ACIAccessory Control Interface
ADCAnalog to digital converter
ASIC Application Specific Integrated Circuit
ASIPApplication Specific Integrated Passive
ADSPApplication DSP (expected to run high level tasks)
ARMAdvanced RISC Machines
ARM915ARM9TDMI Core, Caches, MMU’s
ARM925ARM915 + WinCE Compatible MMU (WinCE is a hardwareprogrammed option
which will not be enabled for Tiku.)
BB Baseband
BB4.5Common BaseBand 4.5 program
BC02Bluetooth module by CSR
BL-8NBattery type.
BlueBirdBluetooth interface program to CSR.
CCPCompact Camera Port
CDSPCellular DSP (expected to run low level tasks)
CIFCommon Intermediate Format (352x288 pixels)
COF Chip on foil
COG Chip On Glass
CPCo-processor
CSRCambridge Silicon Radio
CSTN Color Super Twisted Nematic
CTSIClock Timing Sleep and Interrupt block of Tiku
DCT4.5 Digital Core Technology, generation 4.5
DSP Digital Signal Processor
DUT Device under test
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
FR Full Rate
FSTN Film compensated Super Twisted Nematic
GSMGlobal System Mobile
HW Hardware
IF Interface
IHF Integrated Hands Free
IMEI International Mobile Equipment Identity
IR Infrared
IrDa Infrared Data Association
LCD Liquid Crystal Display
LDOLow Drop Out
LED Light Emitting Diode
LPRF Low Power Radio Frequency
MCU Microprocessor Control Unit
NTCNegative temperature Coefficient, temperature sensitive resistor used as an
temperature sensor.
PAPower Amplifier (RF)
PDAPersonal Digital Assistant
PDRAMProgram/Data RAM (on chip in Tiku)
Phoenix SW tool of DCT4.x
PUPGeneral Purpose IO (PIO), USARTS and Pulse Width Modulators
PWB Printed Wired Board
RHEATI bus from Lead3
RTCReal Time Clock, small circuitry that keeps track of updating the clock counter
and the calendar.
SARAMSingle Access RAM
SIM Subscriber Identification Module
SW Software
SWIMSubscriber / Wallet Identification Module
TCXOTemperature Controlled Chrystal Oscillator
TikuUPP (Universal Phone Processor), Official Tiku3G
TITexas Instruments, American company
UEME Universal Energy Management Enhanced
UI User Interface
USB Universal Serial Bus
USWIMUMTS Subscriber / Wallet Identification Module
USIMUMTS Subscriber Identification Module
UPPUniversal Phone Processor
UPP_WD2Communicator version of DCT4 system ASIC
VIAVersatile Interface Architecture (on chip bus structure)
Copper plated, drilled connection between layers in a PWB
WCDMAWide Band Code Division Multiple Access, Third Generation (3G) of Mobile Tel-
ephones
ZocusZero Ohm Current Sensor, Current measuring device. It measures the current
from and to the battery . It is used by the EM SW for calculating the left over pow-
a. The nominal voltage is defined as being 15% higher than lower extreme voltage. TA will test with this nominal voltage
at an 85% range (0.85 x 3.9V ª 3.3V)
b. This limit is set to be above SW shutdown limit in TA.
b
c
d
c. During fast charging of an empty battery, this voltage might exceed this value. Voltages between 4.20 and 4.60 might
appear for a short while
d. The minimum Battery cell voltage required for the reset circuitry to turn on. This is not confirmed by measures at pt..
■ Temperature conditions
(1) Operational temperature range (all specifications met within this range)
–10°C +55°C
(2) Functional temperature range (Reduced performance)
–30°C +70°C
Temperatures at –10°C, +25°C and +55°C are used for cpk analysis.
The baseband module complies with the SPR4 Operating Conditions.
■ Humidity
Relative humidity range is 5...95%.
The BB module is not protected against water . Condensed or spla shed water might cause mal-
function. Any submerge of the phone will cause permanent damage. Long-term high humidity,
with condensation, will cause permanent damage because of corrosion.
The baseband module complies with the SPR4 Operating Conditions.
■ Vibration
The baseband module complies with the SPR4 Operating Conditions.
■ ESD strength
The baseband module complies with the SPR4 Operating Conditions.
The BaseBand Engine consists of the TEMS (TikuEdge Memory Stacked Package) concept
and UEMEK. The TEMS concept combines all memory components in one package, which is
stacked on top of the TikuEdge. The memory combines 128Mbit NOR Flash, 512Mbit NAND
Flash and 128Mbit SDRAM in one package. The TikuEdge is also implemented in a stacked
package in which all pin connections are available on bottom pinout, and memory interface on
top pin out (POP I/F).
The energy manegement related part of the microBB4.5 engine is the UEMEK.
RTC Circuitry
Therefore a voltage regulator is used to supply the RTC circu it via the battery . The circu it looks
as follows:
Figure 1: RTC supply circuit
This is used in sleep mode where it is able to source 3mA. The supply VBAT_PA is byp assing
the HW switch, and therefore will have contact to the battery also whe n the SIM drawer is pulled
out.
The circuit will give a long back up time. Capacity on the battery when it has been discharged
to engine cut off (3,1V) is still 2.2mAh before battery voltage reaches 2,9V. This gives a back
up time of approx: