Nokia 7600 Service Manual 07 nmm3 system

Customer Care Solutions

NMM-3 Series Transceivers

7 - System Module & UI

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-1

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Table of Contents

Page No

Introduction ............................................................................................................................................. 5

System Module Baseband .................................................................................................................... 5

Power Distribution Diagram ..............................................................................................................7

Environmental operating conditions ...............................................................................................8

Temperature Conditions................................................................................................................... 8

Humidity and Water Resistance.................................................................................................... 8

Baseband Functional Description ...................................................................................................... 8

Modes of Operation ............................................................................................................................. 8

Battery .....................................................................................................................................................9

Backup Battery ....................................................................................................................................10

Power Up and Reset ...........................................................................................................................10

UEME Reset Sequence and Timings ..............................................................................................11

A/D Channels .......................................................................................................................................11

ZOCUS ....................................................................................................................................................12

Bluetooth ..............................................................................................................................................13

Camera ..................................................................................................................................................15

UI Module .............................................................................................................................................16

Display ................................................................................................................................................. 16

Backlighting .................................................................................................................................... 16

IR Module .............................................................................................................................................18

SIM Interface .......................................................................................................................................19

External Accessory Interface ...........................................................................................................20

Pop-Port System Connector ........................................................................................................ 20

Charger interface............................................................................................................................ 21

ACI ..................................................................................................................................................... 21

USB interface................................................................................................................................... 21

External Audio ................................................................................................................................... 22

External Microphone Connection ............................................................................................. 22

External Earphone Connections ................................................................................................ 23

Internal Audio .................................................................................................................................... 23

IHF Speaker ..................................................................................................................................... 23

Internal Microphone ..................................................................................................................... 24

Internal Speaker.............................................................................................................................. 24

Memory Block ......................................................................................................................................25

PDRAM ...................................................................................................................................................25

External Flash Memory ................................................................................................................ 25

External SDRAM ............................................................................................................................. 25

NMM-3 Test interfaces ................................................................................................................... 26

Baseband General Specification ..................................................................................................... 26

Absolute Maximum Ratings .......................................................................................................... 26

DC Characteristics ............................................................................................................................ 26

RF Module Description ....................................................................................................................... 27

Introduction ....................................................................................................................................... 27

DC Characteristics ............................................................................................................................ 27

Regulators ........................................................................................................................................ 27

RF-BB Interface .............................................................................................................................. 29

RF block diagram .............................................................................................................................. 30

Page 7-2 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

General ............................................................................................................................................. 30

Description of the RF Related Converters .............................................................................. 31

GSM RF ..................................................................................................................................................33

GSM RF Characteristics ............................................................................................................... 33

GSM functional descriptions ......................................................................................................... 34

RF block diagram ........................................................................................................................... 34

GSM frequency synthesizer ........................................................................................................ 35

GSM transmitter ............................................................................................................................ 35

Power control ................................................................................................................................. 36

GSM receiver ................................................................................................................................... 37

AGC strategy ................................................................................................................................... 38

AFC function ................................................................................................................................... 39

WCDMA RF ...........................................................................................................................................40

WCDMA RF Characteristics ........................................................................................................ 40

WCDMA Functional Description ................................................................................................... 41

WCDMA synthesizers ................................................................................................................... 41

WCDMA transmitter ..................................................................................................................... 42

TX power control ............................................................................................................................ 43

WCDMA receiver ............................................................................................................................ 44

AGC strategy ................................................................................................................................... 45

Tables

1. Voltage supplies and references ........................................................................................... 27

2. Binary signals ............................................................................................................................. 29

3. Analog signals ............................................................................................................................ 29

4. GSM900 / GSM1800 System Characteristics .................................................................... 33

5. Transmitter Characteristics .................................................................................................... 33

6. Receiver Characteristics .......................................................................................................... 33

7. WCDMA System Characteristics ........................................................................................... 40

8. TX Main Characteristics ........................................................................................................... 40

9. RX Main Characteristics .......................................................................................................... 40

Figures

1. Voltage supplies for RF ............................................................................................................ 28

2. RF related converters ............................................................................................................... 32

3. GSM RF Block Diagram ............................................................................................................ 34

4. Phase locked loop, PLL ............................................................................................................. 35

5. GSM Power Control Loop ........................................................................................................ 37

6. RX Gain Control in GSM .......................................................................................................... 39

7. WCDMA TX Block Diagram ..................................................................................................... 42

8. WCDMA RX Block Diagram .................................................................................................... 44

9. RX Gain Control in WCDMA ................................................................................................... 45

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-3

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

This page has been delibrately left blank

Page 7-4 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

Introduction

The NMM-3 System module (or Engine) consists of Baseband and RF sub-modules, a
summary of the function and operation of the Baseband sub-modules are described here.

System Module: Baseband

Main functionality of the baseband is implemented into two ASICs: TIKU and UEME.

Baseband block diagram:

User data FLASH

256Mbit NAND

FLASH

Program

128Mbit NOR

SDRAM

64Mbit

Core

supply

IR

Camera

supply

Display

Camera

LED

drivers

Core

supply

TIKU

ARM925

PDRAM

CDSP
lead 3

ADSP
lead 3

Keypad

MCU

COWIS

Supply

3G

Logic

2G

Logic

COWIS

NUT

BLUETOOTH

RF Block

UEME

Regulation

Charge control

Audio

FBUS/MBUS

SIM I/F

RTC

Zocus

speaker

Earpiece

MIC

Vibra

Production test

interface

IHF

USIM

Pop-port system

connector

DC

jack

Battery

UEME is the Universal Energy Management Enhanced IC for digital hand portable
phones. In addition to energy management, functionality UEME performs all the base­band mixed–signal functions.

TIKU is the main digital baseband ASIC.

UEME is essentially the same as UEM, but with the following additions:

• An internal IHF amplifier saving the need for an external amplifier and the many
associated passives.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-5

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

• An extra regulator for Tomahawk so saving small area and cost needed for an
external regulator.

• Stereo audio support for stereo tomahawk accessories, which is necessary for the
Music Player.

• Wider audio bandwidth that can be used to improve audio quality of MP3/AAC
and ring tones.

Baseband power is supplied from a 2.8V analogue voltage and 1.8V I/O voltage. UEME
includes 8 linear LDO (Low Drop-Out) regulators for Baseband and 7 regulators for RF. It
also contains 4 current sources for biasing purposes, two for internal use. UEME also
includes a SIM interface, which supports 1.8V and 3V SIM cards. Note: 5V SIM cards are
no longer supported by DCT-4 generation Baseband.

A real time clock function is integrated into UEME, which utilizes the same 32KHz clock
supply as the sleep clock. A backup power supply is provided for the RTC-battery, which

keeps the real time clock running when the main battery is removed. A 10µAh capacitor

provides RTC backup for 3 hours minimum.

The TIKU Brain consists of 5 sections: - the ARM925 Mega-Module, (consisting of the
ARM9 MCU, Cache memory, Parallel LCD Controller, and Traffic Controller), C-DSP Lead 3
Mega-Module, D-DSP Lead 3 Mega-Module, PDRAM, and PDA Peripherals.

The ARM-Mega-Module has a Traffic controller, which provides the interface between
the MCU, external memories, LCD controller, and internal busses. It also processes the
data packages for burst mode memory access.

The PDA Peripherals consists of Camera Compact Port (CCP) interface, IR, USB, and Dis­play interfaces.

The DPLL frequencies are currently:

• MCU: 124.8MHz

• DSPs: 148.0MHz

• PDA: 48MHz

NMM-3 will use TIKU version 1.23

NMM-3 uses a discrete LM2608-1.3 SMPS 1.5V/1.3V regulator for TIKU core supply.

The UEME ASIC handles part of the interface between the baseband and the RF section.
The GSM RX path goes via ADCs in UEME intended for the purpose, but the GSM TX path
uses the dual purpose DACs on board the Tiku baseband ASIC. Tiku DACs are used for
both GSM and WCDMA TX paths. The WCDMA RX path is via Tiku ADCs. UEME also pro­vides the RF section with a DAC for AFC control, a simple "Is RF present?" level detector
TXPWRDET, a DAC for TXC WCDMA power control, two reference voltages VREF01 and
VREF02, and a 4-bit controlled current output IPA1 used for WCDMA PA bias control.
IPA2 is not used. UEME is controlled by Tiku using two serial buses CBUS and DBUS.
CBUS mostly carries commands from the MCU and DBUS mostly carries commands from
the DSP. UEME also contains the analogue parts of the audio codecs which are capable

Page 7-6 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

d

d

N

L

N

Vovp

N

g

CCS Technical Documentation 7 - System Module & UI

of working in various modes from ordinary telephone voice quality to near CD quality. An
8ohm output loudspeaker driver is available for integrated handsfree use. UEME has twin
stereo codecs for stereo headsets. The audio signals are passed from Tiku in the form of
LEFT and RIGHT PDM signals plus and audio clock. The clock and PDM speed changes
according to the quality mode. UEME digital i/o voltages are 1.8V though some of the
internal logic is 2.78V. 2.78V is used for the analogue parts and VBAT is also used for
some of the driver circuits like the vibra, IHF PA, and LED driver.

The Baseband supports both internal and external microphone inputs and speaker out­puts. Input and output source selection and gain control is performed by UEME accord­ing to control messages from TIKU. Keypad tones, DTMF, and other AUDIO tones are
generated and encoded by TIKU and transmitted to UEME for decoding. An external vibra
alert control signal is generated by UEME with separate PWM outputs.

NMM-3 has two external serial control interfaces: FBUS and USB. FBUS can be accessed
via the test pads, and USB via the system connector.

Power Distribution Diagram

The NMM-3 power distribution block diagram is shown below

VIO

Vlogic

IR

Camera

Connector

RF PAs

VFLASH1

Vcc

4R7

UEME VCORE

1.8V

2.8V

LP3985-2.8

2.8 V

VFLASH1

VBAT

20mR

Prot cct

VIO

3.3mR

Battery

contacts

BL-5C

0.22R

ZOCUS

Sense-

Sense+

Vcc

20mR

VREG

VCC
VCC
VCC

VAPP

GND

Vanode

Bluetooth

MANGO GSM/WCDM A RF

BLOCK

VR5

VR4

VR3

VR2

VR1B

VR1A

4.75

4.75

VBATVR1

VBATVR2

VBATVR3

VBATVR4
VBATVR5

VBATVR6
VBATVR7

VBATBB2

VBATBB4

VBATBB5

VBATBB3

VBATBB1

Vibra driver

VBATREGS

V refs Charcon

Charger

Switch

UEME Vchar

protection

Charger

GND

2.8

Jack

2.8

2.8

UEME

VRTC VBU

Back Up

2.8

battery

VR6

2.8

Vin

TK1185

VR7

Audio PA

Vana

Camera
digital supply

UI MODULE

LP2985-1.8

VIO

NUT

(USB IF)

Vcc

33R

VBUS VOUT

Colour LCD

Vcc

Vi/o

Vbat

Vbat

LP3987

2.85V

COWIS

TX/RX

converters

TIK

Clock slicer

I/O

Memory
interface

i/o

VddDi

Core

DPLLs

Periferals

2GBody

ARM9

LEAD3

LEAD3

Voodoo

128Mb NOR Flash

Vcc
Vccq

256Mb NAND

Vcc

Flash

Vccq

64Mb SDRAM

Vccq
Vcc

1.8V

RX

TX

Vbat

LM2608-1.3

DC-DC buck

Vref

1.5V, active

1.3V deep sleep

VTiku

Vpp

12V VPP

gen i/o

+VLCDLED

vfb

VREF01

2.8

-VLCDLED

+VKEYLED

-VKEYLED

KEY LED
Current sink

VREF02

1.35

1.35

GSM RF

converters

VSIM

3.0/1.8V

VFLASH1

2.78V

VIO

1.8V

Vcore

1.8V

VAUX2

2.78V

VANA

2.78V

VAUX1

2.78V

VAUX3

2.78V

IHF

bias

Vdd28

Vdd18

RxAVd

TxAVd

/C

/C

/C

VCHAR

TOMAHAWK (“POP PORT”)

Vcc

SIM

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-7

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Environmental operating conditions

Temperature Conditions:

NMM-3 should operate with full functionality within an ambient temperature range of -

10°C to +60°C, and with reduced functionality between -25°C to -10°C and +55°C to
+75°C.

Humidity and Water Resistance:

Full functionality within humidity range of 5% to 95%.

Condensed or dripping water may cause intermittent malfunctions. Protection against
dripping water has been implemented.

Baseband Functional Description

Modes of Operation

TB4 baseband engine has six different operating modes:

• No supply

• Backup

•Acting Dead

•Active

• Sleep

• Charging

No supply

In NO_SUPPLY mode the phone has no supply voltage. This mode is due to disconnection
of main battery and backup battery or low battery voltage level in both of the batteries.

The phone exits from NO_SUPPLY mode when sufficient battery voltage level is detected.
Battery voltage can rise either by connecting a new battery with VBAT > V

by connecting charger and charging the battery above V

Backup

In BACKUP mode the backup battery has sufficient charge but the main battery can be
disconnected or empty (VBAT < V

and VBACK > 2.0V).

MSTR

MSTR+

.

MSTR+

(2.1V) or

Real Time Clock (VRTC) regulator is disabled in BACKUP mode. VRTC output is supplied
without regulation from backup battery (VBACK). All the other regulators are disabled.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a
state called ”Acting Dead”. To the user the phone acts as if it was switched off. A battery
charging alert is given and/or a battery charging indication on the display is shown to
acknowledge the user that the battery is being charged.

Page 7-8 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

Active

In the active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. There are several sub–states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.

One of the sub–state of the active mode is Bluetooth on state, enabled by UEME. Blu­tooth circuitry is controlled by the MCU and 26MHz reference clock is generated by the

Module TCXO.

In active mode the RF regulators are controlled by SW writing into UEMEs register set­tings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and VR4 –VR7
can be enabled or disabled or forced into low quiescent current mode. VR3 is always
enabled in active mode.

Sleep mode

Sleep mode is entered when the MCU and both DSPs are in stand–by mode. Sleep is con­trolled by the processor. When SLEEPX low signal is detected UEME enters SLEEP mode.
VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All RF reg­ulators are disabled in SLEEP. When SLEEPX=1 goes high, UEME enters ACTIVE mode and
all functions are activated.

Battery

The sleep mode is exited either by the expiration of a sleep clock counter in the UEME or
by some external interrupt, generated by a charger connection, key press, headset con­nection etc.

In sleep mode the 19.2MHz ref clock (VCTCXO) is shut down and 32 kHz sleep clock
oscillator is used as reference clock for the baseband.

Charging

The battery voltage, temperature, size and current are measured by UEME controlled by
the charging software running in TIKU.

The charging control circuitry (CHACON) inside the UEME controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEME switch off when the battery voltage has reached 4.2 V. Charging current is
monitored by measuring the voltage drop across a 220 mOhm resistor R200.

850 mAh Li-ion battery pack BL-5C is used in NMM-3.
Nominal discharge cut–off voltage 3.35V
Nominal battery voltage 3.7V
Nominal charging voltage 4.2V

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-9

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Signal Name Pin Number Function

VBAT 1 Positive battery terminal

BSI 2 Battery capacity measurement (fixed resistor inside the battery pack)

GND 3 Negative/common battery terminal

Battery temperature measurement

In Lynx batteries there are neither BTEMP pin nor NTC resistor. Battery’s temperature is
estimated by the measurement of a discrete NTC resistor in the phone located close to
the battery.

Backup Battery

To preserve the Real Time Clock (RTC), when the main battery is removed, a RTC back-up
capacitor B253 is installed in the phone. This 10uAh solution will give about 3hrs back­up time in worst case.

The backup battery (capacitor) is connected between UEME VBACK and GND. In UEME
backup battery charging high limit is set to 3.2V. The cut–off limit voltage (VBUCoff–) for
backup battery is 2.0V. Backup battery

Charging is controlled by MCU by writing to UEME registers.

Power Up and Reset

Power up and reset is controlled by the UEME ASIC. NMM-3 baseband can be powered
up in following ways:

• Press power button which means grounding the PWRONX pin of the UEME

• Connect the charger to the charger input

• Supply battery voltage to the battery pin

• RTC Alarm, the RTC has been programmed to give an alarm

After receiving one of the above signals, the UEME counts a 20ms delay and then enters
it’s reset mode. The watchdog starts up, and if the battery voltage is greater than V

(2.1V) a 200ms delay is started to allow references etc. to settle. After this delay elapses
the VFLASH1 regulator is enabled. 500us later VR3, VANA, VIO and VCORE are enabled.
Finally the PURX (Power Up Reset) line is held low for 20 ms. this reset, PURX, is fed to
the baseband ASIC TIKU, resets are generated for the MCU and DSPs. During this reset
phase the UEME forces the VCTCXO regulator on regardless of the status of the sleep
control input signal to the UEME.

coff+

Page 7-10 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

U

CCS Technical Documentation 7 - System Module & UI

All baseband regulators are switched on at the UEME power on except SIM and VAUX1,
2, 3 regulators that are controlled by the MCU (VFLASH2 is not used on NMM-3). The
UEME internal watchdogs are running during the UEME reset state, with the longest
watchdog time selected. If the watchdog expires the UEME returns to power off state.
The UEME watchdogs are internally acknowledged at the rising edge of the PURX signal
in order to always give the same watchdog response time to the MCU.

UEME Reset Sequence and Timings

The diagram below shows the timing of the reset sequence on the NMM-3.

POWERONX

EMRSTX

VRAM (SDRAM core)

VTIKU (Tiku core)

VFLASH1

VIO, VR3, VANA,
SMPSCLK

Delay1
20ms

Delay2
200ms

1.3V

Delay3

0.5ms

Delay4
20ms

1.5V

RFCLK

(19.2MHz)

PURX, SLEEPX

A/D Channels

The UEME contains the following A/D converter channels that are used for several mea­surement purpose. The general slow A/D converter is a 10-bit converter using the UEME
interface clock for the conversion. An interrupt will be given at the end of the measure­ment.

The UEME’s 13–channel analog to digital converter is used to monitor charging func­tions, battery functions, voltage levels in external accessory detection inputs, user inter­face and RF functions.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-11

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

The monitored battery functions are:

• Battery voltage (VBATADC),

• Battery type (BSI)

• Battery temperature (BTEMP).

The battery type is recognized through a resistive voltage divider. In phone there is a
100kOhm pull up resistor to VFLASH1 in the BSI line and the battery has a pull down
resistor in the same line. Depending on the battery type the pull down resistor value is
changed. The battery temperature is measured equivalently except that the NTC pull
down resistor used for temperature sensing is on the phone.

The monitored charger functions are:

• Charger Voltage (VCHAR)

• Charger current (ICHAR)

The voltage measured across a 0R22 resistor (R200) in circuit with charger voltage out
from UEME is used to determine ICHAR.

ZOCUS

The HEADINT and HOOKINT are external accessory detection inputs used for monitoring
voltage levels in these inputs. They are routed internally from the miscellaneous.

The monitored RF functions are:

• Power amplifier temperature (GRFTEMP)

• VCXO Temperature (WTx_TEMP)

PATEMP input is used to measure temperature of the TEX and HLGA.

A/D values can be monitored through the ‘ADC Reading’ window in Phoenix.

The ZOCUS device N201 (National LM3819) is a calibrated current sensor, used by energy
management software to determine the current consumption in the mobile phone.

Current is sensed across a “zero-ohm” PWB track resistor (actual trace resistance is

~3.3mΩ) using a high gain and extremely low offset comparator. The measured current

is converted to a pulse width modulation (PWM) signal with the duty cycle representing
both the magnitude and direction of current. The PWM signal is converted to digital data
that can be read by the phone via the CBUS interface.

ZOCUS reads the average current over a period of approximately 1 second.

Page 7-12 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

To determine the functionality of ZOCUS, use Phoenix ADC Reading option to read the
phones Battery average current, the value returned is calculated from values measured
by ZOCUS. Also self-test will prove CBUS connectivity to ZOCUS.

Bluetooth

VBAT

BSI

GND

Current Sense

track resistor

VBAT

UEME

Sense In

ZOCUS

N201

VDD GND

CBUS

D200

The Bluetooth circuit consists of the Bluetooth module (N101), A TCXO (G100) operating
at 26MHz.

The BT202 Bluetooth transceiver module for NMM-3, consists of a RF ASIC, Baseband
ASIC and 4Mbits Flash Memory. It contains UART and PCM user interface. The supply
voltage is VBAT, VFLASH1 and VIO. External reference clock is 26 MHz.

The Bluetooth module is not a repairable part, and so should be replaced if found to be
defective..

56:XTALGND

55:XTAL

54:VCC

53:VCC

52:VCC

51:GND

50:SYSCLK

49:VBB EN

1:GND

2:GND

3:GND

4:GND

5:GND

6:VRE G

7:GND

8:GND

9:GND

10:GND

48:SLEEP X

xxxxxxx

xxxxxxxxxxxxx

47:GND

46:VCC XTAL

45:VDD

44:RESETX

43:GPP2

42:WRX

41:GPP3.

40:GPP4

39:GND

38:GPP0

37:GPP1

36:GPP10

35:GPP11

34:CENX

33:GND

32:VAPPL

31:OSCON

30:GPP9

29:GND

11:G ND

12:ANT

13:GND

14:GND

15:GND

16:REFCLK

17:GND

18:EN26MH Z

19:GND

20:TRST

21:TMS

22:TDO

23:TDI

24:GPP5

25:TCK

26:SPLCLK

27:GPP7

28:GPP6

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-13

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Pin Description:

No.

44 RESETX PURX BB reset input from UEME

50 SYSCLK1 SYSCLK system clock_input / 26MHz from TCXO G100

55 XTAL - internal 13MHz oscillator / Not connected

56 XTALGND GND Select oscillator / Ground

18 EN26MHZ VIO Defines system clock / connected to VIO for 26MHz

16 REFCLK GND Reference clock input / connected to Ground

26 SLPCLK SLEEPCLK Sleep clock input from UEME

49 VBBEN UEMRSTX Internal RF regulators enabled by UEME ResetX

48 SLEEPX SLEEPX Switch to active mode

31 OSCON OSCON Force active mode(=ResetX for Flash)

1-5, 7-11, 13-

15, 17,19,

29,33,

39,47,51

52-54 VCC VBAT_BT Main power supply voltage input from Battery

6 VREG VFLASH1 Regulated power supply voltage input 2.78V from

46 VCCXTAL VCCXTAL Regulated 2.4V supply output for external TCXO G100

Bluetooth
Name

GND GND Ground reference

NMM-3 Name Function / Destination

VFLASH1, used for RF and BB parts.

45 VDD GPP3 Regulated 1.8V supply for internal BB and Memory

Blocks

32 VAPPL VIO 1.8V supply for application interfacing

12 ANT ANT Antenna pin

38 GPP0 LPRFSYNC General purpose port / Data Bus

37 GPP1 LPRFINT Interrupt to TIKU to initilise BT operation.

43 GPP2 GND General purpose port connected to Ground

41 GPP3 VDD General purpose port supply for internal BB and Mem-

ory Blocks

40 GPP4 - General purpose port / No Connection

24 GPP5 GND General purpose port connected to Ground

28 GPP6 LPRFRX General purpose port / Data Bus

27 GPP7 LPRFTX General purpose port / Data Bus

30 GPP9 - General purpose port / No Connection

36 GPP10 CBUSCLK General purpose port used for control and flash pro-

gramming

35 GPP11 CBUSDA General purpose port used for control and flash pro-

gramming

34 CENX CBUSENX CBUS enable / No Connection

20 TRST - JTAG test reset / No Connection

21 TMS - JTAG test mode / No Connection

Page 7-14 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

Camera

No.

22 TDO - JTAG test output / No Connection

23 TDI - JTAG data input / No Connection

25 TCK - JTAG clock / No Connection

42 WRX - Write enable / No Connection

Bluetooth
Name

NMM-3 Name Function / Destination

A 14-way connector connects the camera and shield housing attached is on B-side of
the engine. This uses the differential camera interface on TIKU.

1.8V Supply: UEME VCORE programmed to 1.8V at start-up.

Camera 2.7V supply:

LP3985-2.8 discrete regulator N102 controlled by GPIO7 is used for analogue supply.
Output 1 = ON.

Both camera supplies are enabled /disabled as the camera activity is required.

The camera switch is a discrete button connected to TIKU GPIO6.

The Camera / TIKU interface comprises of two synchronous serial Buses:

• IIC Bus for control

• Fast differential Camera Interface for image data out

Camera

No.

Name

1 GND1 GND GPIO7 TIKU Ground line corresponding to VDDI

2 SDA CAMSDA GENIO26 TIKU Serial data line of IIC bus

3 D+ CIFDAP CIFDaP TIKU Fast serial data out

4 SCL CAMSCI GENIO25 TIKU Serial clock line of IIC bus

5 D- CIFDAN CIFDaN TIKU Fast serial data out of which phase is inverted to D+

6 Extclk CAMCLK GENIO24 TIKU System clock from engine to the camera

7 VDDI VCORE VCORE UEME 1.8V Supply voltage to a camera module (for digital)

8 GND3 GND GND Ground line corresponding to Extclk.

9 CLK + CIFCLKP CIFClkP TIKU Fast serial clock

NMM-3
Name

NMM-3 Destination Function

module.

10 Vctrl CAMVCTRLGENIO27 TIKU This signal is used for activating the camera

module When Vctrl is turned “High”, the
camera module enters the operation mode.
When Vctrl is turned “Low”, the camera
module enters the power off mode.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-15

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Camera

No.

Name

11 CLK - CIFCLKN CIFClkN TIKU Fast serial data out which is inverted to Clk+

12 VDD VCAM VOUT N102 Reg 2.8V Analog supply Voltage

13,14 GND2 GND GND Ground line corresponding to VDD

NMM-3
Name

NMM-3 Destination Function

UI Module

The UI Module comprises of:

•LCD Display

• Display and Keypad Backlight LED’s

• Light Guide

•Key Domes

• Engine Shielding

Display

NMM-3 uses a Sharp active matrix LCD (Liquid Crystal Display) module. The module is
comprised of a glass panel, driving IC’s, a backlight system with three white LED’s (Light­Emitting Diode’s), and a metal frame. The display panel performs RGB with 132 × 162
dot resolution.

For details on signal connections, see ‘UI Module Pin Description’ table below.

Backlighting

NMM-3 UI module has 2 sets of LEDs:

To enable flexibility in driver solution, the engine/UI interface has been arranged with
the power supplies separate. i.e. paired supplies +VLCDLED,-VLCDLED, and +KEYLED, ­KEYLED

Power is supplied by a Toko LED driver.

In block form the LED driver arrangement is shown below.

The TOKO boost supply switches at 600kHz 18V max. LCDLED current set by 22R resistor
across the TOKO 0.5V reference voltage

The constant current sink used for the KeyLEDs is used for tight current control but
allowing the widest possible VF (Forward Voltage) tolerance for the KEYLEDs.

• 3off LCD LEDS: Nichia NSCW215T WHITE. Wired in series. Required cur­rent = 22mA.

• 4off KEY LEDS: Citizen CL270B blue Wired in two series chains of 2. Cur­rent ~ 8.5mA.

Page 7-16 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

DLIGHTPWM

VFLASH1

VBAT

TOKO 350mA pk

boost circuit.

Switching

freq=600kHz

10.5V nom

0.5V

33R

22R

+KEYLED

+LCDLED

-LCDLED

10mA max

15mA

22mA

White
LCD
LEDS

Blue
KEY
LEDS

KLIGHTPWM

constant current sink

(8.5mA)

1.9V
220R

3.5V

-KEYLED

ENGINE

MODULE

UI

MODULE

LED brightness is controlled by a PLUM to DLIGHT and KLIGHT enable. In order to improve
the LED’s lifetime, the brightness is reduced at high levels of ambient temperature.

UI Module Pin Description:

UI Connector LCD Connector Function

PIN Name PIN Name

1 VFLASH1 10 VFLASH1 Power supply for analog display circuits (2.8V)

2 - 9 PSD Not Connected

3 -VLCDLED 1 VLED- LCD LED power supply (cathode)

4 +VLCDLED 2 VLED+ LCD LED power supply (anode)

5 VIO 3 VDDI Power supply for digital display circuits (1.8V)

6 DIFD7 4 D7 Display Bi-directional Bus (MSB)

7 COL0 Keypad Column

8 ROW5 Keypad Row

9 GND Ground

10 GND Ground

11 COL1 Keypad Column

12 DIFD6 5 D6 Display Bi-directional Bus

13 DIFD5 6 D5 Display Bi-directional Bus

14 DIFD4 7 D4 Display Bi-directional Bus

15 DIFD3 8 D3 Display Bi-directional Bus

16 +VLCDLED Key Backlighting +Ve

17 EARN Earpiece -Ve

18 EARP Earpiece +Ve

19 -VLCDLED Key Backlighting –Ve

20 DIFD2 13 D2 Display Bi-directional Bus

21 DIFD1 14 D1 Display Bi-directional Bus

22 DIFD0 15 D0 Display Bi-directional Bus (LSB)

23 DIFA0 16 A0 Command (A0 = low) or parameter (A0 = high)

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-17

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

UI Connector LCD Connector Function

PIN Name PIN Name

24 COL2 Keypad Column

25 ROW4 Keypad Row

26 ROW3 Keypad Row

27 GND 11 GND Ground

28 GND 12 GND Ground

29 ROW2 Keypad Row

30 ROW1 Keypad Row

31 ROW0 Keypad Row

32 COL3 Keypad Column

33 DIFRDX 17 RDX Memory read enable (active low)

34 DIFWRX 18 WRX Memory write enable (active low)

35 LCDRSTX 20 RESX Reset (active low)

36 GND 19 GND Ground

IR Module

As there are no level shifters in UEME, a 1.8V logic interface 1M IR. compliant module
from Citizen: CIM-93M5 is used. It is a shielded package to reduced EMC susceptibility
to GSM/WCDMA emissions.

The IR link supports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 1m. Trans­mission over the IR is half–duplex.

The length of the transmitted IR pulse depends on the speed of the transmission.

At speeds of 115.2 kbit/s or less (SIR), pulse lengths are kept close to the minimum of

1.41us specified by IrDA in order to keep current consumption to a minimum. If trans­mission speed is set to 1.152Mbit/s (MIR) the pulse length is approximately150ns. Signal
rates of 0.576Mbits/s and greater than 1.152 MBit/s are not supported by NMM-3.

IR Module Pin Description:

PIN Name Function Active

1 LEDA LED Anode -

2 LEDC LED Cathode: No connection -

3 TXD Transmitter Data Input High

4 RXD Received Data Output Low

5 SD Shut Down High

6 Vcc Supply Voltage (VFLASH1) -

7 Vlogic Digital Supply Defining I/O Voltage (VIO) -

8 GND Ground -

Shield EMI Shield (Ground)

Page 7-18 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

SIM Interface

NMM-3’s SIM interface uses the standard DCT4 interface, provided by TIKU and UEME.
This complies with international standard specifications.

The SIM interface signals are protected by SIM EMC/ESD ASIP (R407).

UEME contains the SIM interface logic level shifting. SIM interface can be programmed
to support 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEME. It
is only allowed to change the SIM supply voltage when the SIM IF is powered down. The
SIM power up/down sequence is generated in the UEME. This means that the UEME gen­erates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEME. The
card detection is taken from the BSI signal, which detects the removal of the battery. The
monitoring of the BSI signal is done by a comparator within UEME. The comparator off­set is such that the comparator output does not alter state as long as the battery is con­nected. The threshold voltage is calculated from the battery size

specification. The SIM interface is powered up when the SIMCardDet signal indicates
‘card in’. This signal is derived from the BSI signal.

Parameter Min Typ Max Unit

SIMCARDET, BSI comparator threshold 1.94 2.1 2.26 V

SIMCARDET, BSI comparator hysteresis 50 75 100 mV

The whole SIM interface locates in TIKU and UEME. The SIM interface in the UEME con­tains power up/down, port gating, card detect, data receiving, ATR–counter, registers and
level shifting buffers logic. The SIM interface is the electrical interface between the Sub­scriber Identity Module Card (SIM Card) and mobile phone (via UEME device).

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-19

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

External Accessory Interface

Pop-Port System Connector

Because of NMM-3’s shape, there is one deviation from the Tomahawk (pop-Port)
mechanical interface that affects an in-car holder solution: The charger jack will be
mounted remotely from the system connector.

The charger pin on the Pop-Port interface is not connected. This prevents a possible con­nection between charging accessories, and chargers connected into a separate DC charg­ing jack. Pop-Port chargers are not supported.

Pin No / Signal

Name

1. Charge V Charge DC 0-9V / 0.85A Not connected on NMM-3

2. GND Charge GND - 0.85A

3. ACI ACI 1 kbit/s Digital 0 / 2.5V – 2.78V Accessory insertion and

4. Vout DC out DC 2.78V 70mA

5. USB Vbus DC in DC 4.375V – 5.25V

6. USB D+ / FBUS Rx USB 12M USB 0V – 3.3V FBUS not connected on Mango

7. USB D- / FBUS Tx USB 12M USB 0V – 3.3V FBUS not connected on Mango

8. USB data GND Data GND -

9. XMIC N Audio in 300 – 8k 1 Vpp & 2.5V – 2.78V DC

10. XMIC P Audio in 300 – 8k 1 Vpp & 2.5V – 2.78V DC

11. HSEAR N Audio out 20 – 20k 1 Vpp

12. HSEAR P Audio out 20 – 20k 1 Vpp

13 HSEAR R N Audio out 20 – 20k 1 Vpp

14. HSEAR R P Audio out 20 – 20k 1 Vpp

Signal

Description

Spectral

Range

Voltage / Current Levels Notes

removal detect

70mA

2.50V 90mA

Page 7-20 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

A B

Charger connector

Pin No / Signal

Name

Signal

Description

Spectral

Range

Voltage /

Current Levels

A. GND Charge GND - 0.85A

B. Charge V Charge DC 0-9V / 0.85A Inner pin

Charger interface.

NMM-3 conforms to the global Nokia Charger Interface

ACI

The ACI (Accessory Control Interface) is a point-to-point, bi-directional serial bus. It has
two main features:

• The insertion and removal detection of an accessory device.

• Acting as a data bus between phone and accessory, Intended for control pur­poses.

A third function of ACI is to identify and authenticate the accessory.

Accessory power is supplied by VAUX2, a linear low dropout regulator in UEME providing

2.78V at 70mA maximum when active (0.5mA in sleep).

Notes

ACI data passes to and from UEME via the HEADINT line. UEME level shifts the data and
connects HEADINT to MBUS for TIKU to access.

USB interface

ARM92

TIKU

D300

W2FC

core

USBSEMODE

USBPUEN
USBSUSPEND

USBVP/FRX
USBVM

USBRCV
USBV0
USBFSE0

USBOEX

VIO

NUT

N401

VBUS

VPU

D-

D+

33R

USB ASIP

R409

33R

33R

1k5

Tomahawk

Connector

VBUS

D-

D+

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-21

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

The Nokia USB device solution is supported using the Wireless 2 Function Controller
(W2FC) core block in the TIKU ASIC. The core completes several USB functions automati­cally and is controlled by the ARM9 MCU.

NUT (D300)provides the interface between the ASIC's 1.8 V bus and the 3.3 V USB data
bus.

Nokia USB Transceiver (NUT) is fully compliant with the Universal Serial Bus Specifica­tion Rev. 1.1.

NUT is able to transmit and receive serial data at both full-speed. In NMM-3, its low­speed (1.5 Mbit/s) capability is only used in SE (single ended) mode in production loop­back test. FBUS is not supported on NMM-3

External Audio

The NMM-3 is designed to support fully differential external accessories connecting via
the Pop-Port system connector. Features supported are:

• 4-Wire fully differential stereo audio output.

• 2-Wire differential mic input.

• ACI for detection and data interface.

External Microphone Connection

The external microphone input is fully differential lines are connected to UEME micro­phone inputs MIC2N and MIC2P. The UEME (MICB2) provides the bias voltage. Micro­phone input lines are ESD protected.

A short circuit between the headset microphone signals generates a HOOKINT signal.
When the accessory is not connected, a pull-up resistor internal to UEME holds the
HOOKINT line to VFLASH1 (2.8V). When the accessory is connected the voltage on

HOOKINT drops to 1.8V due to the bias current flowing through the 1KΩ ASIP resistors

R415. When the button is pressed the microphone signals are connected together, and
the HOOKINT input will get half of the mic bias DC value 1.1V. This change in the DC
level will cause the HOOKINT comparator to change state, in this case from 0 to 1. The
button can be used for answering in coming calls, but not to initiate outgoing calls.

Page 7-22 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

R

CCS Technical Documentation 7 - System Module & UI

External Microphone connection:

HOOKINT
MICB2

UEME

D200

MIC2P
MIC2N

R415

EMC / ESD
Components

XMICP
XMICN

System
Connector
Pop-Port

External Earphone Connections

The external earphone output has stereo fully differential lines are connected to UEME
HF outputs HF, HFCM, HFR and HFCMR.

The external audio is processed by the Audio Receive Path in UEME, and controlled by
TIKU. UEME performs the following functions:

• Digital to analog conversion of EAR DATA, and low pass filtering (common to all
Rx audio)

• Programmable attenuating stage

• Stereo HF and HFCM drivers

External Earphone connections:

HFCM
HF

UEME

D200

HFCMR
HFR

EMC / ESD
Components

XEARN

XEARP

XEARN

XEARP

System Connector
Pop-Port

Internal Audio

IHF Speaker

The Integrated Hands Free Speaker is used to generate speech audio, alerting and warn­ing tones. The speaker capsule is mounted in the C-cover. Spring contacts are used to
connect the IHF speaker to the Engine PWB. The IHF speaker is driven directly from UEME
that incorporates the audio power amplifier and a programmable attenuation stage.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-23

Company Confidential

NMM-3 Company Confidential

N

7 - System Module & UI CCS Technical Documentation

IHF speaker connections:

UEME

Internal Microphone

The internal microphone capsule is mounted in the C-cover. The microphone is omni
directional and is connected to UEME microphone inputs MIC1P and MIC1N. The micro­phone input is asymmetric and the UEME (MICB1) provides a bias voltage. The audio
transmit path functional blocks included in UEME are:

• Microphone input stage

• Programmable gain stage

• Anti-aliasing lowpass filter

D200

PAOUTP

PAOUTN

• Analog to digital converter

Spring contacts are used to connect the microphone to the engine PWB.

Internal Microphone connection:

MICB1

UEME

D200

MIC1P

MIC1

Internal Speaker

The internal earpiece is a dynamic earpiece with an impedance of 32Ω. The earpiece is

fitted to the UI module. The earpiece is driven directly by UEME. UEME includes the same
functional blocks as the external earphone, but with a separate earpiece driver. The ear­piece output from UEME is ESD protected.

Page 7-24 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

N

CCS Technical Documentation 7 - System Module & UI

UEME

Memory Block

PDRAM

The PDRAM block is the internal memory system for TIKU. It contains the following sub­blocks:

• Boot ROM, containing MCU program code. The boot ROM size is 4k bytes (1k x

32).

• 256 Kbytes of x32 RAM (organized as 4 banks of 16k x 32) for the Cellular DSP
code.

UI Module

D200

EARP

EAR

• 256 Kbytes of x32 RAM (organized as 3 banks of 16k x 32 and 2 banks of 8k x 32)
for Application DSP code and data, all performance critical code is located here.

• One 4Kbytes (organized as 2k x 16) dual-port RAM, accessible by both Applica­tion DSP and Cellular DSP.

External Flash Memory

NMM-3 uses conventional 128Mb “NOR” Flash for the program data and storage of
PMM calibration data, and a 256Mb “NAND” flash for the user data storage (pictures,
music, voice clips, etc).

Program Flash:
4341433 Samsung 128Mb Flash D451

User Flash
434xxxx Samsung 256Mb NAND Flash D450

External SDRAM

4341341 Samsung 64Mb SDRAM is used in NMM-3.

The SDRAM core supply is provided by regulator N450 and is the LP3987-2.85.

SDRAM core control in NMM-3 is as follows:

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-25

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Pin Control System control

enable 1=On UEMRSTX enabled at UEME delay0

0=0ff

mode 1=ON SLEEPX Rises when PURX=1, then under deep sleep control.

NMM-3 Test interfaces

The following interfaces available:

• 9 way test access pads including Fbus, flashing, DAI if needed (Mbus pin) and STI.

• 3-way battery interface repeated under the battery used for production test.

• Service software will use Phoenix SW via USB on Pop-Port connector or FBUS via
the FLA-45 service battery or JBV-1 docking station.

Baseband General Specification

Absolute Maximum Ratings

Signal Limit

Battery Voltage (Idle) -0.3 - +5.5V

Battery Voltage (Call) 4.8V MAX

Charger Input Voltage -0.3V - +16V

DC Characteristics

Regulators and Supply Voltage Ranges

Battery Voltage Range

Signal Min Nom Max

VBAT 3.1V 3.7V 4.2V (Charging high limit target voltage)

BB Regulators

Signal Min Nom Max Output Current

VANA 2.70V 2.78V 2.86V I

VFLASH1 2.70V 2.78V 2.86V I

VAUX2 2.70V 2.78V 2.86V I

VSIM 1.745V

2.91V

VIO 1.72V 1.8V 1.88V I

VCORE 1.71V 1.8V 1.89V I

1.8V

3.0V

1.855V

3.09V

max

max

I

sleep

max

I

sleep

I

max

I

sleep

max

I

sleep

max

= 80mA

= 70mA
= 1.5mA

= 70mA
= 0.5mA

= 25mA
= 0.5mA

= 150mA
= 0.5mA

= 200mA

Page 7-26 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

RF Regulators

Signal Min Nom Max Output Current

VR1A / VR1B 4.60V 4.75V 4.90V I

VR2 2.70V

2.61V

VR3 2.70V 2.78V 2.86V I

VR4 2.70V 2.78V 2.86V I

VR5 2.70V 2.78V 2.86V I

VR6 2.70V 2.78V 2.86V I

VR7 2.70V 2.78V 2.86V I

2.78V

2.78V

2.86V

2.95V

max

I

max

max

max

I

sleep

max

I

sleep

max

I

sleep

max

= 10mA

= 100mA

= 20Ma

= 50mA
= 0.1mA

= 50mA
= 0.1mA

= 50mA
= 0.1mA

= 45mA

Current Sources

Signal Min Nom Max Note

IPA1 and IPA2 0 – 5mA Programmable, +/-6% V

V

= 0V – 2.7V

IPA2

IPA3 and IPA4 95µA 100µA 105µA V

IPA3

/ V

= 0V – 2.7V

IPA4

IPA1

/

RF Module Description

Introduction

This document describes the RF module of the dual system WCDMA, GSM (EGSM900,
GSM1800) engine for N-MM3. Electrical specifications, functional descriptions and block
diagrams are included. The WCDMA RF is supporting 3GPP rel 99 and GSM RF is support­ing GPRS and HSCSD classes 1 to 6.

DC characteristics

Regulators

The RF regulators are found in UEME in the baseband section of the phone. There are six

2.78 V regulators VR2-VR7 and two 4.8V regulators VR1A and VR1B. There is also a

1.35V regulator VrefRF01 which is used as the reference voltage for the RF ICs. Regula­tors EXT.Reg1 and EXT.Reg2 are external to UEME and are used in the WCDMA Tx sec­tion.

Table 1: Voltage supplies and references

Signal name From To Function

VBAT Battery GSM/WCDMA PA SMPS

& UEME

VR1A UEME REX & HELGO VCO control charge pump.

VR1B UEME TEX VCO control charge pump.

Battery supplies.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-27

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Table 1: Voltage supplies and references

Signal name From To Function

VR2 UEME TEX, HELGO WCDMA: TEX supply voltage

GSM: VRF_TX.

VR3 UEME VCTCXO, HELGO VCTCXO.

GSM: VDIG. RFCLK buffer

VR4 UEME REX, HELGO WCDMA: REX LNA, demod, biasing, local buffer.

GSM: VRF_RX, VF_RX, VBB

VR5 UEME REX, HELGO WCDMA: REX BB gain, filter, AGC, VLO, synthe-

sizer.
GSM: VLO, VPRE

VR6 UEME RX VCO WCDMA: RX VCO

VR7 UEME GSM VCO GSM: VCO

VrefRF01 UEME REX, HELGO, TEX, HEX Voltage Reference for RF ICs 1.15% accuracy.

EXT. Reg 1

EXT. Reg 2

1st discrete

2nd discrete

TX VCO WCDMA: TX VCO

WCDMA TX WCDMA: Supply voltage for HEX, PA Vreg, power

detector

VCTCXO

WCDMA
RX VCO

GSM VCO

UEME

TEX

HEX

REX

VR1A

VR1B

VR2

VR3

VR4

VR5

VR6

EXT REG 2

HEX

WCDMA p wr
det

VBAT

EXT REG 1

WCDMA TX
VCO

GSM PA

PA
SMPS

WCDMA PA

HELGO

VR7

VrefRF
01

WCDMA PA

Figure 1: Voltage supplies for RF

Page 7-28 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

RF-BB Interface

Table 2: Binary signals

Signal name From To Function

RFBusEn1X TIKU RF (REX, TEX, HELGO) Data enable for RF-IC

RFBusDa TIKU RF (REX, TEX, HELGO) Data for PLL and RX AGC

RFBusClk TIKU RF (REX, TEX, HELGO) Clock

RXA1/GenIO 9 TIKU REX WCDMA RX AGC one step tuning

RXA2/GenIO 10 TIKU REX WCDMA RX AGC one step tuning

TXP/GenIO 2 TIKU HELGO GSM transmitter power amplifier enable

REXRstX/GenIO 7 TIKU REX REX reset

TEXRstX/GenIO 1 TIKU TEX TEX reset

HelgoRstX/GenIO 5 TIKU HELGO HELGO reset

TXVCOpwr/GenIO 0 TIKU ExtReg1 WCDMA TX VCO enable

HEXPD/GenIO 8 TIKU HEX HEX power down

TXpwr/GenIO 13 TIKU ExtReg2 WCDMA TX pwr enable

PApwr/GenIO 15 TIKU WCDMA RF PA SMPS WCDMA PA SMPS enable

Table 3: Analog signals

Signal name From To Function

RFCLK HELGO TIKU Reference clock to Baseband

AFC UEME VCTCXO Frequency control signal to VCTCXO

WRXIP/M REX TIKU Differential RX base band signals for main receiver I branch.

WRXQP/M REX TIKU Differential RX base band signals for main receiver Q branch.

TXIP/M TIKU TEX TX I/Q signals to the modulator

TXQP/M TIKU TEX TX I/Q signals to the modulator

GRXI/GRXQ HELGO UEME RX base band signal

TxPwrDet WCDMA_RF UEME TX power envelope detector

TXA1 TIKU TEX TEX AGC control

TXA2 TIKU HEX PA driver AGC control

IPA1 UEM WCDMA_PA PA bias control

Iref1 TEX TIKU Reference current for AD converters

Iref2 TEX TIKU "

CALOUT REX TIKU WCDMA BB filter calibration

VREFCAL TEX TIKU WCDMA BB filter calibration (ref. Voltage)

WTxTemp TEX UEME TEX temp.

VREFL REX TIKU Reference voltage for AD converters

VREFM REX TIKU "

VREFH REX TIKU "

GRFTemp HELGO UEM GSM temp.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-29

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

Table 3: Analog signals

Signal name From To Function

TXC UEME HELGO,

WCDMA PA
SMPS

RF block diagram

General

The GSM and WCDMA RF engines are based on direct conversion architecture.

GSM TX/RX design is based around the HELGO RF ASIC.

The WCDMA RX design is based around the REX ASIC. The WCDMA TX design uses TEX
ASIC as the modulator and the 1st AGC stage with HEX ASIC as the driver amplifier

nd

including the 2

AGC stage.

REX

GSM transmitter power control,
WCDMA PA SMPS converter control

DEMOD

RXIQ

Synthesizer

RFBus

VBAT

SMPS

TEX

HEX

Synthesizer

Antenna.
switch
module

LNA input s

VCO

MOD

VCO

HELGO

MUX

MUX

Demod

Synthesizer

Modulator

GTXIQ

VCTCXO

VCO

TxPwrDet

IPA1

TXIQ

AFC

RFClk

GRXIQ

Page 7-30 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

Description of the RF Related Converters

UEME:

• The single ended GSM RXIQ signals from HELGO are routed to the 12 bit AD con­verters in UEME Figure 2. VREFRF02 is a reference voltage for the converters.

• GRF_temp is using channel 6 and WTX_temp channel 4 of the 11 channel AD
converter. GRF_temp is used for GSM temperature compensation and WTX_temp
for WCDMA TX gain temp. compensation (TX power control algorithm) and RX
AGC gain temp. compensation (RX AGC algorithm).

• 10 bit AuxDAC is used for GSM power control (TXC) and controlling the WCDMA
PA SMPS.

• AFC voltage is coming from an 11bit DAC.

• IPA1 (4 bit DAC) is sourcing the bias current (tuned in production) of the WCDMA
PA.

• VREFRF01 is the reference voltage for the RF ASICs.

TIKU:

• The differential current mode TXIQ signals are coming from TIKU. The resolution
of the DACs are in GSM mode 8 bits and in WCDMA 10 bits. GSM TXIQ signals are
routed from TEX to HELGO. The reference current (32 uA) of the converters is
Iref1 from TEX.

• 10 bits AuxDAC1 and AuxDAC2 are controlling the AGC stages in TEX and HEX.
The tuning ranges are 0…1024uA. Iref1 is the reference current for AuxDAC1 and
Iref2 for AuxDAC2. TEX is sourcing both reference currents Iref1 and Iref2. Iref1 is
based on TEX internal resistor and Iref2 external resistor.

• 6 bit AD converters are used for differential WCDMA RXIQ signals. The reference
current for the converters is Iref2. The reference voltages (VrefL/M/H) come from
REX.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-31

Company Confidential

NMM-3 Company Confidential

A

A

A

A

A

A

A

A

7 - System Module & UI CCS Technical Documentation

UEME

11 bit
DAC

IPA1
4 bit
DAC

HELGO

IQ modulator

BB AGC

WCDMA PA SMPS

RXIQ

TXC

GRF_temp

WTX_Temp

VREFRF02

11 channel

DC

12 bit

DC

12 bit

DC

10 bit
DAC

VREFRF01

HEX

IQ modulator

VCTCXO

FC WCDMA PA bias

TEX

TIKU

10/8 bit
DAC

10/8 bit
DAC

10 bit

uxDAC1

10 bit

uxDAC2

MUX

Iref1

REX

32 uA

I/U

TXIQ

I/U

Iref2

32 uA

6 bit

DC

RXIQ

LNA

IQ

BB filter BB AGC

Vref

VrefL

VrefM

VrefH

6 bit

DC

Figure 2: RF related converters

Page 7-32 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

GSM RF

GSM RF Characteristics

Table 4: GSM900 / GSM1800 System Characteristics

Item Value (GSM900 / GSM1800)

Receive frequency range 925…960 MHz / 1805…1880 MHz

Transmit frequency range 880…915 MHz / 1710…1785 MHz

Duplex spacing 45 MHz / 95 MHz

Channel spacing 200 kHz

Number of RF channels 174 / 374

Power class 4 (2 W) / 1 (1 W)

Number of power levels 15 / 16

Table 5: Transmitter Characteristics

Item Value (GSM900 / GSM1800)

Type Direct conversion, nonlinear, FDMA/TDMA

VCO frequency range 3520…3660 MHz / 3420…3570 MHz

Output power 2 W / 1 W peak

Gain control range Min. 30 dB

Maximum phase error (RMS/peak) Max 5 deg. / 20 deg. peak

Table 6: Receiver characteristics

Item Value (GSM900 / GSM1800)

Type Direct conversion, linear, FDMA/TDMA

VCO frequency range 3700…3840 MHz / 3610…3760 MHz

Typical 3 dB bandwidth +/- 101 kHz

Sensitivity Min. –102 dBm (GSM1800 norm. cond. Only)

Total typical receiver voltage gain (from
antenna to RX ADC)

Receiver output level (RF level –95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs

86 dB

Typical AGC dynamic range 84 dB

Typical AGC step in LNA 30 dB

Usable input dynamic range -102…-10 dBm

Compensated gain variation in receiving band +/- 1.0 dB

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-33

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

GSM functional descriptions

RF block diagram

The figure below shows the block diagram of the dual band GSM900/1800 section of the
transceiver. It is based around the HELGO RFIC which is a direct conversion modulator/
demodulator. The main off chip ICs shown are power amplifier module, antenna switch,
TX /RX VCO-module TX SAW filter and VCTCXO.

HELGO

Figure 3: GSM RF block diagram

Page 7-34 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

GSM Frequency Synthesizer

The PLL is located in HELGO and is controlled via serial RFBus. There is a 64/65 (P/P+1)
prescaler, N- and A-divider, reference divider, phase detector and charge pump for the
external loop filter. The LO signal, generated by the VCO is fed through a 180deg bal­anced phase shifter to the prescaler. The prescaler is a dual modulus divider. Its output
is fed to N- and A-divider, which produce the input to the phase detector. The phase
detector compares this signal to reference signal f_ref=400kHz. The output of the phase
detector is fed into the charge pump, which charges or discharges the integrator capaci­tor in the loop filter depending on the phase difference between the measured frequency
f_out/M and reference frequency f_ref.

The loop filter filters out comparison pulses from the phase detector and generates a DC
control voltage for the VCO. The loop filter defines the step response of the PLL (settling
time) and controls its stability . The loop filter includes a resistor for phase compensation
and components for sideband rejection. The dividers are controlled via the RF serial bus.
RFBusDa is for data, RFBusClk is the serial clock and RFBusEn1X is a latch enable, which
stores new data into the dividers.

The LO signal generated by the VCO module is twice the GSM1800 RF frequency and four
times the GSM900 frequency . The LO signal is divided by two or four in HELGO depend­ing on frequency band.

R

f_ref

f_out/M

PHASE
DET.

CHARGE
PUMP

Kd LP K

19.2 MHz frequency reference
AFC-controlled VCTCXO

f_out

VCO

VCO

M

M=A(P+1) + (N-A)P
= NP+A

Figure 4: Phase locked loop, PLL

GSM transmitter

The transmitter chain consists of two final frequency IQ-modulators for upper and lower
GSM bands, dual-band power amplifier, ASM (Antenna Switch module) and a power con­trol loop.

I- and Q-signals are generated by the baseband part of the engine module in Tiku. These
signals first go to TEX where the post filtering is done. After this filtering the signals go

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-35

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

into IQ-modulator in HELGO. The LO-signal for the modulator is generated by a VCO
which is divided by 4 for the GSM900 band and 2 for the GSM1800 band.

In the GSM900 branch there is a SAW filter before the PA to attenuate unwanted signals
and wide-band noise from the HELGO IC. The GSM1800 band uses a balun to convert the
differential modulator signal output to single ended.

The final amplification is realized with a dual band power amplifier. It has two different
power chains one for each band. The PA is able to produce over 2 W (0 dBm input level)
in EGSM band and over 1 W (0 dBm input level) in upper-band band into a 50 ohm out­put . The gain control range is over 55 dB to get the desired power levels and meet the
ramping profile.

Harmonics generated by the nonlinear PA are filtered out internally within the antenna
switch module.

The power control circuitry consists of discrete power detector (common for lower and
upper-band) and error amplifier in HELGO. There is also a directional coupler connected
between PA output and antenna switch. It is a dual-band type and has input and out­puts for both systems. The directional coupler takes a sample from the forward going
power on the coupled port. The signal is then rectified in a schottky-diode and a DC-sig­nal produced after filtering.

The possibility to improve efficiency at low power levels has been specified in the power
amplifier module. The improved efficiency will take place on power level 7 and lower in
the GSM900 band only. For this option there is control input line to the PA module.

Power control

The detected voltage is compared in a error-amplifier in HELGO to the TXC- voltage,
which is generated in baseband by UEME. TXC is a rising cosine pulse shaped burst
which gives the wanted shape to the TX signal. Its level is dependant on the required
output power. Because the dynamic range of the detector is not wide enough to control
the power (actually RF output voltage) there is a control named TXP to work under
detected levels. When TXP is enabled the burst is set to rise until the output level is high
enough so the feedback loop works. The output from the error amplifier controls the gain
of the PA so the desired power level can be set. An RC network is used to prevent the
feedback loop becoming unstable . The pole decreases gain at the higher frequencies and
filters noise coming from TXC line. The TXP signal also enables the antenna switch mod­ule to TX mode.

Page 7-36 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

TX_OUT

TX_OUT

TXP

DIR COUPLER

DETECTOR

K

det

3k3

K

cp

R2 Ctemp

4k7

K = -R1/R2

2n

EGSM900 PA

GSM1800 PA

1p8

R1

22K

-

K

GSM_PA

K

DOMINANT

DCS_PA

POLE

TX_IN

TX_IN

68N 68N

33R

33R

TXP

10pF

GSM receiver

The GSM receiver is a direct conversion, dualband linear receiver. From the antenna the
received RF-signal is first fed to the ASM. Inside the module there is a diplexer which
divides the signal into two separate paths. The lower path is for GSM900 and the upper
for GSM1800. In each of the paths a pin-diode switch is used to select either receive or
transmit mode. The selections are controlled by HELGO, which obtains the mode/band
and timing information through RFBus. After the switch the received signal goes
through a bandpass filter also included in the ASM. The signal is then fed to the inte­grated LNAs within HELGO.

3k3

+

10pF

ERROR
AMPLIFIER

-

+

Figure 5: GSM power control loop

TXC

The LNAs have three gain levels. The first level is for maximum gain, the second is about
30dB below the maximum, and the third is the off state about 50dB below maximum.
The gain selection is controlled via RFBus.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-37

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

After the pregain stages there are demodulator mixers at each signal path to convert the
RF signal directly down to baseband I- and Q-signals. Local oscillator signals for the
mixers are generated by an external VCO the frequency of which is divided by two in
GSM1800 and by four in GSM900. The frequency dividers are integrated in HELGO and
in addition to division they also provide accurate phase shifting by 90 degrees which is
needed for the demodulator mixers.

DtoS (differential to single ended) amplifiers are then used to combine the signals from
the three demodulators to a single common path so that from the output of the demod­ulators to the baseband interface there are only two signal paths (I and Q) to both fre­quency bands. The DtoS amplifiers also performs the first part of the channel filtering
and AGC (automatic gain control). They have two gain stages, the first one with a con­stant gain of 12 dB and 85 kHz -3 dB bandwidth and the second one with a switchable
gain of 6 dB and -4 dB. The filters in the DtoS blocks are active RC filters. The rest of the
analog channel filtering is provided by blocks called BIQUAD, which include modified
Sallen-Key biquad filters.

The channel filters need large off-chip capacitors. They are needed because the direct
conversion receiver requires long RC time constants in the channel filters to be able to
operate properly.

Integrated resistors and capacitors of the channel filters are adjustable by a digital con­trol word. The correct control words that compensate for the process variations of inte­grated resistors and capacitors and for the tolerance of the off- chip capacitors is found
by a calibration circuit inside HELGO which is tuned in production.

After the DtoS and BIQUAD blocks there is another AGC-amplifier, which provides a gain
control range of 42 dB in 6 dB steps. The correlation between the gain steps and the
absolute received power levels is found by a calibration routine in production.

In addition to the AGC steps, the last AGC stage also performs the real time DC offset
compensation, which is needed in a direct conversion receiver to cancel out the effect of
the demodulators local oscillator leakage. DC offset compensation is performed during
an operation called DCN. DCN is carried out by charging integrated capacitors in the last
AGC stages to a voltage which cause a zero DC offset

After the last AGC and DC offset compensation stages the single ended and filtered I­and Q-signals are finally fed to the RX ADCs. The maximum peak-to-peak voltage swing
for the ADCs is 1.45 V.

AGC strategy

The AGC-amplifier is used to maintain the voltage swing at the RF-BB interface at the
wanted level. The nominal voltage level is 240mVpp.

The AGC has to be set before each received burst. In idle mode this is done by an oper­ation called pre-monitoring. The receiver is switched on roughly 240 us before the own
reception begins, the DSP measures the received signal level and then adjusts the AGC
stages by sending gain information through the RFBus. In call mode there is no pre-

Page 7-38 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

monitoring, long term average value is used instead.

There is 54 dB gain control in 6 dB steps and one larger step of about 30 dB in the LNA.
According to the system specification the received signal level must be measured accu­rately in the range of -48...-110 dBm. Above -48 dBm the phone can report a constant
reading to the base station.

Production calibration is done with one RF-level.

mVpp

1350

240

120

AFC function

The AFC is used to lock the VCTCXO frequency to the frequency of the base station. The
AFC-voltage is generated in baseband by UEME using an 11 bit DA-converter. An RC-fil­ter on the AFC control line reduces the noise from the converter. The settling time
requirement for the RC-network comes from the start up time allowed. When the trans­ceiver is in sleep mode and ”wakes” up to receive mode, there is only about 5 ms for the
AFC-voltage to settle. In burst reception mode the system clock has to be settled into +/

- 0.1 ppm frequency accuracy.

lna on lna off

6 dB

+42 +36 +30 +24 +18 +12 +6 0 +12 +6 0 +6 00+6

BB-amplifier

Dtos on Dtos off Dtos on Dtos off

-110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10

-40 dBm

Figure 6: RX Gain control in GSM

dB LSB

60

50

40

30

20

10

Pin/dBm

66

15 dB margin

51

45

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-39

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

WCDMA RF

WCDMA RF Characteristics

Table 7: WCDMA System Characteristics

Item Value (WCDMA)

Receive frequency range 2110…2170MHz
Transmit frequency range 1950…1980 MHz
Duplex spacing 190MHz
Channel spacing 5MHz
Number of RF channels 277
Power class 4 (21dBm)

Table 8: TX Main Characteristics

Item Value

Transmitter frequency range 1920…1980 MHz
TX VCO freq. range 3840 … 3960 MHz
Output power 21 dBm (max); 3GPP uplink signal

-50 dBm (min); 3GPP uplink signal
Whole TX AGC range 100 dB (typ.)
IQ level (differential) WCDMA: 1.2 mApp
GSM IQ output (nominal) 1.0 V (diff.)
Gain variation over temp. (temp. compen-

± 7 dB (max)

sated)
Gain step accuracy ± 0.5 dB (max)/ 1 dB step

± 5 dB (max)/ 7 equal 3 dB step

ACLR (Adjacent Channel Leakage power
Ratio)

ACP1 (± 5 MHz) 33 dBc (max)

ACP2 (± 10 MHz) 43 dBc (max)
EVM 17.5 % (max)
Current consumption

(mobile)

21 dBm 430mA (typ.)
10 dBm 290mA
0 dBm 280mA

Table 9: RX main characteristics

Item Value

Receive frequency range 2110 … 2170 MHz
Rx VCO range 4220 … 4340 MHz
Total gain (IQ level: 400 mV

) 100 dB (min)

rmspp

RSSI range -99 … -25 dBm
IIP3 (max gain) -20 dBm (min)

IIP2 (max gain) 20 dBm (min)

Page 7-40 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

Table 9: RX main characteristics

Item Value

NF (max gain) 9.0 dB (max)
IQ level (differential) 400 mV

ppms

(nominal)

BB 3 dB bandwidth 10 kHz … 2 MHz (tunable)

WCDMA FUNCTIONAL DESCRIPTION

WCDMA synthesizers

TEX and REX have there own synthesizers. The PLL designs are basically the same and are
copied from HELGO. The loop filters are optimized separately so that the RX synthesizer is
faster than the TX.

The 19.2MHz VCTCXO frequency is used as the reference signal for both synthesizers.
The buffer inside of HELGO is used between baseband and the VCTCXO.

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-41

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

WCDMA transmitter

isolator

Duplexer (TX)

VBATREG1

VBAT

Ext reg 2

GenIO13

TXpwr

TXA2

PA

HEX

U/I

power
detector

I/Q modulator

PApwr

GenIO15

PA
SMPS

TXC

TEX

TxPwrDet

IPA1

GSM TX I/Q

I/UMUX

VBAT

VBATT_RF

TXI_P

TXI_N

TXQ_P

TXQ_N

TXA1

VBAT

VBATREG1

MUX

Ext reg 1

GenIO 14

TXVCOpwr

I/U

2

PLL

Balun

TXVCO

Figure 7: WCDMA TX block diagram

Page 7-42 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

The differential IQ signals from TIKU to TEX are in current mode. Before any processing
can be done they are converted to voltage mode by a current to voltage (I/V) converter .
Analog BB filtering (WCDMA and GSM) is then applied in TEX. The MUX (multiplexer)
switches the IQ signals to either WCDMA or GSM signal paths depending on which mode
is selected. After modulation the WCDMA signal is amplified by the AGC stage in TEX.
From TEX the differential signal is routed to the AGC driver amplifier HEX. The AGC
topology of HEX is very similar to TEX only the output signal level is higher. The gain of
HEX and TEX is controlled by TXA1 and TXA2 signals coming from 10bit Dacs in TIKU.
Both AGCs have about 50 dBs of dynamic range.

Before the PA the signal is filtered in a TX SAW filter. After filtering the signal is fed to
the two stage class AB PA. The PA bias current is coming partly from UEME (IPA1 4 bits
DAC) and partly from the TX feedback loop (PAbias). The value of IPA1 (fixed) is cali­brated on production alignment. The feedback loop current PAbias varies depending on
the output power level set. The feedback loop current is generated by measuring the
voltage level at the output of the detector. This voltage is then converted to a current in
TEX and then added to the IPA1 control current.

The supply voltage to the PA varies depending on the output power level set. This is done
to minimize the current consumption of the PA at lower power levels. The TXC signal
from UEME is used to control output voltage of the PA SMPS (Switch Mode Power Sup­ply). The supply voltage varies from 3.5V at 21dBm down to 1.5V at an ouput power

≤10dBm.

The isolator between PA and duplexer ensures that the output load of the PA does not
vary much thus restricting ACLR (Adjacent Channel Leakage power Ratio) variations
under mismatch conditions.

The power detector is needed

• to detect the suitable PA bias current

• to detect the max TX power (limit the max TX power)

• to detect the highest 10 dB power levels

TX power control

Open loop power control is used when creating a call (sending RACH signals). The trans­mitted signal level is estimated from the received signal level. The accuracy demand cov-

ering RX and TX is ± 12 dB in extreme conditions.

In call mode the base station is adjusting the output power of the mobile upwards or

downwards (inner loop power control). The nominal power control steps sizes are ± 1…
±3 dB.

The defined TX dynamic range is 71 dB (21… -50 dBm). Taking into account the gain vari­ations of the hardware in extreme conditions the TX dynamic range is actually 100 dB.
The whole dynamic range is divided fifty-fifty between the AGC stages in TEX and HEX.
The gain curves of both AGC stages are calibrated (modeled) in production alignment.
The TX power control algorithm calculates using two separate gain curves one common

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-43

Company Confidential

NMM-3 Company Confidential

N

7 - System Module & UI CCS Technical Documentation

gain curve for both AGCs covering the entire dynamic range. This ensures that when the
TX power level is changed both AGCs are adjusted simultaneously.

WCDMA receiver

TX signal

ANT signal

Duplexer

IQ demodulator

Balun

REX

2

PLL

Balun

RXVCO

Figure 8: WCDMA RX block diagram

The receiver is based on direct conversion architecture.

The received RF-signal is fed from the WCDMA antenna to the duplexer. In a WCDMA
system both the receiver and transmitter are on at the same time. The main function of
the duplexer is to filter the signal and noise of its own transmitter from the received sig­nal. The typical attenuation for TX noise in the RX band is 45 dB and to the TX signal is
50 dB.

WRXI_P

WRXI_N

WRXQ_P

WRXQ_

After filtering the signal is converted from single-ended to differential using a balun. The
differential signal is then fed to the integrated LNA in REX. The LNA has three gain steps.
The maximum gain step is 18dB, the middle is 6 dB and the lowest is –9dB. The LNA gain
is controlled via RFBus. The current consumption of the LNA can be dropped to half its
nominal value depending on the defined received signal strength level. The drawback of
this is that it affects the LNA gain. This effect is calibrated for in production alignment.

After amplifying the signal is routed out from REX to the SAW filter. The main function of
the RX band filter is to filter out more of the TX signal and to improve the out of band
attenuation performance. The attenuation of the duplexer to frequency ranges outside of
its own band can be very low. The RX SAW filter improves the out of band attenuation to
guarantee the required attenuation for out of band blocking signals.

Page 7-44 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential

Company Confidential NMM-3

CCS Technical Documentation 7 - System Module & UI

After the SAW filter the signal is fed back to REX to the demodulator. After the preampli­fier stage there are demodulator mixers which convert the RF signal to analog baseband
I- and Q-signals. The LO signal for the mixers is generated by the external RX VCO at
twice the RF frequency. The frequency division and 90 deg phase shift is made in REX.

I- and Q-signals are then amplified and filtered by the BB stage. The 3dB bandwidth of
the BB stage is from 10kHz…2MHz. The low pass 2MHz cut off frequency is tuned on the

production line. The tunable channel filter is an active 4th order RC filter. The large
ceramic capacitors (33nF) of the filter are external to REX. The high pass pole at 10kHz
can be controlled by the value of capacitor used. The BB AGC is a bipolar AGC with max­imum gain of 54 dB with a step size of 3 dB. The AGC is made up of three 18dB gain
stages cascaded in series. The gain is controlled by RFBus.

The differential analog I-/Q-signals are then fed to the AD converters in TIKU.

AGC strategy

The AGC-amplifier is used to maintain the voltage swing at the RF-BB interface at the
wanted level. The nominal differential signal level is 400 mV

. The total gain of REX

pprms

is 100 dB (min) with a typical dynamic range of 80 dB. The BB gain is divided into steps
of 3 dBs with the LNA having 3 gain steps. The RX AGC is controlled via RFBus.

The Rx AGC system has to be aligned from -99dBm to -25dBm (74dB).

The production calibration is done with one RF-level. The calibrated parameters are
receiver gain offset, LNA gain steps, LNA gain with 2nd bias current value and BB AGC-

stage slope error.

Figure 9: Rx Gain control in WCDMA

Issue 1 (11/2003) Copyright  2003 Nokia Corporation Page 7-45

Company Confidential

NMM-3 Company Confidential
7 - System Module & UI CCS Technical Documentation

This page has been delibrately left blank

Page 7-46 Copyright  2003 Nokia Corporation Issue 1 (11/2003)

Company Confidential