Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 4
Customer Care Solutions (CCS)
This document is intended for use by qualified service personnel only.
Company Policy
Our policy is of continuous development; details of all technical modifications will be
included with service bulletins.
While every endeavour has been m ade to ensure the accuracy of this do cument, some
errors may exist. If any errors are found by th e reader, NOKIA CORPORATION. should be
notified in writing.
Please state:
Technical Documentation
IMPORTANT
Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error
Please send to: Nokia Corporation / Nokia Mobile Phones
CCS Technical Documentation
PO Box 86
FIN-24101 SALO
Finland
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 5
Customer Care Solutions (CCS)
Technical Documentation
Warnings and Cautions
Please refer to the phone's user guide for instructions relating to operation,
care and maintenance including important safety information.
Note also the following:
Warnings:
1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC
SYSTEMS TO RF ENERGY.
2. THE HANDPO RTABLE TELE PHONE MU ST NOT BE OPERATED IN AREAS LIKELY
3. OPERATION OF ANY RADIO T RA N SMITTING EQUIPMENT, INCLUDING CELLU-
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti-static workstation and that an anti-
3. Ensure sold er, wire, or foreign mat ter does not ent er the te lephone as dam-
4. Use only approved components as specified in the parts list.
5. Ensure all compo nents, modules screws and insulators are correctly re-fit-
TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.
LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS.
OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
static wrist strap is worn.
age may result.
ted after servicing and alignmen t. Ensure all cables and wires are r epositioned correctly.
Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
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Customer Care Solutions (CCS)
Technical Documentation
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Issue 1 10/02
Copyright¤ 2002 Nokia Corporation All Rights Reserved
Page 7
CCS Technica l Documentation
NSM-9DX Series Transceivers
General Information
Issue 1 10/02¤Nokia Corporation
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NSM-9DX
General InformationCCS Technical Documentation
Table of Contents
Page No
The Product.................................................................................................................... 3
Hand portable ...............................................................................................................3
The NSM-9DX is a dual band hand portable mobile telephone for GSM 850/1900 networks. It is a GSM 850/1900 power class 1 (1W) transceiver. The main transceiver features are:
•High resolution B&W display (96 x 65 pixels)
•Full graphic display
•GPRS
•Integrated IR link & internal data
•Internal vibra
•Integrated FM Radio
•Plug & play HF support
•Plug-in SIM card below the battery of the phone
•Integrated antenna
•Jack style UI with two soft keys
•TTY support
Hand portable
Figure 1: Hand portable
1, NSM-9DX
4. ACP-12E
2.
HDC–5
3. ACP-12U
3. ACP-12AR
Table 1: Ha nd portabl es
ItemNameType codeMaterial code
1TransceiverSee Product Variants
Standard battery Li-ionBLB-20670246
2HeadsetHDC-50694059
3StandardCha rger (USplug) 108-132 VacACP-12U0675303
System Connector ............................................................................................................................................A-4
UEM of BB ..........................................................................................................................................................A-6
UPP of BB ......... .................................. ................................. ............................................................................A-11
Decoupling Capacitors of UPP......................................................... ............................................................A-12
Decoupling Capacitors for Flash Memory ................................................................................................A-15
Production Test Pattern.................................................................................................................................A-16
Layout Diagram of HG9 - Top......................................................................................................................A-17
Layout Diagram of HG9 - Bottom..............................................................................................................A-18
Testpoints of HG9 - Top................................................... ..............................................................................A-19
Testpoints of HG9 - Bottom................................................................................. ........................................A-19
Testpoints of HG9 - Top................................................... ..............................................................................A-20
Testpoints of HG9 - Bottom................................................................................. ........................................A-20
The NSM-9DX is a dual band radio transceiver unit for GSM850/1900 networks. The
GSM1900 power class is 1 and the GSM850 power class is 2. It is a true 3 V transceiver,
with an internal antenna and vibra.
The transceiver has a full graphic display and the user interface is based on a Jack III
style UI with two soft keys.
An internal antenna is used, there is no connection to an extern al antenna.
The transceiver has a low leaka ge toler ant earpiec e and an omnidire ctional mi crophone,
providing an excellent audio quality. The transceiver supports a full rate, and an
enhanced full rate speech decoding.
An integrated IR link provides a connection between two NSM-9DX transceiver or a
transceiver and a PC (internal data), or a tr ansceiver and a printer.
The small SIM (Subscriber Identity Module) car d is locate d under the batter y. SIM interface supports both 1.8 V and 3 V SIM cards.
Electrical Modules
The radio module consists of Radio Frequency (RF) and baseband (BB). User Interface (UI)
contains display, keyboard, IR link, vibra, HF/HS connector and audio parts. UI is divided
into radio module PWB HG9 and UI PWB LK5.
The electrical part of the keyboa rd is located in separate UI PWB named LK5. LK5 is connected to radio PWB through spring connectors.
The System blocks provide the MCU, DSP, external memory interface and digital control
functions in UPP ASIC (Universal Phone Processor). Power supply circuitry, charging,
audio processing and RF control hardware are in UEM ASIC (Universal Energy Management).
The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.
Operation Modes
The transceiver has six different operation modes:
•power off mode
•idle mode
•active mode
•charge mode
•local mode
•test mode
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NSM-9DX
CCS Technical DocumentationSystem Module & UI
In the power off mode circuits are powered down and only sleep clock is running.
In the idle mode only the circuits needed for power up are supplied.
In the active mode all the circuits are supplied with power although some parts might be
in the idle state part of the time.
The charge mode is effectiv e in parallel w ith all previous mo des. The ch arge mode itself
consists of two different states, i.e. the fast charge and the maintenance mode.
The local and test modes are used for alignment and testing.
Interconnection Diagram
SIM
Antenna
Keyboard
module
Radio
Module
HG9
MIC IR LinkEarpiece HF
Display
Battery
Charger
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System Module & UICCS Technical Documentation
System Module HG9
Baseband Module
The baseband architecture supp orts a power saving function called "sleep mode ". This
sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and
baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is
waken up by a timer running from this 32 kHz clock supply. The sleep time is determined
by network parameters. Sleep mode is e ntered when both the MCU and the DSP are i n
standby mode and the normal VCTCXO clock is switched off.
NSM-9DX supports both three and tw o w ire t ype of Nok ia charge rs. Three w ire char ger s
are treated like two wire ones. There is not separate PWM output for controlling charger
but it is connected to GND inside the bottom connector. Charging is controlled by UEM
ASIC (Universal Energy Management) and EM SW running in the UPP (Universal Phone
Processor).
The BLB-2 Li-ion battery is used as the power source for the phone.
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CCS Technical DocumentationSystem Module & UI
Block Diagram
Figure 1: Baseband Block Diag ram
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NSM-9DX
System Module & UICCS Technical Documentation
UPP ASIC (Universal Phone Processor) provides the MCU, DSP, external memory interface
and digital control functions. UEM ASIC (Universal Energy Management) contains power
supply circuitry, charging, audio processing and RF control hardware.
Technical Summary
Baseband is running from power rails 2.8 V analog voltage and 1.8 V I/O voltage. UPP
core voltage Vcore can be lowered down to 1.0 V, 1.3 V and 1.5 V. UEM includes 6 linear
LDO (low drop-out) regulators for baseband and 7 regulat ors for RF. It also include s 4
current sources for biasing purposes and internal usage. UEM also includes SIM interface
which supports both 1.8 V and 3 V SIM cards. 5 V SIM cards are not supported by the
NSM-9DX baseband.
A real time clock function is integrated into the UEM which utilizes the same 32 kHz
clock supply as the sleep clock.
The analog interface between the baseband and the RF section is handled by a UEM
ASIC. UEM provides A/ D a nd D/A conv ersi on of the in-phase and quadrat ure re ce ive a nd
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEM supplies the analog TXC and AFC
signals to RF section according to the UPP DSP digital control. Data transmission
between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and
CBUS for MCU. RF ASIC, Hagar, is controlled through UPP RFBUS serial interface. There is
also separate signals for PDM coded a udio. Digital speech processing is handled by the
DSP in side UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from
the baseband supply 1.8 V and the analog parts are running from the analog supply
2.78 V also VBAT is directly used by some blocks.
The baseband supports both internal and external microphone inputs and speaker out-
puts. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEM for decoding. Buzzer
and external vibra aler t control signals are generated by the UEM with separate PWM
outputs.
NSM-9DX has two external serial control interfaces: FBUS and MBUS. These busses can
be accessed only through production test pattern.
EMC shielding for baseband is implemented using a silicon pl astic frame and UI PWB
ground plane. On the other side the engine is shielded with PWB grounding. Heat generated by the circuitry will be conducte d out via the PWB ground planes.
NSM-9DX radio module is implemented to 8 layer PWB. UI module is divided between
main PWB HG9 and separate UI PWB LK5.
NSM-9DX also incudes an integra ted FM-radi o in one chip. Onl y a few e xternal components are needed.
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DC Characteristics
Regulators and Supply Voltage Ranges
Table 1: Battery voltage range
SignalMin.NomMaxNote
VBAT3.1V3.6V4.2V (chargin g hi gh l i mit v o l t ag e)3.1 V SW cut off
This section describes the external and internal electrical connection and interface levels
on the baseband. The electrical interface specifications are collected into tables that
covers a connector or a defined interface.
Internal Signals and Connections
Table 4: Internal micr ophone
SignalMin.NomMax.ConditionNote
MICP
2.0V2.1V
MICN2.0V2.1V2.25VDC
200mV
pp
2.25 VDC
AC
Table 5: Internal speaker
SignalMin.NomMaxConditionNote
EARP0.75V0.8V2.0 V
0.85V
EARN0.75V0.8V2.0 V
0.85V
pp
pp
AC
DC
AC
DC
Differential output
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
FromToParameterMin.TypeMaxUnitFunction
2.2kΩ to MIC1B
(V
= 4.0 Vpp)
diff
VBATBatteryPA &
UEM
Voltage2.953.64.2VBattery supply. Cut-off
Current2000mA
Current drawn by
PA when "off"
0.82uA
level of DCT4 regulators
is 3.04V. Losses in pwb
tracks and ferrites are
taken account to minimum battery voltage
level.
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Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
VR1AUEMVCPVoltage4.64.75 4.9VSupply for varactor for
VR2 UEMVRF_TXVoltage2.702.782.86 VSupply for part of trans-
VR3UEMVCTCXOVoltag e2.702.78 2.86VSupply for VCTC X O
FromToParameterMin.TypeMaxUnitFunction
Current 2 10mA
Noise density 240nVrm
s/
sqrt(
Hz)
Current 65100mA
Noise density
f=100Hz
f>300Hz
Current 120mA
Noise density 240nVrm
120nVrm
s/
sqrt(
Hz)
s/
sqrt(
Hz)
UHF VCO tuning.
mit strip. Supply for TX
I/Q-modulators.
VR4 UEMVRF_RXVoltage2.702.78 2.86VSupply for Hagar RX;
Current 50mA
Noise density
f = 6 Hz
f = 60 Hz
f y 600Hz
VR5 UEMVDIG,
VPRE,
VLO
VR6 UEMVBBV oltage2.702.78 2.86VSupply for Hagar BB and
Voltage2.702.782.86VSupply for Hagar PLL;
Current 50mA
Noise density
BW=100Hz...
100kHz
Current 50mA
Noise density
BW=100Hz...
100kHz
5500
550
55
240nVrm
240nVrm
nVrm
s/
sqrt(
Hz)
s/
sqrt(
Hz)
s/
sqrt(
Hz)
preamp., mixer,
DTOS
Noise density decades
20 dB/dec from 6Hz to
600Hz. From f >600Hz
maximum noise density
RMS
//Hz.
55nV
dividers, LObuffers, prescaler,
LNA
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System Module & UICCS Technical Documentation
Table 6: AC and DC characteristics of RF-BB voltage supplies
Signal
name
VR7 UEMUHF
VrefRF01UEMVREF_RXVoltage1.3341.351.366VVoltage Reference for
VrefRF02UEMVB_EXTVoltage1.3231.351.377VSupply for RF-BB digital
Table 8: AC and DC characteristics of RF-BB signals
Signal
name
VCTCXOGndVCTXOUPPDC Level0VGround for refer-
RXI/RXQRF-ICUEMDifferential volt-
TXIP / TXINUEMRF-ICDifferential volt-
TXQP /
TXQN
FromToParameterMin.TypeMax.UnitFunction
ence clock
1.351.4 1.45VppRX baseband signal.
age swing (static)
DC level1.31.351.4V
I/Q amplitude
mismatch
I/Q phase mis-
match
age swing (static)
DC level1.171.201.23V
Source Impedance200ohm
UEMRF-ICSame spec as for TXIP / TXINDifferential quadra-
-55deg
2.232.48VppProgrammable volt-
0.2dB
age swing.
Programmable
common mode
voltage.
Between TXIP-TXIN
ture phase TX base-
band signal for the
RF modulator
AFCUEMVCTCX
O
Aux_DAC
(TxC)
RFTempRFUEM Voltage at -20°C 1.57VTemperature sensor
UEMRFVoltage Min.
Voltage Min.
Max
Resolution11 bits
Load resistance
and capacitance
Step settling time0.2ms
Max2.4
Source Impedance200ohm
Resolution10bits
Noise density
BW=100Hz...
100kHz
Temp Coef -65+65 uV /C
Voltage at +25°C1.7
Voltage at +60°C 1.79
0.0
2.4
1
800nVrms/
0.1
2.6
100
0.1VTransmitter power
VAutomatic fre-
kohm
nF
sqrt(H
z)
quency control sig-
nal for
VCTCXO
control
NOTE: Assumed
power control
opamp G=1
of RF.
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Table 8: AC and DC characteristics of RF-BB signals
Signal
name
VbaseRF UEM Voltage 2.7VDetecte d voltage
FromToParameterMin.TypeMax.UnitFunction
from PA power level
sensing unit
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System Module & UICCS Technical Documentation
External Signals and Connections
UI (board-to-board) connector
Table 9: UI (board-to-board) connector
PinSignalMin.NomMaxConditionNote
1SLOWAD(2)1.5V
0.1V
2VBAT3.0V3.6V4.2VBattery voltage for LEDs
3ROW(4) 0.7xVIO
0
4ROW(3) 0.7xVIO
0
5COL(2) 0.7xVIO
0
6ROW(2) 0.7xVIO
0
7COL(1) 0.7xVIO
0
8ROW(0) 0.7xVIO
0
9KLIGHTVBAT
10ROW(1)0.7xVIO
0
2.7V
1.0V
1.8V
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
0.3xVBAT
VIO
0.3xVIO
Flip closed
Flip open
High
Low
High
Low
High
Low
High
Low
High
Low
High
Low
LED off
LED on
High
Low
Not used in NSM-9DX
Keyboard matrix ro w 4
Keyboard matrix ro w 3
Keyboard matrix column 2
Keyboard matrix ro w 2
Keyboard matrix column 1
Keyboard matrix ro w 0
LED control
Keyboard matrix ro w 1
11COL(3)0.7xVIO
0
12COL(4)0.7xVIO
0
13GND0V
14GND0V
15GND0V
16GND0V
VIO
0.3xVIO
VIO
0.3xVIO
High
Low
High
Low
LCD connector
Table 10: LCD connector
PinSignalMin.NomMaxConditionNote
1XRES0.8*VIO
0
100nstrwReset active
VIO
0.22*VIO
Logic '1'
Logic '0'
Keyboard matrix column 3
Keyboard matrix column 4
Reset
Active low
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CCS Technical DocumentationSystem Module & UI
Table 10: LCD connector
PinSignalMin.NomMaxConditionNote
2XCS0.8*VIO
0
130nstcssXCS low before SCLK rising edge
130nstcshXCS low after SCLK rising edge
300nstcswXCS high pulse width
3GND0V
4SDA0.8*VIO
0
0.7*VIO
0
100nstsdsData setup time
100nstsdhData hold t ime
5SCLK0.8*VIO
0
250nstscycClock cycle
11 0nstshwClock high
VIO
0.22*VIO
VIO
0.22*VIO
VIO
0.3*VIO
VIO
0.22*VIO
4.0MHz
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Logic '1'
Logic '0'
Max frequenc y
Chip select
Active low
Serial data (driver input)
Serial data (driver output)
Serial clock in put
6VDDI
(VIO)
7VDD
(VFLAS
H1)
8VOUT
110nstslwClock low
1.72V1.8V1.88VLogic voltage supply
Connected to VIO
2.72V2.78V2.86VVoltage supply
Connected to VFLASH1
8.34 V
9VBooster output, C=1uF connected to
GND
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System Module & UICCS Technical Documentation
DC connector
Table 11: DC connector
PinSignalMinNomMaxConditionNote
2VCHAR7.0 V
1CHGND0Charger ground
RMS
8.4 V
RMS
9.2 V
RMS
850 mA
Fast chargerCharger positive input
Headset connector
Table 12: Headset connector
PinSignalMinNomMaxConditionNote
5XMICP1VppG = 0dB
100 mVppG = 20dB
2.0 V2.1 V2.25 VDC
3XMICN1VppG = 0 dB
100 mVppG = 20dB
4XEARN0.75V0.8V0.85VDC
1VppAC
7XEARP0.75V0.8V0.85VDC
1kΩ to MIC2B
1kΩ to GND
1VppAC
5HookInt0V2.86V
(VFLASH1)
6HeadInt0V2.86V (VANA)Accessory detection
Connected to UEM AD-converter
SIM connector
Table 13: SIM connecto r
PinNameParameterMinTypeMaxUnitNotes
1VSIM1.8V SIM Card 1.61.81.9VSupply voltage
3V SIM Card2.83.03.2
2SIMRST1.8V SIM Card 0.9xVSIM
0
3V SIM Card0.9xV SIM
0
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM reset (output)
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Table 13: SIM connecto r
PinNameParameterMinTypeMaxUnitNotes
3SIM-
CLK
4DATA 1.8V Voh
5NC
6GNDGND0VGround
Frequency3.25MHzSIM clock
Trise/Tfall50ns
1.8V Voh
1.8V Vol
3 Voh
3 Vol
1.8V Vol
3 Voh
3 Vol
1.8V Vih
1.8V Vil
3V Vil
3V Vil
0.9xVSIM
0
0.9xVSIM
0
0.9xVSIM
0
0.9xVSIM
0
0.7xVSIM
0
0.7xVSIM
0
VSIMV
VSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM data (output)
SIM data (input)
Trise/Tfall max 1us
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Functional Description
Modes of Operation
HG9 baseband engine has six operating modes:
•No supply
•Backup
•Acting Dead
•Active
•Sleep
•Charging
No supply
In NO_SUPPLY mode the phone has no supply voltage. This mode is due to disconnection
of battery or low battery voltage level.
Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected.
Battery voltage can rise e ither by connecting a new battery wit h VBAT > V
connecting a charger and charging the battery above V
MSTR+
.
MSTR+
or by
Backup
In the backup mode, the backup battery has sufficient charge but the main battery can
be disconnected or emptied (VBAT < V
disabled in the backup mode. VRTC output is supplied without regulation from the
backup battery (UBACK). All the other regulators are disabled.
Acting D ead
If the phone is off when the charger is connected, the phone is powered on, but it enters
a state called "Acting Dead". To the user t he phone a cts as if it was swit ched of f. A ba ttery charging alert is given and/or a battery charging indication on the display is shown
to acknowledge the user that the batte ry is being charged.
Active
In the active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. Ther e are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.
In active mode the RF regulators are controlled by SW writing into UEM's registers
wanted settings: VR1A can be enabled or disabled. VR2 can be enable d or disabled and
its output voltage can be progra mmed to be 2.78V or 3. 3V. VR4 -VR7 can be en abled or
disabled or forced into low quiescent current mode. VR3 is always enabled in active
mode.
and VBACK > VBU
MSTR
). VRTC Regulator is
COFF
Sleep mode
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CCS Technical DocumentationSystem Module & UI
Sleep mode is entered when both MCU and DSP are in stand-by mode. Sleep is controlled
by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE,
VIO and VFLASH1 regulators are put into low quiescent current mode. Al l RF regulators
are disabled in SLEEP. When SLEEPX=1 is detected UEM enters ACTIVE mode and all
functions are activated.
The sleep mode is exited ei ther by t he expirati on of a sleep c lock counte r in th e UEM or
by some external interrupt, gener ated by a charger connection, key press, headset connection etc.
In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference
clock for the baseband.
Charging
The battery voltage, temperature, size and current are measured by the UEM controlled
by the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEM controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEM switch off when the battery voltage has reached 4.2 V. Charging current is
monitored by measuring the voltage drop across a 220 mOhm resistor.
Supply Voltage Regulation
Supply voltage regulation is controlled by UEM asic. There are six regulators used by
baseband block.
Table 14: BB regulators
SignalMinNomMaxNote
VANA2.70V2.78V2.86VI
VFLASH12.70V2.78V2.86VI
VFLASH22.70V2.78V2.86VI
VSIM1.745V
2.91V
1.8V
3.0V
1.855V
3.09V
max
max
I
Sleep
max
I
Sleep
I
max
I
Sleep
=80mA
=70mA
=1.5mA
=40mA
=+/-1.5mA
=25mA
=0.5mA
VIO1.72V1.8V1.88VI
VCORE1.0V
1.235V
1.425V
1.710V
1.053V
1.3V
1.5V
1.8V
1.106V
1.365V
1.575V
1.890V
=150mA
max
I
=0.5mA
Sleep
I
=200mA
max
=0.2mA
I
Sleep
Default value = 1.5V in
start-up
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Battery
Li-ion battery pack BLB-2 is used in NSM-9DX.
Nominal discharge cut-off voltage3.1 V
Nominal battery voltage3.6 V
Nominal charging voltage4.2 V
Table 15: Pin numbering of battery pack
Signal nam ePin numberFunction
VBAT1Positive battery terminal
BSI2Battery capacity measurement (fixed resistor inside the battery pack)
BTEMP3Battery temperature measurement (measured by NTC resistor inside pack)
GND4Negative/common battery terminal
Figure 2: BLB-2 battery pack pin order
Power Up and Reset
Power up and reset is controlled by the UEM ASIC. NSM-9DX baseband can be powe red
up in following ways:
1Press power button which means grounding the PWRONX pin of the UEM
2Connect the charger to the charger input
3Supply battery voltage to the battery pin
4RTC Alarm, the RTC has been programmed to give an alarm
After receiving one of the a bove signals, the U EM counts a 20 ms delay and then ent ers
its reset mode. The watchdog starts up, and if the batt ery v olta ge is g reater tha n Vcof f+
a 200ms delay is started to allow references etc. to settle. After this delay ela pses the
VFLASH1 regulator is enabled. 500 us later VR3, VANA, VIO and VCORE are enabled.
Finally the PURX (Power Up Reset) line is held low for 20 ms. This reset, PURX, is fed to
the baseband ASIC UPP, resets are generated for the MCU and the DSP. During this reset
phase the UEM forces the VCTCXO regulator on regardless of the status of the sleep control input signal to the UEM. The FLSRST x from the ASIC is used to reset the flas h during
power up and to put the flash in power down during sleep.
1(+)2(BSI)3(BTEMP)4(GND)
All baseband regulators are switched on at the UEM power on except VSIM and VFLASH2
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regulators which are controlled by the MCU . The UEM internal watchdogs are running
during the UEM reset state, with the longest watchdog time sel ected. If the watchdog
expires, the UEM returns to power off state. The UEM watchdogs are internally acknowledged at the rising edge of the PURX signal in order to always give the same watchdog
response time to the MCU.
A/D Channels
The UEM contains the follo wing A/D converter channels that a re used for several me asurement purpose. The general slow A/D converter is a 10 bit converter using the UEM
interface clock for the conv ersion. An interr upt will b e given at the end of the measurement.
The UEM's 11-channel analog to digita l convert er is used to monitor charging functions,
battery functions, voltage levels in external accessory detection inputs, user interface
and RF functions.
When the conversion is started t he converter input is selected. Th en the signal proc essing block creates a da ta with MSB set to '1' and ot hers to '0'. In the D/A converter this
data controls the switches which connect the input referenc e voltage (VrefADC) to the
resistor network. The generated output voltage is compared with the input voltage under
measurement and if the latter is greater, MSB remains '1' else it is set '0'. The following
step is to test the next bit and the next...until LSB is reached. The result is then stored to
ADCR register for UPP to read.
The monitored battery functions a re battery voltage (VBATADC), battery type (BSI) and
battery temperature (BTEMP) indication.
The battery type is recognized through a resistive voltage divider. In phone there is a
100kOhm pull up resistor in the BSI line and the battery has a pull down resistor in the
same line. Depending on the battery type the pull down resistor value is changed. The
battery temperature is measured equivalently but the battery has a NTC pull down resistor in the BTEMP line.
KEYB1&2 inputs are used for keyboard scanning purposes. These inputs ar e also routed
internally to the miscellaneous block.
The HEADINT and HOOKINT are external accessory detection inputs used for monitoring
voltage levels in these inputs. They are routed internally from the miscellaneous block
and they are connected to the converter through a 2/1 multiplexer.
The monitored RF functions are PATEMP and VCXOTEMP detection. PA TEMP input is used
for measuring temperature of the RFIC, Hagar. VCXOTEMP is not used in NSM-9DX.
IR Module
The IR interface, when using 2.7 V transceiver, is designed into the UEM. The IR link supports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 1 m. Transmission over
the IR if half-duplex.
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The length of the transmitted IR pulse depends on the speed of the transmission. Whe n
230.4 kbit/s or less is used as a transmission speed, pulse length maximum is 1.63 us. If
transmission speed is set to 1.152 Mbit/s the pulse length is 154 ns according to IrDA
specification.
SIM Interface
UEM contains the SIM interface logic level shifting. SIM interface can be programmed to
support 3 V and 1.8 V SIMs. SIM supply voltage is selected by a register in the UEM. It is
only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEM. This means that the UEM
generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM.
The card detection is taken from the BSI signal, which detects the removal of the battery .
The monitoring of the BSI signal is done by a comparator inside UEM. The co mparator
offset is such that the comparator output does not alter state as long as the battery is
connected. The threshold voltage is calculated from the battery size specifications.
The SIM interface is powered up w hen the SIMCardDet signal indicates "card in". This
signal is derived from the BSI signal.
The whole SIM interface locates in UPP and UEM.
The SIM interface in the UEM contains power up/down, port gating , card detect, data
receiving, ATR-counter, registers and level shifting buffers logic. The SIM interfa ce is the
electrical interface betwee n the Subscriber Identit y Module Card (SIM C ard) and mobile
phone (via UEM device).
The data communication between the card and the phone is asynchronous half duplex.
The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz. The data baud
rate is SIM card clock frequency divided by 372 (by default), 64, 32 or 16. The protocol
type, that is sup ported, is T=0 (asynchronous half duplex character transmission as
defined in ISO 7816-3).
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Figure 3: UPP & UEM SIM connections.
GND
UPP
SIM
C5 C6 C7
C8
C1 C2 C3
C4
From Battery Type contact
From SIM Card contact
SIMDATA
SIMCLK
SIMRST
VSIM
BSI
SIMCardDet
GND
UEM
SIMIF
register
SIMIO
SIMClk
Data
UEM
digital
logic
SIMIO
SIMClk
Data
UIF Block
UEMInt
CBusDa
CBusEnX
CBusClk
The internal clock frequency from UPP CTSI block is 13 MHz in GSM. Thus to achieve the
minimum starting SIMCardClk rate of 3.25 MHz (as is required by the authentication
procedure and the duty cyc le requirement of betwe en 40% and 60%) then the slow est
possible clock supplied to the SIM has to be in the GSM system cl ock rate of 13/4 MHz.
Buzzer
Buzzer is used for generating alerting tones and melodies to indicate incom ing call. It is
also used for generating warning tones for the user. Buzzer is controlled by PWM (Pulse
Width Modulation) signal generated by the buzzer driver of the UEM. Target SPL is 100dB
(A) at 5 cm.
Internal Microphone
The internal microphone capsule is situated in the bottom connector. Microphone is
omnidirectional. The internal microphone is connected to the UEM microphone input
MIC1P/N. The microphone input is asymmetric and microphone bias is provided by the
UEM MIC1B. The microphone input on the UEM is ESD pr otected. Spring contacts are
used for connecting the microphone to the main PWB.
FM Radio
NSM-9 includes also an integrated FM radio. The FM radio circuitry is implemented using
a highly integrated radio IC, TEA5757.
Very few external components like filters, discriminator and capacitors are needed.
TEA5757 is an integrated AM/FM stereo radio circuit including digital tuning and control
functions. NSM-9 radio is implemented as a super heterodyne FM mono receiver.
FM stage of the TEA5757 incorporates a tuned RF stage, a double balanced mixer, one
pin oscillator and is designed for distributed IF ceramic filters. IF frequency is 10.7 MHz.
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Channel tuning and other controls are controlled by the MCU SW. Reference clock, 75
kHz is generated by the UPP CTSI block.
The FM radio circuitry is controlled through serial bus interface by the MCU SW.
TEA5757 informs MCU when channel is tuned by setting FMTuneX signal to logic “0”.
Figure 4: Microphone connection
UEM
UPP
MIC1B
MIC1N
MIC1P
10pF 100nF
33nF
33nF
2k2
2k2
2k2
00ohm@100MHz
10pF
10pF
UPP (Universal Phone Processor) is the digital ASIC of the baseband. UPP includes 8 MBit
internal RAM, ARM7 Thump 16/32-bit RISC MCU core, LEAD3 16-bit DSP core, ROM for
MCU boot code and all digital control logic.
Main functions of the custom logic are:
1Interfa ce between system logic and MCU/DSP (BodyIf)
2Clocking, timing, sleep and interrupt block (CTSI) for system timing control
3MCU controlled general purpose USART, MBUS USART and general purpose IOs
(PUP).
4SIM card interface (SIMIf)
5GSM coder (Coder)
6GPRS support (GPRSCip)
7Interfaces for keyboard, LCD and UEM (UIF)
8Accessory interface for IrDA SIR, IrDA FIR and LPRF (AccIf)
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9SW programmable RF interface (MFI)
10 Programmable serial interface for Hagar RFIC (SCU)
11 Test interface (TestIf)
Memory Block
For the MCU UPP includes ROM, 2 kbytes, t hat is used mainly for boot code of MCU. To
speed up the MCU operation small 64 byte cache is also integrated as a part of the MCU
memory interface. For program memory 8 Mbit (512 x 16 bit) PDRAM is integrated. RAM
block can also be used as data memory and it is byte addressable. RAM is mainly for MCU
purposes but also DSP has also access to it if needed.
MCU code is stored into external flash memory. Size of the flash is 64 Mbit (4096 x 16
bit) The NSM-9DX baseband supports a burst mode fla sh with multiplexe d address/data
bus. Access to the flash memory is performed as 16-bit acce ss. The flash has Read While
Write (RWW) capabilities which makes the emulation of EE PROM within the flash easy.
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RF Module
The RF module takes care of all RF functions of the engine. RF circuitry is located on one
side (B-side) of the 8 layer PCB. PCB area for the RF circuitry is about 12 cm2. PCB area
for the FM radio is about 5 cm2.
EMC leakage is prevented by using a metal B-shield, which screens the whole RF side
(included FM radio) of the engine. The conduc tive silicone gasket is used between the
PCB and the shield. The metal B-shield is separated to three blocks. The first one includes
the FM radio. The second block includes the PA, antenna switch, LNAs and dual RX SAW.
The third block includes the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters. The
blocks are divided on the basis that the attenuation requi rement between harmon ics of
the transmitter and the VCO signal (including Hagar IC) is high. In order to achieve the
adequate attenuation, a reliable contact be tween the shield and the PCB is important.
The VCO and TX outputs of the Hagar RF IC are located one another as far as possible. In
order to guard against the radiated spurious inside blocks, the RF transmission lines are
made with striplines after PA.
The baseband circuitry is located on the A-side of the board, which is shielded with a
metallized frame and ground plane of the UI-board.
Maximum height inside on B-side is 1.8 mm. Heat generated by the circuitry will be conducted out via the PCB ground planes and metallic B-shield.
Figure 5: RF Frequency Plan
869-894
MHz
1930-1990
MHz
f
f
f/4
HAGAR
f
f/2f/4
f
f/2
PLL
32903980
MHz
I-signal
I-signalI-signalI-signal
Q-signal
RX
1850-1910
MHz
824-849
MHz
26 MHz
VCTCXO
I-signal
Q-signal
TX
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DC characteristics
Regulators
Transceiver has a multifunction power management IC on baseband section, which contains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher for charge
pump.
All regulators can be controlled individually with 2.78 V logic directly or through control
register. In GSM direct controls are used to get fast switching, because regulators a re
used to enable RF-functions.
Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and
VrefRF02 are used as the refere nce voltages f or HAGAR RF-IC , VrefRF01 (1.35V) for bias
reference and VrfeRF02 (1.35V) for RX ADC's reference.
Regulators (except VR2 and VR7) are connected to HAGAR. Different modes are switched
on by the aid of serial bus.
List of the needed supply voltages:
Volt. sourceLoad
VR1APLL charge pump (4.8 V)
VR2TX modulator
VR3VCTCXO + buffer
VR4HAGAR IC (LNAs+mixer+DTOS)
VR5HAGAR IC (div+LO-buff+pres caler),
VR6 HAGAR (Vdd_bb)
VR7VCO
VrefRF01ref. voltage for HAGAR
VrefRF02 ref. voltage for HA GAR
VbattPA
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B
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Figure 6: Power Distribution Diagram
SOURCE
VR1
VR2
VR3
VR4
VR5
4.75 V +/- 3.2 %
10 mA
2.78 V +/- 3 %
100 mA
2.78 V +/- 3 %
20 mA
2.78 V +/- 3 %
50 mA
2.78 V +/- 3 %
50 mA
LOAD
Charge pump in HAGAR
TX IQ modulator, power
ontrol opamp in
VCTCXO
VCTCX O buffer in Hagar
GSM 1900 LNA
RX mixer in Hagar
DTOS in Hagar
PLL in Hagar
UEM
VR6
VR7
VrefRF01
VrefRF02
VBATT
2.78 V +/- 3 %
50 mA
2.78 V +/- 3 %
50 mA
1.35 v +/- 1.15 %
<100ua
1.35 V +/- 2 %
<100ua
3.2 - 4.5 V
1700 mA (max)
Dividers in Hagar
LO buffers in Hagar
Prescaler in Hagar
Power detector
BsectioninHagar
SHF VCOModule
Ref. volt. for Hagar RX
Ref. volt. for Hagar
PA module
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RF characteristics
Table 17: Main R F C h a ra cteristic
ItemValues GSM850/1900
Receive frequency range869...894 MHz / 1930...1990 MHz
Transmit frequency range824...849 MHz / 1850...1910 MHz
Duplex spacing45 MHz / 80 MHz
Channel spacing200 kHz
Number of RF channels124 / 299
Pow er class4 (2 W) / 1 (1 W)
Number of power levels15 / 16
Transmitter characteristics
Table 18: Transmitter characteristics
ItemValues GSM850/1900
TypeDirect conversion, nonlinear, FDMA/TDMA
LO frequency range3296...3396 MHz / 3700...3820 MHz
Output power 2 W / 1 W peak
Gain control rangemin. 30 dB
Maximum phase error (RMS/peak)max 5 deg./20 deg. Peak
Receiver characteristics
Table 19: Receiver characteris tic s
ItemValues GSM850/1900
TypeDirect conversion, L ine ar, FDMA/TDMA
LO frequencies3476...3576 MHz / 3860...3980 MHz
Typical 3 dB bandwidth+/- 91 kHz
Sensitivitymin. - 102 dBm
Total typical receiver voltage gain (from antenna
to RX ADC)
86 dB
Receiver output level (RF level -95 dBm)230 mVpp, single-ended I/Q signals to RX ADCs
Typical AGC dynamic range83 dB
Accurate AGC control range60 d B
Typical AGC step in LNA25dB / 35 dB
Usable input dynamic range-102... -10 dBm
RSSI dynamic range-110... -48 dBm
Compensated gain variation in receiving band+/- 1.0 dB
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Figure 7: RF Block Diagram
850
LNA
1900
LNA
RXI
f/4
f
RXQ
INTERNAL
ANTENNA
DUAL
SAW
FI LTER
ANTENNA SW I TCH MODULE
DUAL
COUPLER
DUAL PA MODULE
Frequency synthesizer s
VCO frequency is locked with PLL into stable frequency source, which is a VCTC XO-module (voltage controlled temperature compensated cr ystal oscillator). VCTCXO is running
at 26 MHz. Temperature drifting is con trolled with AFC (automatic frequency control)
voltage. VCTCXO is locked into frequency of the b ase station. AFC is genera ted by baseband with a 11 bit conventional DAC. 13MHz VCTCXO can also be used if multislot operations is not needed. If more tha n 1(RX)+1(TX) slot is wanted settling times hav e to be
less than 300us from channel to channel. This can be achieved when the PLL loopband
width is ~35kHz. Noise coming from the loop and noise from dividers (20*logN) increases
rms phase error over 3 degrees which is the max imum for synthesizer.
SHF
VCO
850 TX SAW
BALUN
Vbat t
BALUN
f/2
f
f/4
f
f/2
f
PLL
HAGAR RFI C
SERI AL CT RL BUS
TXC
TXQP
TXQN
TXI P
TXI N
26 Mhz
AFC
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LPK
M
f
r
CCS Technical DocumentationSystem Module & UI
Figure 8: Frequency synthesizers
req.
R
f
ref
f_out /
M
PHASE
DET.
CHARGE
PUMP
eference
AFC-controlled
f_out
CO
Kd
vco
M
= A(P+1) + (N-A)P=
=NP+A
PLL is located in HAGAR RF-IC and is controlled via serial RFBus. There is 64/65 (P/P+1)
prescaler, N- and A-divider, reference divider, phase detector and charge pump for the
external loop filter. SHF local signal, generated by a VCO-module (VCO = voltage controlled oscillator), is fed through 180deg balanced phase shifter t o prescaler. Prescaler is
a dual modulus divider. Output of the prescaler is fed to N- and A-divider, which produce
the input to phase detector. Phase detector compares this signal to reference signal
(400kHz), which is divided with reference divider from VCTCXO output. Output of the
phase detector is connected into charge pump, w hich charges or discharges integrator
capacitor in the loop filter depending on the phase of the measured frequency compared
to reference frequency.
Loop filter filters out comparison pulses of phase detector and generates DC control voltage to VCO. Loop filter defines step response of the PLL (settling time) and effects to stability of the loop, that's why integr ator capacitor has a resi stor for phase compensation.
Other filter components are for side band rejectio n. Dividers are control led via ser ial bus.
RFBus Data is for data, RFBusClk is serial clock for the bus and RFBusEna1X is a latch
enable, which stores new data into dividers.
LO-signal is generated by SHF VCO module. VCO has double the frequency in GSM1900
and four times the frequency in GSM850 compared to actual RF channel frequency. LO
signal is divided by two or four in HAGAR, depending on system mode.
Receiver
The receiver is a direct conversion, dual band linear receiver. The received RF-signal from
the antenna is fed via RF-antenna switch module to 1st RX bandpass RF-SAW filters and
MMIC LNAs (low noise amplifier). The RF-antenna switch module contains both upper
band and lower band operation. The LNA amplified signal is fed to 2nd RX bandpass RF-
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SAW filters. Both 2nd RX bandpass RF-SAW filters have un-bal/bal configuration to get
the balanced feed for Hagar.
The discrete LNA have three gain levels. The first one is max. gain, the second one i s
about -35dB(GSM1900) and –25dB(GSM850) below max. gain and the last one are off
state. The gain selection control of the LNA comes from HAGAR IC.
The RX bandpass RF-SAW filters define how good are the blocking characteristics against
spurious signals outside baseband and the protection against spurious responses.
Differential RX signal is amplified and mix ed directly down to BB frequency in HAGAR.
Local signal is generated with external VCO. VCO signal is divided by 2 (GSM1900) or by
4 (GSM850). PLL and dividers are in HAGAR-IC.
From the mixer output to ADC input RX signal is divided into I- and Q-signals. Accurate
phasing is generated in LO dividers. After the mixer DTOS amplifiers convert the differential signals to single ended. DTOS has two gain stages. The first one has constant gain of
12dB and 85kHz cut off frequency. The gain of second stage is controlled with control
signal g10. If g10 is high (1) the gain is 6dB and if g10 is low (0) the gain of the stage is
-4dB.
The active channel filters in HAGAR provides selectivity for channels (-3dB @ +/-91 kHz
typ.). Integrated base band filter is act ive-RC-filter with two off-chip capacitors. Large
RC-time constants needed in the channel sel ect filter of direct conversion receiver are
produced with large off-chip capacitors because the impedance levels could not be
increased due to the noise specifications. Baseband filter consist s of two stages, DTOS
and BIQUAD. DTOS is differential to single-ended converter having 8dB or 18dB gain.
BIQUAD is modified Sallen-Key Biquad.
Integrated resistors and capacito rs are tunable. These are controlled wit h a digital control word. The correct control words that compensate for the process variations of integrated resistors and capacitors and of tolerance of off chip capacitors are found with the
calibration circuit.
Next stage in the receiver chain is AGC-am plifier, also integrated into HAGAR. AGC has
digital gain control via serial mode bus. AGC-stage provides gain control range (40 dB,
10 dB steps) for the receiver and also the necessary D C compensation. Additional 10 dB
AGC step is implemented in DTOS stages.
DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus).
DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage
which cause a zero dc-offset. DCN2 set the signal offset to constant value (VrefRF_01
1.35 V). The VrefRF_01 signal is used as a zero level to RX ADCs.
Single ended filtered I/Q-signal is then fed to ADCs in BB. Input level for ADC is 1.45 Vpp
max.
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Rf-temp port is intended to be used for compensation of RX SAW filters thermal behavior. These phenomena will have impact to RSSI reporting accuracy. The current information is -35ppm/C for center frequency drift for all bands. This temperature information is
a voltage over two diodes and diodes are fed with constant current.
Transmitter
Transmitter chain consists of two final frequencies, IQ-modulators for upper and lower
band, a dual power amplifier and a power control loop.
I- and Q-signals are generated by baseband. After post filtering (RC-network) they go
into IQ-modulator in HAGAR. LO-signal for modulator is generated by VCO and is divided
by 2 or by 4 depending on system mode. There are separate outputs, one for GSM850 and
one for GSM1900.
There is an SAW filter before the PA in GSM850 branch to attenuate unwanted signals
and wideband noise from the Hagar IC.
The final amplification is realized with a dual band power amplifie r. It has two different
power chains, one for GSM850 and one for GSM1900. The PA is able to produce over 2 W
(0dBm input level) in GSM850 band and over 1 W (0 dBm input level) in upperband band
into 50 ohm output. The gain control range is over 55 dB to get the desired power levels
and power ramping up and down.
Harmonics generated by the nonlinear PA are filtered out with filtering inside the
antenna switch -module.
Power control circuitry consists of discrete power detector (common for lower and
upperband) and error amplifier in HAGAR. There is a directional coupler connected
between PA output and antenna switch. It is of a dualband type and ha s input and outputs for both systems. The di rectional coupler takes a sample from the f orward going
power with certain ratio. This signal is rectified in a schottky-diode and it produces a DCsignal after filtering.
The detected voltage is compared in the error-amplifier in HAGAR to TXC- voltage, which
4
is generated by DA-converter in BB. TXC has got a raised c osine form (cos
- function),
which reduces switching transients, when pulsing power up and down. Because dynamic
range of the detector is not wide enough to control the power (actually RF output voltage) over the whole range, there is a control named TXP to work under detected levels.
Burst is enabled and set to rise with TXP until the output level is high enough, that feedback loop works. Loop controls the output via the control pin in PA to the desired output
level and burst has got the wa veform of TXC-ramps. Because feedback loops c ould be
unstable, this loop is compensated with a dominating pole. This pole decreases gain o n
higher frequencies to get phase margins high enough. Also this pole filter out the noise
which is coming from TXC line.
Before power ramp the temperature information from detector is stored to Ctemp. This
temperature information is used during the burst to compensate power levels in different
temperatures. TXP signal enables the antenna switch module to TX mode. The power
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control loop in HAGAR has two outputs, one for both freq. bands.
AFC function
AFC is used to lock the transceiv ers clock to fre quency of the base sta tion. AFC -voltag e is
generated in BB with 11 bit DA-converter. There is a RC-filter in AFC control line to
reduce the noise from the converter. Settling time requirement for the RC-network
comes from signalling, how often PSW (pur e sine wave) slots occur. They are repeated
after 10 frames. AFC tracks base station frequency continuously, so transceiver has a stable frequency, because changes in VCTCXO-output don't occur so fast (temperature).
Settling time requirement come s also from the start up-time allowed. When the transceiver is in sleep mode and "wa kes" up to r eceiv e mod e, there is only about 5 ms for the
AFC-voltage to settle. Wh en the first burst co mes in system clock ha s to be settled into
+/- 0.1 ppm frequency accuracy. The VCTCXO-module requires also 5 ms to settle into
final frequency. Amplitude rises into full swing in 1... 2 ms, but frequency settling time is
higher so this oscillator must be powered up early enough.
DC-compensation
DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus).
DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage
which cause a zero dc-offset. DCN2 set the signal offset to consta nt value (RXREF 1.35
V). The RXREF signal is used as a zero level to RX ADCs.
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UI Board LK5
NSM-9DX consists of separate UI board, named as LK5, which includes contacts for the
keypad domes and LEDs for keypad illumination. UI board is connected to main PWB
through 16 pole board-to-board connector with springs. Signals of the connector are
described in section External and Internal Signals and Connections.
5x4 matrix keyboard is used in NSM-9DX. Key pressing is detected by scanning procedure. Keypad signals are connected UPP keyboard interface.
When no key is pressed row inputs are high due to UPP internal pull-up resistors. The
columns are written zero. When key is pressed one row is pulled down and an interrupt is
generated to MCU. After receiving interrupt MCU starts scanning procedure. All columns
are first written high and then one column at the time is writt en down. All other columns except one which was written down are set as inputs. Rows are read while column
at the time is written down. If some row is down it indicates that key whic h is at the
cross point of selected column and row was pressed. After detec ting pressed k ey all re gisters inside the UPP are reset and columns are written back to zero.
LCD & Keypad Illumination
In NSM-9DX pastel blue LEDs are used for LCD and keypad illumination. For LCD illumination four LEDs (on HG9) are used and for keypad six LEDs (on LK5).
Current through LEDs is controlle d by transistor circuitry. External transistor driver circuitry is used as constant current source in order to prevent any change in battery voltage be seen as changing led brightness. Battery vol tage is changing , for example , during
charging.
Figure 9: Display and keypad illumination circuitry.
4R36R8
4K3
VBAT
6K8
470R
Keypad
LEDs are controlled by the UE M P WM outputs. Both LED gro ups ar e co ntrolled by KLight
output of the UEM. Current flo w through the LEDs is set by biasing the transistor and
limiting the current by resistors. Current is set separately to keypad and LCD LEDs.
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Display
LEDs
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System Module & UICCS Technical Documentation
Internal Speaker
The internal earpiece is a dynamic earpiece with an impedance of 32 ohms. The earpiece
is low impedance one since the sound pressure is to be generat ed using current and not
voltage as the supply voltage is restricted to 2.7 V. The earpiece is driven directly by the
UEM. The ear piece driver in UEM is a bridge amplifier.
Figure 10: Speaker Connection
UEM
EARP
EARN
22R
22R
22pF22pF
000R@100MHz
000R@100MHz
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P arts List
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Table of Contents
Page No
Parts List of HG9 (EDMS Issue 1.0) ............................................................................. 3
CCSTechnical DocumentationServiceSoftware Instructions& Service
Service Software Instructions
Phoenix
Phoenix is the next generation Service Software and it has been designed to meet the
challenges in servicing modern cellular phones.
The Phoenix program has been built using component architecture. This means that the
actual program is small and most of the program’s functionality is divided into dynamically loaded modules or DLLs.
Supported Operating Systems
The Phoenix program can be used in any of the following operating systems:
Windows 95, 98, 2000, ME and NT 4.0 (SP4).
Table 1: Supported O perating Systems
Supported Operating Systems
Windows 95
Windows 98
Windows NT 4.0
Windows 2000
Hardware requirements for using Phoenix
The minimum hardware requirements for using Phoenix are:
Table 2: HW requirements for AMS
Minimum HW requirements for AMS
Processor233 MHz
RAM64 MB
Needed disk space50 - 100 MB
For Windows 2000, the following requirements are recommended:
Table 3: HW requirements for Windows 2000
Recommended HW for Windows 2000
Processor700 MHz
RAM512 MB
Needed disk space50 - 100 MB
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Introduction
This section briefly describes how to install the Phoenix software and includes some
basic information on how to use the program. For more detailed information, please refer
to the Phoenix’s Help -files. Each feature in Phoenix has its own Help function, which
can be activated while running the program.
Press the F1 key or the feature's Help-button to activate a Help -file.
Setting up Phoenix
1Download the latest rel ease. Please contact your regional After Market Service s
point for information on where to download the latest release.
Download and read the release notes, whic h will have useful information on the
software version you are using.
2Install Phoenix by executing the phoenix installation package and follow the
instructions on the screen.
Note: In some products the setup may require you to reboot the computer. In
either case, the setup will register Phoenix components. This process can take
several minutes.
3Download the latest data packages for the products you will be using.
By default, the program files are stored under C:\Program Files\Nokia\Phoenix
The Phoenix program has been built using component architecture. This mea ns
that the actual program is very small and most of the program’s f unctionality i s
divided into dynamically loaded modules (DLLs).
The data packages will create product spe cific directories under the insta llation
directory.
Installing Phoenix
1Before you start installing the program, check that
• the dongle is attache d to the parallel port. Contact your supervisor in order to
obtain a suitable dongle.
• you have administrator rights (Windows NT or Windows 2000). This is required
in order to be able to install Phoenix.
2The installation checks that the latest supported dongle driver version is
installed. The dongle driver is installed if there is no previous installa tion of the
dongle driver or if the installed dongle driver is older than the latest supported
version.
3Reboot your PC before using Phoenix, if you are requested to do so.
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Uninstalling Phoenix
Uninstalling another Phoenix version
1Make sure that the dongle is attached.
2Go to the Control Panel and select Add/Remove Programs.
3Select TSS4 Phoenix Release xx.yy.zzz for uninstallation and click Add/Remove.
4Click OK to remove the application
You may be required to reboot your PC after uninstallation.
Note: If you have different product packages installed, the components are unin-
stalled only if they are not included in other product packages.
Data Packages
Data Packages (DP) is a name for a helpful feature in the Phoenix software. This type of
feature provides a flexible way of distributing and installing Phoenix and its data files.
All product-specific data is separated from the pr ogram code and installed separately.
This means that the installation is performed in at least two steps.
Each product will have its own DP. The FPS-8 flashing equipment also has its own package.
Starting a session
Concepts
In the Phoenix context, Product means the cellular phone attached to a PC. More specifically, it is a particular type of phone.
Connection means the type of cable used to attach the phone to the port to which the
other end of the cable is attached.
Selecting a connection
The connection defines the cable and the comm unications port that will be used when
connecting to the phone.
1Active conne ctions are listed in the toolbar’s Connection pull-down menu. You
should make sure that the connection is correct before using the software.
Change it, if necessary.
In case the connection is the wrong one, you need to create a new one.
2Select Settings from the pull-down menu.
3Select Add in the Connection List Dialog and in fill the rele vant fields in the Con-
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nection setup dialog.
Selecting a product
Many of Phoenix’s features are product-specific. It is, therefore, mandatory to choose the
product you will be working on at the beginning of the session.
1Select File - Scan Product (or hold the Ctrl key down and press R). Phoenix will
scan the connected product and load additional menus which ar e designed for
the product. If the product is not supported then an error message will be displayed and a different Phoenix data package may be required.
2If you want to manua lly choose the product or if the phone is dead , select File -
Choose Product. You will be presented with a list of available pr oducts.
After the product selection, you will see an addit ional menu item on the main
menu. If you take a look at the available menu items, you will see that their number has increased.
Phoenix environment
You can configure the program’s main toolbar and the product or t ool -specific options
to your liking.
You can control which toolbars are visible by selecting View and Toolbars from the pulldown menu. The visible toolbars are marked with a check.
The rest of the options are product or tool -specific. The tool-specific options are set
using the associated toolbar.
Using components
When working with Phoenix, each task gene rally has its own component that will per form the task. The first thing, therefore, is to open the desired component.
Opening a component means that you open a tool window within Phoenix.
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Service Concepts and Setup Instructions
Flash Concept
Figure 1: Flash Concept
7
9
6
8
4
3
2
1
Table 4: Flash Concept
ItemNameType
1Point of Sales flash loading adapte rF LA-180770318
2 Power cableFLC-20730185
5
Code
3Modular CableXCS-40730178
4Flash prommer boxFPS-80080321
5Printer cable, incl. in FPS-8 sales package073F000
6D9 - D9 cable, incl. in FPS-8 sales packageAXS-40730090
7Software protection keyPKD-10750018
8Phoenix S erv i c e Software8406941
NSM-9DX Flash SW dat a
9AC charger, incl. in FPS-8 sales package0680032
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Flash Concept - POS (Point-of-Sale)
Figure 2: POS Flash Concept
4
5
2
3
1
Table 5: POS Flash Concep t
ITEMNAMETYPECODE
1Point-of-Sales flash loading adapterFLA-180770318
2Service CableXCS-10730218
3AC Charger (see General Information)ACP-12
4POS flash dongle for Americas areaFLS-40081482
5Phoenix Service SW8406941
NSM-9DX Flash SW data
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JBV-1 Flash Concept
Figure 3: JBV-1 Flash Concept
7
9
8
4
3
2
1
6
5
Table 6: JBV-1 Flash Concept
ITEMNAMETYPECODE
1Docking stationJ BV -10770298
2DC power cablePCS-10730012
3Modular cableXCS-80730178
4Flash prommer boxFPS-80080321
5Printer cable, incl. in FPS-8 sales package073F000
6D9 - D9 cable, incl. in FPS-8 sales packageAXS-40730090
7Software protection keyPKD-10750018
8Phoenix Service Soft wa re8406941
NSM-9DX Flash SW data
9AC charger, incl. in FPS-8 sales package0680032
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Jig Concept
Figure 4: Jig Concept
5
6
2
1
4
3
Table 7: Jig Concept
ITEMNAMETYPECODE
1Module jigMJS-460770316
2DC P o wer CablePCS-10730012
3RF antenna cableXRF-10730085
4Service MBUS cableDAU-9S0730108
5Software protection keyPKD-10750018
6Phoenix Service Soft wa re8406941
NSM-9DX Flash SW data
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CPL-9 Service Concept
Figure 5: CPL-9 Service Co ncept
5
6
2
1
4
3
Table 8: CPL-9 Service Concept
ITEMNAMETYPECODE
1Docking stationJ BV -10770298
2Docking stati o n adapterMJF-60770317
3CouplerCPL-90770529
4DC-DC cableSCB-30730114
5RF antenna cableXRF-10730085
6DC power cablePCS-10730012
7Service MBUS cableDAU-9S0730108
8Software protection keyPKD-10750018
9Phoenix Service Soft wa re8406941
NSM-9DX Flash SW data
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Parallel Flash Concept
Figure 6: Parallel Flash Concept
Table 9: Parallel Flash Concept
ITEMNAMETYPECODE
1Docking stati o n adapterMJF-60770317
2Docking stationJ BV -10770298
3Modular cableXCS-80730178
4DC power cablePCS-10730012
7D9 - D9 cable, incl. in FPS-8 sales packageAXS-40730090
8Printer cable, incl. in FPS-8 sales package073F000
10Software protection keyPKD-10750018
11Phoenix Service Software8406941
NSM-9DX Flash SW data
17Parallel flash prommerFPS-8C0080396
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Service T ools
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Table of Contents
Page No
JBV-1 Docking Station and MJF-6 Adapter ...............................................................4
Fig 1 View of JBV-1 and MJF-6 together ...........................................................................5
Fig 2 View of MJS-46 .........................................................................................................6
Fig 3 View of MJS-47 .........................................................................................................7
Fig 4 View of FPS-8............................................................................................................8
Fig 5 View of FPS-8C .........................................................................................................9
Fig 6 View of ACF-8...........................................................................................................10
Fig 7 View of FLA-18 .........................................................................................................11
Fig 8 View of FLC-2 ...........................................................................................................12
Fig 9 View of AXS-4...........................................................................................................13
Fig 10 View of XCS-1.........................................................................................................14
Fig 11 View of SW Security Device ...................................................................................15
Fig 12 View of FLS-4..........................................................................................................16
Fig 13 View of PCS-1..........................................................................................................17
Fig 14 View of XRF-1.........................................................................................................18
Fig 15 View of DAU-9S......................................................................................................19
Fig 16 View of SCB-3 .........................................................................................................20
Fig 17 View of XCS-4.........................................................................................................21
Fig 18 View of Printer Cable...............................................................................................22
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JBV-1 Docking Station and MJF-6 Adapter
The JBV-1 Docking Station has been designed for calibration and software update use.
The MJF-6 Docking Station Adapter makes signal connections to the phone. JBV-1 and
MJF-6 are used as one unit.
JBV-1 main electric functions are:
•adjustable VBATT calibration voltage, current measurement limit voltage
"VCHAR", current measurement calibration current "ICHAR"
•adjustable ADC calibration voltage via BTEMP and BSI signal
•BTEMP and BSI calibration resistor
•signals from FBUS to the pho ne via parallel jig
•control via FBUS or USB
•Flash OK/FAIL indication
In the calibration mode, the JBV-1 is powered by an external power supply 11 -16V DC.
During flashing, power for the phone can b e taken from the FPS-8 or from an external
power supply 11-16V DC.
The MJF-6’s main electric functions are:
•phone recognizing from BTEMP
•filters of FBUS signals
•SIM CARD reader
Product Code
JBV-1 Docking Station:0770298
MJF-6 Docking Station Adapter:0770317
CPL-9 RF-Coupler: 0770529
CPL-9 is used with JBV-1 and MJF-6 for making RF coupler connection from the phone
to the measurement equipment.
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MJS-46 Module Jig
The MJS-46 Module Jig is used for testing of UI/system/RF-module*.
Product Code
MJS-46 Module Jig:0770316
Figure 2: View of MJS-46
*Note: The nominal supply voltage for MJS-46 is +8.0 V. The supply voltage must
not exceed +12.0 V (min. 5V). (MJS-46 has overvoltage protection). For f lashing with FPS-8, it is possible to bypass the regulator with a jumper. Then the
supply voltage must not exceed 5.2 V.
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MJS-47 Soldering J ig
The Soldering Jig MJS-47 is used for soldering and as a rework jig for system module.
Product Code
MJS-47 Module Jig:0770342
Figure 3: View of MJS-47
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FPS-8 Flash Prommer (Sales Pack)
The Flash Prommer FPS-8 is used with e.g. FLA-18 and JBV-1. Power is supplied to FPS-8
from the Universal Power Supply.
The sales pack includes:
•FPS-8 Flash Prommer0750123
•FPS-8 Activation Sheet9359289
•Universal Power Supply0680032
•AXS-4 Service Cable (D9-D9)0730090
•Printer cable073F000
Sales Package Code
FPS-8 Flash Prommer:0080321
Figure 4: View of FPS-8
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FPS-8C Parallel Flash Prommer (Sales Pack)
The Parallel Flash Prommer FPS-8C is used with MJF-6 and JBV-1. Flash programming
can be done to maximum of 8 phones parallel. FPS-8C consists of eight SF11C programming cards. SF11C card is functionally identical to FPS-8.
Sales package code
FPS-8C Parallel Flash Prommer:0080396
Figure 5: View of FPS-8C
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ACF-8 Universal Power Supply
ACF-8 Universal Power Supply is used to power FPS-8. ACF-8 has 6 V DC and 2.1 A output.
Product Code
ACF-8 Universal Power Supply:0680032
Figure 6: View of ACF-8
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FLA-18 POS (Point Of Sale) Flash Loading Adapter
The POS Flash Loading Adapter FLA-18 is used in place of the phone's normal battery
during service, to supply a controlled operating voltage.
Product Code
FLA-18 POS Flash Loading Adapter:0770318
Figure 7: View of FLA-18
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FLC-2 DC Cable
The FLC-2 is used to supply a controlled operating voltage.
Product Code
FLC-2 DC Cable:0730185
Figure 8: View of FLC-2
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AXS-4 Service Cable
The AXS-4 D9-D9 Service Cable is used to connect two 9 pin D connectors e.g. between
PC and FPS-8. Cable length is 2 meters.
Product Code
AXS-4 D9-D9 Service Cable:0730090
Figure 9: View of AXS-4
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XCS-1 Service Cable
The XCS-1 Service Cable is used to connect FLS-4 to FLA-18.
Product Code
XCS-1 Service Cable:0730218
Figure 10: View of XCS-1
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SW Security Device PKD-1
SW security device is a piece of hardware enabling the use of the service software when
connected to the parallel (LPT) port of the PC. Without the dongle present it is not possible to use the service software. Printer or any such device can be connected to the PC
through the dongle if needed.
Caution: Make sure that you hav e switched off the PC and the printer before making
connections!
Caution: Do not connect the PKD-1 to the serial port. You may damage your PKD-1.
Product Code
SW Security Device PKD-1:0750018
Figure 11: View of SW Security Device
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FLS-4 POS (Point Of Sale) Flash Device (Sales Pack)
FLS-4 is a dongle and flash device incorporated into one package, developed specifically
for POS use.