Nokia 6590 Service manual

Page 1
Customer Care Solutions (CCS)
Technical Documentation
SERVICE
MANUAL
[NMP Part No. 0275637]
NSM-9DX
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 2
Customer Care Solutions (CCS)
Technical Documentation

Amendment Record Sheet

Amendment No Date Inserted By Comments
06/2002 JoM First Draft 10/2002 ViK Issue 1
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 3
Contents:
Customer Care Solutions (CCS)
Technical Documentation

NSM-9DX Overall Manual Contents

Section 1: Foreword Section 2: General Information Section 3: System & UI Module LU9 Section 4: Parts List Section 5: Product Variants Section 6: Service Software Instructions & Service Co nc epts Section 7: Service Tools Section 8: Assembly & Disassembly Instructions Section 9: Troubleshooting Instructions Section 10: Accessories Section 11: Schematic Diagrams
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 4
Customer Care Solutions (CCS)
This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins.
While every endeavour has been m ade to ensure the accuracy of this do cument, some errors may exist. If any errors are found by th e reader, NOKIA CORPORATION. should be notified in writing.
Please state:
Technical Documentation

IMPORTANT

Title of the Document + Issue Number/Date of publication Latest Amendment Number (if applicable) Page(s) and/or Figure(s) in error
Please send to: Nokia Corporation / Nokia Mobile Phones
CCS Technical Documentation PO Box 86 FIN-24101 SALO Finland
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 5
Customer Care Solutions (CCS)
Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide for instructions relating to operation, care and maintenance including important safety information.
Note also the following:
Warnings:
1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELEC­TRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYS­TEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
2. THE HANDPO RTABLE TELE PHONE MU ST NOT BE OPERATED IN AREAS LIKELY
3. OPERATION OF ANY RADIO T RA N SMITTING EQUIPMENT, INCLUDING CELLU-
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti-static workstation and that an anti-
3. Ensure sold er, wire, or foreign mat ter does not ent er the te lephone as dam-
4. Use only approved components as specified in the parts list.
5. Ensure all compo nents, modules screws and insulators are correctly re-fit-
TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADE­QUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
static wrist strap is worn.
age may result.
ted after servicing and alignmen t. Ensure all cables and wires are r eposi­tioned correctly.
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 6
Customer Care Solutions (CCS)
Technical Documentation
This page intentionally left blank.
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 7
CCS Technica l Documentation
NSM-9DX Series Transceivers

General Information

Issue 1 10/02 ¤Nokia Corporation
Page 8
NSM-9DX
General Information CCS Technical Documentation

Table of Contents

Page No
The Product.................................................................................................................... 3
Hand portable ...............................................................................................................3
Desktop Option ............................................................................................................4
Product and Module List .............................................................................................5
General Specifications of Transceiver NSM-9DX ......................................................6

List of Figures

Page No
Fig 1 Hand portable .............................................................................................................3
Fig 2 Desktop option............................................................................................................4
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 9
NSM-9DX
CCS Technical Documentation General Information

The Product

The NSM-9DX is a dual band hand portable mobile telephone for GSM 850/1900 net­works. It is a GSM 850/1900 power class 1 (1W) transceiver. The main transceiver fea­tures are:
High resolution B&W display (96 x 65 pixels)
Full graphic display
•GPRS
Integrated IR link & internal data
Internal vibra
Integrated FM Radio
Plug & play HF support
Plug-in SIM card below the battery of the phone
Integrated antenna
Jack style UI with two soft keys
TTY support

Hand portable

Figure 1: Hand portable
1, NSM-9DX
4. ACP-12E
2.
HDC–5
3. ACP-12U
3. ACP-12AR
Table 1: Ha nd portabl es
Item Name Type code Material code
1 Transceiver See Product Variants
Standard battery Li-ion BLB-2 0670246 2 Headset HDC-5 0694059 3 StandardCha rger (USplug) 108-132 Vac ACP-12U 0675303
StandardCharger (USplug) 198-242 Vac ACP-1 2E 0675294 4 StandardCharger (Europlug) 207-253 Vac ACP-12AR 0675298 5 Standard Travel Charger ACP-7
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 10
NSM-9DX
General Information CCS Technical Documentation

Desktop Option

The desktop option allows the user to charge the phone from the mains. Besides these optional chargers also ACP-8 can be used.
Figure 2: Desktop option
1. NSM-9DX
2. DCD-1 Desk Stand
4. ACP-12E
3. ACP-12U
Table 2: Desktop options
Item Name: Type Code: Material Code:
1. Transceiver (See Product Variants) See Product Variants 2 Desk stand DCD-1 0675253
3. Travel Charger (
4. Travel Charger (US plug) 90-264 Vac ACP-8U 0675303
Travel Charger (AR-plug) ACP-12AR
Euro plug) 90-264 Vac ACP-12E 0675294
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 11
NSM-9DX
CCS Technical Documentation General Information

Product and Module List

Table 3: Product and module list
Unit/type Product code
NSM-9DX Transceiver See Product Variants BLB-2 Standard Battery Li-ion 0670322 ACP-7E Travel Charger (EUR) 207-253 Vac 0675144 ACP-7U Standard Charger (US) 108-132 Vac 0675143 ACP-7C Standard Charger (US) 198-242 Vac 0675158 ACP-8E Rapid Charger (EUR) 90-264 Vac 0675195 ACP-8U Travel Charger (US) 90-264 Vac 0675196 ACP-12E Travel Charger
ACP-12U Travel Charger ACP-12AR Travel Charger
LCH-9 Rapid Cigarette Lighter Charger 0675120 MBD-10 Mobile Holder 0630409 DCD-1 Desktop Stand 0675253 DDC-1 Battery Charging Stand 067526 1 HDC-5 Headset Kit (with answer and end button) 0694059 LPS-3 Loopset 0630244 HDB-5 Boom Headset 0694107 HDD-1 Dual Headset 0694066 HDE-2 Headset Kit 0694075 HDA-9 TTY/TTD Phone Adapter 06941 1 6 CARK-130 Express Carkit (PPH-1, HFM-8, MBD-10, HHS-15) 0080539 CARK 132 Full Carkit (MCC-5 , HHS-9, MKU -1, HFU - 5, HFS-12, HFM-8, PCH-4) 008519 8 PPH-1 Plug-in HF Car Kit 0675182
0675294 0675303 0675298
MKU-1 Mounting Plate 0620036 HHS-9 Swivel Mount 0620037 HFM-8 HF Microphone 0690016
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 12
NSM-9DX
General Information CCS Technical Documentation

General Specifications of Transceiver NSM-9DX

Table 4: NSM-9DX General Specifications
Parameter GSM850/1900
Receive frequency range 869...894 MHz / 1930…1990 MHz Transmit frequency range 824...849 MHz / 1850…1910 MHz Duplex spacing 45 / 80 MHz Channel spacing 200 kHz Number of RF channels 124 / 299 Power class 4(2W)/1(1W) Number of power levels 15 / 16 Sensitivity, Static channel -102 dBm Frequency error, static channel <0.1ppm RMS Phase error <5.0° Peak phase error <20.0°
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 13
CCS Technica l Documentation
NSM-9DX Series Transceivers

System Module & UI

Issue 1 10/02 ¤Nokia Corporation
Page 14
NSM-9DX
System Module & UI CCS Technical Documentation

Table of Contents

Transceiver NSM-9DX.................................................................................................. 4
Introduction ..................................................................................................................4
Electrical Modules..................................................................................................... 4
Operation Modes....................................................................................................... 4
Interconnection Diagram .............................................................................................5
System Module HG9...................................................................................................... 6
Baseband Module ........................................................................................................6
Block Diagram .............................................................................................................7
Technical Summary................................................................................................... 8
DC Characteristics .......................................................................................................9
Regulators and Supply Voltage Ranges.................................................................... 9
External and Internal Signals and Connections....................................................... 10
Internal Signals and Connections............................................................................ 10
External Signals and Connections .............................................................................16
UI (board-to-board) connector ................................................................................ 16
LCD connector........................................................................................................ 16
DC connector........................................................................................................... 18
Headset connector ................................................................................................... 18
Functional Description ...............................................................................................20
Modes of Operation................................................................................................. 20
Supply Voltage Regulation ..................................................................................... 21
Battery..................................................................................................................... 22
Power Up and Reset................................................................................................ 22
A/D Channels.......................................................................................................... 23
IR Module ............................................................................................................... 23
SIM Interface........................................................................................................... 24
Buzzer...................................................................................................................... 25
Internal Microphone................................................................................................ 25
UPP.......................................................................................................................... 26
Memory Block......................................................................................................... 26
RF Module ................................................................................................................... 28
DC characteristics ......................................................................................................29
Regulators................................................................................................................ 29
RF characteristics .......................................................................................................31
Transmitter characteristics ...................................................................................... 31
Receiver characteristics........................................................................................... 31
Frequency synthesizers ..............................................................................................32
Receiver .....................................................................................................................33
Transmitter .................................................................................................................35
AFC function .............................................................................................................36
DC-compensation ......................................................................................................36
UI Board LK5 .............................................................................................................. 37
LCD & Keypad Illumination .....................................................................................37
Internal Speaker .........................................................................................................38
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 15
NSM-9DX
CCS Technical Documentation System Module & UI
List of Figures
Page No
Fig 1 Baseband Block Diagram...........................................................................................7
Fig 2 BLB-2 battery pack pin order.....................................................................................22
Fig 3 UPP & UEM SIM connections...................................................................................25
Fig 4 Microphone connection..............................................................................................26
Fig 5 RF Frequency Plan .....................................................................................................28
Fig 6 Power Distribution Diagram.......................................................................................30
Fig 7 RF Block Diagram......................................................................................................32
Fig 8 Frequency synthesizers...............................................................................................33
Fig 9 Display and keypad illumination circuitry. ................................................................37
Fig 10 Speaker Connection..................................................................................................38
List of Schematics
RF & BB ...................................... ................................................ ....................................................................A-1
RF ..........................................................................................................................................................A-2
BB Connections .................................. ................................. .................................. ............................................A-3
System Connector ............................................................................................................................................A-4
Audio Interface .................................................................................................................................................A-5
UEM of BB ..........................................................................................................................................................A-6
UEM VBAT Filtering ..................................................................................................... .....................................A-7
Display and Keyboard Interface ........................ ...........................................................................................A-8
Infrared Module ................................................................................................................................................A-9
SIM Reader ..................................... ..................................................................................................................A-10
UPP of BB ......... .................................. ................................. ............................................................................A-11
Decoupling Capacitors of UPP......................................................... ............................................................A-12
RF - BB Interface.............................................................................................................................................A-13
Flash Memory................................... .................................. ................................. .............................................A-14
Decoupling Capacitors for Flash Memory ................................................................................................A-15
Production Test Pattern.................................................................................................................................A-16
Layout Diagram of HG9 - Top......................................................................................................................A-17
Layout Diagram of HG9 - Bottom..............................................................................................................A-18
Testpoints of HG9 - Top................................................... ..............................................................................A-19
Testpoints of HG9 - Bottom................................................................................. ........................................A-19
Testpoints of HG9 - Top................................................... ..............................................................................A-20
Testpoints of HG9 - Bottom................................................................................. ........................................A-20
UI Board - LK5...................................................................... ............................................................................A-21
Layout Diagram - LK5 .......... ................................. .................................. .......................................................A-22
RF Testpoints Diagram ................................................................................................... ................................A-23
RF Testpoints - PWB layout.......................................................................... ................................................A-24
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 16
NSM-9DX
System Module & UI CCS Technical Documentation

Transceiver NSM-9DX

Introduction

The NSM-9DX is a dual band radio transceiver unit for GSM850/1900 networks. The GSM1900 power class is 1 and the GSM850 power class is 2. It is a true 3 V transceiver, with an internal antenna and vibra.
The transceiver has a full graphic display and the user interface is based on a Jack III style UI with two soft keys.
An internal antenna is used, there is no connection to an extern al antenna. The transceiver has a low leaka ge toler ant earpiec e and an omnidire ctional mi crophone,
providing an excellent audio quality. The transceiver supports a full rate, and an enhanced full rate speech decoding.
An integrated IR link provides a connection between two NSM-9DX transceiver or a transceiver and a PC (internal data), or a tr ansceiver and a printer.
The small SIM (Subscriber Identity Module) car d is locate d under the batter y. SIM inter­face supports both 1.8 V and 3 V SIM cards.
Electrical Modules
The radio module consists of Radio Frequency (RF) and baseband (BB). User Interface (UI) contains display, keyboard, IR link, vibra, HF/HS connector and audio parts. UI is divided into radio module PWB HG9 and UI PWB LK5.
The electrical part of the keyboa rd is located in separate UI PWB named LK5. LK5 is con­nected to radio PWB through spring connectors.
The System blocks provide the MCU, DSP, external memory interface and digital control functions in UPP ASIC (Universal Phone Processor). Power supply circuitry, charging, audio processing and RF control hardware are in UEM ASIC (Universal Energy Manage­ment).
The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.
Operation Modes
The transceiver has six different operation modes:
power off mode
•idle mode
active mode
charge mode
local mode
test mode
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 17
NSM-9DX
CCS Technical Documentation System Module & UI
In the power off mode circuits are powered down and only sleep clock is running. In the idle mode only the circuits needed for power up are supplied. In the active mode all the circuits are supplied with power although some parts might be
in the idle state part of the time. The charge mode is effectiv e in parallel w ith all previous mo des. The ch arge mode itself
consists of two different states, i.e. the fast charge and the maintenance mode. The local and test modes are used for alignment and testing.

Interconnection Diagram

SIM
Antenna
Keyboard module
Radio Module HG9
MIC IR Link Earpiece HF
Display
Battery
Charger
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 18
NSM-9DX
System Module & UI CCS Technical Documentation

System Module HG9

Baseband Module

The baseband architecture supp orts a power saving function called "sleep mode ". This sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is waken up by a timer running from this 32 kHz clock supply. The sleep time is determined by network parameters. Sleep mode is e ntered when both the MCU and the DSP are i n standby mode and the normal VCTCXO clock is switched off.
NSM-9DX supports both three and tw o w ire t ype of Nok ia charge rs. Three w ire char ger s are treated like two wire ones. There is not separate PWM output for controlling charger but it is connected to GND inside the bottom connector. Charging is controlled by UEM ASIC (Universal Energy Management) and EM SW running in the UPP (Universal Phone Processor).
The BLB-2 Li-ion battery is used as the power source for the phone.
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 19
NSM-9DX
CCS Technical Documentation System Module & UI

Block Diagram

Figure 1: Baseband Block Diag ram
Issue 1 10/02 ¤Nokia Corporation Page 7
Page 20
NSM-9DX
System Module & UI CCS Technical Documentation
UPP ASIC (Universal Phone Processor) provides the MCU, DSP, external memory interface and digital control functions. UEM ASIC (Universal Energy Management) contains power supply circuitry, charging, audio processing and RF control hardware.
Technical Summary
Baseband is running from power rails 2.8 V analog voltage and 1.8 V I/O voltage. UPP core voltage Vcore can be lowered down to 1.0 V, 1.3 V and 1.5 V. UEM includes 6 linear LDO (low drop-out) regulators for baseband and 7 regulat ors for RF. It also include s 4 current sources for biasing purposes and internal usage. UEM also includes SIM interface which supports both 1.8 V and 3 V SIM cards. 5 V SIM cards are not supported by the NSM-9DX baseband.
A real time clock function is integrated into the UEM which utilizes the same 32 kHz clock supply as the sleep clock.
The analog interface between the baseband and the RF section is handled by a UEM ASIC. UEM provides A/ D a nd D/A conv ersi on of the in-phase and quadrat ure re ce ive a nd transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEM supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control. Data transmission between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and CBUS for MCU. RF ASIC, Hagar, is controlled through UPP RFBUS serial interface. There is also separate signals for PDM coded a udio. Digital speech processing is handled by the DSP in side UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from the baseband supply 1.8 V and the analog parts are running from the analog supply
2.78 V also VBAT is directly used by some blocks. The baseband supports both internal and external microphone inputs and speaker out-
puts. Input and output signal source selection and gain control is done by the UEM according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEM for decoding. Buzzer and external vibra aler t control signals are generated by the UEM with separate PWM outputs.
NSM-9DX has two external serial control interfaces: FBUS and MBUS. These busses can be accessed only through production test pattern.
EMC shielding for baseband is implemented using a silicon pl astic frame and UI PWB ground plane. On the other side the engine is shielded with PWB grounding. Heat gener­ated by the circuitry will be conducte d out via the PWB ground planes.
NSM-9DX radio module is implemented to 8 layer PWB. UI module is divided between main PWB HG9 and separate UI PWB LK5.
NSM-9DX also incudes an integra ted FM-radi o in one chip. Onl y a few e xternal compo­nents are needed.
Page 8 ¤Nokia Corporation Issue 1 10/02
Page 21
NSM-9DX
CCS Technical Documentation System Module & UI

DC Characteristics

Regulators and Supply Voltage Ranges
Table 1: Battery voltage range
Signal Min. Nom Max Note
VBAT 3.1V 3.6V 4.2V (chargin g hi gh l i mit v o l t ag e) 3.1 V SW cut off
Table 2: BB Regulators
Signal Min. Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
VFLASH2 2.70V 2.78V 2.86V I
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.8V
3.0V
1.053V
1.3V
1.5V
1.8V
1.855V
3.09V
1.106V
1.365V
1.575V
1.890V
max
max
I
Sleep
I
max
I
Sleep
max
I
Sleep
max
I
Sleep
I
max
I
Sleep
Default value = 1.5V
Table 3: RF Regulators
Signal Min. Nom Max Note
= 80mA = 70mA
= 1.5mA = 25mA
= 0.5mA = 40mA
= 1.5mA
= 150mA
= 0.5mA
= 200mA
= 0.2mA
VR1A 4.6V 4.75V 4.9V Imax = 10mA
VR2 2.70V
3.20V VR3 2.70V 2.78V 2.86V Imax = 20mA VR4 2.70V 2.78V 2.86V Imax = 50mA
VR5 2.70V 2.78V 2.86V Imax = 50mA
2.78V
3.3V
2.86V
3.40V
Imax = 100mA
ISleep = 0.1mA
ISleep = 0.1mA
Issue 1 10/02 ¤Nokia Corporation Page 9
Page 22
NSM-9DX
System Module & UI CCS Technical Documentation
Table 3: RF Regulators
Signal Min. Nom Max Note
VR6 2.70V 2.78V 2.86V Imax = 50mA
ISleep = 0.1mA
VR7 2.70V 2.78V 2.86V Imax = 45mA
External and Internal Signals and Connections
This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that covers a connector or a defined interface.
Internal Signals and Connections
Table 4: Internal micr ophone
Signal Min. Nom Max. Condition Note
MICP
2.0V 2.1V
MICN 2.0V 2.1V 2.25V DC
200mV
pp
2.25 V DC
AC
Table 5: Internal speaker
Signal Min. Nom Max Condition Note
EARP 0.75V 0.8V 2.0 V
0.85V
EARN 0.75V 0.8V 2.0 V
0.85V
pp
pp
AC DC
AC DC
Differential output
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal name
From To Parameter Min. Type Max Unit Function
2.2kto MIC1B
(V
= 4.0 Vpp)
diff
VBAT Battery PA &
UEM
Voltage 2.95 3.6 4.2 V Battery supply. Cut-off Current 2000 mA Current drawn by
PA when "off"
0.8 2 uA
level of DCT4 regulators is 3.04V. Losses in pwb tracks and ferrites are taken account to mini­mum battery voltage level.
Page 10 ¤Nokia Corporation Issue 1 10/02
Page 23
NSM-9DX
CCS Technical Documentation System Module & UI
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal name
VR1A UEM VCP Voltage 4.6 4.75 4.9 V Supply for varactor for
VR2 UEM VRF_TX Voltage 2.70 2.78 2.86 V Supply for part of trans-
VR3 UEM VCTCXOVoltag e 2.70 2.78 2.86 V Supply for VCTC X O
From To Parameter Min. Type Max Unit Function
Current 2 10 mA Noise density 240 nVrm
s/ sqrt( Hz)
Current 65 100 mA Noise density
f=100Hz f>300Hz
Current 1 20 mA Noise density 240 nVrm
120 nVrm
s/ sqrt( Hz)
s/ sqrt( Hz)
UHF VCO tuning.
mit strip. Supply for TX I/Q-modulators.
VR4 UEM VRF_RXVoltage 2.70 2.78 2.86 V Supply for Hagar RX;
Current 50 mA Noise density
f = 6 Hz f = 60 Hz f y 600Hz
VR5 UEM VDIG,
VPRE, VLO
VR6 UEM VBB V oltage 2.70 2.78 2.86 V Supply for Hagar BB and
Voltage 2.70 2.78 2.86 V Supply for Hagar PLL; Current 50 mA Noise density
BW=100Hz... 100kHz
Current 50 mA Noise density
BW=100Hz... 100kHz
5500 550 55
240 nVrm
240 nVrm
nVrm s/ sqrt( Hz)
s/ sqrt( Hz)
s/ sqrt( Hz)
preamp., mixer, DTOS Noise density decades 20 dB/dec from 6Hz to 600Hz. From f >600Hz maximum noise density
RMS
//Hz.
55nV
dividers, LO­buffers, prescaler,
LNA
Issue 1 10/02 ¤Nokia Corporation Page 11
Page 24
NSM-9DX
System Module & UI CCS Technical Documentation
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal name
VR7 UEM UHF
VrefRF01UEM VREF_RXVoltage 1.334 1.35 1.366V Voltage Reference for
VrefRF02UEM VB_EXTVoltage 1.323 1.35 1.377V Supply for RF-BB digital
From To Parameter Min. Type Max Unit Function
Voltag e 2.70 2.78 2.86 V Supply for UHF VCO
VCO
Current 30 mA Noise density
100Hz<f<2 kHz 2kHz<f<10 kHz 10kHz<f<30 kH z 30kHz<f<90 kHz 90kHz<f<3 MHz
Current 100 uA Temp Coef -65 +65 uV/C Noise density
BW=600Hz... 100kHz
Current 100 uA
70 55 35 30 30
60 nVrm
nVrm s/ sqrt( Hz)
s/ sqrt( Hz)
RF-IC.
Note: Below 600Hz noise density is allowed to increase 20 dB/oct
interface and some digi­tal parts of RF.
Temp Coef -65 +65 uV/C Noise density
BW=100Hz... 100kHz
Table 7: AC and DC characteristics if RF-BB signals
Signal name From To Parameter
TXP
(RFGenOut3)
UPP PA & RF-IC "1" 1.38 1.88 V Transmitter
"0" 0 0.4 V
Load Resistance 10 220 kohm
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
350 nVrm
s/ sqrt( Hz)
Input characteristics
Min
Type Max Unit
Function
power
amplifier
enable / D C
N2 timing
Page 12 ¤Nokia Corporation Issue 1 10/02
Page 25
NSM-9DX
CCS Technical Documentation System Module & UI
Table 7: AC and DC characteristics if RF-BB signals
Input characteristics
Signal name From To Parameter
Min
RFBusEna1X UPP RF-IC "1" 1.38 1.88 V RFbus
"0" 0 0.4 V
Current 50 uA
Load resistance 10 220 kohm
Load capacitance 20 pF
RFBusData UPP RF-IC "1" 1.38 1.88 V RFbus data;
"0" 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Type Max Unit
Function
enable
read /write
Data frequency 10 MHz
RFBusClk UPP RF-IC "1" 1.38 1.88 V RFbus clock
"0" 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz
RESET
(GENIO6)
UPP RF-IC "1" 1.38 1.85 V Reset to
Hagar
"0" 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 kohm
Timing accuracy 1/4 symbol
Table 8: AC and DC characteristics of RF-BB signals
Signal name
From To Parameter Min. Type Max. Unit Function
VCTCXO VCTCXO UPP Signal amplitude 0.2 0.8 2.0 Vpp High stability clock
Input Impedance 10 kohm
Input Capacitance 10 pF
Harmonic Content -8 dBc
Clear signal win-
dow (no glitch)
Duty Cycle 40 60 %
200 mVpp
signal for the logic
circuits, AC cou-
pled. Distorted sine
wave e.g. sawtooth.
Issue 1 10/02 ¤Nokia Corporation Page 13
Page 26
NSM-9DX
System Module & UI CCS Technical Documentation
Table 8: AC and DC characteristics of RF-BB signals
Signal name
VCTCXOGnd VCTXO UPP DC Level 0 V Ground for refer-
RXI/RXQ RF-IC UEM Differential volt-
TXIP / TXIN UEM RF-IC Differential volt-
TXQP /
TXQN
From To Parameter Min. Type Max. Unit Function
ence clock
1.35 1.4 1.45 Vpp RX baseband signal.
age swing (static)
DC level 1.3 1.35 1.4 V
I/Q amplitude
mismatch
I/Q phase mis-
match
age swing (static)
DC level 1.17 1.20 1.23 V
Source Impedance 200 ohm
UEM RF-IC Same spec as for TXIP / TXIN Differential quadra-
-5 5 deg
2.23 2.48 Vpp Programmable volt-
0.2 dB
age swing. Programmable common mode
voltage.
Between TXIP-TXIN
ture phase TX base-
band signal for the
RF modulator
AFC UEM VCTCX
O
Aux_DAC
(TxC)
RFTemp RF UEM Voltage at -20°C 1.57 V Temperature sensor
UEM RF Voltage Min.
Voltage Min.
Max
Resolution 11 bits
Load resistance
and capacitance
Step settling time 0.2 ms
Max 2.4
Source Impedance 200 ohm
Resolution 10 bits
Noise density
BW=100Hz...
100kHz
Temp Coef -65 +65 uV /C
Voltage at +25°C1.7 Voltage at +60°C 1.79
0.0
2.4
1
800 nVrms/
0.1
2.6
100
0.1 V Transmitter power
VAutomatic fre-
kohm
nF
sqrt(H
z)
quency control sig-
nal for
VCTCXO
control
NOTE: Assumed
power control
opamp G=1
of RF.
Page 14 ¤Nokia Corporation Issue 1 10/02
Page 27
NSM-9DX
CCS Technical Documentation System Module & UI
Table 8: AC and DC characteristics of RF-BB signals
Signal name
Vbase RF UEM Voltage 2.7 V Detecte d voltage
From To Parameter Min. Type Max. Unit Function
from PA power level
sensing unit
Issue 1 10/02 ¤Nokia Corporation Page 15
Page 28
NSM-9DX
System Module & UI CCS Technical Documentation

External Signals and Connections

UI (board-to-board) connector
Table 9: UI (board-to-board) connector
Pin Signal Min. Nom Max Condition Note
1 SLOWAD(2) 1.5V
0.1V 2 VBAT 3.0V 3.6V 4.2V Battery voltage for LEDs 3ROW(4) 0.7xVIO
0
4ROW(3) 0.7xVIO
0
5COL(2) 0.7xVIO
0
6ROW(2) 0.7xVIO
0
7COL(1) 0.7xVIO
0
8ROW(0) 0.7xVIO
0
9KLIGHT VBAT
10 ROW(1) 0.7xVIO
0
2.7V
1.0V
1.8V
0.3xVIO VIO
0.3xVIO VIO
0.3xVIO VIO
0.3xVIO VIO
0.3xVIO VIO
0.3xVIO
0.3xVBAT VIO
0.3xVIO
Flip closed
Flip open
High
Low
High
Low
High
Low
High
Low
High
Low
High
Low
LED off LED on
High
Low
Not used in NSM-9DX
Keyboard matrix ro w 4
Keyboard matrix ro w 3
Keyboard matrix column 2
Keyboard matrix ro w 2
Keyboard matrix column 1
Keyboard matrix ro w 0
LED control
Keyboard matrix ro w 1
11 COL(3) 0.7xVIO
0
12 COL(4) 0.7xVIO
0 13 GND 0V 14 GND 0V 15 GND 0V 16 GND 0V
VIO
0.3xVIO VIO
0.3xVIO
High
Low
High
Low
LCD connector
Table 10: LCD connector
Pin Signal Min. Nom Max Condition Note
1XRES0.8*VIO
0
100ns trw Reset active
VIO
0.22*VIO
Logic '1' Logic '0'
Keyboard matrix column 3
Keyboard matrix column 4
Reset
Active low
Page 16 ¤Nokia Corporation Issue 1 10/02
Page 29
NSM-9DX
CCS Technical Documentation System Module & UI
Table 10: LCD connector
Pin Signal Min. Nom Max Condition Note
2 XCS 0.8*VIO
0 130ns tcss XCS low before SCLK rising edge 130ns tcsh XCS low after SCLK rising edge 300ns tcsw XCS high pulse width
3GND 0V 4 SDA 0.8*VIO
0
0.7*VIO 0
100ns tsds Data setup time 100ns tsdh Data hold t ime
5SCLK0.8*VIO
0
250ns tscyc Clock cycle
11 0ns tshw Clock high
VIO
0.22*VIO
VIO
0.22*VIO VIO
0.3*VIO
VIO
0.22*VIO
4.0MHz
Logic '1' Logic '0'
Logic '1' Logic '0'
Logic '1' Logic '0'
Logic '1' Logic '0'
Max frequenc y
Chip select
Active low
Serial data (driver input)
Serial data (driver output)
Serial clock in put
6 VDDI
(VIO)
7 VDD
(VFLAS
H1)
8VOUT
110ns tslw Clock low
1.72V 1.8V 1.88V Logic voltage supply Connected to VIO
2.72V 2.78V 2.86V Voltage supply
Connected to VFLASH1
8.34 V
9V Booster output, C=1uF connected to
GND
Issue 1 10/02 ¤Nokia Corporation Page 17
Page 30
NSM-9DX
System Module & UI CCS Technical Documentation
DC connector
Table 11: DC connector
Pin Signal Min Nom Max Condition Note
2 VCHAR 7.0 V
1 CHGND 0 Charger ground
RMS
8.4 V
RMS
9.2 V
RMS
850 mA
Fast charger Charger positive input
Headset connector
Table 12: Headset connector
Pin Signal Min Nom Max Condition Note
5XMICP 1Vpp G = 0dB
100 mVpp G = 20dB
2.0 V 2.1 V 2.25 V DC
3 XMICN 1Vpp G = 0 dB
100 mVpp G = 20dB
4 XEARN 0.75V 0.8V 0.85V DC
1Vpp AC
7 XEARP 0.75V 0.8V 0.85V DC
1kto MIC2B
1k to GND
1Vpp AC
5 HookInt 0V 2.86V
(VFLASH1)
6 HeadInt 0V 2.86V (VANA) Accessory detection
Connected to UEM AD-converter
SIM connector
Table 13: SIM connecto r
Pin Name Parameter Min Type Max Unit Notes
1 VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage
3V SIM Card 2.8 3.0 3.2
2SIMRST1.8V SIM Card 0.9xVSIM
0
3V SIM Card 0.9xV SIM
0
VSIM
0.15xVSIM VSIM
0.15xVSIM
V SIM reset (output)
Page 18 ¤Nokia Corporation Issue 1 10/02
Page 31
NSM-9DX
CCS Technical Documentation System Module & UI
Table 13: SIM connecto r
Pin Name Parameter Min Type Max Unit Notes
3SIM-
CLK
4DATA 1.8V Voh
5NC 6GND GND 0 V Ground
Frequency 3.25 MHz SIM clock
Trise/Tfall 50 ns
1.8V Voh
1.8V Vol 3 Voh
3 Vol
1.8V Vol 3 Voh
3 Vol
1.8V Vih
1.8V Vil 3V Vil
3V Vil
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.7xVSIM 0
0.7xVSIM 0
VSIM V
VSIM
VSIM
0.15xVSIM VSIM
0.15xVSIM VSIM
0.15xVSIM VSIM
0.15xVSIM
V SIM data (output)
SIM data (input)
Trise/Tfall max 1us
Issue 1 10/02 ¤Nokia Corporation Page 19
Page 32
NSM-9DX
System Module & UI CCS Technical Documentation

Functional Description

Modes of Operation
HG9 baseband engine has six operating modes:
No supply
•Backup
•Acting Dead
•Active
Sleep
•Charging
No supply
In NO_SUPPLY mode the phone has no supply voltage. This mode is due to disconnection of battery or low battery voltage level.
Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise e ither by connecting a new battery wit h VBAT > V
connecting a charger and charging the battery above V
MSTR+
.
MSTR+
or by
Backup
In the backup mode, the backup battery has sufficient charge but the main battery can be disconnected or emptied (VBAT < V
disabled in the backup mode. VRTC output is supplied without regulation from the backup battery (UBACK). All the other regulators are disabled.
Acting D ead
If the phone is off when the charger is connected, the phone is powered on, but it enters a state called "Acting Dead". To the user t he phone a cts as if it was swit ched of f. A ba t­tery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the batte ry is being charged.
Active
In the active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. Ther e are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
In active mode the RF regulators are controlled by SW writing into UEM's registers wanted settings: VR1A can be enabled or disabled. VR2 can be enable d or disabled and its output voltage can be progra mmed to be 2.78V or 3. 3V. VR4 -VR7 can be en abled or disabled or forced into low quiescent current mode. VR3 is always enabled in active mode.
and VBACK > VBU
MSTR
). VRTC Regulator is
COFF
Sleep mode
Page 20 ¤Nokia Corporation Issue 1 10/02
Page 33
NSM-9DX
CCS Technical Documentation System Module & UI
Sleep mode is entered when both MCU and DSP are in stand-by mode. Sleep is controlled by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. Al l RF regulators are disabled in SLEEP. When SLEEPX=1 is detected UEM enters ACTIVE mode and all functions are activated.
The sleep mode is exited ei ther by t he expirati on of a sleep c lock counte r in th e UEM or by some external interrupt, gener ated by a charger connection, key press, headset con­nection etc.
In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the baseband.
Charging
The battery voltage, temperature, size and current are measured by the UEM controlled by the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEM controls the charging current delivered from the charger to the battery. The battery voltage rise is limited by turning the UEM switch off when the battery voltage has reached 4.2 V. Charging current is monitored by measuring the voltage drop across a 220 mOhm resistor.
Supply Voltage Regulation
Supply voltage regulation is controlled by UEM asic. There are six regulators used by baseband block.
Table 14: BB regulators
Signal Min Nom Max Note
VANA 2.70V 2.78V 2.86V I VFLASH1 2.70V 2.78V 2.86V I
VFLASH2 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
1.8V
3.0V
1.855V
3.09V
max
max
I
Sleep
max
I
Sleep
I
max
I
Sleep
=80mA =70mA
=1.5mA
=40mA
=+/-1.5mA
=25mA
=0.5mA
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.053V
1.3V
1.5V
1.8V
1.106V
1.365V
1.575V
1.890V
=150mA
max
I
=0.5mA
Sleep
I
=200mA
max
=0.2mA
I
Sleep
Default value = 1.5V in start-up
Issue 1 10/02 ¤Nokia Corporation Page 21
Page 34
NSM-9DX
System Module & UI CCS Technical Documentation
Battery
Li-ion battery pack BLB-2 is used in NSM-9DX. Nominal discharge cut-off voltage 3.1 V Nominal battery voltage 3.6 V Nominal charging voltage 4.2 V
Table 15: Pin numbering of battery pack
Signal nam e Pin number Function
VBAT 1 Positive battery terminal BSI 2 Battery capacity measurement (fixed resistor inside the battery pack) BTEMP 3 Battery temperature measurement (measured by NTC resistor inside pack) GND 4 Negative/common battery terminal
Figure 2: BLB-2 battery pack pin order
Power Up and Reset
Power up and reset is controlled by the UEM ASIC. NSM-9DX baseband can be powe red up in following ways:
1 Press power button which means grounding the PWRONX pin of the UEM 2 Connect the charger to the charger input 3 Supply battery voltage to the battery pin 4 RTC Alarm, the RTC has been programmed to give an alarm
After receiving one of the a bove signals, the U EM counts a 20 ms delay and then ent ers its reset mode. The watchdog starts up, and if the batt ery v olta ge is g reater tha n Vcof f+ a 200ms delay is started to allow references etc. to settle. After this delay ela pses the VFLASH1 regulator is enabled. 500 us later VR3, VANA, VIO and VCORE are enabled. Finally the PURX (Power Up Reset) line is held low for 20 ms. This reset, PURX, is fed to the baseband ASIC UPP, resets are generated for the MCU and the DSP. During this reset phase the UEM forces the VCTCXO regulator on regardless of the status of the sleep con­trol input signal to the UEM. The FLSRST x from the ASIC is used to reset the flas h during power up and to put the flash in power down during sleep.
1(+)2(BSI)3(BTEMP)4(GND)
All baseband regulators are switched on at the UEM power on except VSIM and VFLASH2
Page 22 ¤Nokia Corporation Issue 1 10/02
Page 35
NSM-9DX
CCS Technical Documentation System Module & UI
regulators which are controlled by the MCU . The UEM internal watchdogs are running during the UEM reset state, with the longest watchdog time sel ected. If the watchdog expires, the UEM returns to power off state. The UEM watchdogs are internally acknowl­edged at the rising edge of the PURX signal in order to always give the same watchdog response time to the MCU.
A/D Channels
The UEM contains the follo wing A/D converter channels that a re used for several me a­surement purpose. The general slow A/D converter is a 10 bit converter using the UEM interface clock for the conv ersion. An interr upt will b e given at the end of the measure­ment.
The UEM's 11-channel analog to digita l convert er is used to monitor charging functions, battery functions, voltage levels in external accessory detection inputs, user interface and RF functions.
When the conversion is started t he converter input is selected. Th en the signal proc ess­ing block creates a da ta with MSB set to '1' and ot hers to '0'. In the D/A converter this data controls the switches which connect the input referenc e voltage (VrefADC) to the resistor network. The generated output voltage is compared with the input voltage under measurement and if the latter is greater, MSB remains '1' else it is set '0'. The following step is to test the next bit and the next...until LSB is reached. The result is then stored to ADCR register for UPP to read.
The monitored battery functions a re battery voltage (VBATADC), battery type (BSI) and battery temperature (BTEMP) indication.
The battery type is recognized through a resistive voltage divider. In phone there is a 100kOhm pull up resistor in the BSI line and the battery has a pull down resistor in the same line. Depending on the battery type the pull down resistor value is changed. The battery temperature is measured equivalently but the battery has a NTC pull down resis­tor in the BTEMP line.
KEYB1&2 inputs are used for keyboard scanning purposes. These inputs ar e also routed internally to the miscellaneous block.
The HEADINT and HOOKINT are external accessory detection inputs used for monitoring voltage levels in these inputs. They are routed internally from the miscellaneous block and they are connected to the converter through a 2/1 multiplexer.
The monitored RF functions are PATEMP and VCXOTEMP detection. PA TEMP input is used for measuring temperature of the RFIC, Hagar. VCXOTEMP is not used in NSM-9DX.
IR Module
The IR interface, when using 2.7 V transceiver, is designed into the UEM. The IR link sup­ports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 1 m. Transmission over the IR if half-duplex.
Issue 1 10/02 ¤Nokia Corporation Page 23
Page 36
NSM-9DX
System Module & UI CCS Technical Documentation
The length of the transmitted IR pulse depends on the speed of the transmission. Whe n
230.4 kbit/s or less is used as a transmission speed, pulse length maximum is 1.63 us. If transmission speed is set to 1.152 Mbit/s the pulse length is 154 ns according to IrDA specification.
SIM Interface
UEM contains the SIM interface logic level shifting. SIM interface can be programmed to support 3 V and 1.8 V SIMs. SIM supply voltage is selected by a register in the UEM. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEM. This means that the UEM generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM. The card detection is taken from the BSI signal, which detects the removal of the battery . The monitoring of the BSI signal is done by a comparator inside UEM. The co mparator offset is such that the comparator output does not alter state as long as the battery is connected. The threshold voltage is calculated from the battery size specifications.
The SIM interface is powered up w hen the SIMCardDet signal indicates "card in". This signal is derived from the BSI signal.
Table 16: SIM interface
SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV
The whole SIM interface locates in UPP and UEM. The SIM interface in the UEM contains power up/down, port gating , card detect, data
receiving, ATR-counter, registers and level shifting buffers logic. The SIM interfa ce is the electrical interface betwee n the Subscriber Identit y Module Card (SIM C ard) and mobile phone (via UEM device).
The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz. The data baud rate is SIM card clock frequency divided by 372 (by default), 64, 32 or 16. The protocol type, that is sup ported, is T=0 (asynchronous half duplex character transmission as defined in ISO 7816-3).
Page 24 ¤Nokia Corporation Issue 1 10/02
Page 37
NSM-9DX
CCS Technical Documentation System Module & UI
Figure 3: UPP & UEM SIM connections.
GND
UPP
SIM
C5 C6 C7
C8
C1 C2 C3
C4
From Battery Type contact
From SIM Card contact
SIMDATA
SIMCLK
SIMRST
VSIM
BSI
SIMCardDet
GND
UEM
SIMIF register
SIMIO SIMClk
Data
UEM digital logic
SIMIO
SIMClk
Data
UIF Block
UEMInt
CBusDa
CBusEnX
CBusClk
The internal clock frequency from UPP CTSI block is 13 MHz in GSM. Thus to achieve the minimum starting SIMCardClk rate of 3.25 MHz (as is required by the authentication procedure and the duty cyc le requirement of betwe en 40% and 60%) then the slow est possible clock supplied to the SIM has to be in the GSM system cl ock rate of 13/4 MHz.
Buzzer
Buzzer is used for generating alerting tones and melodies to indicate incom ing call. It is also used for generating warning tones for the user. Buzzer is controlled by PWM (Pulse Width Modulation) signal generated by the buzzer driver of the UEM. Target SPL is 100dB (A) at 5 cm.
Internal Microphone
The internal microphone capsule is situated in the bottom connector. Microphone is omnidirectional. The internal microphone is connected to the UEM microphone input MIC1P/N. The microphone input is asymmetric and microphone bias is provided by the UEM MIC1B. The microphone input on the UEM is ESD pr otected. Spring contacts are used for connecting the microphone to the main PWB.
FM Radio
NSM-9 includes also an integrated FM radio. The FM radio circuitry is implemented using a highly integrated radio IC, TEA5757.
Very few external components like filters, discriminator and capacitors are needed. TEA5757 is an integrated AM/FM stereo radio circuit including digital tuning and control
functions. NSM-9 radio is implemented as a super heterodyne FM mono receiver. FM stage of the TEA5757 incorporates a tuned RF stage, a double balanced mixer, one
pin oscillator and is designed for distributed IF ceramic filters. IF frequency is 10.7 MHz.
Issue 1 10/02 ¤Nokia Corporation Page 25
Page 38
NSM-9DX
6
System Module & UI CCS Technical Documentation
Channel tuning and other controls are controlled by the MCU SW. Reference clock, 75 kHz is generated by the UPP CTSI block.
The FM radio circuitry is controlled through serial bus interface by the MCU SW. TEA5757 informs MCU when channel is tuned by setting FMTuneX signal to logic “0”.
Figure 4: Microphone connection
UEM
UPP
MIC1B
MIC1N
MIC1P
10pF 100nF
33nF
33nF
2k2
2k2
2k2
00ohm@100MHz
10pF
10pF
UPP (Universal Phone Processor) is the digital ASIC of the baseband. UPP includes 8 MBit internal RAM, ARM7 Thump 16/32-bit RISC MCU core, LEAD3 16-bit DSP core, ROM for MCU boot code and all digital control logic.
Main functions of the custom logic are:
1 Interfa ce between system logic and MCU/DSP (BodyIf) 2 Clocking, timing, sleep and interrupt block (CTSI) for system timing control 3 MCU controlled general purpose USART, MBUS USART and general purpose IOs
(PUP). 4 SIM card interface (SIMIf) 5 GSM coder (Coder) 6 GPRS support (GPRSCip) 7 Interfaces for keyboard, LCD and UEM (UIF) 8 Accessory interface for IrDA SIR, IrDA FIR and LPRF (AccIf)
Page 26 ¤Nokia Corporation Issue 1 10/02
Page 39
NSM-9DX
CCS Technical Documentation System Module & UI
9 SW programmable RF interface (MFI) 10 Programmable serial interface for Hagar RFIC (SCU) 11 Test interface (TestIf)
Memory Block
For the MCU UPP includes ROM, 2 kbytes, t hat is used mainly for boot code of MCU. To speed up the MCU operation small 64 byte cache is also integrated as a part of the MCU memory interface. For program memory 8 Mbit (512 x 16 bit) PDRAM is integrated. RAM block can also be used as data memory and it is byte addressable. RAM is mainly for MCU purposes but also DSP has also access to it if needed.
MCU code is stored into external flash memory. Size of the flash is 64 Mbit (4096 x 16 bit) The NSM-9DX baseband supports a burst mode fla sh with multiplexe d address/data bus. Access to the flash memory is performed as 16-bit acce ss. The flash has Read While Write (RWW) capabilities which makes the emulation of EE PROM within the flash easy.
Issue 1 10/02 ¤Nokia Corporation Page 27
Page 40
NSM-9DX
System Module & UI CCS Technical Documentation

RF Module

The RF module takes care of all RF functions of the engine. RF circuitry is located on one side (B-side) of the 8 layer PCB. PCB area for the RF circuitry is about 12 cm2. PCB area for the FM radio is about 5 cm2.
EMC leakage is prevented by using a metal B-shield, which screens the whole RF side (included FM radio) of the engine. The conduc tive silicone gasket is used between the PCB and the shield. The metal B-shield is separated to three blocks. The first one includes the FM radio. The second block includes the PA, antenna switch, LNAs and dual RX SAW. The third block includes the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters. The blocks are divided on the basis that the attenuation requi rement between harmon ics of the transmitter and the VCO signal (including Hagar IC) is high. In order to achieve the adequate attenuation, a reliable contact be tween the shield and the PCB is important. The VCO and TX outputs of the Hagar RF IC are located one another as far as possible. In order to guard against the radiated spurious inside blocks, the RF transmission lines are made with striplines after PA.
The baseband circuitry is located on the A-side of the board, which is shielded with a metallized frame and ground plane of the UI-board.
Maximum height inside on B-side is 1.8 mm. Heat generated by the circuitry will be con­ducted out via the PCB ground planes and metallic B-shield.
Figure 5: RF Frequency Plan
869-894 MHz
1930-1990 MHz
f
f
f/4
HAGAR
f
f/2f/4
f
f/2
PLL
3290­3980 MHz
I-signal
I-signalI-signalI-signal Q-signal
RX
1850-1910 MHz
824-849 MHz
26 MHz
VCTCXO
I-signal
Q-signal
TX
Page 28 ¤Nokia Corporation Issue 1 10/02
Page 41
NSM-9DX
CCS Technical Documentation System Module & UI

DC characteristics

Regulators
Transceiver has a multifunction power management IC on baseband section, which con­tains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher for charge pump.
All regulators can be controlled individually with 2.78 V logic directly or through control register. In GSM direct controls are used to get fast switching, because regulators a re used to enable RF-functions.
Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and VrefRF02 are used as the refere nce voltages f or HAGAR RF-IC , VrefRF01 (1.35V) for bias reference and VrfeRF02 (1.35V) for RX ADC's reference.
Regulators (except VR2 and VR7) are connected to HAGAR. Different modes are switched on by the aid of serial bus.
List of the needed supply voltages:
Volt. source Load
VR1A PLL charge pump (4.8 V) VR2 TX modulator VR3 VCTCXO + buffer VR4 HAGAR IC (LNAs+mixer+DTOS) VR5 HAGAR IC (div+LO-buff+pres caler), VR6 HAGAR (Vdd_bb) VR7 VCO VrefRF01 ref. voltage for HAGAR VrefRF02 ref. voltage for HA GAR Vbatt PA
Issue 1 10/02 ¤Nokia Corporation Page 29
Page 42
NSM-9DX
c
B
System Module & UI CCS Technical Documentation
Figure 6: Power Distribution Diagram
SOURCE
VR1
VR2
VR3
VR4
VR5
4.75 V +/- 3.2 % 10 mA
2.78 V +/- 3 %
100 mA
2.78 V +/- 3 %
20 mA
2.78 V +/- 3 %
50 mA
2.78 V +/- 3 %
50 mA
LOAD
Charge pump in HAGAR
TX IQ modulator, power
ontrol opamp in
VCTCXO VCTCX O buffer in Hagar
GSM 1900 LNA RX mixer in Hagar DTOS in Hagar
PLL in Hagar
UEM
VR6
VR7
VrefRF01
VrefRF02
VBATT
2.78 V +/- 3 %
50 mA
2.78 V +/- 3 %
50 mA
1.35 v +/- 1.15 %
<100ua
1.35 V +/- 2 %
<100ua
3.2 - 4.5 V
1700 mA (max)
Dividers in Hagar LO buffers in Hagar Prescaler in Hagar Power detector
BsectioninHagar
SHF VCOModule
Ref. volt. for Hagar RX
Ref. volt. for Hagar
PA module
Page 30 ¤Nokia Corporation Issue 1 10/02
Page 43
NSM-9DX
CCS Technical Documentation System Module & UI

RF characteristics

Table 17: Main R F C h a ra cteristic
Item Values GSM850/1900
Receive frequency range 869...894 MHz / 1930...1990 MHz Transmit frequency range 824...849 MHz / 1850...1910 MHz Duplex spacing 45 MHz / 80 MHz Channel spacing 200 kHz Number of RF channels 124 / 299 Pow er class 4 (2 W) / 1 (1 W) Number of power levels 15 / 16
Transmitter characteristics
Table 18: Transmitter characteristics
Item Values GSM850/1900
Type Direct conversion, nonlinear, FDMA/TDMA LO frequency range 3296...3396 MHz / 3700...3820 MHz Output power 2 W / 1 W peak Gain control range min. 30 dB Maximum phase error (RMS/peak) max 5 deg./20 deg. Peak
Receiver characteristics
Table 19: Receiver characteris tic s
Item Values GSM850/1900
Type Direct conversion, L ine ar, FDMA/TDMA LO frequencies 3476...3576 MHz / 3860...3980 MHz Typical 3 dB bandwidth +/- 91 kHz Sensitivity min. - 102 dBm Total typical receiver voltage gain (from antenna
to RX ADC)
86 dB
Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs Typical AGC dynamic range 83 dB Accurate AGC control range 60 d B Typical AGC step in LNA 25dB / 35 dB Usable input dynamic range -102... -10 dBm RSSI dynamic range -110... -48 dBm Compensated gain variation in receiving band +/- 1.0 dB
Issue 1 10/02 ¤Nokia Corporation Page 31
Page 44
NSM-9DX
System Module & UI CCS Technical Documentation
Figure 7: RF Block Diagram
850 LNA
1900 LNA
RXI
f/4
f
RXQ
INTERNAL ANTENNA
DUAL SAW FI LTER
ANTENNA SW I TCH MODULE
DUAL COUPLER
DUAL PA MODULE

Frequency synthesizer s

VCO frequency is locked with PLL into stable frequency source, which is a VCTC XO-mod­ule (voltage controlled temperature compensated cr ystal oscillator). VCTCXO is running at 26 MHz. Temperature drifting is con trolled with AFC (automatic frequency control) voltage. VCTCXO is locked into frequency of the b ase station. AFC is genera ted by base­band with a 11 bit conventional DAC. 13MHz VCTCXO can also be used if multislot oper­ations is not needed. If more tha n 1(RX)+1(TX) slot is wanted settling times hav e to be less than 300us from channel to channel. This can be achieved when the PLL loopband width is ~35kHz. Noise coming from the loop and noise from dividers (20*logN) increases rms phase error over 3 degrees which is the max imum for synthesizer.
SHF VCO
850 TX SAW
BALUN
Vbat t
BALUN
f/2
f
f/4
f
f/2
f
PLL
HAGAR RFI C
SERI AL CT RL BUS
TXC
TXQP TXQN
TXI P
TXI N
26 Mhz
AFC
Page 32 ¤Nokia Corporation Issue 1 10/02
Page 45
NSM-9DX
V
LPK
M
f
r
CCS Technical Documentation System Module & UI
Figure 8: Frequency synthesizers
req.
R
f
ref
f_out /
M
PHASE
DET.
CHARGE
PUMP
eference
AFC-controlled
f_out
CO
Kd
vco
M
= A(P+1) + (N-A)P= =NP+A
PLL is located in HAGAR RF-IC and is controlled via serial RFBus. There is 64/65 (P/P+1) prescaler, N- and A-divider, reference divider, phase detector and charge pump for the external loop filter. SHF local signal, generated by a VCO-module (VCO = voltage con­trolled oscillator), is fed through 180deg balanced phase shifter t o prescaler. Prescaler is a dual modulus divider. Output of the prescaler is fed to N- and A-divider, which produce the input to phase detector. Phase detector compares this signal to reference signal (400kHz), which is divided with reference divider from VCTCXO output. Output of the phase detector is connected into charge pump, w hich charges or discharges integrator capacitor in the loop filter depending on the phase of the measured frequency compared to reference frequency.
Loop filter filters out comparison pulses of phase detector and generates DC control volt­age to VCO. Loop filter defines step response of the PLL (settling time) and effects to sta­bility of the loop, that's why integr ator capacitor has a resi stor for phase compensation. Other filter components are for side band rejectio n. Dividers are control led via ser ial bus. RFBus Data is for data, RFBusClk is serial clock for the bus and RFBusEna1X is a latch enable, which stores new data into dividers.
LO-signal is generated by SHF VCO module. VCO has double the frequency in GSM1900 and four times the frequency in GSM850 compared to actual RF channel frequency. LO signal is divided by two or four in HAGAR, depending on system mode.
Receiver
The receiver is a direct conversion, dual band linear receiver. The received RF-signal from the antenna is fed via RF-antenna switch module to 1st RX bandpass RF-SAW filters and MMIC LNAs (low noise amplifier). The RF-antenna switch module contains both upper band and lower band operation. The LNA amplified signal is fed to 2nd RX bandpass RF-
Issue 1 10/02 ¤Nokia Corporation Page 33
Page 46
NSM-9DX
System Module & UI CCS Technical Documentation
SAW filters. Both 2nd RX bandpass RF-SAW filters have un-bal/bal configuration to get the balanced feed for Hagar.
The discrete LNA have three gain levels. The first one is max. gain, the second one i s about -35dB(GSM1900) and –25dB(GSM850) below max. gain and the last one are off state. The gain selection control of the LNA comes from HAGAR IC.
The RX bandpass RF-SAW filters define how good are the blocking characteristics against spurious signals outside baseband and the protection against spurious responses.
Differential RX signal is amplified and mix ed directly down to BB frequency in HAGAR. Local signal is generated with external VCO. VCO signal is divided by 2 (GSM1900) or by 4 (GSM850). PLL and dividers are in HAGAR-IC.
From the mixer output to ADC input RX signal is divided into I- and Q-signals. Accurate phasing is generated in LO dividers. After the mixer DTOS amplifiers convert the differen­tial signals to single ended. DTOS has two gain stages. The first one has constant gain of 12dB and 85kHz cut off frequency. The gain of second stage is controlled with control signal g10. If g10 is high (1) the gain is 6dB and if g10 is low (0) the gain of the stage is
-4dB. The active channel filters in HAGAR provides selectivity for channels (-3dB @ +/-91 kHz
typ.). Integrated base band filter is act ive-RC-filter with two off-chip capacitors. Large RC-time constants needed in the channel sel ect filter of direct conversion receiver are produced with large off-chip capacitors because the impedance levels could not be increased due to the noise specifications. Baseband filter consist s of two stages, DTOS and BIQUAD. DTOS is differential to single-ended converter having 8dB or 18dB gain. BIQUAD is modified Sallen-Key Biquad.
Integrated resistors and capacito rs are tunable. These are controlled wit h a digital con­trol word. The correct control words that compensate for the process variations of inte­grated resistors and capacitors and of tolerance of off chip capacitors are found with the calibration circuit.
Next stage in the receiver chain is AGC-am plifier, also integrated into HAGAR. AGC has digital gain control via serial mode bus. AGC-stage provides gain control range (40 dB, 10 dB steps) for the receiver and also the necessary D C compensation. Additional 10 dB AGC step is implemented in DTOS stages.
DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus). DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage which cause a zero dc-offset. DCN2 set the signal offset to constant value (VrefRF_01
1.35 V). The VrefRF_01 signal is used as a zero level to RX ADCs.
Single ended filtered I/Q-signal is then fed to ADCs in BB. Input level for ADC is 1.45 Vpp max.
Page 34 ¤Nokia Corporation Issue 1 10/02
Page 47
NSM-9DX
CCS Technical Documentation System Module & UI
Rf-temp port is intended to be used for compensation of RX SAW filters thermal behav­ior. These phenomena will have impact to RSSI reporting accuracy. The current informa­tion is -35ppm/C for center frequency drift for all bands. This temperature information is a voltage over two diodes and diodes are fed with constant current.

Transmitter

Transmitter chain consists of two final frequencies, IQ-modulators for upper and lower band, a dual power amplifier and a power control loop.
I- and Q-signals are generated by baseband. After post filtering (RC-network) they go into IQ-modulator in HAGAR. LO-signal for modulator is generated by VCO and is divided by 2 or by 4 depending on system mode. There are separate outputs, one for GSM850 and one for GSM1900.
There is an SAW filter before the PA in GSM850 branch to attenuate unwanted signals and wideband noise from the Hagar IC.
The final amplification is realized with a dual band power amplifie r. It has two different power chains, one for GSM850 and one for GSM1900. The PA is able to produce over 2 W (0dBm input level) in GSM850 band and over 1 W (0 dBm input level) in upperband band into 50 ohm output. The gain control range is over 55 dB to get the desired power levels and power ramping up and down.
Harmonics generated by the nonlinear PA are filtered out with filtering inside the antenna switch -module.
Power control circuitry consists of discrete power detector (common for lower and upperband) and error amplifier in HAGAR. There is a directional coupler connected between PA output and antenna switch. It is of a dualband type and ha s input and out­puts for both systems. The di rectional coupler takes a sample from the f orward going power with certain ratio. This signal is rectified in a schottky-diode and it produces a DC­signal after filtering.
The detected voltage is compared in the error-amplifier in HAGAR to TXC- voltage, which
4
is generated by DA-converter in BB. TXC has got a raised c osine form (cos
- function), which reduces switching transients, when pulsing power up and down. Because dynamic range of the detector is not wide enough to control the power (actually RF output volt­age) over the whole range, there is a control named TXP to work under detected levels. Burst is enabled and set to rise with TXP until the output level is high enough, that feed­back loop works. Loop controls the output via the control pin in PA to the desired output level and burst has got the wa veform of TXC-ramps. Because feedback loops c ould be unstable, this loop is compensated with a dominating pole. This pole decreases gain o n higher frequencies to get phase margins high enough. Also this pole filter out the noise which is coming from TXC line.
Before power ramp the temperature information from detector is stored to Ctemp. This temperature information is used during the burst to compensate power levels in different temperatures. TXP signal enables the antenna switch module to TX mode. The power
Issue 1 10/02 ¤Nokia Corporation Page 35
Page 48
NSM-9DX
System Module & UI CCS Technical Documentation
control loop in HAGAR has two outputs, one for both freq. bands.

AFC function

AFC is used to lock the transceiv ers clock to fre quency of the base sta tion. AFC -voltag e is generated in BB with 11 bit DA-converter. There is a RC-filter in AFC control line to reduce the noise from the converter. Settling time requirement for the RC-network comes from signalling, how often PSW (pur e sine wave) slots occur. They are repeated after 10 frames. AFC tracks base station frequency continuously, so transceiver has a sta­ble frequency, because changes in VCTCXO-output don't occur so fast (temperature).
Settling time requirement come s also from the start up-time allowed. When the trans­ceiver is in sleep mode and "wa kes" up to r eceiv e mod e, there is only about 5 ms for the AFC-voltage to settle. Wh en the first burst co mes in system clock ha s to be settled into +/- 0.1 ppm frequency accuracy. The VCTCXO-module requires also 5 ms to settle into final frequency. Amplitude rises into full swing in 1... 2 ms, but frequency settling time is higher so this oscillator must be powered up early enough.

DC-compensation

DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus). DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage which cause a zero dc-offset. DCN2 set the signal offset to consta nt value (RXREF 1.35 V). The RXREF signal is used as a zero level to RX ADCs.
Page 36 ¤Nokia Corporation Issue 1 10/02
Page 49
NSM-9DX
CCS Technical Documentation System Module & UI

UI Board LK5

NSM-9DX consists of separate UI board, named as LK5, which includes contacts for the keypad domes and LEDs for keypad illumination. UI board is connected to main PWB through 16 pole board-to-board connector with springs. Signals of the connector are described in section External and Internal Signals and Connections.
5x4 matrix keyboard is used in NSM-9DX. Key pressing is detected by scanning proce­dure. Keypad signals are connected UPP keyboard interface.
When no key is pressed row inputs are high due to UPP internal pull-up resistors. The columns are written zero. When key is pressed one row is pulled down and an interrupt is generated to MCU. After receiving interrupt MCU starts scanning procedure. All columns are first written high and then one column at the time is writt en down. All other col­umns except one which was written down are set as inputs. Rows are read while column at the time is written down. If some row is down it indicates that key whic h is at the cross point of selected column and row was pressed. After detec ting pressed k ey all re g­isters inside the UPP are reset and columns are written back to zero.

LCD & Keypad Illumination

In NSM-9DX pastel blue LEDs are used for LCD and keypad illumination. For LCD illumi­nation four LEDs (on HG9) are used and for keypad six LEDs (on LK5).
Current through LEDs is controlle d by transistor circuitry. External transistor driver cir­cuitry is used as constant current source in order to prevent any change in battery volt­age be seen as changing led brightness. Battery vol tage is changing , for example , during charging.
Figure 9: Display and keypad illumination circuitry.
4R3 6R8
4K3
VBAT
6K8
470R
Keypad
LEDs are controlled by the UE M P WM outputs. Both LED gro ups ar e co ntrolled by KLight output of the UEM. Current flo w through the LEDs is set by biasing the transistor and limiting the current by resistors. Current is set separately to keypad and LCD LEDs.
Issue 1 10/02 ¤Nokia Corporation Page 37
KLIGHT
Display LEDs
Page 50
NSM-9DX
1
1
System Module & UI CCS Technical Documentation

Internal Speaker

The internal earpiece is a dynamic earpiece with an impedance of 32 ohms. The earpiece is low impedance one since the sound pressure is to be generat ed using current and not voltage as the supply voltage is restricted to 2.7 V. The earpiece is driven directly by the UEM. The ear piece driver in UEM is a bridge amplifier.
Figure 10: Speaker Connection
UEM
EARP
EARN
22R
22R
22pF 22pF
000R@100MHz
000R@100MHz
Page 38 ¤Nokia Corporation Issue 1 10/02
Page 51
CCS Technica l Documentation
NSM-9DX Series Transceivers

P arts List

Issue 1 10/02 ¤Nokia Corporation
Page 52
NSM-9DX
Parts List CCS Technical Documentation

Table of Contents

Page No
Parts List of HG9 (EDMS Issue 1.0) ............................................................................. 3
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 53
NSM-9DX
V
3
CCS Technical Documentation Parts List

P arts List of HG9 (EDMS Issue 1.0)

Item Code Side X YPart name
B200 4510303 Top R 3 CRYSTAL 32.768KHZ+-20PPM12.5PF B301 5140211 Top C 3 BUZZER 85DB 3KHZ 3.0V 10.4X8.7X3.1 ~ ~ B302 5140067 Top C 5 SPEAKER+SPRING 103+-3DB 32R D13.2 ~ ~ C100 2320744 Top S 4 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C101 2320536 Top R 6 Chipcap 5% NP0 10p normal,-5%,5% C102 2320536 Top R 7 Chipcap 5% NP0 10p normal,-5%,5% C103 2320544 Top R 5 Chipcap 5% NP0 22p normal,-5%,5% C104 2320548 Top R 2 Chipcap 5% NP0 33p normal,-5%,5% C105 2320544 Top R 7 Chipcap 5% NP0 22p normal,-5%,5% C107 2320544 Bottom P 4 Chipcap 5% NP0 22p normal,-5%,5% C108 2320538 Top R 3 Chipcap 5% NP0 12p normal,-5%,5% C109 2315201 Bottom O 5 CHIP ARRAY NP0 2X27P K 25V 0405 2x27p normal,-10%,10% C111 2315205 Top Q 6 CHIP ARRAY X5R 2X1N M 16V 0405 2x1n normal,-20%,20% C112 2320778 Top R 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C113 2320778 Top R 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C114 2320604 Bottom P 3 Chipcap 5% NP0 18p normal,-5%,5% C115 2320546 Bottom P 3 Chipcap 5% NP0 27p normal,-5%,5% C151 2315209 Top O 2 CHIP ARRAY X5R 2X33N M 10V 0405 2x33n normal,-20%,20% C152 2320546 Top R 7 Chipcap 5% NP0 27p normal,-5%,5% C153 2315205 Top P 2 CHIP ARRAY X5R 2X1N M 16V 0405 2x1n normal,-10%,10% C154 2320744 Top O 2 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C155 2315209 Top P 2 CHIP ARRAY X5R 2X33N M 10V 0405 2x33n normal,-20%,20% C156 2320604 Top R 7 Chipcap 5% NP0 18p normal,-5%,5% C157 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C158 2320805 Top R 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C160 2315201 Top F 3 CHIP ARRAY NP0 2X27P K 25V 0405 2x27p normal,-10%,10% C161 2315213 Top R 6 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10% C163 2315213 Top Q 6 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10% C165 2320805 Top P 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C166 2320805 Top O 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C168 2320546 Top O 2 Chipcap 5% NP0 27p normal,-5%,5% C201 2320481 Top R 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C202 2320778 Bottom Q 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C203 2320481 Bottom O 2 CHIPCAP X 5R 1U K 6V3 0603 1u0 normal,-10%,10% C204 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C205 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C206 2320481 Top Q 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C207 2320481 Top N 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C208 2320481 Top N 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C209 2320536 Top R 3 Chipcap 5% NP0 10p normal,-5%,5% C210 2320536 Top R 3 Chipcap 5% NP0 10p normal,-5%,5% C211 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C212 2320481 Top R 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C213 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C214 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C215 2320481 Top O 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C218 2320805 Top N 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C219 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C221 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C222 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C223 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C224 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C225 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
alue Description
2.768kHz~
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 54
NSM-9DX
Y
P
V
Parts List CCS Technical Documentation
Item Code Side X
C226 2320481 Top N 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C227 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C228 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C229 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C230 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C231 2320481 Top N 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C232 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C233 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C234 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C235 2320481 Top R 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C236 2320805 Top N 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C237 2320805 Top N 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C238 2320805 Top Q 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C239 2320805 Top N 3 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C240 2315203 Top N 2 CHIP ARRAY X5R 2X10N M 16V 0405 2x10n normal,-20%,20% C241 2315203 Top N 2 CHIP ARRAY X5R 2X10N M 16V 0405 2x10n normal,-20%,20% C242 2320805 Top R 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C243 2320481 Bottom P 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C250 2315213 Top P 8 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10% C260 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C261 2320481 Top Q 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C262 2320481 Top Q 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C263 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C264 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C265 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C301 2320125 Top K 6 CHIPCAP X5R 1U K 16V 0603 1u0 normal,-10%,10% C303 2315211 Bottom G 5 CHIP ARRAY X5R 2X100N Y 10V 0405 2x100n normal,-20%,10% C306 2320546 Top N 2 Chipcap 5% NP0 27p normal,-5%,5% C307 2320604 Top N 2 Chipcap 5% NP0 18p normal,-5%,5% C308 2320778 Top E 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C312 2320544 Top K 5 Chipcap 5% NP0 22p normal,-5%,5% C319 2320744 Bottom N 2 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C320 2320544 Bottom D 8 Chipcap 5% NP0 22p normal,-5%,5% C350 2320805 Bottom F 7 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C351 2312243 Bottom F 7 CHIPCAP X5R 4U7 K 6V3 0805 4u7 normal,-10%,10% C357 2310041 Bottom K 6 CHIPCAP X5R 1U5 K 10V 0805 1u5 normal,-10%,10% C358 2320520 Bottom J 7 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25p C359 2320520 Bottom J 7 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25p C360 2320805 Bottom H 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C361 2320805 Bottom J 8 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C362 2320805 Bottom J 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C363 2320481 Bottom J 8 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C364 2310793 Bottom I 6 CHIPCAP X5R 2U2 K 10V 0805 2u2 normal,-10%,10% C365 2320481 Bottom H 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C366 2320481 Bottom I 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C367 2320805 Bottom J 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C368 2320805 Bottom H 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C369 2320744 Bottom H 7 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C370 2320137 Bottom J 6 CHIPCAP X5R 470N K 10V 0603 470n normal,-10%,10% C371 2320137 Bottom J 6 CHIPCAP X5R 470N K 10V 0603 470n normal,-10%,10% C372 2320598 Bottom J 5 Chipcap 5% X7R 3n9 normal,-5%,5% C373 2320805 Bottom J 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C374 2320744 Bottom G 6 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C375 2320778 Bottom H 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C378 2320805 Top P 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
art name
alue Description
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 55
NSM-9DX
Y
P
V
CCS Technical Documentation Parts List
Item Code Side X
C389 2320805 Bottom M 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C400 2320778 Top N 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C401 2320805 Top N 3 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C402 2320778 Top N 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C403 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C404 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C405 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C406 2320778 Top M 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C420 2320560 Bottom H 4 Chipcap 5% NP0 100p normal,-5%,5% C421 2320560 Top O 5 Chipcap 5% NP0 100p normal,-5%,5% C422 2320560 Top O 5 Chipcap 5% NP0 100p normal,-5%,5% C450 2320778 Top N 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C451 2320805 Top N 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C454 2320779 Top M 7 CHIPCAP X7R 100N K 16V 0603 100n normal,-10%,10% C470 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5% C471 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5% C472 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5% C500 2320534 Bottom C 2 Chipcap +-0.25pF NP0 8p2 normal,-0.25pF,0.25pF C501 2320546 Bottom D 2 Chipcap 5% NP0 27p normal,-5%,5% C502 2320602 Bottom E 3 Chipcap +-0.25pF NP0 4p7 normal,-0.25pF,0.25pF C503 2320560 Bottom E 2 Chipcap 5% NP0 100p normal,-5%,5% C504 2320491 Bottom F 2 CHIPCAP X7R 220N K 10V 0603 220n normal,-10%,10% C505 2320560 Bottom G 2 Chipcap 5% NP0 100p normal,-5%,5% C506 2320560 Bottom G 2 Chipcap 5% NP0 100p normal,-5%,5% C507 2320778 Bottom D 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C508 2320508 Bottom D 3 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF C509 2320538 Bottom C 3 Chipcap 5% NP0 12p normal,-5%,5% C549 2320538 Bottom C 2 Chipcap 5% NP0 12p normal,-5%,5% C550 2320536 Bottom C 3 Chipcap 5% NP0 10p normal,-5%,5% C551 2320536 Bottom D 3 Chipcap 5% NP0 10p normal,-5%,5% C552 2320514 Bottom E 3 Chipcap +-0.25pF NP0 1p2 normal,-0.25pF,0.25pF C553 2320536 Bottom E 3 Chipcap 5% NP0 10p normal,-5%,5% C554 2320805 Bottom E 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C555 2320560 Bottom G 3 Chipcap 5% NP0 100p normal,-5%,5% C556 2320560 Bottom G 3 Chipcap 5% NP0 100p normal,-5%,5% C557 2320536 Bottom E 3 Chipcap 5% NP0 10p normal,-5%,5% C600 2320548 Bottom H 5 Chipcap 5% NP0 33p normal,-5%,5% C601 2320554 Bottom G 3 Chipcap 5% NP0 56p normal,-5%,5% C602 2320778 Bottom I 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C603 2320778 Bottom I 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C604 2320536 Bottom I 4 Chipcap 5% NP0 10p normal,-5%,5% C605 2320805 Bottom I 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C606 2320481 Bottom H 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C608 2320783 Bottom I 3 CHIPCAP X7R 33N K 10V 0402 33n normal,-10%,10% C609 2320562 Bottom I 3 Chipcap 5% NP0 120p normal,-5%,5% C610 2320562 Bottom I 3 Chipcap 5% NP0 120p normal,-5%,5% C611 2320783 Bottom I 3 CHIPCAP X7R 33N K 10V 0402 33n normal,-10%,10% C612 2320778 Bottom I 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C613 2320805 Bottom H 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C614 2320778 Bottom K 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C615 2320558 Bottom H 2 Chipcap 5% NP0 82p normal,-5%,5% C616 2320552 Bottom I 4 Chipcap 5% NP0 47p normal,-5%,5% C617 2320552 Bottom I 4 Chipcap 5% NP0 47p normal,-5%,5% C620 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C621 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
art name
alue Description
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 56
NSM-9DX
Y
P
V
Parts List CCS Technical Documentation
Item Code Side X
C622 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C623 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C624 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5% C625 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5% C626 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5% C627 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5% C650 2320554 Bottom K 4 Chipcap 5% NP0 56p normal,-5%,5% C651 2320629 Bottom I 3 CHIPCAP NP0 1P0 B 50V 0402 1p0 normal,-0.1p,0.1p C652 2320633 Bottom K 4 CHIPCAP NP0 220P J 25V 0402 220p normal,-5%,5% C653 2310055 Bottom J 4 CHIPCAP NP0 3N9 J 16V 0805 3n9 normal,-5%,5% C654 2320633 Bottom J 4 CHIPCAP NP0 220P J 25V 0402 220p normal,-5%,5% C655 2320481 Bottom K 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10% C656 2320520 Bottom K 3 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF C657 2320520 Bottom K 3 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF C658 2320520 Bottom K 6 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF C660 2320560 Bottom J 2 Chipcap 5% NP0 100p normal,-5%,5% C661 2320805 Bottom K 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10% C662 2320536 Bottom K 2 Chipcap 5% NP0 10p normal,-5%,5% C699 2320508 Bottom F 4 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF C700 2320621 Bottom G 4 CHIPCAP NP0 0P5 C 50V 0402 0p5 normal,-0.25p,0.25p C701 2320548 Bottom G 4 Chipcap 5% NP0 33p normal,-5%,5% C702 2320548 Bottom G 4 Chipcap 5% NP0 33p normal,-5%,5% C703 2320554 Bottom G 4 Chipcap 5% NP0 56p normal,-5%,5% C705 2320536 Bottom D 4 Chipcap 5% NP0 10p normal,-5%,5% C706 2320604 Bottom F 3 Chipcap 5% NP0 18p normal,-5%,5% C707 2320508 Bottom F 3 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF C708 2611753 Bottom P 7 CHIPTCAP 33U M 16V 6.0X3.2X1.5 33u_16V normal,-20%,20% C709 2611741 Bottom B 5 CHIPTCAP 4U7 M 10V 2.0X1.3X1.2 4u7_10V normal,-20%,20% C710 2320778 Bottom B 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C711 2320548 Bottom D 7 Chipcap 5% NP0 33p normal,-5%,5% C712 2320778 Bottom B 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C716 2320548 Bottom C 4 Chipcap 5% NP0 33p normal,-5%,5% C717 2320536 Bottom C 3 Chipcap 5% NP0 10p normal,-5%,5% C718 2320778 Bottom E 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C719 2320778 Bottom E 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C720 2320534 Bottom F 3 Chipcap +-0.25pF NP0 8p2 normal,-0.25pF,0.25pF C721 2320548 Bottom F 4 Chipcap 5% NP0 33p normal,-5%,5% C723 2320744 Bottom G 5 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C725 2320508 Bottom F 4 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF C726 2320514 Bottom G 4 Chipcap +-0.25pF NP0 1p2 normal,-0.25pF,0.25pF C727 2320546 Bottom E 6 Chipcap 5% NP0 27p normal,-5%,5% C729 2320548 Top E 6 Chipcap 5% NP0 33p normal,-5%,5% C730 2320744 Bottom I 4 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10% C733 2320778 Bottom B 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C734 2320778 Bottom B 7 Chipcap X7R 10% 16V 0402 10n normal,-10%,10% C751 2320560 Bottom G 4 Chipcap 5% NP0 100p normal,-5%,5% C752 2322023 Bottom H 4 CHIPCAP NP0 2N2 J 16V 0603 2n2 normal,-5%,5% C753 2320538 Bottom D 3 Chipcap 5% NP0 12p normal,-5%,5% C754 2320538 Bottom D 4 Chipcap 5% NP0 12p normal,-5%,5% C756 2320546 Bottom D 3 Chipcap 5% NP0 27p normal,-5%,5% C759 2320546 Bottom D 4 Chipcap 5% NP0 27p normal,-5%,5% C780 2320548 Bottom C 2 Chipcap 5% NP0 33p normal,-5%,5% C781 2320548 Bottom B 2 Chipcap 5% NP0 33p normal,-5%,5% D200 4370841 Top P 4 UEM V6.0 W-DOG ENA TO09L TFBGA168 ~ ~ D400 4370815 Top L 4 UPP8M V1.1 F741987A C05 UBGA144 ~ ~
art name
alue Description
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 57
NSM-9DX
Y
P
V
3
2
2
2
2
CCS Technical Documentation Parts List
Item Code Side X
D450 4341207 Top N 6 FLASH NMP DCT4 64MBIT 40MHZ 4Mx16 ~ F100 5119019 Top S 5 SM FUSE F 1.5A 32V 0603 ~ ~ G650 4350301 Bottom J 4 VCO 3290-3980MHZ 2.7V 20MA G660 4510349 Bottom J 2 VCTCXO 26MHZ+-10PPM 2.7V 1.5MA 26MHz ~ L100 3203743 Top R 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805 ~ ~ L101 3645319 Top R 7 CHIP COIL 220N J Q25/100MHZ 0603 220nH normal,-5%,5% L104 3203801 Top R 6 CHIP BEAD ARRAY 2X1000R 0405 L105 3203725 Top R 7 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L106 3203725 Top R 6 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L107 3203725 Top R 6 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L151 3203801 Top E 3 CHIP BEAD ARRAY 2X1000R 0405 L356 3645327 Bottom J 7 CHIP COIL 72N G Q34/150MHZ 0603 72nH normal,-2%,2% L357 3645207 Bottom J 7 CHIP COIL 56N G Q38/200MHZ 0603 56nH normal,-2%,2% L470 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L471 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L472 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~ L500 3646091 Bottom E 2 CHIP COIL 6N8 J Q27/800M 0402 6n8H normal,-5%,5% L501 3646077 Bottom G 2 CHIP COIL 82N J Q17/300M 0402 82nH normal,-5%,5% L502 3646055 Bottom D 2 CHIP COIL 8N2 J Q28/800MHZ 0402 8n2H normal,-5%,+5% L503 3646067 Bottom D 2 CHIP COIL 18N J Q29/800M 0402 18nH normal,-5%,5% L504 3646047 Bottom D 3 CHIP COIL 3N3 +-0N3 Q28/800M 0402 3n3H normal,-0n3,+0n3% L549 3646055 Bottom C 2 CHIP COIL 8N2 J Q28/800MHZ 0402 8n2H normal,-5%,+5% L550 3646051 Bottom E 3 CHIP COIL 3N9 +-0N3 Q28/800M0402 3n9H normal,-0n3,+0n3 L551 3646091 Bottom G 3 CHIP COIL 6N8 J Q27/800M 0402 6n8H normal,-5%,5% L700 3646059 Bottom G 4 CHIP COIL 5N6 +-0N3 Q28/800M 0402 5n6H normal,-0n3,+0n3 L701 3646059 Bottom G 5 CHIP COIL 5N6 +-0N3 Q28/800M 0402 5n6H normal,-0n3,+0n3 L703 3203743 Bottom E 6 FERR.BEAD 0R03 42R/100MHZ 3A 0805 ~ ~ L708 3646051 Bottom G 4 CHIP COIL 3N9 +-0N3 Q28/800M 0402 3n9H normal,-0n3,+0n3 L750 4550197 Bottom C 4 DIR.COULER 850/1800/1900 2.1X1.35 ~ ~ N356 4341023 Bottom I 7 AM/FM RECEIVER TEA5757 LQFP48 ~ ~ N600 4370781 Bottom H 3 HAGAR 5 LFBGA80 ~ ~ N700 435H092 Bottom C 5 PW AMP RF3132 GSM850/1900 3.5V ~ ~ R102 1430804 Top N 8 Resistor 5% 63mW 100k normal,-5%,5% R152 1430762 Top O 2 Resistor 5% 63mW 2k2 normal,-5%,5% R154 1430778 Top S 4 Resistor 5% 63mW 10k normal,-5%,5% R155 1430804 Top Q 6 Resistor 5% 63mW 100k normal,-5%,5% R156 1620105 Top O 2 RES NETWORK 0W06 2X2k2 J 0404 2x2k2 ~ R157 1620105 Top O 2 RES NETWORK 0W06 2X2k2 J 0404 2x2k2 ~ R159 1825031 Top R 6 VARISTOR ARRAY 2XVWM16V VC50 0405 R161 1825031 Top R 6 VARISTOR ARRAY 2XVWM16V VC50 0405 R164 1620103 Bottom P 2 Chipres Array 0W06 J 0404 2x22R normal,-5%,5% R165 1620103 Top Q 2 Chipres Array 0W06 J 0404 2x22R normal,-5%,5% R166 1430137 Top P 2 CHIPRES 0W06 1K0 F 200PPM 0402 1k0 normal,-1%,1% R167 1430137 Top P 2 CHIPRES 0W06 1K0 F 200PPM 0402 1k0 normal,-1%,1% R168 1430778 Top R 4 Resistor 5% 63mW 10k normal,-5%,5% R200 1419003 Top R 4 CHIPRES 0W5 0R22 J 1210 0R22 normal,-5%,5% R202 1620067 Top N 2 RES NETWORK 0W06 4X100K J 0804 4x100k normal,-5%,5% R203 1620029 Top N 2 RES NETWORK 0W06 2X4K7 J 0404 2x4k7 normal,-5%,5% R204 1430778 Top P 7 Resistor 5% 63mW 10k normal,-5%,5% R301 1430770 Top L 5 Resistor 5% 63mW 4k7 normal,-5%,5% R304 1430681 Top M 5 CHIPRES 0W06 4R3 J 0402 4R3 normal,-5%,5% R305 1430744 Top M 5 Resistor 5% 63mW 470R normal,-5%,5% R306 1825033 Top M 7 CHIP VARISTOR VW14V VC46V 0402 14V/46V ­R307 1430695 Top M 5 CHIPRES 0W06 6R8 J 0402 6R8 normal,-5%,5% R350 1419009 Bottom F 6 CHIPRES 0W5 4R7 J 1210 4R7 normal,-5%,5%
art name
alue Description
290-3980 ~
x1000R/1-
x1000R/1-
XVWM16normal,-20%,20% XVWM16normal,-20%,20%
Issue 1 10/02 ¤Nokia Corporation Page 7
Page 58
NSM-9DX
V
2
Parts List CCS Technical Documentation
Item Code Side X YPart name
R352 1430804 Bottom F 6 Resistor 5% 63mW 100k normal,-5%,5% R358 1430778 Bottom K 7 Resistor 5% 63mW 10k normal,-5%,5% R359 1430722 Bottom G 6 Resistor 5% 63mW 68R normal,-5%,5% R360 1430802 Bottom J 6 Resistor 5% 63mW 82k normal,-5%,5% R361 1430762 Bottom I 6 Resistor 5% 63mW 2k2 normal,-5%,5% R362 1430770 Bottom I 5 Resistor 5% 63mW 4k7 normal,-5%,5% R363 1430778 Bottom H 6 Resistor 5% 63mW 10k normal,-5%,5% R364 1430804 Bottom I 5 Resistor 5% 63mW 100k normal,-5%,5% R365 1430778 Bottom H 6 Resistor 5% 63mW 10k normal,-5%,5% R369 1430796 Bottom G 7 Resistor 5% 63mW 47k normal,-5%,5% R370 1430796 Bottom K 7 Resistor 5% 63mW 47k normal,-5%,5% R371 1430778 Bottom H 7 Resistor 5% 63mW 10k normal,-5%,5% R380 1430796 Bottom H 8 Resistor 5% 63mW 47k normal,-5%,5% R381 1430804 Bottom J 5 Resistor 5% 63mW 100k normal,-5%,5% R382 1430796 Bottom G 7 Resistor 5% 63mW 47k normal,-5%,5% R383 1430796 Bottom H 7 Resistor 5% 63mW 47k normal,-5%,5% R388 4120071 Bottom O 2 ASIP EMIF03-SIM01 SIM FILTER BGA8 ~ ~ R420 1430726 Bottom H 5 Resistor 5% 63mW 100R normal,-5%,5% R421 1620019 Top O 5 RES NETWORK 0W06 2X10K J 0404 2x10k normal,-5%,5% R422 1430268 Top P 6 CHIPRES 0W06 27K F 100PPM 0603 27k normal,-1%,+1% R450 1430770 Top M 7 Resistor 5% 63mW 4k7 normal,-5%,5% R500 1430726 Bottom E 2 Resistor 5% 63mW 100R normal,-5%,5% R501 1430700 Bottom F 2 Resistor 5% 63mW 10R normal,-5%,5% R502 1430846 Bottom E 2 Resistor 1% 63mW 2k7 normal,-1%,1% R550 1430746 Bottom E 3 Resistor 5% 63mW 560R normal,-5%,5% R551 1430700 Bottom E 4 Resistor 5% 63mW 10R normal,-5%,5% R600 1620081 Bottom I 2 RES NETWORK 0W03 4X22R J 0804 4x22R normal,-5%,5% R602 1430770 Bottom I 2 Resistor 5% 63mW 4k7 normal,-5%,5% R603 1430846 Bottom G 3 Resistor 1% 63mW 2k7 normal,-1%,1% R604 1430770 Bottom H 2 Resistor 5% 63mW 4k7 normal,-5%,5% R606 1430784 Bottom H 2 Resistor 5% 63mW 15k normal,-5%,5% R607 1620033 Bottom I 4 RES NETWORK 0W06 2X5K6 J 0404 2x5k6 ~ R608 1620033 Bottom I 4 RES NETWORK 0W06 2X5K6 J 0404 2x5k6 ~ R610 1430700 Bottom I 4 Resistor 5% 63mW 10R normal,-5%,5% R650 1430770 Bottom K 4 Resistor 5% 63mW 4k7 normal,-5%,5% R651 1430772 Bottom J 4 Resistor 5% 63mW 5k6 normal,-5%,5% R652 1430700 Bottom K 4 Resistor 5% 63mW 10R normal,-5%,5% R660 1430762 Bottom J 2 Resistor 5% 63mW 2k2 normal,-5%,5% R661 1430774 Bottom K 2 Resistor 5% 63mW 6k8 normal,-5%,5% R700 1620121 Bottom G 4 RES NETWORK 0W06 2X220R J 0404 2x220R normal,-5%,5% R701 1620121 Bottom G 4 RES NETWORK 0W06 2X220R J 0404 2x220R normal,-5%,5% R703 1430714 Bottom E 5 Resistor 5% 63mW 33R normal,-5%,5% R704 1430718 Bottom E 6 Resistor 5% 63mW 47R normal,-5%,5% R706 1430693 Bottom G 5 Chipres 0W06 5R6 J 0402 5R6 normal,-5%,5% R707 1430693 Bottom G 4 Chipres 0W06 5R6 J 0402 5R6 normal,-5%,5% R722 1620507 Bottom E 5 RES NETWORK 0W04 3DB ATT 0404 R751 1430770 Bottom E 4 Resistor 5% 63mW 4k7 normal,-5%,5% R752 1430788 Bottom H 4 Resistor 5% 63mW 22k normal,-5%,5% R753 1430770 Bottom D 4 Resistor 5% 63mW 4k7 normal,-5%,5% R754 1430726 Bottom D 4 Resistor 5% 63mW 100R normal,-5%,5% R755 1430718 Bottom D 3 Resistor 5% 63mW 47R normal,-5%,5% R756 1430770 Bottom H 5 Resistor 5% 63mW 4k7 normal,-5%,5% R757 1430778 Bottom D 4 Resistor 5% 63mW 10k normal,-5%,5% R780 1430700 Bottom C 2 Resistor 5% 63mW 10R normal,-5%,5% R781 1430700 Bottom B 2 Resistor 5% 63mW 10R normal,-5%,5%
alue Description
92R/17R6~
Page 8 ¤Nokia Corporation Issue 1 10/02
Page 59
NSM-9DX
V
8
8
8
CCS Technical Documentation Parts List
Item Code Side X YPart name
R782 1620515 Bottom E 6 RES NETWORK 0W04 1DB ATT 0404 S300 5200025 Top B 7 SM TACT SW SIDE TRAVEL 0.2MM ~ ~ S301 5200025 Top C 2 SM TACT SW SIDE TRAVEL 0.2MM ~ ~ S302 5200025 Top D 2 SM TACT SW SIDE TRAVEL 0.2MM ~ ~ T650 4550187 Bottom I 3 TRANSF BALUN 3600MHZ+-400MHZ ~ ~ T700 3640431 Bottom F 4 TRANSF BALUN 1920+/-70MHZ 0805 ~ ~ V100 4113721 Top R 4 TVS DI 1PMT16AT3 16V 175W PWRMITE ~ ~ V300 4219937 Top N 5 TRX2 UMT1/PUMT1 P40V100MA SOT363 ~ ~ V301 4219937 Top M 5 TRX2 UMT1/PUMT1 P40V100MA SOT363 ~ ~ V324 4864595 Top K 3 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~ V325 4864595 Top K 7 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~ V326 4864595 Top K 4 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~ V327 4864595 Top K 5 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~ V329 4110475 Top M 5 SCH DI RB521S-30 200MA 35V SOD523 ~ ~ V350 4219921 Bottom F 5 TR DTC143ZE N RBE4K7/47K 0A1 SC75 ~ ~ V351 4860101 Bottom C 8 IRDA TFDU5102 9.K6-1M152 BABYFACE ~ ~ V356 4110931 Bottom K 7 CAPDIX2 BBY66-05 CT=5.5 FM SOT23 ~ ~ V357 4110931 Bottom K 6 CAPDIX2 BBY66-05 CT=5.5 FM SOT23 ~ ~ V500 4210277 Bottom D 2 TR BGB420 MIRROR ADJ BIAS SOT343 ~ ~ V550 4210261 Bottom D 3 TR BGA428 LNA1.8GHZ 19.5DB SOT363 ~ ~ V750 4110079 Bottom D 4 SCH DIX2 HSMS282C 15V <1PF SOT323 ~ ~ X100 5400181 Bottom R 5 SYS CONN SPR HS/SW+DC+MIC+V.MOTOR ~ ~ X101 5409141 Bottom P 5 SM BATTERY CONN 4POL SPR. 12V 2A ~ ~ X300 5409183 Top I 5 SM LCD CONN 1X8 P2.0 SPR 50V 0.5A ~ ~ X303 5469135 Top L 6 SM CONN 2X8 SPR 50V 0.5A PCB/PCB ~ ~ X386 5409107 Bottom M 4 SM SIM CONN 2X3POL P2.54 H=1.6MM ~ ~ Z260 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z261 3203741 Top R 4 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z262 3203741 Top Q 7 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z263 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z264 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z265 3203741 Top P 7 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~ Z301 4120031 Top M 6 EMI/ESD FILT EMIF10-1K010F1 BGA24 ~ ~ Z356 4550145 Bottom G 7 CER FILT 10.7+-0.03MHZ 3.45X3.1 10.7MHz ~ Z357 4550099 Bottom H 6 CER FILT 10.7+-0.0225MHZ 3.4X2.6 10.7MHz ~ Z358 4550145 Bottom F 7 CER FILT 10.7+-0.03MHZ 3.45X3.1 10.7MHz ~ Z500 4550185 Bottom C 3 ANT.SW 824-894/1850-1990MHZ 6.7X5 Z501 4510357 Bottom G 2 SAW FILT 881.5 +-12.5MHZ/3DB 2.5X2 881.5MHz ~ Z520 4510353 Bottom D 2 SAW FILT 881.5/1960MHZ 3X2.5X0.9 Z551 4511273 Bottom F 3 SAW FILT 1960+-30MHZ/4.0DB 2520 1960MHz ~ Z700 4510351 Bottom F 4 SAW FILT 836.5+-12.5MHZ/2.5DB 836.5MHz ~
alue Description
70R/5R77~
24-894/18~
81.5/1960~
Issue 1 10/02 ¤Nokia Corporation Page 9
Page 60
NSM-9DX
Parts List CCS Technical Documentation
[This page left intentionally blank.]
Page 10 ¤Nokia Corporation Issue 1 10/02
Page 61
CCS Technica l Documentation
NSM-9DX Series Transceivers

Product Variants

Issue 1 10/02 ¤Nokia Corporation
Page 62
NSM-9DX
Product Variants CCSTechnical D ocumentation

Table of Contents

Page No
Transceiver NSM-9DX.................................................................................................. 3
Basic Nokia Modules ...................................................................................................4
Exploded View of Transceiver NSM-9DX .................................................................5
Assembly Parts of NSM-9DX .....................................................................................6

List of Figures

Page No
Fig 1 Transceiver NSM-9DX ..............................................................................................3
Fig 2 Exploded view of NSM-9DX.....................................................................................5
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 63
NSM-9DX
CCSTechnical Documentation Product Variants

Transceiver NSM-9DX

Figure 1: Transceiver NSM-9DX
The NSM-9DX is a dual band transceiver unit designed for the GSM850/1900 networks. It is a GSM850/1900 power class 1 (1W) transceiver.
The transceivers main HW parts / features are:
•GPRS
high resolution B&W display (96 x 65 pixels)
Jack III style UI with two soft keys
Integrated IR link & internal data
Internal vibra
Integrate d FM radio
Plug & play HF support
Plug-in SIM card below the battery of the phone
Integrated antenna
Note: The Service Manual is intended for use by qualified service personnel only.
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 64
NSM-9DX
Product Variants CCSTechnical D ocumentation

Basic Nokia Modules

NSM-9DX 6590 Nokia Americas without SIM LOCK beige 0507890
grey 0507889
A-cover assy greyish green DMC04311 9458332
beige DMC04311 9458252 Keypad Latin silver DMC04442 9794062 Battery cover assy greyish green DMC04312 9458327
beige DMC04312 9458254
Transceiver NSM-9DX ATO Module 0507878
system module HG9 0201836
UI module LU9 0201817
mechanics NSM-9 0262794
SW module NSM-9 0245091
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 65
NSM-9DX
CCSTechnical Documentation Product Variants

Exploded View of Transceiver NSM-9DX

Figure 2: Explod ed view of NSM-9 D X
I013
I001
I003
I004
I005
I006
I007
I010
I008
I012
I011
I009
I002
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 66
NSM-9DX
Product Variants CCSTechnical D ocumentation

Assembly P arts of NSM-9DX

CIRCUIT REF./ ITEM Q'TY CODE DESCRIPTION VALUE/TYPE
I001 9458332 A-cover assy greyish green DMC04311
9458252 beige DMC04311 I002 9794062 Keypad Latin DMC04442 I003 6 6150051 Screw M1.6X5.5 T6 DMD07562 I004 0201817 UI Module DMC03712 I005 5140067 Speaker + spring I006 0201836 Radio Module H69 I007 6800055 Vibra Motor assy I008 5140205 Microphone assy I009 5400181 System connector I010 9458435 B-cover assembly DMC04825 I011 9460377 SIM Card Cover (incl. in B-cover assy) DMD06170 I012 0670322 Battery BLB-2 Li-ion I013 9458254 Battery cover assy Nokia brand, beige DMC03189
9458327 Battery cover assy, greyish green DMC04815
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 67
CCS Technica l Documentation
NSM-9DX Series Transceivers
Service Software Instructions
& Service Concepts
Issue 1 10/02 ¤Nokia Corporation
Page 68
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation

Table of Contents

Page No
Service Software Instructions ........................................................................................ 3
Phoenix ........................................................................................................................3
Supported Operating Systems ................................................................................... 3
Hardware requirements for using Phoenix................................................................ 3
Introduction............................................................................................................... 4
Setting up Phoenix .................................................................................................... 4
Installing Phoenix...................................................................................................... 4
Uninstalling Phoenix................................................................................................. 5
Data Packages ........................................................................................................... 5
Starting a session....................................................................................................... 5
Service Concepts and Setup Instructions....................................................................... 7
Flash Concept ..............................................................................................................7
Flash Concept - POS (Point-of-Sale) ...........................................................................8
JBV-1 Flash Concept ...................................................................................................9
Jig Concept ................................................................................................................10
CLP-9 Service Concept .............................................................................................11
Parallel Flash Concept ...............................................................................................12

List of Figures

Fig 1 Flash Concept .............................................................................................................7
Fig 2 POS Flash Concept ....................................................................................................8
Fig 3 JBV-1 Flash Concept .................................................................................................9
Fig 4 Jig Concept ................................................................................................................10
Fig 5 CLP-9 Service Concept .............................................................................................11
Fig 6 Parallel Flash Concept ...............................................................................................12
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 69
NSM-9DX
CCSTechnical Documentation ServiceSoftware Instructions& Service

Service Software Instructions

Phoenix

Phoenix is the next generation Service Software and it has been designed to meet the challenges in servicing modern cellular phones.
The Phoenix program has been built using component architecture. This means that the actual program is small and most of the program’s functionality is divided into dynami­cally loaded modules or DLLs.
Supported Operating Systems
The Phoenix program can be used in any of the following operating systems:
Windows 95, 98, 2000, ME and NT 4.0 (SP4).
Table 1: Supported O perating Systems
Supported Operating Systems Windows 95 Windows 98 Windows NT 4.0 Windows 2000
Hardware requirements for using Phoenix
The minimum hardware requirements for using Phoenix are:
Table 2: HW requirements for AMS
Minimum HW requirements for AMS Processor 233 MHz RAM 64 MB Needed disk space 50 - 100 MB
For Windows 2000, the following requirements are recommended:
Table 3: HW requirements for Windows 2000
Recommended HW for Windows 2000 Processor 700 MHz RAM 512 MB Needed disk space 50 - 100 MB
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 70
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation
Introduction
This section briefly describes how to install the Phoenix software and includes some basic information on how to use the program. For more detailed information, please refer to the Phoenix’s Help -files. Each feature in Phoenix has its own Help function, which can be activated while running the program.
Press the F1 key or the feature's Help-button to activate a Help -file.
Setting up Phoenix
1 Download the latest rel ease. Please contact your regional After Market Service s
point for information on where to download the latest release.
Download and read the release notes, whic h will have useful information on the
software version you are using.
2 Install Phoenix by executing the phoenix installation package and follow the
instructions on the screen.
Note: In some products the setup may require you to reboot the computer. In either case, the setup will register Phoenix components. This process can take several minutes.
3 Download the latest data packages for the products you will be using.
By default, the program files are stored under C:\Program Files\Nokia\Phoenix
The Phoenix program has been built using component architecture. This mea ns that the actual program is very small and most of the program’s f unctionality i s divided into dynamically loaded modules (DLLs).
The data packages will create product spe cific directories under the insta llation directory.
Installing Phoenix
1 Before you start installing the program, check that
• the dongle is attache d to the parallel port. Contact your supervisor in order to obtain a suitable dongle.
• you have administrator rights (Windows NT or Windows 2000). This is required in order to be able to install Phoenix.
2 The installation checks that the latest supported dongle driver version is
installed. The dongle driver is installed if there is no previous installa tion of the dongle driver or if the installed dongle driver is older than the latest supported version.
3 Reboot your PC before using Phoenix, if you are requested to do so.
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 71
NSM-9DX
CCSTechnical Documentation ServiceSoftware Instructions& Service
Uninstalling Phoenix
Uninstalling another Phoenix version
1 Make sure that the dongle is attached. 2 Go to the Control Panel and select Add/Remove Programs. 3Select TSS4 Phoenix Release xx.yy.zzz for uninstallation and click Add/Remove. 4Click OK to remove the application
You may be required to reboot your PC after uninstallation.
Note: If you have different product packages installed, the components are unin-
stalled only if they are not included in other product packages.
Data Packages
Data Packages (DP) is a name for a helpful feature in the Phoenix software. This type of feature provides a flexible way of distributing and installing Phoenix and its data files.
All product-specific data is separated from the pr ogram code and installed separately. This means that the installation is performed in at least two steps.
Each product will have its own DP. The FPS-8 flashing equipment also has its own pack­age.
Starting a session Concepts
In the Phoenix context, Product means the cellular phone attached to a PC. More specif­ically, it is a particular type of phone.
Connection means the type of cable used to attach the phone to the port to which the other end of the cable is attached.
Selecting a connection
The connection defines the cable and the comm unications port that will be used when connecting to the phone.
1 Active conne ctions are listed in the toolbar’s Connection pull-down menu. You
should make sure that the connection is correct before using the software. Change it, if necessary.
In case the connection is the wrong one, you need to create a new one. 2Select Settings from the pull-down menu. 3Select Add in the Connection List Dialog and in fill the rele vant fields in the Con-
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 72
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation
nection setup dialog.
Selecting a product
Many of Phoenix’s features are product-specific. It is, therefore, mandatory to choose the product you will be working on at the beginning of the session.
1Select File - Scan Product (or hold the Ctrl key down and press R). Phoenix will
scan the connected product and load additional menus which ar e designed for the product. If the product is not supported then an error message will be dis­played and a different Phoenix data package may be required.
2 If you want to manua lly choose the product or if the phone is dead , select File -
Choose Product. You will be presented with a list of available pr oducts.
After the product selection, you will see an addit ional menu item on the main menu. If you take a look at the available menu items, you will see that their num­ber has increased.
Phoenix environment
You can configure the program’s main toolbar and the product or t ool -specific options to your liking.
You can control which toolbars are visible by selecting View and Toolbars from the pull­down menu. The visible toolbars are marked with a check.
The rest of the options are product or tool -specific. The tool-specific options are set using the associated toolbar.
Using components
When working with Phoenix, each task gene rally has its own component that will per ­form the task. The first thing, therefore, is to open the desired component.
Opening a component means that you open a tool window within Phoenix.
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 73
NSM-9DX
CCSTechnical Documentation ServiceSoftware Instructions& Service

Service Concepts and Setup Instructions

Flash Concept

Figure 1: Flash Concept
7
9
6
8
4
3
2
1
Table 4: Flash Concept
Item Name Type
1 Point of Sales flash loading adapte r F LA-18 0770318 2 Power cable FLC-2 0730185
5
Code
3 Modular Cable XCS-4 0730178 4 Flash prommer box FPS-8 0080321 5 Printer cable, incl. in FPS-8 sales package 073F000 6 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090 7 Software protection key PKD-1 0750018 8 Phoenix S erv i c e Software 8406941
NSM-9DX Flash SW dat a
9 AC charger, incl. in FPS-8 sales package 0680032
Issue 1 10/02 ¤Nokia Corporation Page 7
Page 74
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation

Flash Concept - POS (Point-of-Sale)

Figure 2: POS Flash Concept
4
5
2
3
1
Table 5: POS Flash Concep t
ITEM NAME TYPE CODE
1 Point-of-Sales flash loading adapter FLA-18 0770318 2 Service Cable XCS-1 0730218 3 AC Charger (see General Information) ACP-12 4 POS flash dongle for Americas area FLS-4 0081482 5 Phoenix Service SW 8406941
NSM-9DX Flash SW data
Page 8 ¤Nokia Corporation Issue 1 10/02
Page 75
NSM-9DX
CCSTechnical Documentation ServiceSoftware Instructions& Service

JBV-1 Flash Concept

Figure 3: JBV-1 Flash Concept
7
9
8
4
3
2
1
6
5
Table 6: JBV-1 Flash Concept
ITEM NAME TYPE CODE
1 Docking station J BV -1 0770298 2 DC power cable PCS-1 0730012 3 Modular cable XCS-8 0730178 4 Flash prommer box FPS-8 0080321 5 Printer cable, incl. in FPS-8 sales package 073F000 6 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090 7 Software protection key PKD-1 0750018 8 Phoenix Service Soft wa re 8406941
NSM-9DX Flash SW data
9 AC charger, incl. in FPS-8 sales package 0680032
Issue 1 10/02 ¤Nokia Corporation Page 9
Page 76
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation

Jig Concept

Figure 4: Jig Concept
5
6
2
1
4
3
Table 7: Jig Concept
ITEM NAME TYPE CODE
1 Module jig MJS-46 0770316 2 DC P o wer Cable PCS-1 0730012 3 RF antenna cable XRF-1 0730085 4 Service MBUS cable DAU-9S 0730108 5 Software protection key PKD-1 0750018 6 Phoenix Service Soft wa re 8406941
NSM-9DX Flash SW data
Page 10 ¤Nokia Corporation Issue 1 10/02
Page 77
NSM-9DX
CCSTechnical Documentation ServiceSoftware Instructions& Service

CPL-9 Service Concept

Figure 5: CPL-9 Service Co ncept
5
6
2
1
4
3
Table 8: CPL-9 Service Concept
ITEM NAME TYPE CODE
1 Docking station J BV -1 0770298 2 Docking stati o n adapter MJF-6 0770317 3 Coupler CPL-9 0770529 4DC-DC cable SCB-3 0730114 5 RF antenna cable XRF-1 0730085 6 DC power cable PCS-1 0730012 7 Service MBUS cable DAU-9S 0730108 8 Software protection key PKD-1 0750018 9 Phoenix Service Soft wa re 8406941
NSM-9DX Flash SW data
Issue 1 10/02 ¤Nokia Corporation Page 11
Page 78
NSM-9DX
Service Software Instructions & Service Concepts CCSTechnical Documentation

Parallel Flash Concept

Figure 6: Parallel Flash Concept
Table 9: Parallel Flash Concept
ITEM NAME TYPE CODE
1 Docking stati o n adapter MJF-6 0770317 2 Docking station J BV -1 0770298 3 Modular cable XCS-8 0730178 4 DC power cable PCS-1 0730012 7 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090 8 Printer cable, incl. in FPS-8 sales package 073F000 10 Software protection key PKD-1 0750018 11 Phoenix Service Software 8406941
NSM-9DX Flash SW data
17 Parallel flash prommer FPS-8C 0080396
Page 12 ¤Nokia Corporation Issue 1 10/02
Page 79
CCS Technica l Documentation
NSM-9DX Series Transceivers

Service T ools

Issue 1 10/02 Nokia Corporation
Page 80
NSM-9DX
Service Tools CCSTechnical Documentation

Table of Contents

Page No
JBV-1 Docking Station and MJF-6 Adapter ...............................................................4
Product Code............................................................................................................. 4
MJS-46 Module Jig ......................................................................................................6
Product Code............................................................................................................. 6
MJS-47 Soldering Jig ..................................................................................................7
Product Code............................................................................................................. 7
FPS-8 Flash Prommer (Sales Pack) .............................................................................8
Sales Package Code................................................................................................... 8
FPS-8C Parallel Flash Prommer (Sales Pack) .............................................................9
Sales package code.................................................................................................... 9
ACF-8 Universal Power Supply ................................................................................10
Product Code........................................................................................................... 10
FLA-18 POS (Point Of Sale) Flash Loading Adapter ...............................................11
Product Code........................................................................................................... 11
FLC-2 DC Cable ........................................................................................................12
Product Code........................................................................................................... 12
AXS-4 Service Cable .................................................................................................13
Product Code........................................................................................................... 13
XCS-1 Service Cable .................................................................................................14
Product Code........................................................................................................... 14
SW Security Device PKD-1 ......................................................................................15
Product Code........................................................................................................... 15
FLS-4 POS (Point Of Sale) Flash Device (Sales Pack) .............................................16
Product Code........................................................................................................... 16
PCS-1 Power Cable ...................................................................................................17
Product Code........................................................................................................... 17
XRF-1 RF Cable ........................................................................................................18
Product Code........................................................................................................... 18
DAU-9S MBUS Cable ..............................................................................................19
Product Code........................................................................................................... 19
SCB-3 DC Cable ........................................................................................................20
Product Code........................................................................................................... 20
XCS-4 Modular Cable ...............................................................................................21
Product Code........................................................................................................... 21
Printer Cable ..............................................................................................................22
Product Code........................................................................................................... 22
Page No
Page 2 ¤Nokia Corporation Issue 1 10/02
Page 81
NSM-9DX
CCSTechnical Documentation Service Tools

List of Figures

Page No
Fig 1 View of JBV-1 and MJF-6 together ...........................................................................5
Fig 2 View of MJS-46 .........................................................................................................6
Fig 3 View of MJS-47 .........................................................................................................7
Fig 4 View of FPS-8............................................................................................................8
Fig 5 View of FPS-8C .........................................................................................................9
Fig 6 View of ACF-8...........................................................................................................10
Fig 7 View of FLA-18 .........................................................................................................11
Fig 8 View of FLC-2 ...........................................................................................................12
Fig 9 View of AXS-4...........................................................................................................13
Fig 10 View of XCS-1.........................................................................................................14
Fig 11 View of SW Security Device ...................................................................................15
Fig 12 View of FLS-4..........................................................................................................16
Fig 13 View of PCS-1..........................................................................................................17
Fig 14 View of XRF-1.........................................................................................................18
Fig 15 View of DAU-9S......................................................................................................19
Fig 16 View of SCB-3 .........................................................................................................20
Fig 17 View of XCS-4.........................................................................................................21
Fig 18 View of Printer Cable...............................................................................................22
Issue 1 10/02 ¤Nokia Corporation Page 3
Page 82
NSM-9DX
Service Tools CCSTechnical Documentation

JBV-1 Docking Station and MJF-6 Adapter

The JBV-1 Docking Station has been designed for calibration and software update use. The MJF-6 Docking Station Adapter makes signal connections to the phone. JBV-1 and MJF-6 are used as one unit.
JBV-1 main electric functions are:
adjustable VBATT calibration voltage, current measurement limit voltage
"VCHAR", current measurement calibration current "ICHAR"
adjustable ADC calibration voltage via BTEMP and BSI signal
BTEMP and BSI calibration resistor
signals from FBUS to the pho ne via parallel jig
control via FBUS or USB
Flash OK/FAIL indication
In the calibration mode, the JBV-1 is powered by an external power supply 11 -16V DC. During flashing, power for the phone can b e taken from the FPS-8 or from an external power supply 11-16V DC.
The MJF-6’s main electric functions are:
phone recognizing from BTEMP
filters of FBUS signals
SIM CARD reader
Product Code
JBV-1 Docking Station: 0770298 MJF-6 Docking Station Adapter: 0770317
Page 4 ¤Nokia Corporation Issue 1 10/02
Page 83
NSM-9DX
CCSTechnical Documentation Service Tools
Figure 1: View of JBV-1 and MJF-6 together
CPL-6 RF-Coupler: 0775308 CPL-6isusedwithJBV-1and
MJF-6 for making RF coupler connection from the phone to measurement equipment.
CPL-9 RF-Coupler: 0770529 CPL-9 is used with JBV-1 and MJF-6 for making RF coupler connection from the phone
to the measurement equipment.
Issue 1 10/02 ¤Nokia Corporation Page 5
Page 84
NSM-9DX
Service Tools CCSTechnical Documentation

MJS-46 Module Jig

The MJS-46 Module Jig is used for testing of UI/system/RF-module*.
Product Code
MJS-46 Module Jig: 0770316
Figure 2: View of MJS-46
*Note: The nominal supply voltage for MJS-46 is +8.0 V. The supply voltage must
not exceed +12.0 V (min. 5V). (MJS-46 has overvoltage protection). For f lash­ing with FPS-8, it is possible to bypass the regulator with a jumper. Then the supply voltage must not exceed 5.2 V.
Page 6 ¤Nokia Corporation Issue 1 10/02
Page 85
NSM-9DX
CCSTechnical Documentation Service Tools

MJS-47 Soldering J ig

The Soldering Jig MJS-47 is used for soldering and as a rework jig for system module.
Product Code
MJS-47 Module Jig: 0770342
Figure 3: View of MJS-47
Issue 1 10/02 ¤Nokia Corporation Page 7
Page 86
NSM-9DX
Service Tools CCSTechnical Documentation

FPS-8 Flash Prommer (Sales Pack)

The Flash Prommer FPS-8 is used with e.g. FLA-18 and JBV-1. Power is supplied to FPS-8 from the Universal Power Supply.
The sales pack includes:
FPS-8 Flash Prommer 0750123
FPS-8 Activation Sheet 9359289
Universal Power Supply 0680032
AXS-4 Service Cable (D9-D9) 0730090
Printer cable 073F000
Sales Package Code
FPS-8 Flash Prommer: 0080321
Figure 4: View of FPS-8
Page 8 ¤Nokia Corporation Issue 1 10/02
Page 87
NSM-9DX
CCSTechnical Documentation Service Tools

FPS-8C Parallel Flash Prommer (Sales Pack)

The Parallel Flash Prommer FPS-8C is used with MJF-6 and JBV-1. Flash programming can be done to maximum of 8 phones parallel. FPS-8C consists of eight SF11C program­ming cards. SF11C card is functionally identical to FPS-8.
Sales package code
FPS-8C Parallel Flash Prommer: 0080396
Figure 5: View of FPS-8C
Issue 1 10/02 ¤Nokia Corporation Page 9
Page 88
NSM-9DX
Service Tools CCSTechnical Documentation

ACF-8 Universal Power Supply

ACF-8 Universal Power Supply is used to power FPS-8. ACF-8 has 6 V DC and 2.1 A out­put.
Product Code
ACF-8 Universal Power Supply: 0680032
Figure 6: View of ACF-8
Page 10 ¤Nokia Corporation Issue 1 10/02
Page 89
NSM-9DX
CCSTechnical Documentation Service Tools

FLA-18 POS (Point Of Sale) Flash Loading Adapter

The POS Flash Loading Adapter FLA-18 is used in place of the phone's normal battery during service, to supply a controlled operating voltage.
Product Code
FLA-18 POS Flash Loading Adapter: 0770318
Figure 7: View of FLA-18
Issue 1 10/02 ¤Nokia Corporation Page 11
Page 90
NSM-9DX
Service Tools CCSTechnical Documentation

FLC-2 DC Cable

The FLC-2 is used to supply a controlled operating voltage.
Product Code
FLC-2 DC Cable: 0730185
Figure 8: View of FLC-2
Page 12 ¤Nokia Corporation Issue 1 10/02
Page 91
NSM-9DX
CCSTechnical Documentation Service Tools

AXS-4 Service Cable

The AXS-4 D9-D9 Service Cable is used to connect two 9 pin D connectors e.g. between PC and FPS-8. Cable length is 2 meters.
Product Code
AXS-4 D9-D9 Service Cable: 0730090
Figure 9: View of AXS-4
Issue 1 10/02 ¤Nokia Corporation Page 13
Page 92
NSM-9DX
Service Tools CCSTechnical Documentation

XCS-1 Service Cable

The XCS-1 Service Cable is used to connect FLS-4 to FLA-18.
Product Code
XCS-1 Service Cable: 0730218
Figure 10: View of XCS-1
Page 14 ¤Nokia Corporation Issue 1 10/02
Page 93
NSM-9DX
CCSTechnical Documentation Service Tools

SW Security Device PKD-1

SW security device is a piece of hardware enabling the use of the service software when connected to the parallel (LPT) port of the PC. Without the dongle present it is not possi­ble to use the service software. Printer or any such device can be connected to the PC through the dongle if needed.
Caution: Make sure that you hav e switched off the PC and the printer before making
connections!
Caution: Do not connect the PKD-1 to the serial port. You may damage your PKD-1.
Product Code
SW Security Device PKD-1: 0750018
Figure 11: View of SW Security Device
Issue 1 10/02 ¤Nokia Corporation Page 15
Page 94
NSM-9DX
Service Tools CCSTechnical Documentation

FLS-4 POS (Point Of Sale) Flash Device (Sales Pack)

FLS-4 is a dongle and flash device incorporated into one package, developed specifically for POS use.
Product Code
Sales Pack - Europe/Africa 0081483 Sales Pack -APAC 0081481 Sales Pack -Americas 0081482
Figure 12: View of F LS-4
Page 16 ¤Nokia Corporation Issue 1 10/02
Page 95
NSM-9DX
CCSTechnical Documentation Service Tools

PCS-1 Power Cable

The PCS-1 Power Cable (DC) is used to connect, for example, JBV-1 to FPS-8.
Product Code
PCS-1 Power Cable: 0730012
Figure 13: View of PCS-1
Issue 1 10/02 ¤Nokia Corporation Page 17
Page 96
NSM-9DX
Service Tools CCSTechnical Documentation

XRF-1 RF Cable

RF cable XRF-1 is used to connect, for example, the Module Jig MJS-46 to the RF mea­surement equipment.
Product Code
XRF-1 RF Cable: 0 730085
Figure 14: View of XRF-1
Page 18 ¤Nokia Corporation Issue 1 10/02
Page 97
NSM-9DX
CCSTechnical Documentation Service Tools

DAU-9S MBUS Cable

The MBUS Cable DAU-9S has a modular connector, and is used with between PC's serial port and, for example, the Module Jig MJS-46.
Product Code
DAU-9S MBUS Cable: 0730108
Figure 15: View of DAU-9S
Issue 1 10/02 ¤Nokia Corporation Page 19
Page 98
NSM-9DX
Service Tools CCSTechnical Documentation

SCB-3 DC Cable

The DC Cable SCB-3 is used to connect, for example, the JBV-1 to the phone.
Product Code
SCB-3 DC Cable: 0730114
Figure 16: View of SCB-3
Page 20 ¤Nokia Corporation Issue 1 10/02
Page 99
NSM-9DX
CCSTechnical Documentation Service Tools

XCS-4 Modular Cable

XCS-4 is a shielded cable (one specially shielded conductor) modular cable for flashing and service purposes.
Product Code
XCS-4 Modular Cable: 0730178
Figure 17: View of XCS-4
Issue 1 10/02 ¤Nokia Corporation Page 21
Page 100
NSM-9DX
Service Tools CCSTechnical Documentation

Printer Cable

This cable is used to connect the PC to FPS-8.
Product Code
Printer Cable: 073F000
Figure 18: View of Printer Cable
Page 22 ¤Nokia Corporation Issue 1 10/02
Loading...