Nokia 6590 Service manual
Customer Care Solutions (CCS)
Technical Documentation
SERVICE
MANUAL
[NMP Part No. 0275637]
NSM-9DX
Series Cellular Phones
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Customer Care Solutions (CCS)
Technical Documentation
Amendment Record Sheet
Amendment No Date Inserted By Comments
06/2002 JoM First Draft
10/2002 ViK Issue 1
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Contents:
Customer Care Solutions (CCS)
Technical Documentation
NSM-9DX Overall Manual Contents
Section 1: Foreword
Section 2: General Information
Section 3: System & UI Module LU9
Section 4: Parts List
Section 5: Product Variants
Section 6: Service Software Instructions & Service Co nc epts
Section 7: Service Tools
Section 8: Assembly & Disassembly Instructions
Section 9: Troubleshooting Instructions
Section 10: Accessories
Section 11: Schematic Diagrams
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Customer Care Solutions (CCS)
This document is intended for use by qualified service personnel only.
Company Policy
Our policy is of continuous development; details of all technical modifications will be
included with service bulletins.
While every endeavour has been m ade to ensure the accuracy of this do cument, some
errors may exist. If any errors are found by th e reader, NOKIA CORPORATION. should be
notified in writing.
Please state:
Technical Documentation
IMPORTANT
Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error
Please send to: Nokia Corporation / Nokia Mobile Phones
CCS Technical Documentation
PO Box 86
FIN-24101 SALO
Finland
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Customer Care Solutions (CCS)
Technical Documentation
Warnings and Cautions
Please refer to the phone's user guide for instructions relating to operation,
care and maintenance including important safety information.
Note also the following:
Warnings:
1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC
SYSTEMS TO RF ENERGY.
2. THE HANDPO RTABLE TELE PHONE MU ST NOT BE OPERATED IN AREAS LIKELY
3. OPERATION OF ANY RADIO T RA N SMITTING EQUIPMENT, INCLUDING CELLU-
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti-static workstation and that an anti-
3. Ensure sold er, wire, or foreign mat ter does not ent er the te lephone as dam-
4. Use only approved components as specified in the parts list.
5. Ensure all compo nents, modules screws and insulators are correctly re-fit-
TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.
LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS.
OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
static wrist strap is worn.
age may result.
ted after servicing and alignmen t. Ensure all cables and wires are r epositioned correctly.
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Customer Care Solutions (CCS)
Technical Documentation
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Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
CCS Technica l Documentation
NSM-9DX Series Transceivers
General Information
Issue 1 10/02 ¤Nokia Corporation
NSM-9DX
General Information CCS Technical Documentation
Table of Contents
Page No
The Product.................................................................................................................... 3
Hand portable ...............................................................................................................3
Desktop Option ............................................................................................................4
Product and Module List .............................................................................................5
General Specifications of Transceiver NSM-9DX ......................................................6
List of Figures
Page No
Fig 1 Hand portable .............................................................................................................3
Fig 2 Desktop option............................................................................................................4
Page 2 ¤Nokia Corporation Issue 1 10/02
NSM-9DX
CCS Technical Documentation General Information
The Product
The NSM-9DX is a dual band hand portable mobile telephone for GSM 850/1900 networks. It is a GSM 850/1900 power class 1 (1W) transceiver. The main transceiver features are:
• High resolution B&W display (96 x 65 pixels)
• Full graphic display
•GPRS
• Integrated IR link & internal data
• Internal vibra
• Integrated FM Radio
• Plug & play HF support
• Plug-in SIM card below the battery of the phone
• Integrated antenna
• Jack style UI with two soft keys
• TTY support
Hand portable
Figure 1: Hand portable
1, NSM-9DX
4. ACP-12E
2.
HDC–5
3. ACP-12U
3. ACP-12AR
Table 1: Ha nd portabl es
Item Name Type code Material code
1 Transceiver See Product Variants
Standard battery Li-ion BLB-2 0670246
2 Headset HDC-5 0694059
3 StandardCha rger (USplug) 108-132 Vac ACP-12U 0675303
StandardCharger (USplug) 198-242 Vac ACP-1 2E 0675294
4 StandardCharger (Europlug) 207-253 Vac ACP-12AR 0675298
5 Standard Travel Charger ACP-7
Issue 1 10/02 ¤Nokia Corporation Page 3
NSM-9DX
General Information CCS Technical Documentation
Desktop Option
The desktop option allows the user to charge the phone from the mains. Besides these
optional chargers also ACP-8 can be used.
Figure 2: Desktop option
1. NSM-9DX
2. DCD-1 Desk Stand
4. ACP-12E
3. ACP-12U
Table 2: Desktop options
Item Name: Type Code: Material Code:
1. Transceiver (See Product Variants) See Product Variants
2 Desk stand DCD-1 0675253
3. Travel Charger (
4. Travel Charger (US plug) 90-264 Vac ACP-8U 0675303
Travel Charger (AR-plug) ACP-12AR
Euro plug) 90-264 Vac ACP-12E 0675294
Page 4 ¤Nokia Corporation Issue 1 10/02
NSM-9DX
CCS Technical Documentation General Information
Product and Module List
Table 3: Product and module list
Unit/type Product code
NSM-9DX Transceiver See Product Variants
BLB-2 Standard Battery Li-ion 0670322
ACP-7E Travel Charger (EUR) 207-253 Vac 0675144
ACP-7U Standard Charger (US) 108-132 Vac 0675143
ACP-7C Standard Charger (US) 198-242 Vac 0675158
ACP-8E Rapid Charger (EUR) 90-264 Vac 0675195
ACP-8U Travel Charger (US) 90-264 Vac 0675196
ACP-12E Travel Charger
ACP-12U Travel Charger
ACP-12AR Travel Charger
LCH-9 Rapid Cigarette Lighter Charger 0675120
MBD-10 Mobile Holder 0630409
DCD-1 Desktop Stand 0675253
DDC-1 Battery Charging Stand 067526 1
HDC-5 Headset Kit (with answer and end button) 0694059
LPS-3 Loopset 0630244
HDB-5 Boom Headset 0694107
HDD-1 Dual Headset 0694066
HDE-2 Headset Kit 0694075
HDA-9 TTY/TTD Phone Adapter 06941 1 6
CARK-130 Express Carkit (PPH-1, HFM-8, MBD-10, HHS-15) 0080539
CARK 132 Full Carkit (MCC-5 , HHS-9, MKU -1, HFU - 5, HFS-12, HFM-8, PCH-4) 008519 8
PPH-1 Plug-in HF Car Kit 0675182
0675294
0675303
0675298
MKU-1 Mounting Plate 0620036
HHS-9 Swivel Mount 0620037
HFM-8 HF Microphone 0690016
Issue 1 10/02 ¤Nokia Corporation Page 5
NSM-9DX
General Information CCS Technical Documentation
General Specifications of Transceiver NSM-9DX
Table 4: NSM-9DX General Specifications
Parameter GSM850/1900
Receive frequency range 869...894 MHz / 1930…1990 MHz
Transmit frequency range 824...849 MHz / 1850…1910 MHz
Duplex spacing 45 / 80 MHz
Channel spacing 200 kHz
Number of RF channels 124 / 299
Power class 4(2W)/1(1W)
Number of power levels 15 / 16
Sensitivity, Static channel -102 dBm
Frequency error, static channel <0.1ppm
RMS Phase error <5.0°
Peak phase error <20.0°
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CCS Technica l Documentation
NSM-9DX Series Transceivers
System Module & UI
Issue 1 10/02 ¤Nokia Corporation
NSM-9DX
System Module & UI CCS Technical Documentation
Table of Contents
Transceiver NSM-9DX.................................................................................................. 4
Introduction ..................................................................................................................4
Electrical Modules..................................................................................................... 4
Operation Modes....................................................................................................... 4
Interconnection Diagram .............................................................................................5
System Module HG9...................................................................................................... 6
Baseband Module ........................................................................................................6
Block Diagram .............................................................................................................7
Technical Summary................................................................................................... 8
DC Characteristics .......................................................................................................9
Regulators and Supply Voltage Ranges.................................................................... 9
External and Internal Signals and Connections....................................................... 10
Internal Signals and Connections............................................................................ 10
External Signals and Connections .............................................................................16
UI (board-to-board) connector ................................................................................ 16
LCD connector........................................................................................................ 16
DC connector........................................................................................................... 18
Headset connector ................................................................................................... 18
Functional Description ...............................................................................................20
Modes of Operation................................................................................................. 20
Supply Voltage Regulation ..................................................................................... 21
Battery..................................................................................................................... 22
Power Up and Reset................................................................................................ 22
A/D Channels.......................................................................................................... 23
IR Module ............................................................................................................... 23
SIM Interface........................................................................................................... 24
Buzzer...................................................................................................................... 25
Internal Microphone................................................................................................ 25
UPP.......................................................................................................................... 26
Memory Block......................................................................................................... 26
RF Module ................................................................................................................... 28
DC characteristics ......................................................................................................29
Regulators................................................................................................................ 29
RF characteristics .......................................................................................................31
Transmitter characteristics ...................................................................................... 31
Receiver characteristics........................................................................................... 31
Frequency synthesizers ..............................................................................................32
Receiver .....................................................................................................................33
Transmitter .................................................................................................................35
AFC function .............................................................................................................36
DC-compensation ......................................................................................................36
UI Board LK5 .............................................................................................................. 37
LCD & Keypad Illumination .....................................................................................37
Internal Speaker .........................................................................................................38
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CCS Technical Documentation System Module & UI
List of Figures
Page No
Fig 1 Baseband Block Diagram...........................................................................................7
Fig 2 BLB-2 battery pack pin order.....................................................................................22
Fig 3 UPP & UEM SIM connections...................................................................................25
Fig 4 Microphone connection..............................................................................................26
Fig 5 RF Frequency Plan .....................................................................................................28
Fig 6 Power Distribution Diagram.......................................................................................30
Fig 7 RF Block Diagram......................................................................................................32
Fig 8 Frequency synthesizers...............................................................................................33
Fig 9 Display and keypad illumination circuitry. ................................................................37
Fig 10 Speaker Connection..................................................................................................38
List of Schematics
RF & BB ...................................... ................................................ ....................................................................A-1
RF ..........................................................................................................................................................A-2
BB Connections .................................. ................................. .................................. ............................................A-3
System Connector ............................................................................................................................................A-4
Audio Interface .................................................................................................................................................A-5
UEM of BB ..........................................................................................................................................................A-6
UEM VBAT Filtering ..................................................................................................... .....................................A-7
Display and Keyboard Interface ........................ ...........................................................................................A-8
Infrared Module ................................................................................................................................................A-9
SIM Reader ..................................... ..................................................................................................................A-10
UPP of BB ......... .................................. ................................. ............................................................................A-11
Decoupling Capacitors of UPP......................................................... ............................................................A-12
RF - BB Interface.............................................................................................................................................A-13
Flash Memory................................... .................................. ................................. .............................................A-14
Decoupling Capacitors for Flash Memory ................................................................................................A-15
Production Test Pattern.................................................................................................................................A-16
Layout Diagram of HG9 - Top......................................................................................................................A-17
Layout Diagram of HG9 - Bottom..............................................................................................................A-18
Testpoints of HG9 - Top................................................... ..............................................................................A-19
Testpoints of HG9 - Bottom................................................................................. ........................................A-19
Testpoints of HG9 - Top................................................... ..............................................................................A-20
Testpoints of HG9 - Bottom................................................................................. ........................................A-20
UI Board - LK5...................................................................... ............................................................................A-21
Layout Diagram - LK5 .......... ................................. .................................. .......................................................A-22
RF Testpoints Diagram ................................................................................................... ................................A-23
RF Testpoints - PWB layout.......................................................................... ................................................A-24
Issue 1 10/02 ¤Nokia Corporation Page 3
NSM-9DX
System Module & UI CCS Technical Documentation
Transceiver NSM-9DX
Introduction
The NSM-9DX is a dual band radio transceiver unit for GSM850/1900 networks. The
GSM1900 power class is 1 and the GSM850 power class is 2. It is a true 3 V transceiver,
with an internal antenna and vibra.
The transceiver has a full graphic display and the user interface is based on a Jack III
style UI with two soft keys.
An internal antenna is used, there is no connection to an extern al antenna.
The transceiver has a low leaka ge toler ant earpiec e and an omnidire ctional mi crophone,
providing an excellent audio quality. The transceiver supports a full rate, and an
enhanced full rate speech decoding.
An integrated IR link provides a connection between two NSM-9DX transceiver or a
transceiver and a PC (internal data), or a tr ansceiver and a printer.
The small SIM (Subscriber Identity Module) car d is locate d under the batter y. SIM interface supports both 1.8 V and 3 V SIM cards.
Electrical Modules
The radio module consists of Radio Frequency (RF) and baseband (BB). User Interface (UI)
contains display, keyboard, IR link, vibra, HF/HS connector and audio parts. UI is divided
into radio module PWB HG9 and UI PWB LK5.
The electrical part of the keyboa rd is located in separate UI PWB named LK5. LK5 is connected to radio PWB through spring connectors.
The System blocks provide the MCU, DSP, external memory interface and digital control
functions in UPP ASIC (Universal Phone Processor). Power supply circuitry, charging,
audio processing and RF control hardware are in UEM ASIC (Universal Energy Management).
The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.
Operation Modes
The transceiver has six different operation modes:
• power off mode
•idle mode
• active mode
• charge mode
• local mode
• test mode
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NSM-9DX
CCS Technical Documentation System Module & UI
In the power off mode circuits are powered down and only sleep clock is running.
In the idle mode only the circuits needed for power up are supplied.
In the active mode all the circuits are supplied with power although some parts might be
in the idle state part of the time.
The charge mode is effectiv e in parallel w ith all previous mo des. The ch arge mode itself
consists of two different states, i.e. the fast charge and the maintenance mode.
The local and test modes are used for alignment and testing.
Interconnection Diagram
SIM
Antenna
Keyboard
module
Radio
Module
HG9
MIC IR Link Earpiece HF
Display
Battery
Charger
Issue 1 10/02 ¤Nokia Corporation Page 5
NSM-9DX
System Module & UI CCS Technical Documentation
System Module HG9
Baseband Module
The baseband architecture supp orts a power saving function called "sleep mode ". This
sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and
baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is
waken up by a timer running from this 32 kHz clock supply. The sleep time is determined
by network parameters. Sleep mode is e ntered when both the MCU and the DSP are i n
standby mode and the normal VCTCXO clock is switched off.
NSM-9DX supports both three and tw o w ire t ype of Nok ia charge rs. Three w ire char ger s
are treated like two wire ones. There is not separate PWM output for controlling charger
but it is connected to GND inside the bottom connector. Charging is controlled by UEM
ASIC (Universal Energy Management) and EM SW running in the UPP (Universal Phone
Processor).
The BLB-2 Li-ion battery is used as the power source for the phone.
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NSM-9DX
CCS Technical Documentation System Module & UI
Block Diagram
Figure 1: Baseband Block Diag ram
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NSM-9DX
System Module & UI CCS Technical Documentation
UPP ASIC (Universal Phone Processor) provides the MCU, DSP, external memory interface
and digital control functions. UEM ASIC (Universal Energy Management) contains power
supply circuitry, charging, audio processing and RF control hardware.
Technical Summary
Baseband is running from power rails 2.8 V analog voltage and 1.8 V I/O voltage. UPP
core voltage Vcore can be lowered down to 1.0 V, 1.3 V and 1.5 V. UEM includes 6 linear
LDO (low drop-out) regulators for baseband and 7 regulat ors for RF. It also include s 4
current sources for biasing purposes and internal usage. UEM also includes SIM interface
which supports both 1.8 V and 3 V SIM cards. 5 V SIM cards are not supported by the
NSM-9DX baseband.
A real time clock function is integrated into the UEM which utilizes the same 32 kHz
clock supply as the sleep clock.
The analog interface between the baseband and the RF section is handled by a UEM
ASIC. UEM provides A/ D a nd D/A conv ersi on of the in-phase and quadrat ure re ce ive a nd
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEM supplies the analog TXC and AFC
signals to RF section according to the UPP DSP digital control. Data transmission
between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and
CBUS for MCU. RF ASIC, Hagar, is controlled through UPP RFBUS serial interface. There is
also separate signals for PDM coded a udio. Digital speech processing is handled by the
DSP in side UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from
the baseband supply 1.8 V and the analog parts are running from the analog supply
2.78 V also VBAT is directly used by some blocks.
The baseband supports both internal and external microphone inputs and speaker out-
puts. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEM for decoding. Buzzer
and external vibra aler t control signals are generated by the UEM with separate PWM
outputs.
NSM-9DX has two external serial control interfaces: FBUS and MBUS. These busses can
be accessed only through production test pattern.
EMC shielding for baseband is implemented using a silicon pl astic frame and UI PWB
ground plane. On the other side the engine is shielded with PWB grounding. Heat generated by the circuitry will be conducte d out via the PWB ground planes.
NSM-9DX radio module is implemented to 8 layer PWB. UI module is divided between
main PWB HG9 and separate UI PWB LK5.
NSM-9DX also incudes an integra ted FM-radi o in one chip. Onl y a few e xternal components are needed.
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CCS Technical Documentation System Module & UI
DC Characteristics
Regulators and Supply Voltage Ranges
Table 1: Battery voltage range
Signal Min. Nom Max Note
VBAT 3.1V 3.6V 4.2V (chargin g hi gh l i mit v o l t ag e) 3.1 V SW cut off
Table 2: BB Regulators
Signal Min. Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
VFLASH2 2.70V 2.78V 2.86V I
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.8V
3.0V
1.053V
1.3V
1.5V
1.8V
1.855V
3.09V
1.106V
1.365V
1.575V
1.890V
max
max
I
Sleep
I
max
I
Sleep
max
I
Sleep
max
I
Sleep
I
max
I
Sleep
Default value = 1.5V
Table 3: RF Regulators
Signal Min. Nom Max Note
= 80mA
= 70mA
= 1.5mA
= 25mA
= 0.5mA
= 40mA
= 1.5mA
= 150mA
= 0.5mA
= 200mA
= 0.2mA
VR1A 4.6V 4.75V 4.9V Imax = 10mA
VR2 2.70V
3.20V
VR3 2.70V 2.78V 2.86V Imax = 20mA
VR4 2.70V 2.78V 2.86V Imax = 50mA
VR5 2.70V 2.78V 2.86V Imax = 50mA
2.78V
3.3V
2.86V
3.40V
Imax = 100mA
ISleep = 0.1mA
ISleep = 0.1mA
Issue 1 10/02 ¤Nokia Corporation Page 9
NSM-9DX
System Module & UI CCS Technical Documentation
Table 3: RF Regulators
Signal Min. Nom Max Note
VR6 2.70V 2.78V 2.86V Imax = 50mA
ISleep = 0.1mA
VR7 2.70V 2.78V 2.86V Imax = 45mA
External and Internal Signals and Connections
This section describes the external and internal electrical connection and interface levels
on the baseband. The electrical interface specifications are collected into tables that
covers a connector or a defined interface.
Internal Signals and Connections
Table 4: Internal micr ophone
Signal Min. Nom Max. Condition Note
MICP
2.0V 2.1V
MICN 2.0V 2.1V 2.25V DC
200mV
pp
2.25 V DC
AC
Table 5: Internal speaker
Signal Min. Nom Max Condition Note
EARP 0.75V 0.8V 2.0 V
0.85V
EARN 0.75V 0.8V 2.0 V
0.85V
pp
pp
AC
DC
AC
DC
Differential output
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
From To Parameter Min. Type Max Unit Function
2.2kΩ to MIC1B
(V
= 4.0 Vpp)
diff
VBAT Battery PA &
UEM
Voltage 2.95 3.6 4.2 V Battery supply. Cut-off
Current 2000 mA
Current drawn by
PA when "off"
0.8 2 uA
level of DCT4 regulators
is 3.04V. Losses in pwb
tracks and ferrites are
taken account to minimum battery voltage
level.
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CCS Technical Documentation System Module & UI
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
VR1A UEM VCP Voltage 4.6 4.75 4.9 V Supply for varactor for
VR2 UEM VRF_TX Voltage 2.70 2.78 2.86 V Supply for part of trans-
VR3 UEM VCTCXOVoltag e 2.70 2.78 2.86 V Supply for VCTC X O
From To Parameter Min. Type Max Unit Function
Current 2 10 mA
Noise density 240 nVrm
s/
sqrt(
Hz)
Current 65 100 mA
Noise density
f=100Hz
f>300Hz
Current 1 20 mA
Noise density 240 nVrm
120 nVrm
s/
sqrt(
Hz)
s/
sqrt(
Hz)
UHF VCO tuning.
mit strip. Supply for TX
I/Q-modulators.
VR4 UEM VRF_RXVoltage 2.70 2.78 2.86 V Supply for Hagar RX;
Current 50 mA
Noise density
f = 6 Hz
f = 60 Hz
f y 600Hz
VR5 UEM VDIG,
VPRE,
VLO
VR6 UEM VBB V oltage 2.70 2.78 2.86 V Supply for Hagar BB and
Voltage 2.70 2.78 2.86 V Supply for Hagar PLL;
Current 50 mA
Noise density
BW=100Hz...
100kHz
Current 50 mA
Noise density
BW=100Hz...
100kHz
5500
550
55
240 nVrm
240 nVrm
nVrm
s/
sqrt(
Hz)
s/
sqrt(
Hz)
s/
sqrt(
Hz)
preamp., mixer,
DTOS
Noise density decades
20 dB/dec from 6Hz to
600Hz. From f >600Hz
maximum noise density
RMS
//Hz.
55nV
dividers, LObuffers, prescaler,
LNA
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NSM-9DX
System Module & UI CCS Technical Documentation
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
VR7 UEM UHF
VrefRF01UEM VREF_RXVoltage 1.334 1.35 1.366V Voltage Reference for
VrefRF02UEM VB_EXTVoltage 1.323 1.35 1.377V Supply for RF-BB digital
From To Parameter Min. Type Max Unit Function
Voltag e 2.70 2.78 2.86 V Supply for UHF VCO
VCO
Current 30 mA
Noise density
100Hz<f<2 kHz
2kHz<f<10 kHz
10kHz<f<30 kH z
30kHz<f<90 kHz
90kHz<f<3 MHz
Current 100 uA
Temp Coef -65 +65 uV/C
Noise density
BW=600Hz...
100kHz
Current 100 uA
70
55
35
30
30
60 nVrm
nVrm
s/
sqrt(
Hz)
s/
sqrt(
Hz)
RF-IC.
Note: Below 600Hz
noise density is allowed
to increase 20 dB/oct
interface and some digital parts of RF.
Temp Coef -65 +65 uV/C
Noise density
BW=100Hz...
100kHz
Table 7: AC and DC characteristics if RF-BB signals
Signal name From To Parameter
TXP
(RFGenOut3)
UPP PA & RF-IC "1" 1.38 1.88 V Transmitter
"0" 0 0.4 V
Load Resistance 10 220 kohm
Load Capacitance 20 pF
Timing Accuracy 1/4 symbol
350 nVrm
s/
sqrt(
Hz)
Input characteristics
Min
Type Max Unit
Function
power
amplifier
enable / D C
N2 timing
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CCS Technical Documentation System Module & UI
Table 7: AC and DC characteristics if RF-BB signals
Input characteristics
Signal name From To Parameter
Min
RFBusEna1X UPP RF-IC "1" 1.38 1.88 V RFbus
"0" 0 0.4 V
Current 50 uA
Load resistance 10 220 kohm
Load capacitance 20 pF
RFBusData UPP RF-IC "1" 1.38 1.88 V RFbus data;
"0" 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Type Max Unit
Function
enable
read /write
Data frequency 10 MHz
RFBusClk UPP RF-IC "1" 1.38 1.88 V RFbus clock
"0" 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz
RESET
(GENIO6)
UPP RF-IC "1" 1.38 1.85 V Reset to
Hagar
"0" 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 kohm
Timing accuracy 1/4 symbol
Table 8: AC and DC characteristics of RF-BB signals
Signal
name
From To Parameter Min. Type Max. Unit Function
VCTCXO VCTCXO UPP Signal amplitude 0.2 0.8 2.0 Vpp High stability clock
Input Impedance 10 kohm
Input Capacitance 10 pF
Harmonic Content -8 dBc
Clear signal win-
dow (no glitch)
Duty Cycle 40 60 %
200 mVpp
signal for the logic
circuits, AC cou-
pled. Distorted sine
wave e.g. sawtooth.
Issue 1 10/02 ¤Nokia Corporation Page 13
NSM-9DX
System Module & UI CCS Technical Documentation
Table 8: AC and DC characteristics of RF-BB signals
Signal
name
VCTCXOGnd VCTXO UPP DC Level 0 V Ground for refer-
RXI/RXQ RF-IC UEM Differential volt-
TXIP / TXIN UEM RF-IC Differential volt-
TXQP /
TXQN
From To Parameter Min. Type Max. Unit Function
ence clock
1.35 1.4 1.45 Vpp RX baseband signal.
age swing (static)
DC level 1.3 1.35 1.4 V
I/Q amplitude
mismatch
I/Q phase mis-
match
age swing (static)
DC level 1.17 1.20 1.23 V
Source Impedance 200 ohm
UEM RF-IC Same spec as for TXIP / TXIN Differential quadra-
-5 5 deg
2.23 2.48 Vpp Programmable volt-
0.2 dB
age swing.
Programmable
common mode
voltage.
Between TXIP-TXIN
ture phase TX base-
band signal for the
RF modulator
AFC UEM VCTCX
O
Aux_DAC
(TxC)
RFTemp RF UEM Voltage at -20°C 1.57 V Temperature sensor
UEM RF Voltage Min.
Voltage Min.
Max
Resolution 11 bits
Load resistance
and capacitance
Step settling time 0.2 ms
Max 2.4
Source Impedance 200 ohm
Resolution 10 bits
Noise density
BW=100Hz...
100kHz
Temp Coef -65 +65 uV /C
Voltage at +25°C1.7
Voltage at +60°C 1.79
0.0
2.4
1
800 nVrms/
0.1
2.6
100
0.1 V Transmitter power
VAutomatic fre-
kohm
nF
sqrt(H
z)
quency control sig-
nal for
VCTCXO
control
NOTE: Assumed
power control
opamp G=1
of RF.
Page 14 ¤Nokia Corporation Issue 1 10/02
NSM-9DX
CCS Technical Documentation System Module & UI
Table 8: AC and DC characteristics of RF-BB signals
Signal
name
Vbase RF UEM Voltage 2.7 V Detecte d voltage
From To Parameter Min. Type Max. Unit Function
from PA power level
sensing unit
Issue 1 10/02 ¤Nokia Corporation Page 15
NSM-9DX
System Module & UI CCS Technical Documentation
External Signals and Connections
UI (board-to-board) connector
Table 9: UI (board-to-board) connector
Pin Signal Min. Nom Max Condition Note
1 SLOWAD(2) 1.5V
0.1V
2 VBAT 3.0V 3.6V 4.2V Battery voltage for LEDs
3ROW(4) 0.7xVIO
0
4ROW(3) 0.7xVIO
0
5COL(2) 0.7xVIO
0
6ROW(2) 0.7xVIO
0
7COL(1) 0.7xVIO
0
8ROW(0) 0.7xVIO
0
9KLIGHT VBAT
10 ROW(1) 0.7xVIO
0
2.7V
1.0V
1.8V
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
0.3xVBAT
VIO
0.3xVIO
Flip closed
Flip open
High
Low
High
Low
High
Low
High
Low
High
Low
High
Low
LED off
LED on
High
Low
Not used in NSM-9DX
Keyboard matrix ro w 4
Keyboard matrix ro w 3
Keyboard matrix column 2
Keyboard matrix ro w 2
Keyboard matrix column 1
Keyboard matrix ro w 0
LED control
Keyboard matrix ro w 1
11 COL(3) 0.7xVIO
0
12 COL(4) 0.7xVIO
0
13 GND 0V
14 GND 0V
15 GND 0V
16 GND 0V
VIO
0.3xVIO
VIO
0.3xVIO
High
Low
High
Low
LCD connector
Table 10: LCD connector
Pin Signal Min. Nom Max Condition Note
1XRES0.8*VIO
0
100ns trw Reset active
VIO
0.22*VIO
Logic '1'
Logic '0'
Keyboard matrix column 3
Keyboard matrix column 4
Reset
Active low
Page 16 ¤Nokia Corporation Issue 1 10/02
NSM-9DX
CCS Technical Documentation System Module & UI
Table 10: LCD connector
Pin Signal Min. Nom Max Condition Note
2 XCS 0.8*VIO
0
130ns tcss XCS low before SCLK rising edge
130ns tcsh XCS low after SCLK rising edge
300ns tcsw XCS high pulse width
3GND 0V
4 SDA 0.8*VIO
0
0.7*VIO
0
100ns tsds Data setup time
100ns tsdh Data hold t ime
5SCLK0.8*VIO
0
250ns tscyc Clock cycle
11 0ns tshw Clock high
VIO
0.22*VIO
VIO
0.22*VIO
VIO
0.3*VIO
VIO
0.22*VIO
4.0MHz
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Max frequenc y
Chip select
Active low
Serial data (driver input)
Serial data (driver output)
Serial clock in put
6 VDDI
(VIO)
7 VDD
(VFLAS
H1)
8VOUT
110ns tslw Clock low
1.72V 1.8V 1.88V Logic voltage supply
Connected to VIO
2.72V 2.78V 2.86V Voltage supply
Connected to VFLASH1
8.34 V
9V Booster output, C=1uF connected to
GND
Issue 1 10/02 ¤Nokia Corporation Page 17
NSM-9DX
System Module & UI CCS Technical Documentation
DC connector
Table 11: DC connector
Pin Signal Min Nom Max Condition Note
2 VCHAR 7.0 V
1 CHGND 0 Charger ground
RMS
8.4 V
RMS
9.2 V
RMS
850 mA
Fast charger Charger positive input
Headset connector
Table 12: Headset connector
Pin Signal Min Nom Max Condition Note
5XMICP 1Vpp G = 0dB
100 mVpp G = 20dB
2.0 V 2.1 V 2.25 V DC
3 XMICN 1Vpp G = 0 dB
100 mVpp G = 20dB
4 XEARN 0.75V 0.8V 0.85V DC
1Vpp AC
7 XEARP 0.75V 0.8V 0.85V DC
1kΩ to MIC2B
1kΩ to GND
1Vpp AC
5 HookInt 0V 2.86V
(VFLASH1)
6 HeadInt 0V 2.86V (VANA) Accessory detection
Connected to UEM AD-converter
SIM connector
Table 13: SIM connecto r
Pin Name Parameter Min Type Max Unit Notes
1 VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage
3V SIM Card 2.8 3.0 3.2
2SIMRST1.8V SIM Card 0.9xVSIM
0
3V SIM Card 0.9xV SIM
0
VSIM
0.15xVSIM
VSIM
0.15xVSIM
V SIM reset (output)
Page 18 ¤Nokia Corporation Issue 1 10/02
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