on one side of the LG4 module.
Figure 1 shows LG4 module from component side, main components are listed.
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r
r
Figure 1: Main components on LG4
UI module
connecto
AEM
Ambient light
senso
Antenna
switch
PA
Hagar
VCO
UI module
backlight
DC/DC
UEM
IR
Module
Proximity
sensor
Earpiece
Bluetooth
module,
BT102
VCTCXO
64Mbit
SDRA
UPP_WD2
32 + 128
Mbit flashes
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
p
g
p
p
Figure 2: Spring connection pads on top side of LG4
Power switch pads
Integrated handsfree
speaker pads
Headset
connector pads
Flex solder
pads, Grip IF
BT antenna pads
Microphone
ads
Figure 3: Spring connection pads on back side of LG4 and flex cable solder pads
Prod testing:
Powering
Camera
ads
SIM
GSM antenna
ads
Production testin
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CCS Technical Documentation System Module LG4 and Grip Module LS4
Figure 4: Test points in LG4 baseband
Test points of BB
)
J140
(VBAtt)
J262 (UEMRst)
J114 (FLDEX) (mem cntr)
J113 (FLCS0X)
J109 (FLADa0)
J105 (AEMSleepX
J111 (FLCS1x)
J120 (RxQD)
J117 (TxQD)
RF: J118 (AuXDA)
J119 (RxID)
J110 (VcoreA)
J102 (SleepX)
J103 (PURX)
J104 (UEMInt)
J116 (TxID)
J270
(GenV battIO
J138 (Vctrl (camera)
J100 (RFClk)
J101 (Sleepclk)
J106
(SDRDa0)
J115 (FlClk)
J07
(SDR Ad0)
J108
(SDRAMClk)
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
Block diagram
Below is the block diagram of LG4 module. External interfaces are drawn as arrows crossing LG4 border.
Figure 5: Block diagram of LG4
BT
antenna
Flex
to LS4
(Grip)
Flashing & Testing
LG4 module
BB
Sensors
Bluetooth
RF
VGA
camera
UImodule
Audio
SIM card
GSM
antenna
UI Interface
UI module interface pin numbering is presented in figure below. UI interface details are in
UI-module specification.
Figure 6: UI connector pin numbering on LG4 side
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Baseband Technical Summary
The heart of the BB is UPP_WD2, which includes MCU, DSP and Digital Control Logic.
Powering handled by Using AEM ASIC and UEM ASIC. There is Flash Memory 128Mbit +
32Mbit Flashes (20 Mbytes) and 64 Mbit (8 Mbytes) SDRAM. So there is a total of 28
Mbytes of Memory Capacity.
In BB there is an integrated Handsfree Audio Amplifier In AEM. There are two Audio Elements (Earpiece 8 mm and Speaker 16 mm) and External Galvanic Headset (DCT4) interface. IHF Speaker is also used to handle the Ringing tone. For IHF automated off function
there is proximity Sensor. In NHL-2NA there is only one microphone for both modes HS
and IHF.
For Data connectivity there is 1Mbit IR Module (IrDA compatible) and Bluetooth.
Display is MD-TFD type Color Display with 4096 Colors and 176x208 pixels with Backlight. Keyboard is partially in UI-Module and Partially in Grip-Module. Also there is This
Navigation Key Feature in UI-Module.
For imaging purposes BB supports VGA camera via CCP interfaces, which are integrated
in UPP_WD2.
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
Functional Description
BB Description
Core is based on UPP_WD2 CPU, which is a special version of the DCT4 UPP ASIC.
UPP_WD2 takes care of all the signal processing and operation controlling tasks of the
phone as well as all PDA tasks.
For Power management there are two Asics for controlling energy management and supplying current and different voltages; UEM and AEM. UEM and SW have the main control of the system voltages and operating modes and AEM acts as an auxiliary source of
voltages and current. The main reset for the system is generated by the UEM.
The interface from the RF and audio sections is handled also by UEM. This ASIC provides
A/D and D/A conversion of the in-phase and quadrature receive and transmit signal
paths and also A/D and D/A conversions of received and transmitted audio signals. Data
transmission between the UEM, AEM and RF and the UPP_WD2 is implemented using
different serial connections (CBUS, DBUS and RFBUS). Digital speech processing is handled by UPP_WD2 ASIC. Internal HF with proximity sensor functionality is implemented
inside the AEM ASIC.
A real time clock function is integrated into UEM, which utilizes the same 32kHz-clock
source as the sleep clock. A rechargeable battery provides backup power to run the RTC
when the main battery is removed. Backuptime is 20 Hours.
Memory Configuration
NHL-2NA uses two kinds of memories, Flash and SDRAM. These Memories have their
own Dedicated buses in UPP_WD2.
Synchronous DRAM is used as working memory. Interface is 16 bit wide data and 14 bit
Address. Memory clocking speed is 104 MHz. The SDRAM size 64Mbits (4Mx16).
SDRAM I/O is 1.8 V and core 2.78 V supplied by AEM’s regulators VIOA and VMEMA. All
memory contents are lost if the supply voltage is switched off.
Multiplexed Flash Memory Interface is used to store the MCU program code and User
Data. The memory interface is a burst type FLASH with multiplexed address/data bus.
Both I/O and core voltage are 1.8 V supplied by AEM’s VMEMB.
Energy Management
The master of EM control is UEM and with SW they have the main control of the system
voltages and operating modes. AEM (Auxiliary Energy Management) acts as an auxiliary
source of voltages and current.
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Modes of Operation
NHL-2NA employs several hardware & SW controlled operation modes. Main Modes are
described below.
• NO_SUPPLY mode means that the main battery is not present or its
voltage is too low (below UEM master reset threshold) and back-up battery voltage is too low.
• In BACK_UP mode the main battery is not present or its voltage is too
low but back-up battery has sufficient charge in it.
• In PWR_OFF mode the main battery is present and its voltage is over
UEM master reset threshold. All regulators are disabled.
• RESET mode is a synonym for start-up sequence and contains in fact
several modes. In this mode regulators and oscillators are enabled and
after they have stabilized system reset is released and PWR_ON mode
entered.
• In PWR_ON mode SW is running and controlling the system.
• SLEEP mode is entered from PWR_ON mode when the system’s activity is low (SLEEPX and AEMSLEEPX controlled by SW).
• FLASHING mode is for production SW download.
Voltage limits
In the following the voltage limits of the system are listed. These are also controlling system states.:
Parameter Description Value
V
MSTR+
V
MSTR-
V
COFF+
V
COFF-
V_BU
COFF+
Master reset threshold (rising) 2.1 V (typ.)
Master reset threshold (falling) 1.9 V (typ.)
Hardware cutoff (rising) 3.1 V (typ.)
Hardware cutoff (falling) 2.8 V (typ.)
Back-up battery cutoff (rising) 2.1 V (typ.)
V_BU
SW
COFF
COFF-
Back-up battery cutoff (falling) 2.0 V (typ.)
SW cutoff limit (> regulator drop-out limit) MIN! 3.15 V SW changeable
The master reset threshold controls the internal reset of UEM. If battery voltage is above
, UEM’s charging control logic is alive. Also, RTC is active and supplied from the
V
MSTR
main battery. Above V
UEM allows the system to be powered on although this may
MSTR
not succeed due to voltage drops during start-up. SW can also consider battery voltage
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
too low for operation and power down the system.
Clocking Scheme
A 26 MHz VCTCXO is used as system clock generator in GSM. During the system start-up,
UEM and AEM use their own RC-oscillators to generate timing for state machines. All
clock signals of the engine are illustrated in following figure.
In PWR_ON mode, SW must configure CBUS clock (1MHz) to be active all the time, as
this clock is used in AEM as digital clock and for the SMPS. Bluetooth uses 26 MHz analog clock.
Figure 7: NHL-2NA Clocking.
RF
26 MHz
VCXO
RF-ASIC
(Hagar)
RFClk
13 MHz
RFBusCl
UPP_WD2 UEM
SleepClk
CBusCl
DBusCl
SIMCl
SIM
Flash
Clk
LPRF
FLASHes
CAMERA
In SLEEP mode the VCTCXO is off. UEM generates low frequency clock signal (32.768
kHz) that is fed to UPP_WD2, Bluetooth and AEM.
UPP_WD2 voltage/clock frequency adjusting
The systems of the BB make it possible to adjust both clock frequency and the core voltage of the main ASIC. Here is a rough description of the Clocking Scheme.
No external clock is available for UPP_WD2 before VCTCXO starts. As reset is released,
the VCTCXO is running and MCU uses the 13 MHz clock while DSP is in reset. There are
three identical DPLL's, for MCU, for DSP and for accessory interfaces, which can be controlled independently. The clock for MCU can be up to 104 MHz and 117 MHz is maximum clock Frequency for the DSP. These clock signals are used either directly (SDRAM IF)
or divided down for the interfaces (e.g. flash IF).
SDRAM
Clk
SDRAM
AEM
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Power Distribution, Control and Reset
All power (except backup battery power) is drawn from BLB-2 Li-Ion battery located in
the Grip part of the phone. Power goes through LM3822 current gauge which is used for
current measurement and thus for remaining operating time estimation.
LG4 board contains two power ASIC’s UEM and AEM which contain the regulators
needed for generating the different operating voltages. In addition there is a SMPS in
LG4 generating the operating voltage for display module backlighting. In LS4 keyboard
the backlight is powered with a current pump.
Figure 8: Power distribution diagram
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System Module LG4 and Grip Module LS4 CCS Technical Documentation
Power-up sequence (Reset mode)
RESET mode can be entered in four ways: by inserting the battery or charger, by RTC
alarm or by pressing the power key. After voltage appearing at UEM’s pin UEMRSTX (connected to AEM’s pin REFENA) is used as indication for AEM to start up HW regulators.
Also VCTXO is Powered up by using VR3 (UEM). After the 220 ms delays regulator are
configured and UEM enters PWR_ON mode and system reset PURX is released.
During system start-up, in RESET state, the regulators are enabled, and each regulator
charges the capacitor(s) at the output with the maximum current (short circuit current)
it can deliver. This results in battery voltage dropping during the start-up. When a battery with voltage level just above the hardware cutoff limit is inserted, the system may
not start due to excessive voltage dipping. Dropping below 2.8 V for longer than 5 us
forces the system to PWR_OFF state.
Powering off
Controlled powering off is done when the user requests it by pressing power-key or when
the battery voltage is falling too low. Uncontrolled powering off happens when battery is
suddenly removed or if over-temperature condition is detected in regulator block while
in RESET mode. Then all UEM’s regulators are disabled immediately and AEM’s regulators
are disabled as VDD supply disappears.
Controlled powering off
For NHL-2NA powering off is initiated by pressing the power key and Power off sequence
is activated in UEM and SW. Basically Power key cause UEM Interrupt to UPP_WD2 and
SW sets Watchdog time value to zero and as this happens, PURX is forced low and all
regulators are disabled.
If the battery voltage falls below the very last SW-cutoff level, SW will power off the
system by letting the UEM’s watchdog elapse.
If thermal shutdown limit in UEM regulator block is exceeded, the system is powered off.
System reset PURX is forced low. AEM has its own thermal limit for regulators. Whenever
the limit is exceeded, an interrupt is given to UPP_WD2 and SW should immediately
power off the whole system. AEM will disable its regulators in any case by itself after 10
ms delay (uncontrolled powering off).
Uncontrolled powering off
This happens when the battery is suddenly removed and is problematic as data may corrupt in memories. UEM’s state machine notices battery removal after battery voltage has
been below V
COFF-
regulators are disabled. AEM’s regulators except for VCOREA, VIOA, VMEMA and VMEMB
are disabled as PURX goes low. These regulators stay enabled as long as there is voltage
present at pin VDD (from UEM’s VIO).
for 5 us and enters PWR_OFF mode. PURX is set low and all UEM’s
Watchdogs
There are three watchdogs in UEM. First one is for controlling system power-on and
power-down sequences. The initial time for this watchdog after reset is 32 s and the
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watchdog can not be disabled. The time can be set using a register. This watchdog is used
for powering the system off in a controlled manner. The other one is for security block
and is used during IMEI code setting. The third one is a power key watchdog. It is used to
power off the system in case SW is stuck and the user presses the power key. This WD is
SW configurable.
There is also a ”soft watchdog” in UPP_WD2. It is used to reset the chip in case software
gets stuck for any reason. The Bluetooth module also contains a watchdog.
Charging
Charging controls and charge switch is in UEM. There are three different charging
modes; charging empty battery (start-up charge mode), PWM charging mode (without
SW control) and SW controlled charging.
UEM digital part takes care of charger detection (generates interrupt to UPP_WD2),
pulse width modulated charging control (for internal charge switch and external performance charger) and over voltage and current detection. SW using registers controls all
these.
Chargers
Battery
NHL-2NA BB is supporting a standard charger (two wires) or fast (performance) charger
(three wires), Chargers ACP-7, ACP-8 and ACP-9 and ACP-12, Cigarette Charger LCH-8
are supported.
With the standard version the PWM signal is set to 1 Hz, while with fast charger it is set
to 32 Hz. Also PWM signal is connected from UEM pin to the charger’s control input.
Due to high current consumption of the NHL-2NA BB, a performance charger ACP-8 is
needed.
NHL-2NA Battery is a detachable, semi-fixed Lithium-Ion BLB-2 battery. Other batteries
are allowed to use but NOT charged. Nominal voltage is thus 3.6-3.7 V (max charging
voltage 4.1-4.2 V).
The interface consists of four pins: VBAT, GND, BSI and BTEMP. Pull-down resistor inside
of the batteries (BSI signal) recognizes the battery types. Voltage level at BSI line is measured with using Em's AD-converter.
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Back-up battery and real time clock
Real time clock (RTC), crystal oscillator and back-up battery circuitry reside in UEM. A
register in UEM controls back-up battery charging and charging is possible only in
POWER_ON State.
Baseband Measurement A/D Converter
The UEM contains 11 channels A/D converter, which is used for different Baseband measurement purposes. The resolution of A/D converter is 10 bits. Converter uses the CBUS
interface clock signal for the conversion. An interrupt will be given to the MCU at the
end of the all measurement. Converter is used for following purposes.
• Battery Voltage Measurement A/D Channel (Internal)
• Charger Voltage Measurement A/D Channel (Internal)
• Charger Current Measurement A/D Channel (Internal)
• Battery Temperature Measurement A/D Channel (External)
• Battery Size Measurement A/D Channel (External)
• Light Sensor Measurement A/D Channel (External)
• PA Temperature measurement A/D Channel (External)
• VCTCXO Temperature measurement A/D Channel (External)
There is also auxiliary AD converter in UEM, which is used to monitor RF functions. Converter is controlled directly by UPP DSP. Converter can be used for following purposes:
VCXO Temperature measurement A/D Channel (if not used in normal AD)
PA Temperature measurement A/D Channel (if not used in normal AD)
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