Nokia 7280 Service Manual 07 RM14 sysmod

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Nokia Customer Care

7 - System Module

RM-14

Nokia Customer Care 7 - System Module

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Table of Contents

Page No

Abbreviations ......................................................................................................6

General Description............................................................................................9

Feature list ......................................................................................................... 9

HW specific features: ....................................................................................... 9

UI features .......................................................................................................9

Technical Specifications .................................................................................. 10

Normal and extreme voltages.......................................................................... 10

Temperature conditions................................................................................... 10

Humidity........................................................................................................... 11

Vibration........................................................................................................... 11

ESD strength.................................................................................................... 11

HW Architecture Description ...........................................................................12

GSM Cellular Engine .....................................................................................12

RTC Circuitry .................................................................................................12

Zocus .............................................................................................................13

Power Management .......................................................................................... 14

HW reset switch............................................................................................... 14

Safety protected battery mode .......................................................................14

UEMEK............................................................................................................ 15

Internal regulator.............................................................................................. 16

External regulators........................................................................................... 17

VCORE SMPS ............................................................................................... 17

Bluetooth regulator .........................................................................................18

White Led Driver ............................................................................................ 18

Filter Components ..........................................................................................18

Power distribution ............................................................................................ 19

Battery connector............................................................................................. 20

Battery.............................................................................................................. 20

Charger interface............................................................................................. 21

System Connector ............................................................................................ 22

Interfaces ...........................................................................................................23

Camera............................................................................................................ 23

SIM interface.................................................................................................... 23

Flash Pads Pattern ........................................................................................23

Connectivity....................................................................................................... 25

IrDA.................................................................................................................. 25

IrDA Tiku EDGE Interface .............................................................................. 25

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Audio..................................................................................................................26

Display unit ...................................................................................................... 26

Mounting ........................................................................................................26

Engine Interface .............................................................................................26

Keyboard/UI..................................................................................................... 26

UI module .......................................................................................................26

Rotator ...........................................................................................................27

Function during use .......................................................................................27

Slide switch...................................................................................................... 29

LED driver........................................................................................................ 29

Generel circuit description .............................................................................30

Driving display and UI backlight ..................................................................... 30

Driving RGB LED ........................................................................................... 30

RF Module Introduction.................................................................................... 31

RF Frequency Plan............................................................................................ 32

Regulators ......................................................................................................... 33

Power Distribution ............................................................................................35

RF Characteristics ............................................................................................ 36

RF Block Diagram . ............................................................................................ 38

Frequency Synthesizers................................................................................... 39

Receiver........................................................................................................... 39

Transmittter...................................................................................................... 39

Front end.......................................................................................................... 39

Power amplifier................................................................................................ 40

RF ASIC Helgo ................................................................................................ 41

AFC function.................................................................................................... 41

List of Figures Page No

Fig 1 RTC supply circuit.......................................................................................11

Fig 2 Zocus Circuit ...............................................................................................12

Fig 3 HW Reset circuit .......................................................................................... 14

Fig 4 Power Supply Overview..............................................................................15

Fig 5 SIM Filtering.................................................................................................17

Fig 6 Power Distribution.......................................................................................18

Fig 7 The connector............................................................................................. 19

Fig 8 BL-8N Battery.............................................................................................. 19

Fig 9 Charger Circuit............................................................................................20

Fig 10 TIKU/UEMEK SIM Interface Connections................................................. 22

Fig 11 FINUI and LABEL I/F ................................................................................ 23

Fig 12 Schematic for UI module............................................................................ 25

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Fig 13 Function during use.................................................................................... 26

Fig 14 The switch................................................................................................. 28

Fig 15 LED driver................................................................................................. 29

Fig 16 Figure 13 RF Frequency Plan....................................................................31

Fig 17 Power distribution diagram......................................................................... 34

Fig 18 RF Block Diagram.....................................................................................37

Fig 19 Front end................................................................................................... 40

Fig 20 Power Amplifier.........................................................................................40

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Abbreviations

Abbr. Description

ACI Accessory Control Interface ADC Analog to digital converter ASIC Application Specific Integrated Circuit ASIP Application Specific Integrated Passive ADSP Application DSP (expected to run high level tasks) ARM Advanced RISC Machines ARM915 ARM9TDMI Core, Caches, MMU’s ARM925 ARM915 + WinCE Compatible MMU (WinCE is a hardwareprogrammed option

which will not be enabled for Tiku.) BB Baseband BB4.5 Common BaseBand 4.5 program BC02 Bluetooth module by CSR BL-8N Battery type. BlueBird Bluetooth interface program to CSR. CCP Compact Camera Port CDSP Cellular DSP (expected to run low level tasks) CIF Common Intermediate Format (352x288 pixels) COF Chip on foil COG Chip On Glass CP Co-processor CSR Cambridge Silicon Radio CSTN Color Super Twisted Nematic CTSI Clock Timing Sleep and Interrupt block of Tiku DCT4.5 Digital Core Technology, generation 4.5 DSP Digital Signal Processor DUT Device under test EMC Electro Magnetic Compatibility ESD Electro Static Discharge

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FR Full Rate FSTN Film compensated Super Twisted Nematic GSM Global System Mobile HW Hardware IF Interface IHF Integrated Hands Free IMEI International Mobile Equipment Identity IR Infrared IrDa Infrared Data Association LCD Liquid Crystal Display LDO Low Drop Out LED Light Emitting Diode LPRF Low Power Radio Frequency MCU Microprocessor Control Unit NTC Negative temperature Coefficient, temperature sensitive resistor used as an

temperature sensor. PA Power Amplifier (RF) PDA Personal Digital Assistant PDRAM Program/Data RAM (on chip in Tiku) Phoenix SW tool of DCT4.x PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators PWB Printed Wired Board RHEA TI bus from Lead3 RTC Real Time Clock, small circuitry that keeps track of updating the clock counter

and the calendar. SARAM Single Access RAM SIM Subscriber Identification Module SW Software SWIM Subscriber / Wallet Identification Module TCXO Temperature Controlled Chrystal Oscillator Tiku UPP (Universal Phone Processor), Official Tiku3G TI Texas Instruments, American company

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UEME Universal Energy Management Enhanced UI User Interface USB Universal Serial Bus USWIM UMTS Subscriber / Wallet Identification Module USIM UMTS Subscriber Identification Module UPP Universal Phone Processor UPP_WD2Communicator version of DCT4 system ASIC

VIA Versatile Interface Architecture (on chip bus structure)

Copper plated, drilled connection between layers in a PWB WCDMA Wide Band Code Division Multiple Access, Third Generation (3G) of Mobile Tel-

ephones Zocus Zero Ohm Current Sensor, Current measuring device. It measures the current

from and to the battery . It is used by the EM SW for calculating the left over pow-

er in the battery.

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General Description

■ Feature list

HW specific features:

- Monoblock phone

- Tripleband Engine (900, 1800, 1900)

- GPRS/EGPRS MSC 10 (4+1, 3+2)

- FR, EFR, AMR codecs

- Integrated VGA Camera

- Display: 208x104 pixels, transmissive and mirror (on film) effect

- MMS (Multi Media Messaging), Java MIDP2.0, SyncML1.1.1 and X-HTML

- Intergrated MP3 file support

- Bluetooth

- IR

- FM Radio

- IHF

- Rotator with limited UI input keys: Upper Soft Key, Lower Soft Key, SEND/END keys

- Mono (Plug'n'play) Accessory support

- Slide for receiving call

- Fixed battery

UI features

Bearers supported:

− EDGE

−CSD, HSCSD

−GPRS

−Bluetooth

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Technical Specifications

These figures are a summary of the SPR-requirements.

■ Normal and extreme voltages

Following voltages are assumed as normal and extreme voltages for used battery:

Table 1: Normal and extreme voltages

Voltage Voltage [V] Condition

General Conditions

Nominal voltage 3.90

Lower extreme voltage 3.3

Higher extreme voltage 4.30

HW Shutdown Voltages

Vmstr+ 2.1 ± 0,1 Off to on

Vmstr- 1.9 ± 0,1 On to off

SW Shutdown Voltages Sw shutdown 3.1 In call Sw shutdown 3.2 In idle

Min Operating Voltage

Vcoff+ 3.1 ± 0,1 Off to on

Vcoff- 2.8 ± 0,1 On to off

HW-Reset Demands

Min 1.0V

Max --

a. The nominal voltage is defined as being 15% higher than lower extreme voltage. TA will test with this nominal voltage at an 85% range (0.85 x 3.9V ª 3.3V) b. This limit is set to be above SW shutdown limit in TA.

b c

c. During fast charging of an empty battery, this voltage might exceed this value. Voltages between 4.20 and 4.60 might

appear for a short while

d. The minimum Battery cell voltage required for the reset circuitry to turn on. This is not confirmed by measures at pt..

■ Temperature conditions

(1) Operational temperature range (all specifications met within this range) –10°C +55°C

(2) Functional temperature range (Reduced performance) –30°C +70°C

(3) Storage temperature range: –30°C +85°C

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Temperatures at –10°C, +25°C and +55°C are used for cpk analysis. The baseband module complies with the SPR4 Operating Conditions.

■ Humidity

Relative humidity range is 5...95%. The BB module is not protected against water . Condensed or spla shed water might cause mal-

function. Any submerge of the phone will cause permanent damage. Long-term high humidity, with condensation, will cause permanent damage because of corrosion.

The baseband module complies with the SPR4 Operating Conditions.

■ Vibration

The baseband module complies with the SPR4 Operating Conditions.

■ ESD strength

The baseband module complies with the SPR4 Operating Conditions.

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HW Architecture Description

GSM Cellular Engine

The BaseBand Engine consists of the TEMS (TikuEdge Memory Stacked Package) concept and UEMEK. The TEMS concept combines all memory components in one package, which is stacked on top of the TikuEdge. The memory combines 128Mbit NOR Flash, 512Mbit NAND Flash and 128Mbit SDRAM in one package. The TikuEdge is also implemented in a stacked package in which all pin connections are available on bottom pinout, and memory interface on top pin out (POP I/F).

The energy manegement related part of the microBB4.5 engine is the UEMEK.

RTC Circuitry

Therefore a voltage regulator is used to supply the RTC circu it via the battery . The circu it looks as follows:

Figure 1: RTC supply circuit

This is used in sleep mode where it is able to source 3mA. The supply VBAT_PA is byp assing the HW switch, and therefore will have contact to the battery also whe n the SIM drawer is pulled out.

The circuit will give a long back up time. Capacity on the battery when it has been discharged to engine cut off (3,1V) is still 2.2mAh before battery voltage reaches 2,9V. This gives a back up time of approx:

71 hours.

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Zocus

The Zocus device (LM3820) is a precision current sensor, used by energy management software to determine the current consumption in the mobile phone.

Figure 2: Zocus Circuit

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Power Management

■ HW reset switch

Since the RM-14 project is equipped with a “fixed battery”, a need of a specific HW reset solution is required, since this is no longer possible by removing the battery. This request is meet by the implementation of a power cut-of f switch that disconnects the battery power from the rest of the phone. This switch is implemented by 2 P-Channel MOSFET’s inserted in the battery power line.

RTC backup: A minimum of 10 minutes power supplied to the RTC circuit is required. Dead battery charge: A battery safety circuit is protected by battery cell, which must be re-enabled. Description: The circuit depicted in HW Reset circuit-figure is connected to battery at “VBAT” and to the

phone at VBA T_OUT. The switch referred to as “SW” illustrates the switch, which enables power, supplied to the phone. This is implemented as a normally open switch in the SIM can. Its function is to open when SIM-card is inserted and close whenever it’s extracted.

Beside of the PA-Module implementation, the rest of the phone will be powered from the VBAT_OUT.

Safety protected battery mode

This mode implies a battery that has its cell disconnected from battery terminals by the batt eries own protection circuit .

When the protection circuit is disabled, the battery cell voltage is visible at the ba ttery terminals. This means that the voltage of VBA T_OUT equals the battery cells whereas this must be higher than the Gate-Source threshold voltage of Q1-2.

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Figure 3:HW Reset circuit

■ UEMEK

The UEMEK is providing the power for the phone. It consist of the following regulators:

− BB 8 voltage regulators

− RF 7 voltage regulators, 2 current regulators

The BB regulators in the UEMEK are controlled by MCUSW except VANA, VFLASH1, VIO, which are controlled by the UEMEK itself. The RF regulators are controlled by DSPSW except VR3, which is controlled by the UEMEK.

An external regulator (SMPS) provides the core voltage for the phone processor (T ikuEDGE).

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The inputs of the UEMEK regulators are filtered by a coil / capacitor filter. Some of the inputs are joined together..

Figure below shows the connections in the different filters. VIO regulator is overloaded in sleep mode (this issue is inherited from Nokia 6230). Due to

peak currents on display and SDRAM the maximum output current for VIO regulator (2mA) is exceeded.

Figure 4: Power Supply Overview

Charger Section

Charger

Connector

Charger

Filter

Fuse 1.5A

BATT

VBAT

Zocus

Battery

■ Internal regulator

LM2708

Regulator

LP3987

Regulator

HW Reset

VBAT_PA

Switch

VCORE

2,8V REG

VBAT

TO RF

Bluetooth BC02

Tiku

PA-Module

VBATBB

LM2795,

White Led

Driver

Current

Regulator

Audio

Legend:

UEMEK EMC Section Ext. components

Display

BLight

KBoard

BLight

RGB Led

Buzzer

Tiku PLL

Filter 1

Filter 2

Filter 3

Filter 4

Filter 5

Filter 6

Filter 7

VAUX1

Regulator

VAUX2

Regulator

VAUX3

Regulator VFLASH1

Regulator

VCORE

Regulator

VANA

Regulator

VIO

Regulator

VSIM

Regulator

VR1A/B

Regulator

VR3

Regulator

VR2

Regulator

VR4

Regulator

VR5

Regulator

VR6

Regulator

VR7

Regulator

VAUX1

VAUX2

VAUX3

VFLASH1

VCORE_LIN

VANA

VIO

VSIM

VR1A/B

VR3

VR2

VR4

VR5

VR6

VR7

Not used

LCD, IrDA, FM radio, Camera analog

Camera Dig

UEME audio, RF

{

RX/TX conv. Flash, SDRAM, LCD i/

o, NUT i/o, TIKU i/o,

{

BT i/o, Zocus i/o

SIM

RF Section

RF Section Enable for BT clock

RF Section

The following list shows the internal regulators:

Table 2: Internal Regulators

Name Voltage (V) Current (mA) Fil-

Comment

ter

Min Nom Max Max Sleep

Max

VANA 2.70 2.78 2.86 80 2 5uA minimum for stability.

Controlled by the UEMEK. Disabled in Sleep mode.

VFLASH1 2.7

(2.61)

2.78 2.86 (2.95)

70 1.5 1 5uA minimum for stability.

Controlled by the UEMEK. (Sleep indication)

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Name Voltage (V) Current (mA) Fil-

ter

Min Nom Max Max Sleep

Max

VIO 1.72 1.80 1.88 150 2 3 5uA minimum for stability.

VCORE Camera on

VAUX1 1.745

VAUX2 2.70 2.78 2.86 70 0.5 1 5uA minimum for stability. VAUX3 2.70 2.78 2.86 20 0.5 1 5uA minimum for stability. VSIM 1.745

VR1A/B 4.60 4.75 4.90 10 - 4 Disabled in Sleep mode. The

1.71 1.8 1.89 200 0.2 1 5uA minimum for stability.

2.91

1.80

3.0

1.80

3.00

1.855

3.09

1.855

3.09

50 0.5 1 Voltage level is set by

25 0.5 - 5uA minimum for stability.

Comment

Controlled by the UEMEK.

MCUSW is setting the voltage.

MCUSW.

maximum current is for 1 regulator active. If both are used, maximum 5mA each.

VR2 2.70

(2.61)

VR3 2.70 2.78 2.86 20 - 4 100uA minimum for stability.

VR4 2.70 2.78 2.86 50 0.1 6 100uA minimum for stability. VR5 2.70 2.78 2.86 50 0.1 7 100uA minimum for stability. VR6 2.70 2.78 2.86 50 0.1 7 100uA minimum for stability. VR7 2.70 2.78 2.86 45 - 7 100uA minimum for stability.

2.78

(2.78)

2.86 (2.95)

100 - 5 100uA minimum for stability.

Active during (Sleepmode).

Controlled by the UEMEK.

■ External regulators

VCORE SMPS

The VCORE regulator is based on the LM2708 step-down DC-DC converter . The regulator can provide 350mA and can switch between 1.35 – 1.57V output voltag e. It can switch between low power mode (Sleep) (linear mode) and full power mode (switched).

- Input voltage 2.7 – 5.5V

- Output voltage 1.35V – 1.57V

- External Sync input (PWM frequency between 500kHz and 750khz)

- Output current 517mA

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- Overload and thermal protection

Bluetooth regulator

An external regulator powers the BC02 module. The used regulator is a LP3987ITL by National Semiconductor. The output voltage is 2.8V and the output current is 150mA continuously.

White Led Driver

A white led driver is implemented for display backlight and key_UI le’s. RGB Led Regulator This regulator supplies the RGB led.

Filter Components

All connectors going to the “outside world” have filter components, ESD protection and EMC reduction.

The Digital/Data lines on SIM have special d edicated filter ASIP . The belo w figure show the SIM filtering.

Figure 5:SIM Filtering

The Audio circuit: Earpiece, IHF, internal microphone and external speaker are filtered with discrete components (common mode reduction coils, Varistors, caps and resistors), where as the external microphone uses differential mode mic. ASIP.

The 16 UEMEK BB & RF regulators are specified to have a decoupling cap of 1 uF ±20%.

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■ Power distribution

The connection of various power connection can be seen in the following overview.

Figure 6: Power Distribution

Speaker

Vibra

"On Key"

CHARGER

PAOUTN

ESD

PAOUTP

ESD

BuzzO

PwrOnX

ESD

VR1A 4.75V VR1B 4.75V

VR2

2.78V

VR3

2.78V / 3.6V

VR4

2.78V / 3.6V

VR5

2.78V / 3.6V

VR6

2.78V / 3.6V

VR7

2.78V / 3.6V

RF Regulators BB Regulators

VRefRF02

VRefRF01

VBack

VCharOut

BTEMP

RF CODECS

AUDIO CODEC

DIGITAL BLOCKS

VBack

BSI

PURX

SleepClk

SleepX

VCharIn

UEMEK

2.78V VAUX2

2.78V

VAUX3

VANA2.78V

VFLASH1

2.78V

1.8/3.0V

VSIM

VAUX11.8/3.0V

VCORE1.0-1.8V

1.8V

1,8V VIO

KLight DLight

CALLED

UEMRstX

Vibra

ESD

RGB Led

Display

illumination

LCD Driver

LED

driver

RGB

Reg

Module

SIM

CCP

Camera

Parallel Display

Keyb Light

Rotator

FM Radio

Battery

BL-8N

BATT

VBAT

VXO

ZOCUS-C

HW Reset

HELGO

PA_Module

TIKU

EDGE Memory

Stacked

(TEMS)

RFClock

BC02

2.8V

LP3987

1.5V

VCORE

LM2708

NewVision Jinx

Power Distribution Diagram

Ver. 0.1

18.02.2004

CONFIDENTIAL

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■ Battery connector

The battery connector has two pogo pins one for VBA T (Pin A) and one f or GND (Pin B). There are no connections for either BTEMP or BSI. Hence the temperature is measured with a NTC on PWB opposite side of battery.

The connector has a dynamic movement area of 0.6 - 2.1mm with a force of 2.3 – 0.3N respectivly.

Figure 7: The connector

■ Battery

Type:BL-8N Technology:Li-Ion. 4.2V charging. 3.1V cut-off Capacity:700 mAh

The battery pack is designed for RM-14 . The BSI resistor is placed on the main PWB as RM-14 supports only one battery capacity. Fur-

ther a BSI connection is added to the Flash interface. The battery temperature is measured by a NTC resistor placed on the main PWB, opposite to

the Battery. Battery pack has an impedance of 130 - 150mΩ (0 – 45

Figure 8: BL-8N Battery

C).

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Inside the battery, an over-temperature and an over-voltage protection circuit are present. Op-

erational temperatures of battery are –20 – 70

C in discharge mode.

Care should be taken with the temperature. If the battery is charged above 60 degrees Celsius, overheating might occur.

■ Charger interface

RM-14 conforms to the global NMP Charger Interface. Charging is controlled by the UEMEK. The charger connection is through the system connector

interface. The RM-14 baseband is designed to support both 2- and 3-wire type chargers.

Figure 9: Charger Circuit

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System Connector

The system connector in RM-14 is a plug and play connector.

The Plug & Play system connector supports the fully differential DCT4, 4-wire audio/co ntrol interface which includes:

Audio

- 2 -wire fully differential mono audio

- 2-wire differential mic input

Detection/controlling

- Headint passive brake switch

Not supported is:

- Pins for 2 -wire charging in cradles

Table 3: DC Plug pinlist

PinNo Pin Name Description Voltage levels, Current Comment 2 CHARGE Charger input 0-16,9V, 0,85A Max Voltage Peak from

AC-7 used.

1 GND Ground 0,85A

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Interfaces

■ Camera

The module has only one operating mode: Bayer mode (raw pixel data output). Thus viewfinder, video streaming, colour correction, white balance etc. must be handled in software.

■ SIM interface

The engine first tries to contact SIM card with 1.8V. If no response is given, 3.0V supply is tried instead.

The whole SIM interface locates in two asics; TIKU and UEMEK.

Figure 10: TIKU/UEMEK SIM Interface Connections

SIM

C5C6C7

C1C2C3

UEMEK

SIMIF Block

SIMData SIMClk SIMRst

VSIM

BSI

GND GND

Data

SIMClk

SIMIO

UEMEK Dig. Logic

Tiku

Data SIMClk SIMIO

UIF Block

UEMInt CBusDa CBusEnX CBusClk

The internal clock frequency from the CTSI Block is 13 MHz in GSM.

Flash Pads Pattern

These are accessed through the SIM Can by removing the SIM draw’. There is no access to the battery connector and hereby the battery, through this interface connection. The battery cannot be charged when the POS adapter is inserted.

The power is supplied to the Engine for purposes of power supply during flashing only. Also, this interface is used for flashing when battery is inserted, and hereby the I/F ensures that there is no connection to battery.

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Figure 11: FINUI and LABEL I/F

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Connectivity

■ IrDA

RM-14 suppports data connectivity via the Infra Red lin k. The IR interface is integrated into the TIKU and the main external component is the IR module. The datarate supported will be

1.152Mbit. The circuit around the module is the same as in Nokia 6230. However, since the IR window due to design reasons is lifted in relations to the PWB an lig htguide has to connect the IR light and the IR window . Thus the u p firing module TFDU5307 from Vishay has been selected, instead of the one used in Nokia 6230.

IrDA Tiku EDGE Interface

This interface receives data from, and transmits data to peripheral equipment. It transforms serial data to parallel data, for the MCU or DSP, and vice versa.

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Audio

The audio and vibrator functions are specified UI

■ Display unit

Mounting

The Display Unit interface is a parallel interface.

Engine Interface

A 24-pin connector provides the interface between the Display Unit and the Engine PWB.

■ Keyboard/UI

UI module

RM-14 is instead of a traditional alphanumerical keyboard equipped with a rotator. The user interface is thus the rotator + 5 keys (upper soft key, lower soft key, send, end/power, select). All this combined with backlight is called UI module.

The schematic of the complete UI-module can be seen below.

Figure 12: Schematic for UI module

ASIC

PWB

LED driver

circuit

10 line EMI filter

1kOhm

16 pin UIconnector

16 line

flexpiece

LED1+

Upper Soft Key

Lower Soft Key____________________________

TIKU P(00) row0 TIKU P(01) row1 TIKU P(02) row2

Send

LED2+

Rotator module

LED1-

GND

Sel

220 Ohm

(0402 comp)

1nF

(0402 comp)

PWRONX

LED2-

GND

68 Ohm

(0402 comp)

CL-510S-WD-D-T

SOFT LEFT SOFT RIGHT

SEND END

68 Ohm

(0402 comp)

Citizen

SwitchA

Select

SwitchC

CL-510S-WD-D-T

Citizen

SwitchB

5V6/15V/0J05

(1825127)

Varistor

AVX TVS (1825127)

Varistor AVX TVS

In the middle of the rotator there is a select key. On top of this 4 keys are present, these are:

- Send

- End/power-key

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- Upper soft key

− Lower soft key These are implemented so that they can be pressed (and detected) simultaneously. The powerkey is implemented in the END key. Therefore this will be connected to the

PWRONX pin on the UEME.

Rotator

The connections from the rotator module (including keys) to the engine are:

Function Connecting IC Pin Level pressed/

unpressed Upper soft key TIKU GPIO2 (col0) 0/Open Lower soft key TIKU GPIO3 (col1) 0/Open Select TIKU GPIO13 0/Open Switch A TIKU GPIO10 -Switch B TIKU GPIO9 -Switch C TIKU GPIO8 -Send TIKU GPIO4 0/Open End/Power UEME PWRONX 0/Open

Function during use

This consists of 3 switches which during rotation open and close in the following pattern:

Figure 13:Function during use

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In the following:

-contacts in rotator are CAPITAL LETTERS

-pins on TIKU are corresponding lowercase letters (Thus switch A corresponds to pin A on

TIKU).

If the system has been initalized following routine is present (starting at point 1): System has enabled pin c (driven low), a and b are disabled (pulled high). Pos. 1: Contact A and B are closed, C is open (pin a = hi, b = hi, c = lo). Between 1 & 2: Rotating the wheel CW causes: Contact A to open => Now only B is closed, (pin a = hi, b = hi, c = lo). Pos. 2: Rotating further CW causes: C to close => now B and C is closed, This causes a low interrupt on pin b (pin a = hi, b = lo, c

= lo). New state in SW is set: (pin a = lo, b = hi, c = hi). Now ready for next step.

Between 2 & 3: Rotating further CW causes: B to open => now only C is closed, (pin a = lo, b = hi, c = hi). Pos. 3: Rotating further CW causes: A to close => Now A and C are closed. This causes a low interrupt on pin c (pin a = lo, b = hi,

c = lo). New state in SW is set: (pin a = hi, b = lo, c = hi). Now ready for next step.

Between 3 & 1: Rotating further CW causes: contact C to open => Now only A is closed. Pos.1: This is similar to the first position 1. The pattern is repeated.

This pattern will go on as long as the rotator is turned CW, and the switches open and close regulairy.

This means:

-In between steps only one switch is closed. This switch stays closed while the 2 other are changing state.

-Every time a switch closes a low interrupt is generated.

-When going CCW the same pattern will happen, but in opposite order.

-Every time an interrupt is generated a new state has to be set.

-If a false state occurs, initalization routine has to be run until a correct state is reached.

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Whether the rotator movement is CW (down) or CCW (up) can thus b e decoded by comparing the interrupt pin with the stage of the last interrupt.

■ Slide switch

A switch is needed to detect the position of the slide. Connection to the engine:

Connecting pin

AuxDet UEME Output from Hall IC tells if slide is open or

This switch is implemented with a hall IC and a magnet. The hall IC is SH248CSP from Samsung.

Connecting ICFunction Open/

Closed 1/0

closed

Figure 14: The switch

The signal from the Hall IC is connected to the analog keyboard input (AuxDet) in the UEME, as this also is an interrupt input. This allows the phone to wake up, by opening the phone.

Analog keyboard input is used due to interrupt possibilities and because the Hall IC requires a minimum supply voltage of 2.7V.

The Hall solution requires a magnet, which is placed on top of Ha ll-IC, and is moved away from the sensor with the moving mechanics, thus making a change of the magnetic field. The magnet has the dimensions 5x3x1 mm and is mounted in the top of the phone in the sliding part.

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■ LED driver

The general LED driver circuit looks as follows:

Figure 15: LED driver

Generel circuit description

The circuit is build around LM2795(NMP code: 4341425. This is a switched capacitor type step up converter. It has 5 outputs. 4 of them are mirrored current sources (D1-D4), and the 5 the output from the chargepump(Pout).

Driving display and UI backlight

The mirrored current sources are used to drive the display backlight (D1-D3), and the backlight(D4) to the UI-module (rotator).

Driving RGB LED

The Pout output (from the chargepump) is fed to the RGB LED’s.

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RF Module Introduction

The RF module performs the necessary high frequency operations of the EGSM900/ GSM1800/GSM1900 tripleband (EDGE) engine in the RM-14 product.

Both the transmitter and receiver have been implemented by using direct conversion architecture, which means that the modulator and demodulator operate at the channel frequency.

The core of the RF is an application-specific integrated circuit, Helgo. Another core component is a power amplifier module, which includes two amplifier chains, one for EGSM900 and the other for GSM1800/GSM1900.

Other key components include:

• 26 MHz VCTCXO for frequency reference

• 3296-3980 MHz SHF VCO (super high frequency voltage controlled oscillator)

• front end module comprising a RX/TX switch and two RF bandpass SAW filters

• three additional SAW filters

The control information for the RF is coming from the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the information about the frequency band, mode of operation, and synthesizer channel for the RF.

In addition, exact timing information and receiver gain settings are transferred through the RFBus. Physically, the bus is located between the baseband ASIC called TIKU and Helgo.

The RF circuitry is located on both sides of the 8 layer PWB.

EMC leakage is prevented by using metal cans. The RF circuits are separated to four blocks:

− FM radio.

−PA, front end module and VCTCXO.

− Helgo RF IC, baluns and balanced filters.

− VCO

The baseband circuitry is located on both side of the board, which is shielded with a meallized frame and ground plane of the UI-board.

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RF Frequency Plan

RF frequency plan is shown below. The VCO operates at the channe l frequen cy multiplie d b y two or four depending on the frequency band of operation.

Figure 16: RF Frequency Plan

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Regulators

The transceiver baseband section has a multi function analog ASIC, UEM, which contains among other functions six pieces of 2.78 V linear regulators and a 4.8 V switching regulator.

The seven regulators are named VR1 to VR7. VrefRF01 and VrefRF02 are used as the reference voltages for the Helgo, VrefRF01 (1.35V) for the bias reference and VrefRF02 (1.35V) for the RX ADC (analog-to-digital converter) reference.

The regulators (except for VR7) are connected to the Helgo. List of the needed supply voltages

Volt. Source Load VR1 PLL charge pump (4.8 V) VR2 TX modulators, VPECTRL3s (ALC), driver VR3 VCTCXO, synthesizer digital parts VR4 Helgo pre-amps, mixers, DtoS VR5 dividers, LO-buffers, prescaler VR6 LNAs, Helgo baseband (Vdd_bb) VR7 VCO VrefRF01 ref. Voltage for Helgo VrefRF02 ref. Voltage for Helgo Vbatt PA

Typical Current Consumption The table below shows the typical current consumption in different operation modes.

Operation mode Current consumption Notes Power OFF < 10 uA RX, EGSM900 75 mA, peak RX, GSM1800/

GSM1900

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TX, power level 5, EGSM900

TX, power level 0, GSM1800/GSM1900

1700 mA, peak

1000 mA, peak

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Power Distribution

Power Distribution Diagram

Figure 17:Power distribution diagram

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RF Characteristics

Main RF Characteristics

Parameter Unit and value Cellular system EGSM900/GSM1800/GSM1900 RX Frequency range EGSM900: 925 ... 960 MHz

GSM1800: 1805...1880 MHz GSM1900: 1930...1990 MHz

TX Frequency range EGSM900: 880 ... 915 MHz

GSM1800: 1710 ...1785 MHz GSM1900: 1850 …1910 MHz

Duplex spacing EGSM900: 45 MHz

GSM1800: 95 MHz

GSM1900: 80 MHz Channel spacing 200 kHz Number of RF channels EGSM900: 174

GSM1800: 374

GSM1900: 300 Output Power EGSM900: GSMK 5…33 dBm

EGSM900: 8-PSK 5…27 dBm

GSM1800: GSMK 0…30 dBm

GSM1800: 8-PSK 0…26 dBm

GSM1900: GSMK 0…30 dBm

GSM1900: 8-PSK 0…26 dBm Number of power levels GMSK EGSM900: 15

GSM1800: 16

GSM1900: 16 Number of power levels 8-PSK EGSM900: 12

GSM1800: 14

GSM1900: 14

Transmitter Characteristics

Item Values (EGSM900/1800/1900) Type Direct conversion, nonlinear, FDMA/TDMA LO frequency range EGSM900: 3520...3660 MHz (4 x TX freq)

GSM1800: 3420...3570 MHz (2 x TX freq) GSM1900: 3700...3820 MHz (2 x TX freq)

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Output power (EGSM900/GSM1800/GSM1900)

Receiver Characteristics

Item Values, EGSM900/1800/1900 Type Direct conversion, Linear, FDMA/TDMA LO frequencies EGSM900: 3700...3840 MHz (4 x RX freq)

Typical 3 dB bandwidth +/- 91 kHz Sensitivity min. - 102 dBm (normal condition)

Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX

GMSK 33/30/30 dBm 8-PSK 27/26/26 dBm

GSM1800: 3610...3760 MHz (2 x RX freq) GSM1900: 3860...3980 MHz (2 x RX freq)

ADCs

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RF Block Diagram

The block diagram of the RF module can be seen in Figure 15. The detailed funct ional description is given in the following sections.

Figure 18: RF Block Diagram

Helgo

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Frequency Synthesizers

The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCTCXO, which is running at 26 MHz.

The frequency synthesizer is integrated in Helgo except for the VCTCXO, VCO, and the loop filter.

■ Receiver

Each receiver path is a direct conversion linear receiver. From the antenna the received RFsignal is fed to a front-end module where a diplexer first divides the signal to two separate p aths according to the band of operation: either lower, EGSM900 or upper, GSM1800/GSM1900 path.

Most of the receiver circuitry is included in Helgo.

■ Transmittter

The transmitter consists of two final frequency IQ-modulators and power amplifiers, for the lower and upper bands separately, and a power control loop. The IQ-modulators are integrated in Helgo, as well as the operational amplifiers of the power control loop. The two power amp lifiers are located in a single module with power detector.

■ Front end

The front end features include:

- Antenna 50 ohm input

- RX EGSM900 balanced output

- RX GSM1800 balanced output

- RX GSM1900 single ended output

- TX GSM900 single ended 50 ohm input

- TX GSM1800/GSM1900 single ended 50 ohm input

- 3 control lines from the Helgo

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Figure 19: Front end

■ Power amplifier

The power amplifier features include: 50 ohm input and output, EGSM900 and GSM1800/GSM1900 Internal power detector GMSK and EDGE mode

Figure 20: Power Amplifier

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■ RF ASIC Helgo

The RF ASIC features include Balanced I/Q demodulator and balanced I/Q modulator Power control operational amplifier, acts as an error amplifier The signal from VCO is balanced, frequencies 3296 to 3980 MHz Low noise amplifiers (LNAs) for EGSM900 and GSM1800 are integrated. The Helgo can be tested by test points only.

■ AFC function

AFC is used to lock the transceiver’s clock to the frequency of the base station.

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Nokia 7280 Service Manual 07 RM14 sysmod

Specifications and Main Features

Frequently Asked Questions

User Manual

Abbreviations

General Description

■ Feature list

HW specific features:

UI features

Technical Specifications

■ Normal and extreme voltages

■ Temperature conditions

■ Humidity

■ Vibration

■ ESD strength

HW Architecture Description

GSM Cellular Engine

RTC Circuitry

Zocus

Power Management

■ HW reset switch

Safety protected battery mode

■ UEMEK

■ Internal regulator

■ External regulators

VCORE SMPS

Bluetooth regulator

White Led Driver

Filter Components

■ Power distribution

■ Battery connector

■ Battery

■ Charger interface

System Connector

Interfaces

■ Camera

■ SIM interface

Flash Pads Pattern

Connectivity

■ IrDA

IrDA Tiku EDGE Interface

Audio

■ Display unit

Mounting

Engine Interface

■ Keyboard/UI

UI module

Rotator

Function during use

■ Slide switch

■ LED driver

Generel circuit description

Driving display and UI backlight

Driving RGB LED

RF Module Introduction

RF Frequency Plan

Regulators

Power Distribution

RF Characteristics

RF Block Diagram

Frequency Synthesizers

■ Receiver

■ Transmittter

■ Front end

■ Power amplifier

■ RF ASIC Helgo

■ AFC function