Nokia 7600 Service Manual 07 nmm3 system

Customer Care Solutions
NMM-3 Series Transceivers

7 - System Module & UI

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Page No
Introduction ............................................................................................................................................. 5
System Module Baseband .................................................................................................................... 5
Power Distribution Diagram ..............................................................................................................7
Environmental operating conditions ...............................................................................................8
Temperature Conditions................................................................................................................... 8
Humidity and Water Resistance.................................................................................................... 8
Baseband Functional Description ...................................................................................................... 8
Modes of Operation ............................................................................................................................. 8
Battery .....................................................................................................................................................9
Backup Battery ....................................................................................................................................10
Power Up and Reset ...........................................................................................................................10
UEME Reset Sequence and Timings ..............................................................................................11
A/D Channels .......................................................................................................................................11
ZOCUS ....................................................................................................................................................12
Bluetooth ..............................................................................................................................................13
Camera ..................................................................................................................................................15
UI Module .............................................................................................................................................16
Display ................................................................................................................................................. 16
Backlighting .................................................................................................................................... 16
IR Module .............................................................................................................................................18
SIM Interface .......................................................................................................................................19
External Accessory Interface ...........................................................................................................20
Pop-Port System Connector ........................................................................................................ 20
Charger interface............................................................................................................................ 21
ACI ..................................................................................................................................................... 21
USB interface................................................................................................................................... 21
External Audio ................................................................................................................................... 22
External Microphone Connection ............................................................................................. 22
External Earphone Connections ................................................................................................ 23
Internal Audio .................................................................................................................................... 23
IHF Speaker ..................................................................................................................................... 23
Internal Microphone ..................................................................................................................... 24
Internal Speaker.............................................................................................................................. 24
Memory Block ......................................................................................................................................25
PDRAM ...................................................................................................................................................25
External Flash Memory ................................................................................................................ 25
External SDRAM ............................................................................................................................. 25
NMM-3 Test interfaces ................................................................................................................... 26
Baseband General Specification ..................................................................................................... 26
Absolute Maximum Ratings .......................................................................................................... 26
DC Characteristics ............................................................................................................................ 26
RF Module Description ....................................................................................................................... 27
Introduction ....................................................................................................................................... 27
DC Characteristics ............................................................................................................................ 27
Regulators ........................................................................................................................................ 27
RF-BB Interface .............................................................................................................................. 29
RF block diagram .............................................................................................................................. 30
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CCS Technical Documentation 7 - System Module & UI
General ............................................................................................................................................. 30
Description of the RF Related Converters .............................................................................. 31
GSM RF ..................................................................................................................................................33
GSM RF Characteristics ............................................................................................................... 33
GSM functional descriptions ......................................................................................................... 34
RF block diagram ........................................................................................................................... 34
GSM frequency synthesizer ........................................................................................................ 35
GSM transmitter ............................................................................................................................ 35
Power control ................................................................................................................................. 36
GSM receiver ................................................................................................................................... 37
AGC strategy ................................................................................................................................... 38
AFC function ................................................................................................................................... 39
WCDMA RF ...........................................................................................................................................40
WCDMA RF Characteristics ........................................................................................................ 40
WCDMA Functional Description ................................................................................................... 41
WCDMA synthesizers ................................................................................................................... 41
WCDMA transmitter ..................................................................................................................... 42
TX power control ............................................................................................................................ 43
WCDMA receiver ............................................................................................................................ 44
AGC strategy ................................................................................................................................... 45
Tables
1. Voltage supplies and references ........................................................................................... 27
2. Binary signals ............................................................................................................................. 29
3. Analog signals ............................................................................................................................ 29
4. GSM900 / GSM1800 System Characteristics .................................................................... 33
5. Transmitter Characteristics .................................................................................................... 33
6. Receiver Characteristics .......................................................................................................... 33
7. WCDMA System Characteristics ........................................................................................... 40
8. TX Main Characteristics ........................................................................................................... 40
9. RX Main Characteristics .......................................................................................................... 40
Figures
1. Voltage supplies for RF ............................................................................................................ 28
2. RF related converters ............................................................................................................... 32
3. GSM RF Block Diagram ............................................................................................................ 34
4. Phase locked loop, PLL ............................................................................................................. 35
5. GSM Power Control Loop ........................................................................................................ 37
6. RX Gain Control in GSM .......................................................................................................... 39
7. WCDMA TX Block Diagram ..................................................................................................... 42
8. WCDMA RX Block Diagram .................................................................................................... 44
9. RX Gain Control in WCDMA ................................................................................................... 45
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CCS Technical Documentation 7 - System Module & UI

Introduction

The NMM-3 System module (or Engine) consists of Baseband and RF sub-modules, a summary of the function and operation of the Baseband sub-modules are described here.

System Module: Baseband

Main functionality of the baseband is implemented into two ASICs: TIKU and UEME.
Baseband block diagram:
User data FLASH
256Mbit NAND
FLASH
Program
128Mbit NOR
SDRAM
64Mbit
Core
supply
IR
Camera
supply
Display
Camera
LED
drivers
Core
supply
TIKU
ARM925
PDRAM
CDSP lead 3
ADSP lead 3
Keypad
MCU
COWIS
Supply
3G
Logic
2G
Logic
COWIS
NUT
BLUETOOTH
RF Block
UEME
Regulation
Charge control
Audio
FBUS/MBUS
SIM I/F
RTC
Zocus
speaker
Earpiece
MIC
Vibra
Production test
interface
IHF
USIM
Pop-port system
connector
DC
jack
Battery
UEME is the Universal Energy Management Enhanced IC for digital hand portable phones. In addition to energy management, functionality UEME performs all the base­band mixed–signal functions.
TIKU is the main digital baseband ASIC.
UEME is essentially the same as UEM, but with the following additions:
An internal IHF amplifier saving the need for an external amplifier and the many associated passives.
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An extra regulator for Tomahawk so saving small area and cost needed for an external regulator.
Stereo audio support for stereo tomahawk accessories, which is necessary for the Music Player.
Wider audio bandwidth that can be used to improve audio quality of MP3/AAC and ring tones.
Baseband power is supplied from a 2.8V analogue voltage and 1.8V I/O voltage. UEME includes 8 linear LDO (Low Drop-Out) regulators for Baseband and 7 regulators for RF. It also contains 4 current sources for biasing purposes, two for internal use. UEME also includes a SIM interface, which supports 1.8V and 3V SIM cards. Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.
A real time clock function is integrated into UEME, which utilizes the same 32KHz clock supply as the sleep clock. A backup power supply is provided for the RTC-battery, which
keeps the real time clock running when the main battery is removed. A 10µAh capacitor
provides RTC backup for 3 hours minimum.
The TIKU Brain consists of 5 sections: - the ARM925 Mega-Module, (consisting of the ARM9 MCU, Cache memory, Parallel LCD Controller, and Traffic Controller), C-DSP Lead 3 Mega-Module, D-DSP Lead 3 Mega-Module, PDRAM, and PDA Peripherals.
The ARM-Mega-Module has a Traffic controller, which provides the interface between the MCU, external memories, LCD controller, and internal busses. It also processes the data packages for burst mode memory access.
The PDA Peripherals consists of Camera Compact Port (CCP) interface, IR, USB, and Dis­play interfaces.
The DPLL frequencies are currently:
MCU: 124.8MHz
DSPs: 148.0MHz
PDA: 48MHz
NMM-3 will use TIKU version 1.23
NMM-3 uses a discrete LM2608-1.3 SMPS 1.5V/1.3V regulator for TIKU core supply.
The UEME ASIC handles part of the interface between the baseband and the RF section. The GSM RX path goes via ADCs in UEME intended for the purpose, but the GSM TX path uses the dual purpose DACs on board the Tiku baseband ASIC. Tiku DACs are used for both GSM and WCDMA TX paths. The WCDMA RX path is via Tiku ADCs. UEME also pro­vides the RF section with a DAC for AFC control, a simple "Is RF present?" level detector TXPWRDET, a DAC for TXC WCDMA power control, two reference voltages VREF01 and VREF02, and a 4-bit controlled current output IPA1 used for WCDMA PA bias control. IPA2 is not used. UEME is controlled by Tiku using two serial buses CBUS and DBUS. CBUS mostly carries commands from the MCU and DBUS mostly carries commands from the DSP. UEME also contains the analogue parts of the audio codecs which are capable
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CCS Technical Documentation 7 - System Module & UI
of working in various modes from ordinary telephone voice quality to near CD quality. An 8ohm output loudspeaker driver is available for integrated handsfree use. UEME has twin stereo codecs for stereo headsets. The audio signals are passed from Tiku in the form of LEFT and RIGHT PDM signals plus and audio clock. The clock and PDM speed changes according to the quality mode. UEME digital i/o voltages are 1.8V though some of the internal logic is 2.78V. 2.78V is used for the analogue parts and VBAT is also used for some of the driver circuits like the vibra, IHF PA, and LED driver.
The Baseband supports both internal and external microphone inputs and speaker out­puts. Input and output source selection and gain control is performed by UEME accord­ing to control messages from TIKU. Keypad tones, DTMF, and other AUDIO tones are generated and encoded by TIKU and transmitted to UEME for decoding. An external vibra alert control signal is generated by UEME with separate PWM outputs.
NMM-3 has two external serial control interfaces: FBUS and USB. FBUS can be accessed via the test pads, and USB via the system connector.

Power Distribution Diagram

The NMM-3 power distribution block diagram is shown below
VIO
Vlogic
IR
Camera
Connector
RF PAs
VFLASH1
Vcc
4R7
UEME VCORE
1.8V
2.8V
LP3985-2.8
2.8 V
VFLASH1
VBAT
20mR
Prot cct
VIO
3.3mR
Battery
contacts
BL-5C
0.22R
ZOCUS
Sense-
Sense+
Vcc
20mR
VREG
VCC VCC VCC
VAPP
GND
Vanode
Bluetooth
MANGO GSM/WCDM A RF
BLOCK
VR5
VR4
VR3
VR2
VR1B
VR1A
4.75
4.75
VBATVR1
VBATVR2
VBATVR3
VBATVR4 VBATVR5
VBATVR6 VBATVR7
VBATBB2
VBATBB4
VBATBB5
VBATBB3
VBATBB1
Vibra driver
VBATREGS
V refs Charcon
Charger
Switch
UEME Vchar
protection
Charger
GND
2.8
Jack
2.8
2.8
UEME
VRTC VBU
Back Up
2.8
battery
VR6
2.8
Vin
TK1185
VR7
Audio PA
Vana
Camera digital supply
UI MODULE
LP2985-1.8
VIO
NUT
(USB IF)
Vcc
33R
VBUS VOUT
Colour LCD
Vcc
Vi/o
Vbat
Vbat
LP3987
2.85V
COWIS
TX/RX
converters
TIK
Clock slicer
I/O
Memory interface
i/o
VddDi
Core
DPLLs
Periferals
2GBody
ARM9
LEAD3
LEAD3
Voodoo
128Mb NOR Flash
Vcc Vccq
256Mb NAND
Vcc
Flash
Vccq
64Mb SDRAM
Vccq Vcc
1.8V
RX
TX
Vbat
LM2608-1.3
DC-DC buck
Vref
1.5V, active
1.3V deep sleep
VTiku
Vpp
12V VPP
gen i/o
+VLCDLED
vfb
VREF01
2.8
-VLCDLED
+VKEYLED
-VKEYLED
KEY LED Current sink
VREF02
1.35
1.35
GSM RF
converters
VSIM
3.0/1.8V
VFLASH1
2.78V
VIO
1.8V
Vcore
1.8V
VAUX2
2.78V
VANA
2.78V
VAUX1
2.78V
VAUX3
2.78V
IHF
bias
Vdd28
Vdd18
RxAVd
TxAVd
/C
/C
/C
VCHAR
TOMAHAWK (“POP PORT”)
Vcc
SIM
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Environmental operating conditions

Temperature Conditions:
NMM-3 should operate with full functionality within an ambient temperature range of -
10°C to +60°C, and with reduced functionality between -25°C to -10°C and +55°C to +75°C.
Humidity and Water Resistance:
Full functionality within humidity range of 5% to 95%.
Condensed or dripping water may cause intermittent malfunctions. Protection against dripping water has been implemented.

Baseband Functional Description

Modes of Operation

TB4 baseband engine has six different operating modes:
No supply
Backup
•Acting Dead
•Active
Sleep
Charging
No supply
In NO_SUPPLY mode the phone has no supply voltage. This mode is due to disconnection of main battery and backup battery or low battery voltage level in both of the batteries.
The phone exits from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > V
by connecting charger and charging the battery above V
Backup
In BACKUP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < V
and VBACK > 2.0V).
MSTR
MSTR+
.
MSTR+
(2.1V) or
Real Time Clock (VRTC) regulator is disabled in BACKUP mode. VRTC output is supplied without regulation from backup battery (VBACK). All the other regulators are disabled.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user the phone acts as if it was switched off. A battery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.
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Active
In the active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub–states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
One of the sub–state of the active mode is Bluetooth on state, enabled by UEME. Blu­tooth circuitry is controlled by the MCU and 26MHz reference clock is generated by the
Module TCXO.
In active mode the RF regulators are controlled by SW writing into UEMEs register set­tings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and VR4 –VR7 can be enabled or disabled or forced into low quiescent current mode. VR3 is always enabled in active mode.
Sleep mode
Sleep mode is entered when the MCU and both DSPs are in stand–by mode. Sleep is con­trolled by the processor. When SLEEPX low signal is detected UEME enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All RF reg­ulators are disabled in SLEEP. When SLEEPX=1 goes high, UEME enters ACTIVE mode and all functions are activated.

Battery

The sleep mode is exited either by the expiration of a sleep clock counter in the UEME or by some external interrupt, generated by a charger connection, key press, headset con­nection etc.
In sleep mode the 19.2MHz ref clock (VCTCXO) is shut down and 32 kHz sleep clock oscillator is used as reference clock for the baseband.
Charging
The battery voltage, temperature, size and current are measured by UEME controlled by the charging software running in TIKU.
The charging control circuitry (CHACON) inside the UEME controls the charging current delivered from the charger to the battery. The battery voltage rise is limited by turning the UEME switch off when the battery voltage has reached 4.2 V. Charging current is monitored by measuring the voltage drop across a 220 mOhm resistor R200.
850 mAh Li-ion battery pack BL-5C is used in NMM-3. Nominal discharge cut–off voltage 3.35V Nominal battery voltage 3.7V Nominal charging voltage 4.2V
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Signal Name Pin Number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the battery pack)
GND 3 Negative/common battery terminal
Battery temperature measurement
In Lynx batteries there are neither BTEMP pin nor NTC resistor. Battery’s temperature is estimated by the measurement of a discrete NTC resistor in the phone located close to the battery.

Backup Battery

To preserve the Real Time Clock (RTC), when the main battery is removed, a RTC back-up capacitor B253 is installed in the phone. This 10uAh solution will give about 3hrs back­up time in worst case.
The backup battery (capacitor) is connected between UEME VBACK and GND. In UEME backup battery charging high limit is set to 3.2V. The cut–off limit voltage (VBUCoff–) for backup battery is 2.0V. Backup battery
Charging is controlled by MCU by writing to UEME registers.

Power Up and Reset

Power up and reset is controlled by the UEME ASIC. NMM-3 baseband can be powered up in following ways:
Press power button which means grounding the PWRONX pin of the UEME
Connect the charger to the charger input
Supply battery voltage to the battery pin
RTC Alarm, the RTC has been programmed to give an alarm
After receiving one of the above signals, the UEME counts a 20ms delay and then enters it’s reset mode. The watchdog starts up, and if the battery voltage is greater than V
(2.1V) a 200ms delay is started to allow references etc. to settle. After this delay elapses the VFLASH1 regulator is enabled. 500us later VR3, VANA, VIO and VCORE are enabled. Finally the PURX (Power Up Reset) line is held low for 20 ms. this reset, PURX, is fed to the baseband ASIC TIKU, resets are generated for the MCU and DSPs. During this reset phase the UEME forces the VCTCXO regulator on regardless of the status of the sleep control input signal to the UEME.
coff+
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All baseband regulators are switched on at the UEME power on except SIM and VAUX1, 2, 3 regulators that are controlled by the MCU (VFLASH2 is not used on NMM-3). The UEME internal watchdogs are running during the UEME reset state, with the longest watchdog time selected. If the watchdog expires the UEME returns to power off state. The UEME watchdogs are internally acknowledged at the rising edge of the PURX signal in order to always give the same watchdog response time to the MCU.

UEME Reset Sequence and Timings

The diagram below shows the timing of the reset sequence on the NMM-3.
POWERONX
EMRSTX
VRAM (SDRAM core)
VTIKU (Tiku core)
VFLASH1
VIO, VR3, VANA, SMPSCLK
Delay1 20ms
Delay2 200ms
1.3V
Delay3
0.5ms
Delay4 20ms
1.5V
RFCLK
(19.2MHz)
PURX, SLEEPX

A/D Channels

The UEME contains the following A/D converter channels that are used for several mea­surement purpose. The general slow A/D converter is a 10-bit converter using the UEME interface clock for the conversion. An interrupt will be given at the end of the measure­ment.
The UEME’s 13–channel analog to digital converter is used to monitor charging func­tions, battery functions, voltage levels in external accessory detection inputs, user inter­face and RF functions.
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The monitored battery functions are:
Battery voltage (VBATADC),
Battery type (BSI)
Battery temperature (BTEMP).
The battery type is recognized through a resistive voltage divider. In phone there is a 100kOhm pull up resistor to VFLASH1 in the BSI line and the battery has a pull down resistor in the same line. Depending on the battery type the pull down resistor value is changed. The battery temperature is measured equivalently except that the NTC pull down resistor used for temperature sensing is on the phone.
The monitored charger functions are:
Charger Voltage (VCHAR)
Charger current (ICHAR)
The voltage measured across a 0R22 resistor (R200) in circuit with charger voltage out from UEME is used to determine ICHAR.

ZOCUS

The HEADINT and HOOKINT are external accessory detection inputs used for monitoring voltage levels in these inputs. They are routed internally from the miscellaneous.
The monitored RF functions are:
Power amplifier temperature (GRFTEMP)
VCXO Temperature (WTx_TEMP)
PATEMP input is used to measure temperature of the TEX and HLGA.
A/D values can be monitored through the ‘ADC Reading’ window in Phoenix.
The ZOCUS device N201 (National LM3819) is a calibrated current sensor, used by energy management software to determine the current consumption in the mobile phone.
Current is sensed across a “zero-ohm” PWB track resistor (actual trace resistance is
~3.3m) using a high gain and extremely low offset comparator. The measured current
is converted to a pulse width modulation (PWM) signal with the duty cycle representing both the magnitude and direction of current. The PWM signal is converted to digital data that can be read by the phone via the CBUS interface.
ZOCUS reads the average current over a period of approximately 1 second.
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To determine the functionality of ZOCUS, use Phoenix ADC Reading option to read the phones Battery average current, the value returned is calculated from values measured by ZOCUS. Also self-test will prove CBUS connectivity to ZOCUS.

Bluetooth

VBAT
BSI
GND
Current Sense
track resistor
VBAT
UEME
Sense In
ZOCUS
N201
VDD GND
CBUS
D200
The Bluetooth circuit consists of the Bluetooth module (N101), A TCXO (G100) operating at 26MHz.
The BT202 Bluetooth transceiver module for NMM-3, consists of a RF ASIC, Baseband ASIC and 4Mbits Flash Memory. It contains UART and PCM user interface. The supply voltage is VBAT, VFLASH1 and VIO. External reference clock is 26 MHz.
The Bluetooth module is not a repairable part, and so should be replaced if found to be defective..
56:XTALGND
55:XTAL
54:VCC
53:VCC
52:VCC
51:GND
50:SYSCLK
49:VBB EN
1:GND
2:GND
3:GND
4:GND
5:GND
6:VRE G
7:GND
8:GND
9:GND
10:GND
48:SLEEP X
xxxxxxx
xxxxxxxxxxxxx
47:GND
46:VCC XTAL
45:VDD
44:RESETX
43:GPP2
42:WRX
41:GPP3.
40:GPP4
39:GND
38:GPP0
37:GPP1
36:GPP10
35:GPP11
34:CENX
33:GND
32:VAPPL
31:OSCON
30:GPP9
29:GND
11:G ND
12:ANT
13:GND
14:GND
15:GND
16:REFCLK
17:GND
18:EN26MH Z
19:GND
20:TRST
21:TMS
22:TDO
23:TDI
24:GPP5
25:TCK
26:SPLCLK
27:GPP7
28:GPP6
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Pin Description:
No.
44 RESETX PURX BB reset input from UEME
50 SYSCLK1 SYSCLK system clock_input / 26MHz from TCXO G100
55 XTAL - internal 13MHz oscillator / Not connected
56 XTALGND GND Select oscillator / Ground
18 EN26MHZ VIO Defines system clock / connected to VIO for 26MHz
16 REFCLK GND Reference clock input / connected to Ground
26 SLPCLK SLEEPCLK Sleep clock input from UEME
49 VBBEN UEMRSTX Internal RF regulators enabled by UEME ResetX
48 SLEEPX SLEEPX Switch to active mode
31 OSCON OSCON Force active mode(=ResetX for Flash)
1-5, 7-11, 13-
15, 17,19,
29,33,
39,47,51
52-54 VCC VBAT_BT Main power supply voltage input from Battery
6 VREG VFLASH1 Regulated power supply voltage input 2.78V from
46 VCCXTAL VCCXTAL Regulated 2.4V supply output for external TCXO G100
Bluetooth Name
GND GND Ground reference
NMM-3 Name Function / Destination
VFLASH1, used for RF and BB parts.
45 VDD GPP3 Regulated 1.8V supply for internal BB and Memory
Blocks
32 VAPPL VIO 1.8V supply for application interfacing
12 ANT ANT Antenna pin
38 GPP0 LPRFSYNC General purpose port / Data Bus
37 GPP1 LPRFINT Interrupt to TIKU to initilise BT operation.
43 GPP2 GND General purpose port connected to Ground
41 GPP3 VDD General purpose port supply for internal BB and Mem-
ory Blocks
40 GPP4 - General purpose port / No Connection
24 GPP5 GND General purpose port connected to Ground
28 GPP6 LPRFRX General purpose port / Data Bus
27 GPP7 LPRFTX General purpose port / Data Bus
30 GPP9 - General purpose port / No Connection
36 GPP10 CBUSCLK General purpose port used for control and flash pro-
gramming
35 GPP11 CBUSDA General purpose port used for control and flash pro-
gramming
34 CENX CBUSENX CBUS enable / No Connection
20 TRST - JTAG test reset / No Connection
21 TMS - JTAG test mode / No Connection
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