Nokia 7260 Service Manual 07 rm17 sysmod

Nokia Customer Care

7 - System Module

ISSUE 1 09/2004 COMPANY CONFIDENTIAL

RM-17

Nokia Customer Care 7 - System Module

[This page intentionally blank]

2 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

Table of Contents

Page No

Glossary of Terms............................................................................................... 7

Baseband ........................................................................................................... 10

Block diagram .................................................................................................. 11

Environmental Specifications.......................................................................... 13

Absolute maximum ratings............................................................................... 13

Temperature conditions ................................................................................... 13

Humidity and water resistance......................................................................... 13

Frequencies in baseband................................................................................. 14

PWB................................................................................................................. 14

Characteristics of the PWB ............................................................................ 14

Key components ............................................................................................ 14

Technical Specifications .................................................................................. 16

Baseband core................................................................................................. 16

UPP ................................................................................................................ 16

UEMEK .......................................................................................................... 16

External SRAM and Flash .............................................................................. 16

Energy management........................................................................................ 17

Modes of operation ........................................................................................ 17

No Supply ...................................................................................................... 17

Backup ........................................................................................................... 17

Acting Dead ................................................................................................... 17

Active ............................................................................................................. 17

Sleep Mode .................................................................................................... 18

Charging ........................................................................................................ 18

Power distribution ............................................................................................ 18

DC characteristics............................................................................................ 19

Supply voltage ranges ................................................................................... 19

Baseband regulators ...................................................................................... 19

Function Groups ............................................................................................... 21

Battery.............................................................................................................. 21

Audio................................................................................................................ 21

Internal microphone ....................................................................................... 21

Internal speaker ............................................................................................. 22

IHF speaker ................................................................................................... 23

External audio ................................................................................................ 23

External microphone connection .................................................................... 23

Headset connections ..................................................................................... 23

Test possibilities ............................................................................................. 23

Camera ............................................................................................................ 23

Key features ................................................................................................... 24

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 3

RM-17

Nokia Customer Care 7 - System Module

Specifications ................................................................................................. 25

CCP bus ......................................................................................................... 25

CCI bus .......................................................................................................... 25

UIF bus .......................................................................................................... 26

Clocks ............................................................................................................ 26

Test possibility ............................................................................................... 26

Vibra................................................................................................................. 26

Test possibility ............................................................................................... 26

LCD module ..................................................................................................... 26

Characteristics ............................................................................................... 27

LCD connector ............................................................................................... 28

Test possibility ............................................................................................... 29

Keypad............................................................................................................. 29

Test possibility ............................................................................................... 29

Illumination....................................................................................................... 30

Test possibility ............................................................................................... 30

SIM................................................................................................................... 30

Test possibility ............................................................................................... 31

FM radio........................................................................................................... 31

Function ......................................................................................................... 32

Test Possibility ............................................................................................... 32

IR Module......................................................................................................... 32

Interfaces ........................................................................................................... 34

BB-RF interface ............................................................................................... 34

System connector interface ............................................................................. 34

System connector .......................................................................................... 34

ACI ................................................................................................................. 35

FBUS ............................................................................................................. 35

VOUT ............................................................................................................. 35

DC plug .......................................................................................................... 36

Component Placement Hints ........................................................................... 37

Power switch (S2419) ...................................................................................... 38

Helgo RF-chip (N7500) .................................................................................... 38

Camera socket (X1470) ................................................................................... 39

Hardware accelerator (D1470)......................................................................... 39

UEM (D2800) ................................................................................................... 40

Flash (D3000) .................................................................................................. 40

SIM card reader (X2700) ................................................................................. 40

System connector (X2002) .............................................................................. 40

UEM (D2200) ................................................................................................... 41

Battery connector (X2000) ............................................................................... 41

Label placement............................................................................................... 42

RF Module Description ..................................................................................... 43

General specifications of the transceiver ......................................................... 44

4 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

Frequency concept .......................................................................................... 45

RF power supply configuration ........................................................................ 45

RF block diagram............................................................................................. 46

Antenna switch (TX/RX switch)........................................................................ 47

Receiver ......................................................................................................... 48

Transmitter ..................................................................................................... 48

Frequency synthesizer ................................................................................... 48

Signal paths ..................................................................................................... 49

Receiver signal paths ..................................................................................... 49

Transmitter signal paths ................................................................................. 51

Frequency synthesizer signals ....................................................................... 52

Printed Wiring Board ........................................................................................ 53

RF key component placement ......................................................................... 54

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 5

RM-17

Nokia Customer Care 7 - System Module

[This page intentionally blank]

6 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

Glossary of Terms

ACI Accessory Control Interface

ADC Analogue to Digital Converter

AFC Automatic Frequency Control

ASIC Application Specific Integrated Circuit

ASM Antenna switch module

BB Baseband

BSI Battery Size Indicator

DCT4 Digital Core Technology, generation 4

DSP Digital Signal Processor

DUT Device under test

EDGE Enhanced Data Rates for Global Evolution

EGPRS Enhanced General Packed Radio Service

EMC Electro Magnetic Compatibility

ESD Electro Static Discharge

FC Functional Cover

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packed Radio Service

GSM Global System for Mobile Communication

GSM900 GSM900 (channels 1 - 124)+extended GSM900

(channels 975 - 1023, 0)

HSCSD High Speed Circuit Switched Data

HW Hardware

IF Interface

IHF Integrated Hands Free

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 7

RM-17

Nokia Customer Care 7 - System Module

IMEI International Mobile Equipment Identity

I/O Input/Output

IR Infrared

IrDA Infrared Data Association

LCD Liquid Crystal Display

LED Light Emitting Diode

LDO Low Drop Out

LNA Low Noise Amplifier

LO Local Oscillator

MCU Micro Controller Unit

PA Power Amplifier

Phoenix SW tool of DCT4

PLL Phase Locked Loop

PWB Printed Wired Board

RF Radio Frequency

RTC Real Time Clock

RX Receiver

SA Spectrum analyzer

SIM Subscriber Identification Module

SW Software

TP Test point

TX Transmitter

UEMEK Universal Energy Management ASIC enhanced version

UI User Interface

UPP Universal Phone Processor

USB Universal Serial Bus

8 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

VBU

<COFF>

Back-up Battery Cut Off voltage (typical: 2.0 V)

VCO Voltage controlled oscillator

VCTCXO Voltage controlled temperature compensated oscillator

<MSTR+>

Master Reset Threshold (typical: 2.1 V)

8-PSK Phase Shift Keying with 8 states (Modulation scheme for EDGE/

EGPRS)

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 9

RM-17

Nokia Customer Care 7 - System Module

Baseband

The RM-17 product is a DCT4.5 Fashion segment phone. It is a triple band EGSM900/ GSM1800/GSM1900 phone.

The HW has the following features:

• GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also in (3RX + 1TX) (MCS6)

• DCT4 with AMR and 16 MIDI tones

• 128/16 Mbit Combo memory

• Amazon Active display with 64k colours

• Battery BL-5B

• PopPort

• 5-way navigation key with select

interface

•VGA Camera

•Vibra

•IHF

• FM radio

• IR module

• Back-up battery

The RM-17 BB is based on the DCT4/4.5 engine and is compatible to the PopPort ries. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal Energy Management IC including voltage regulators, charge control and audio circuits, audio IHF amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU, DSP and RAM from DCT4).

accesso-

10 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

■ Block diagram

Figure 1: Baseband block diagram

Camera

LCD

ctive TFD colour

LED drivers

Battery

BL-5B

Backup bat

SIM

RF Interface

FLASH

128 Mbit

SRAM

16 Mbit

UEMEK

UPP8M

Keyboard

Illumination

VIBRA

IR Int

IHF

Charger

DC ack

System connector

Pop-Port

FM-Radio

UEMEK supplies both baseband and RF with power via built in voltage regulators, which are connected to the battery. The RF parts use mainly 2.78 V and the baseband parts 1.8V I/O voltage. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or 1.5V. UEMEK includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. The UEMEK is furthermore supplying the SIM interface with a programmable voltage of 1.8V or 3V.

Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.

UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is divided by two down to the nominal system clock frequency of 13 MHz. The DSP and MCU contain PLLs, which can multiply the system clock to a higher frequency.

A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz clock supply as the sleep clock.

The communication between UEMEK and UPP is implemented using two bi-directional serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1 MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz. Both processors are located in the UPP.

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 11

RM-17

Nokia Customer Care 7 - System Module

The UEMEK ASIC handles the analog interface between the Baseband and the RF section. UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEMEK supplies the analog TXC and AFC signals to the RF section according to UPP signal control. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC.

UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are running from the analog supply 2.78V. Also VBAT is directly used (Vibra, LED-driver, Camera Regulator, FCI).

The Baseband supports both internal and external microphone inputs and speaker outputs. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEMEK for decoding. An external vibra alert control signals are generated by the UEMEK with separate PWM outputs.

EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.

12 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

Environmental Specifications

■ Absolute maximum ratings

Table 1: Absolute maximum ratings

Signal Note

Battery Voltage (Idle) -0.3…5.5V

Battery Voltage (Call) Max 4.8V

Charger Input Voltage -0.3V …16V

■ Temperature conditions

Table 2: Temperature conditions

Condition Min Max

Normal operating temperature -10°C+55°C Reduced functionality -25°C+75°C Storage -40°C+85°C

■ Humidity and water resistance

Table 3: Humidity conditions

Condition Min Max

Relative Humidity 5% 95%

The module is not protected against water.

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 13

RM-17

Nokia Customer Care 7 - System Module

■ Frequencies in baseband

Table 4: Frequencies in baseband

Frequency Context UPP UEMEK Flash SIM Comment

32 kHz SleepClk X

1 MHz CBUS X X

Up to 1 MHz RFConvClk X X Estimation

6,5 MHz Display IF X

3,25 MHz SIMIF X X Min

13 MHz DBUS, RFBUClk X X

26 MHz RF Clk X

52 MHz Memory Clock X X

■ PWB

Characteristics of the PWB

•Single PWB

• 8 layer board

• Double side assembled

Key components

Figure 2: Key components

14 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

Table 5: Key components

Position Component Name Code

D1470 HW Accelerator 4377033

D2800 UPP8M v 3.5 4371105

D2200 UEMEKv2.0 4376371

D3000 Combo Memory (128M NOR + 16M UTRAM) 4347043

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 15

RM-17

Nokia Customer Care 7 - System Module

Technical Specifications

■ Baseband core

UPP

Main characteristics of the used UPP are:

• DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz

• MCU based on ARM7 RISC MCU core max 50 MHz

• Internal 8 Mbit SRAM (PDRAM)

• General purpose UARTS

• SIM card interface

• Accessory interface (ACI)

• Interface control for Keypad, LCD, Audio and UEM control

• Handling of BB-RF Interface

UEMEK

Main characteristics of the used UEMEK are:

• ACI support

• Audio codec

• 11 Channel A/D converter

• Auxiliary A/D converter

• 32 KHz crystal oscillator

• SIM interface and drivers

• Security logic

• Storage of IMEI code

• Buzzer and vibra motor PWM drivers

• 2 LED drivers, keyboard and display backlight drivers

• Voltage reference for analogue blocks

• Charging function

• Baseband regulators

• RF regulators

• RF interface converters

External SRAM and Flash

The Combo-Memory is a multi chip package memory which combines 128 Mbit (8Mx16) muxed burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM with SRAM interface).

16 COMPANY CONFIDENTIAL ISSUE 1 09/2004

RM-17

7 - System Module Nokia Customer Care

The combo is supplied by single 1,8 V for read, write and erase operations. For accelerated flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device.

The combo memory is housed in a 44-ball FBGA.

■ Energy management

The energy management of RM-17 is based on BB 4.0 architecture. A so-called semi fixed battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF PA. The UEMEK includes several regulators to supply RF and Baseband. It provides energy management including power up/down procedure. (If the main battery is not present, a cell capacitor maintains backup power supply for the RTC part of UEMEK.)

Modes of operation

The baseband engine has six different functional modes: Since the UEMEK controls the regulated power distribution; each of these states affects the general functionality of the phone.

1. No supply

2. Backup

3. Acting Dead

4. Active

5. Sleep

6. Charging

No Supply

In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the disconnection of the main battery and backup battery or low battery voltage level in both of the batteries.

The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. The battery voltage can rise either by connecting a new battery with VBAT > V necting charger and charging the battery above V

MSTR+

or by con-

Backup

In BACKUP mode the backup battery has sufficient charge but the main battery can be discon- nected or empty (VBAT < V

and VBACK > VBU

MSTR

COFF

The VRTC regulator is disabled in BACKUP mode. VRTC output is supplied without regulation from the backup battery (VBACK). All the other regulators are disabled.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery-charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.

Active

In Active mode, the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 17

+ 39 hidden pages