Nokia 6590 Service manual

Customer Care Solutions (CCS)

Technical Documentation

SERVICE

MANUAL

[NMP Part No. 0275637]

NSM-9DX

Series Cellular Phones

Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

Customer Care Solutions (CCS)

Technical Documentation

Amendment Record Sheet

Amendment No Date Inserted By Comments

06/2002 JoM First Draft
10/2002 ViK Issue 1

Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

Contents:

Customer Care Solutions (CCS)

Technical Documentation

NSM-9DX Overall Manual Contents

Section 1: Foreword
Section 2: General Information
Section 3: System & UI Module LU9
Section 4: Parts List
Section 5: Product Variants
Section 6: Service Software Instructions & Service Co nc epts
Section 7: Service Tools
Section 8: Assembly & Disassembly Instructions
Section 9: Troubleshooting Instructions
Section 10: Accessories
Section 11: Schematic Diagrams

Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

Customer Care Solutions (CCS)

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be
included with service bulletins.

While every endeavour has been m ade to ensure the accuracy of this do cument, some
errors may exist. If any errors are found by th e reader, NOKIA CORPORATION. should be
notified in writing.

Please state:

Technical Documentation

IMPORTANT

Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error

Please send to: Nokia Corporation / Nokia Mobile Phones

CCS Technical Documentation
PO Box 86
FIN-24101 SALO
Finland

Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

Customer Care Solutions (CCS)

Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide for instructions relating to operation,
care and maintenance including important safety information.

Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELEC­TRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYS­TEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC
SYSTEMS TO RF ENERGY.

2. THE HANDPO RTABLE TELE PHONE MU ST NOT BE OPERATED IN AREAS LIKELY

3. OPERATION OF ANY RADIO T RA N SMITTING EQUIPMENT, INCLUDING CELLU-

Cautions:

1. Servicing and alignment must be undertaken by qualified personnel only.

2. Ensure all work is carried out at an anti-static workstation and that an anti-

3. Ensure sold er, wire, or foreign mat ter does not ent er the te lephone as dam-

4. Use only approved components as specified in the parts list.

5. Ensure all compo nents, modules screws and insulators are correctly re-fit-

TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.

LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADE­QUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS.
OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

static wrist strap is worn.

age may result.

ted after servicing and alignmen t. Ensure all cables and wires are r eposi­tioned correctly.

Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

Customer Care Solutions (CCS)

Technical Documentation

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Issue 1 10/02

Copyright¤ 2002 Nokia Corporation All Rights Reserved

CCS Technica l Documentation

NSM-9DX Series Transceivers

General Information

Issue 1 10/02 ¤Nokia Corporation

NSM-9DX

General Information CCS Technical Documentation

Table of Contents

Page No

The Product.................................................................................................................... 3

Hand portable ...............................................................................................................3

Desktop Option ............................................................................................................4

Product and Module List .............................................................................................5

General Specifications of Transceiver NSM-9DX ......................................................6

List of Figures

Page No

Fig 1 Hand portable .............................................................................................................3

Fig 2 Desktop option............................................................................................................4

Page 2 ¤Nokia Corporation Issue 1 10/02

NSM-9DX

CCS Technical Documentation General Information

The Product

The NSM-9DX is a dual band hand portable mobile telephone for GSM 850/1900 net­works. It is a GSM 850/1900 power class 1 (1W) transceiver. The main transceiver fea­tures are:

• High resolution B&W display (96 x 65 pixels)

• Full graphic display

•GPRS

• Integrated IR link & internal data

• Internal vibra

• Integrated FM Radio

• Plug & play HF support

• Plug-in SIM card below the battery of the phone

• Integrated antenna

• Jack style UI with two soft keys

• TTY support

Hand portable

Figure 1: Hand portable

1, NSM-9DX

4. ACP-12E

2.

HDC–5

3. ACP-12U

3. ACP-12AR

Table 1: Ha nd portabl es

Item Name Type code Material code

1 Transceiver See Product Variants

Standard battery Li-ion BLB-2 0670246
2 Headset HDC-5 0694059
3 StandardCha rger (USplug) 108-132 Vac ACP-12U 0675303

StandardCharger (USplug) 198-242 Vac ACP-1 2E 0675294
4 StandardCharger (Europlug) 207-253 Vac ACP-12AR 0675298
5 Standard Travel Charger ACP-7

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NSM-9DX

General Information CCS Technical Documentation

Desktop Option

The desktop option allows the user to charge the phone from the mains. Besides these
optional chargers also ACP-8 can be used.

Figure 2: Desktop option

1. NSM-9DX

2. DCD-1 Desk Stand

4. ACP-12E

3. ACP-12U

Table 2: Desktop options

Item Name: Type Code: Material Code:

1. Transceiver (See Product Variants) See Product Variants
2 Desk stand DCD-1 0675253

3. Travel Charger (

4. Travel Charger (US plug) 90-264 Vac ACP-8U 0675303

Travel Charger (AR-plug) ACP-12AR

Euro plug) 90-264 Vac ACP-12E 0675294

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NSM-9DX

CCS Technical Documentation General Information

Product and Module List

Table 3: Product and module list

Unit/type Product code

NSM-9DX Transceiver See Product Variants
BLB-2 Standard Battery Li-ion 0670322
ACP-7E Travel Charger (EUR) 207-253 Vac 0675144
ACP-7U Standard Charger (US) 108-132 Vac 0675143
ACP-7C Standard Charger (US) 198-242 Vac 0675158
ACP-8E Rapid Charger (EUR) 90-264 Vac 0675195
ACP-8U Travel Charger (US) 90-264 Vac 0675196
ACP-12E Travel Charger

ACP-12U Travel Charger
ACP-12AR Travel Charger

LCH-9 Rapid Cigarette Lighter Charger 0675120
MBD-10 Mobile Holder 0630409
DCD-1 Desktop Stand 0675253
DDC-1 Battery Charging Stand 067526 1
HDC-5 Headset Kit (with answer and end button) 0694059
LPS-3 Loopset 0630244
HDB-5 Boom Headset 0694107
HDD-1 Dual Headset 0694066
HDE-2 Headset Kit 0694075
HDA-9 TTY/TTD Phone Adapter 06941 1 6
CARK-130 Express Carkit (PPH-1, HFM-8, MBD-10, HHS-15) 0080539
CARK 132 Full Carkit (MCC-5 , HHS-9, MKU -1, HFU - 5, HFS-12, HFM-8, PCH-4) 008519 8
PPH-1 Plug-in HF Car Kit 0675182

0675294
0675303
0675298

MKU-1 Mounting Plate 0620036
HHS-9 Swivel Mount 0620037
HFM-8 HF Microphone 0690016

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NSM-9DX

General Information CCS Technical Documentation

General Specifications of Transceiver NSM-9DX

Table 4: NSM-9DX General Specifications

Parameter GSM850/1900

Receive frequency range 869...894 MHz / 1930…1990 MHz
Transmit frequency range 824...849 MHz / 1850…1910 MHz
Duplex spacing 45 / 80 MHz
Channel spacing 200 kHz
Number of RF channels 124 / 299
Power class 4(2W)/1(1W)
Number of power levels 15 / 16
Sensitivity, Static channel -102 dBm
Frequency error, static channel <0.1ppm
RMS Phase error <5.0°
Peak phase error <20.0°

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CCS Technica l Documentation

NSM-9DX Series Transceivers

System Module & UI

Issue 1 10/02 ¤Nokia Corporation

NSM-9DX

System Module & UI CCS Technical Documentation

Table of Contents

Transceiver NSM-9DX.................................................................................................. 4

Introduction ..................................................................................................................4

Electrical Modules..................................................................................................... 4

Operation Modes....................................................................................................... 4

Interconnection Diagram .............................................................................................5

System Module HG9...................................................................................................... 6

Baseband Module ........................................................................................................6

Block Diagram .............................................................................................................7

Technical Summary................................................................................................... 8

DC Characteristics .......................................................................................................9

Regulators and Supply Voltage Ranges.................................................................... 9

External and Internal Signals and Connections....................................................... 10

Internal Signals and Connections............................................................................ 10

External Signals and Connections .............................................................................16

UI (board-to-board) connector ................................................................................ 16

LCD connector........................................................................................................ 16

DC connector........................................................................................................... 18

Headset connector ................................................................................................... 18

Functional Description ...............................................................................................20

Modes of Operation................................................................................................. 20

Supply Voltage Regulation ..................................................................................... 21

Battery..................................................................................................................... 22

Power Up and Reset................................................................................................ 22

A/D Channels.......................................................................................................... 23

IR Module ............................................................................................................... 23

SIM Interface........................................................................................................... 24

Buzzer...................................................................................................................... 25

Internal Microphone................................................................................................ 25

UPP.......................................................................................................................... 26

Memory Block......................................................................................................... 26

RF Module ................................................................................................................... 28

DC characteristics ......................................................................................................29

Regulators................................................................................................................ 29

RF characteristics .......................................................................................................31

Transmitter characteristics ...................................................................................... 31

Receiver characteristics........................................................................................... 31

Frequency synthesizers ..............................................................................................32

Receiver .....................................................................................................................33

Transmitter .................................................................................................................35

AFC function .............................................................................................................36

DC-compensation ......................................................................................................36

UI Board LK5 .............................................................................................................. 37

LCD & Keypad Illumination .....................................................................................37

Internal Speaker .........................................................................................................38

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CCS Technical Documentation System Module & UI

List of Figures

Page No

Fig 1 Baseband Block Diagram...........................................................................................7

Fig 2 BLB-2 battery pack pin order.....................................................................................22

Fig 3 UPP & UEM SIM connections...................................................................................25

Fig 4 Microphone connection..............................................................................................26

Fig 5 RF Frequency Plan .....................................................................................................28

Fig 6 Power Distribution Diagram.......................................................................................30

Fig 7 RF Block Diagram......................................................................................................32

Fig 8 Frequency synthesizers...............................................................................................33

Fig 9 Display and keypad illumination circuitry. ................................................................37

Fig 10 Speaker Connection..................................................................................................38

List of Schematics

RF & BB ...................................... ................................................ ....................................................................A-1

RF ..........................................................................................................................................................A-2

BB Connections .................................. ................................. .................................. ............................................A-3

System Connector ............................................................................................................................................A-4

Audio Interface .................................................................................................................................................A-5

UEM of BB ..........................................................................................................................................................A-6

UEM VBAT Filtering ..................................................................................................... .....................................A-7

Display and Keyboard Interface ........................ ...........................................................................................A-8

Infrared Module ................................................................................................................................................A-9

SIM Reader ..................................... ..................................................................................................................A-10

UPP of BB ......... .................................. ................................. ............................................................................A-11

Decoupling Capacitors of UPP......................................................... ............................................................A-12

RF - BB Interface.............................................................................................................................................A-13

Flash Memory................................... .................................. ................................. .............................................A-14

Decoupling Capacitors for Flash Memory ................................................................................................A-15

Production Test Pattern.................................................................................................................................A-16

Layout Diagram of HG9 - Top......................................................................................................................A-17

Layout Diagram of HG9 - Bottom..............................................................................................................A-18

Testpoints of HG9 - Top................................................... ..............................................................................A-19

Testpoints of HG9 - Bottom................................................................................. ........................................A-19

Testpoints of HG9 - Top................................................... ..............................................................................A-20

Testpoints of HG9 - Bottom................................................................................. ........................................A-20

UI Board - LK5...................................................................... ............................................................................A-21

Layout Diagram - LK5 .......... ................................. .................................. .......................................................A-22

RF Testpoints Diagram ................................................................................................... ................................A-23

RF Testpoints - PWB layout.......................................................................... ................................................A-24

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NSM-9DX

System Module & UI CCS Technical Documentation

Transceiver NSM-9DX

Introduction

The NSM-9DX is a dual band radio transceiver unit for GSM850/1900 networks. The
GSM1900 power class is 1 and the GSM850 power class is 2. It is a true 3 V transceiver,
with an internal antenna and vibra.

The transceiver has a full graphic display and the user interface is based on a Jack III
style UI with two soft keys.

An internal antenna is used, there is no connection to an extern al antenna.
The transceiver has a low leaka ge toler ant earpiec e and an omnidire ctional mi crophone,

providing an excellent audio quality. The transceiver supports a full rate, and an
enhanced full rate speech decoding.

An integrated IR link provides a connection between two NSM-9DX transceiver or a
transceiver and a PC (internal data), or a tr ansceiver and a printer.

The small SIM (Subscriber Identity Module) car d is locate d under the batter y. SIM inter­face supports both 1.8 V and 3 V SIM cards.

Electrical Modules

The radio module consists of Radio Frequency (RF) and baseband (BB). User Interface (UI)
contains display, keyboard, IR link, vibra, HF/HS connector and audio parts. UI is divided
into radio module PWB HG9 and UI PWB LK5.

The electrical part of the keyboa rd is located in separate UI PWB named LK5. LK5 is con­nected to radio PWB through spring connectors.

The System blocks provide the MCU, DSP, external memory interface and digital control
functions in UPP ASIC (Universal Phone Processor). Power supply circuitry, charging,
audio processing and RF control hardware are in UEM ASIC (Universal Energy Manage­ment).

The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.

Operation Modes

The transceiver has six different operation modes:

• power off mode

•idle mode

• active mode

• charge mode

• local mode

• test mode

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CCS Technical Documentation System Module & UI

In the power off mode circuits are powered down and only sleep clock is running.
In the idle mode only the circuits needed for power up are supplied.
In the active mode all the circuits are supplied with power although some parts might be

in the idle state part of the time.
The charge mode is effectiv e in parallel w ith all previous mo des. The ch arge mode itself

consists of two different states, i.e. the fast charge and the maintenance mode.
The local and test modes are used for alignment and testing.

Interconnection Diagram

SIM

Antenna

Keyboard
module

Radio
Module
HG9

MIC IR Link Earpiece HF

Display

Battery

Charger

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NSM-9DX

System Module & UI CCS Technical Documentation

System Module HG9

Baseband Module

The baseband architecture supp orts a power saving function called "sleep mode ". This
sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and
baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is
waken up by a timer running from this 32 kHz clock supply. The sleep time is determined
by network parameters. Sleep mode is e ntered when both the MCU and the DSP are i n
standby mode and the normal VCTCXO clock is switched off.

NSM-9DX supports both three and tw o w ire t ype of Nok ia charge rs. Three w ire char ger s
are treated like two wire ones. There is not separate PWM output for controlling charger
but it is connected to GND inside the bottom connector. Charging is controlled by UEM
ASIC (Universal Energy Management) and EM SW running in the UPP (Universal Phone
Processor).

The BLB-2 Li-ion battery is used as the power source for the phone.

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NSM-9DX

CCS Technical Documentation System Module & UI

Block Diagram

Figure 1: Baseband Block Diag ram

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NSM-9DX

System Module & UI CCS Technical Documentation

UPP ASIC (Universal Phone Processor) provides the MCU, DSP, external memory interface
and digital control functions. UEM ASIC (Universal Energy Management) contains power
supply circuitry, charging, audio processing and RF control hardware.

Technical Summary

Baseband is running from power rails 2.8 V analog voltage and 1.8 V I/O voltage. UPP
core voltage Vcore can be lowered down to 1.0 V, 1.3 V and 1.5 V. UEM includes 6 linear
LDO (low drop-out) regulators for baseband and 7 regulat ors for RF. It also include s 4
current sources for biasing purposes and internal usage. UEM also includes SIM interface
which supports both 1.8 V and 3 V SIM cards. 5 V SIM cards are not supported by the
NSM-9DX baseband.

A real time clock function is integrated into the UEM which utilizes the same 32 kHz
clock supply as the sleep clock.

The analog interface between the baseband and the RF section is handled by a UEM
ASIC. UEM provides A/ D a nd D/A conv ersi on of the in-phase and quadrat ure re ce ive a nd
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEM supplies the analog TXC and AFC
signals to RF section according to the UPP DSP digital control. Data transmission
between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and
CBUS for MCU. RF ASIC, Hagar, is controlled through UPP RFBUS serial interface. There is
also separate signals for PDM coded a udio. Digital speech processing is handled by the
DSP in side UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from
the baseband supply 1.8 V and the analog parts are running from the analog supply

2.78 V also VBAT is directly used by some blocks.
The baseband supports both internal and external microphone inputs and speaker out-

puts. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEM for decoding. Buzzer
and external vibra aler t control signals are generated by the UEM with separate PWM
outputs.

NSM-9DX has two external serial control interfaces: FBUS and MBUS. These busses can
be accessed only through production test pattern.

EMC shielding for baseband is implemented using a silicon pl astic frame and UI PWB
ground plane. On the other side the engine is shielded with PWB grounding. Heat gener­ated by the circuitry will be conducte d out via the PWB ground planes.

NSM-9DX radio module is implemented to 8 layer PWB. UI module is divided between
main PWB HG9 and separate UI PWB LK5.

NSM-9DX also incudes an integra ted FM-radi o in one chip. Onl y a few e xternal compo­nents are needed.

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CCS Technical Documentation System Module & UI

DC Characteristics

Regulators and Supply Voltage Ranges

Table 1: Battery voltage range

Signal Min. Nom Max Note

VBAT 3.1V 3.6V 4.2V (chargin g hi gh l i mit v o l t ag e) 3.1 V SW cut off

Table 2: BB Regulators

Signal Min. Nom Max Note

VANA 2.70V 2.78V 2.86V I

VFLASH1 2.70V 2.78V 2.86V I

VSIM 1.745V

2.91V

VFLASH2 2.70V 2.78V 2.86V I

VIO 1.72V 1.8V 1.88V I

VCORE 1.0V

1.235V

1.425V

1.710V

1.8V

3.0V

1.053V

1.3V

1.5V

1.8V

1.855V

3.09V

1.106V

1.365V

1.575V

1.890V

max

max

I

Sleep

I

max

I

Sleep

max

I

Sleep

max

I

Sleep

I

max

I

Sleep

Default value = 1.5V

Table 3: RF Regulators

Signal Min. Nom Max Note

= 80mA
= 70mA

= 1.5mA
= 25mA

= 0.5mA
= 40mA

= 1.5mA

= 150mA

= 0.5mA

= 200mA

= 0.2mA

VR1A 4.6V 4.75V 4.9V Imax = 10mA

VR2 2.70V

3.20V
VR3 2.70V 2.78V 2.86V Imax = 20mA
VR4 2.70V 2.78V 2.86V Imax = 50mA

VR5 2.70V 2.78V 2.86V Imax = 50mA

2.78V

3.3V

2.86V

3.40V

Imax = 100mA

ISleep = 0.1mA

ISleep = 0.1mA

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NSM-9DX

System Module & UI CCS Technical Documentation

Table 3: RF Regulators

Signal Min. Nom Max Note

VR6 2.70V 2.78V 2.86V Imax = 50mA

ISleep = 0.1mA

VR7 2.70V 2.78V 2.86V Imax = 45mA

External and Internal Signals and Connections

This section describes the external and internal electrical connection and interface levels
on the baseband. The electrical interface specifications are collected into tables that
covers a connector or a defined interface.

Internal Signals and Connections

Table 4: Internal micr ophone

Signal Min. Nom Max. Condition Note

MICP

2.0V 2.1V

MICN 2.0V 2.1V 2.25V DC

200mV

pp

2.25 V DC

AC

Table 5: Internal speaker

Signal Min. Nom Max Condition Note

EARP 0.75V 0.8V 2.0 V

0.85V

EARN 0.75V 0.8V 2.0 V

0.85V

pp

pp

AC
DC

AC
DC

Differential output

Table 6: AC and DC characteristics of RF-BB voltage supplies

Signal
name

From To Parameter Min. Type Max Unit Function

2.2kΩ to MIC1B

(V

= 4.0 Vpp)

diff

VBAT Battery PA &

UEM

Voltage 2.95 3.6 4.2 V Battery supply. Cut-off
Current 2000 mA
Current drawn by

PA when "off"

0.8 2 uA

level of DCT4 regulators
is 3.04V. Losses in pwb
tracks and ferrites are
taken account to mini­mum battery voltage
level.

Page 10 ¤Nokia Corporation Issue 1 10/02

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CCS Technical Documentation System Module & UI

Table 6: AC and DC characteristics of RF-BB voltage supplies

Signal
name

VR1A UEM VCP Voltage 4.6 4.75 4.9 V Supply for varactor for

VR2 UEM VRF_TX Voltage 2.70 2.78 2.86 V Supply for part of trans-

VR3 UEM VCTCXOVoltag e 2.70 2.78 2.86 V Supply for VCTC X O

From To Parameter Min. Type Max Unit Function

Current 2 10 mA
Noise density 240 nVrm

s/
sqrt(
Hz)

Current 65 100 mA
Noise density

f=100Hz
f>300Hz

Current 1 20 mA
Noise density 240 nVrm

120 nVrm

s/
sqrt(
Hz)

s/
sqrt(
Hz)

UHF VCO tuning.

mit strip. Supply for TX
I/Q-modulators.

VR4 UEM VRF_RXVoltage 2.70 2.78 2.86 V Supply for Hagar RX;

Current 50 mA
Noise density

f = 6 Hz
f = 60 Hz
f y 600Hz

VR5 UEM VDIG,

VPRE,
VLO

VR6 UEM VBB V oltage 2.70 2.78 2.86 V Supply for Hagar BB and

Voltage 2.70 2.78 2.86 V Supply for Hagar PLL;
Current 50 mA
Noise density

BW=100Hz...
100kHz

Current 50 mA
Noise density

BW=100Hz...
100kHz

5500
550
55

240 nVrm

240 nVrm

nVrm
s/
sqrt(
Hz)

s/
sqrt(
Hz)

s/
sqrt(
Hz)

preamp., mixer,
DTOS
Noise density decades
20 dB/dec from 6Hz to
600Hz. From f >600Hz
maximum noise density

RMS

//Hz.

55nV

dividers, LO­buffers, prescaler,

LNA

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System Module & UI CCS Technical Documentation

Table 6: AC and DC characteristics of RF-BB voltage supplies

Signal
name

VR7 UEM UHF

VrefRF01UEM VREF_RXVoltage 1.334 1.35 1.366V Voltage Reference for

VrefRF02UEM VB_EXTVoltage 1.323 1.35 1.377V Supply for RF-BB digital

From To Parameter Min. Type Max Unit Function

Voltag e 2.70 2.78 2.86 V Supply for UHF VCO

VCO

Current 30 mA
Noise density

100Hz<f<2 kHz
2kHz<f<10 kHz
10kHz<f<30 kH z
30kHz<f<90 kHz
90kHz<f<3 MHz

Current 100 uA
Temp Coef -65 +65 uV/C
Noise density

BW=600Hz...
100kHz

Current 100 uA

70
55
35
30
30

60 nVrm

nVrm
s/
sqrt(
Hz)

s/
sqrt(
Hz)

RF-IC.

Note: Below 600Hz
noise density is allowed
to increase 20 dB/oct

interface and some digi­tal parts of RF.

Temp Coef -65 +65 uV/C
Noise density

BW=100Hz...
100kHz

Table 7: AC and DC characteristics if RF-BB signals

Signal name From To Parameter

TXP

(RFGenOut3)

UPP PA & RF-IC "1" 1.38 1.88 V Transmitter

"0" 0 0.4 V

Load Resistance 10 220 kohm

Load Capacitance 20 pF

Timing Accuracy 1/4 symbol

350 nVrm

s/
sqrt(
Hz)

Input characteristics

Min

Type Max Unit

Function

power

amplifier

enable / D C

N2 timing

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CCS Technical Documentation System Module & UI

Table 7: AC and DC characteristics if RF-BB signals

Input characteristics

Signal name From To Parameter

Min

RFBusEna1X UPP RF-IC "1" 1.38 1.88 V RFbus

"0" 0 0.4 V

Current 50 uA

Load resistance 10 220 kohm

Load capacitance 20 pF

RFBusData UPP RF-IC "1" 1.38 1.88 V RFbus data;

"0" 0 0.4 V

Load resistance 10 220 kohm

Load capacitance 20 pF

Type Max Unit

Function

enable

read /write

Data frequency 10 MHz

RFBusClk UPP RF-IC "1" 1.38 1.88 V RFbus clock

"0" 0 0.4 V

Load resistance 10 220 kohm

Load capacitance 20 pF

Data frequency 10 MHz

RESET

(GENIO6)

UPP RF-IC "1" 1.38 1.85 V Reset to

Hagar

"0" 0 0.4 V

Load capacitance 20 pF

Load resistance 10 220 kohm

Timing accuracy 1/4 symbol

Table 8: AC and DC characteristics of RF-BB signals

Signal
name

From To Parameter Min. Type Max. Unit Function

VCTCXO VCTCXO UPP Signal amplitude 0.2 0.8 2.0 Vpp High stability clock

Input Impedance 10 kohm

Input Capacitance 10 pF

Harmonic Content -8 dBc

Clear signal win-

dow (no glitch)

Duty Cycle 40 60 %

200 mVpp

signal for the logic

circuits, AC cou-

pled. Distorted sine

wave e.g. sawtooth.

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System Module & UI CCS Technical Documentation

Table 8: AC and DC characteristics of RF-BB signals

Signal
name

VCTCXOGnd VCTXO UPP DC Level 0 V Ground for refer-

RXI/RXQ RF-IC UEM Differential volt-

TXIP / TXIN UEM RF-IC Differential volt-

TXQP /

TXQN

From To Parameter Min. Type Max. Unit Function

ence clock

1.35 1.4 1.45 Vpp RX baseband signal.

age swing (static)

DC level 1.3 1.35 1.4 V

I/Q amplitude

mismatch

I/Q phase mis-

match

age swing (static)

DC level 1.17 1.20 1.23 V

Source Impedance 200 ohm

UEM RF-IC Same spec as for TXIP / TXIN Differential quadra-

-5 5 deg

2.23 2.48 Vpp Programmable volt-

0.2 dB

age swing.
Programmable
common mode

voltage.

Between TXIP-TXIN

ture phase TX base-

band signal for the

RF modulator

AFC UEM VCTCX

O

Aux_DAC

(TxC)

RFTemp RF UEM Voltage at -20°C 1.57 V Temperature sensor

UEM RF Voltage Min.

Voltage Min.

Max

Resolution 11 bits

Load resistance

and capacitance

Step settling time 0.2 ms

Max 2.4

Source Impedance 200 ohm

Resolution 10 bits

Noise density

BW=100Hz...

100kHz

Temp Coef -65 +65 uV /C

Voltage at +25°C1.7
Voltage at +60°C 1.79

0.0

2.4

1

800 nVrms/

0.1

2.6

100

0.1 V Transmitter power

VAutomatic fre-

kohm

nF

sqrt(H

z)

quency control sig-

nal for

VCTCXO

control

NOTE: Assumed

power control

opamp G=1

of RF.

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Table 8: AC and DC characteristics of RF-BB signals

Signal
name

Vbase RF UEM Voltage 2.7 V Detecte d voltage

From To Parameter Min. Type Max. Unit Function

from PA power level

sensing unit

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System Module & UI CCS Technical Documentation

External Signals and Connections

UI (board-to-board) connector

Table 9: UI (board-to-board) connector

Pin Signal Min. Nom Max Condition Note

1 SLOWAD(2) 1.5V

0.1V
2 VBAT 3.0V 3.6V 4.2V Battery voltage for LEDs
3ROW(4) 0.7xVIO

0

4ROW(3) 0.7xVIO

0

5COL(2) 0.7xVIO

0

6ROW(2) 0.7xVIO

0

7COL(1) 0.7xVIO

0

8ROW(0) 0.7xVIO

0

9KLIGHT VBAT

10 ROW(1) 0.7xVIO

0

2.7V

1.0V

1.8V

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO

0.3xVBAT
VIO

0.3xVIO

Flip closed

Flip open

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

LED off
LED on

High

Low

Not used in NSM-9DX

Keyboard matrix ro w 4

Keyboard matrix ro w 3

Keyboard matrix column 2

Keyboard matrix ro w 2

Keyboard matrix column 1

Keyboard matrix ro w 0

LED control

Keyboard matrix ro w 1

11 COL(3) 0.7xVIO

0

12 COL(4) 0.7xVIO

0
13 GND 0V
14 GND 0V
15 GND 0V
16 GND 0V

VIO

0.3xVIO
VIO

0.3xVIO

High

Low

High

Low

LCD connector

Table 10: LCD connector

Pin Signal Min. Nom Max Condition Note

1XRES0.8*VIO

0

100ns trw Reset active

VIO

0.22*VIO

Logic '1'
Logic '0'

Keyboard matrix column 3

Keyboard matrix column 4

Reset

Active low

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CCS Technical Documentation System Module & UI

Table 10: LCD connector

Pin Signal Min. Nom Max Condition Note

2 XCS 0.8*VIO

0
130ns tcss XCS low before SCLK rising edge
130ns tcsh XCS low after SCLK rising edge
300ns tcsw XCS high pulse width

3GND 0V
4 SDA 0.8*VIO

0

0.7*VIO
0

100ns tsds Data setup time
100ns tsdh Data hold t ime

5SCLK0.8*VIO

0

250ns tscyc Clock cycle

11 0ns tshw Clock high

VIO

0.22*VIO

VIO

0.22*VIO
VIO

0.3*VIO

VIO

0.22*VIO

4.0MHz

Logic '1'
Logic '0'

Logic '1'
Logic '0'

Logic '1'
Logic '0'

Logic '1'
Logic '0'

Max frequenc y

Chip select

Active low

Serial data (driver input)

Serial data (driver output)

Serial clock in put

6 VDDI

(VIO)

7 VDD

(VFLAS

H1)

8VOUT

110ns tslw Clock low

1.72V 1.8V 1.88V Logic voltage supply
Connected to VIO

2.72V 2.78V 2.86V Voltage supply

Connected to VFLASH1

8.34 V

9V Booster output, C=1uF connected to

GND

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System Module & UI CCS Technical Documentation

DC connector

Table 11: DC connector

Pin Signal Min Nom Max Condition Note

2 VCHAR 7.0 V

1 CHGND 0 Charger ground

RMS

8.4 V

RMS

9.2 V

RMS

850 mA

Fast charger Charger positive input

Headset connector

Table 12: Headset connector

Pin Signal Min Nom Max Condition Note

5XMICP 1Vpp G = 0dB

100 mVpp G = 20dB

2.0 V 2.1 V 2.25 V DC

3 XMICN 1Vpp G = 0 dB

100 mVpp G = 20dB

4 XEARN 0.75V 0.8V 0.85V DC

1Vpp AC

7 XEARP 0.75V 0.8V 0.85V DC

1kΩ to MIC2B

1kΩ to GND

1Vpp AC

5 HookInt 0V 2.86V

(VFLASH1)

6 HeadInt 0V 2.86V (VANA) Accessory detection

Connected to UEM AD-converter

SIM connector

Table 13: SIM connecto r

Pin Name Parameter Min Type Max Unit Notes

1 VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage

3V SIM Card 2.8 3.0 3.2

2SIMRST1.8V SIM Card 0.9xVSIM

0

3V SIM Card 0.9xV SIM

0

VSIM

0.15xVSIM
VSIM

0.15xVSIM

V SIM reset (output)

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Table 13: SIM connecto r

Pin Name Parameter Min Type Max Unit Notes

3SIM-

CLK

4DATA 1.8V Voh

5NC
6GND GND 0 V Ground

Frequency 3.25 MHz SIM clock

Trise/Tfall 50 ns

1.8V Voh

1.8V Vol
3 Voh

3 Vol

1.8V Vol
3 Voh

3 Vol

1.8V Vih

1.8V Vil
3V Vil

3V Vil

0.9xVSIM
0

0.9xVSIM
0

0.9xVSIM
0

0.9xVSIM
0

0.7xVSIM
0

0.7xVSIM
0

VSIM V

VSIM

VSIM

0.15xVSIM
VSIM

0.15xVSIM
VSIM

0.15xVSIM
VSIM

0.15xVSIM

V SIM data (output)

SIM data (input)

Trise/Tfall max 1us

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Functional Description

Modes of Operation

HG9 baseband engine has six operating modes:

• No supply

•Backup

•Acting Dead

•Active

• Sleep

•Charging

No supply

In NO_SUPPLY mode the phone has no supply voltage. This mode is due to disconnection
of battery or low battery voltage level.

Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected.
Battery voltage can rise e ither by connecting a new battery wit h VBAT > V

connecting a charger and charging the battery above V

MSTR+

.

MSTR+

or by

Backup

In the backup mode, the backup battery has sufficient charge but the main battery can
be disconnected or emptied (VBAT < V

disabled in the backup mode. VRTC output is supplied without regulation from the
backup battery (UBACK). All the other regulators are disabled.

Acting D ead

If the phone is off when the charger is connected, the phone is powered on, but it enters
a state called "Acting Dead". To the user t he phone a cts as if it was swit ched of f. A ba t­tery charging alert is given and/or a battery charging indication on the display is shown
to acknowledge the user that the batte ry is being charged.

Active

In the active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. Ther e are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.

In active mode the RF regulators are controlled by SW writing into UEM's registers
wanted settings: VR1A can be enabled or disabled. VR2 can be enable d or disabled and
its output voltage can be progra mmed to be 2.78V or 3. 3V. VR4 -VR7 can be en abled or
disabled or forced into low quiescent current mode. VR3 is always enabled in active
mode.

and VBACK > VBU

MSTR

). VRTC Regulator is

COFF

Sleep mode

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Sleep mode is entered when both MCU and DSP are in stand-by mode. Sleep is controlled
by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE,
VIO and VFLASH1 regulators are put into low quiescent current mode. Al l RF regulators
are disabled in SLEEP. When SLEEPX=1 is detected UEM enters ACTIVE mode and all
functions are activated.

The sleep mode is exited ei ther by t he expirati on of a sleep c lock counte r in th e UEM or
by some external interrupt, gener ated by a charger connection, key press, headset con­nection etc.

In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference
clock for the baseband.

Charging

The battery voltage, temperature, size and current are measured by the UEM controlled
by the charging software running in the UPP.

The charging control circuitry (CHACON) inside the UEM controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEM switch off when the battery voltage has reached 4.2 V. Charging current is
monitored by measuring the voltage drop across a 220 mOhm resistor.

Supply Voltage Regulation

Supply voltage regulation is controlled by UEM asic. There are six regulators used by
baseband block.

Table 14: BB regulators

Signal Min Nom Max Note

VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I

VFLASH2 2.70V 2.78V 2.86V I

VSIM 1.745V

2.91V

1.8V

3.0V

1.855V

3.09V

max

max

I

Sleep

max

I

Sleep

I

max

I

Sleep

=80mA
=70mA

=1.5mA

=40mA

=+/-1.5mA

=25mA

=0.5mA

VIO 1.72V 1.8V 1.88V I

VCORE 1.0V

1.235V

1.425V

1.710V

1.053V

1.3V

1.5V

1.8V

1.106V

1.365V

1.575V

1.890V

=150mA

max

I

=0.5mA

Sleep

I

=200mA

max

=0.2mA

I

Sleep

Default value = 1.5V in
start-up

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System Module & UI CCS Technical Documentation

Battery

Li-ion battery pack BLB-2 is used in NSM-9DX.
Nominal discharge cut-off voltage 3.1 V
Nominal battery voltage 3.6 V
Nominal charging voltage 4.2 V

Table 15: Pin numbering of battery pack

Signal nam e Pin number Function

VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the battery pack)
BTEMP 3 Battery temperature measurement (measured by NTC resistor inside pack)
GND 4 Negative/common battery terminal

Figure 2: BLB-2 battery pack pin order

Power Up and Reset

Power up and reset is controlled by the UEM ASIC. NSM-9DX baseband can be powe red
up in following ways:

1 Press power button which means grounding the PWRONX pin of the UEM
2 Connect the charger to the charger input
3 Supply battery voltage to the battery pin
4 RTC Alarm, the RTC has been programmed to give an alarm

After receiving one of the a bove signals, the U EM counts a 20 ms delay and then ent ers
its reset mode. The watchdog starts up, and if the batt ery v olta ge is g reater tha n Vcof f+
a 200ms delay is started to allow references etc. to settle. After this delay ela pses the
VFLASH1 regulator is enabled. 500 us later VR3, VANA, VIO and VCORE are enabled.
Finally the PURX (Power Up Reset) line is held low for 20 ms. This reset, PURX, is fed to
the baseband ASIC UPP, resets are generated for the MCU and the DSP. During this reset
phase the UEM forces the VCTCXO regulator on regardless of the status of the sleep con­trol input signal to the UEM. The FLSRST x from the ASIC is used to reset the flas h during
power up and to put the flash in power down during sleep.

1(+)2(BSI)3(BTEMP)4(GND)

All baseband regulators are switched on at the UEM power on except VSIM and VFLASH2

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regulators which are controlled by the MCU . The UEM internal watchdogs are running
during the UEM reset state, with the longest watchdog time sel ected. If the watchdog
expires, the UEM returns to power off state. The UEM watchdogs are internally acknowl­edged at the rising edge of the PURX signal in order to always give the same watchdog
response time to the MCU.

A/D Channels

The UEM contains the follo wing A/D converter channels that a re used for several me a­surement purpose. The general slow A/D converter is a 10 bit converter using the UEM
interface clock for the conv ersion. An interr upt will b e given at the end of the measure­ment.

The UEM's 11-channel analog to digita l convert er is used to monitor charging functions,
battery functions, voltage levels in external accessory detection inputs, user interface
and RF functions.

When the conversion is started t he converter input is selected. Th en the signal proc ess­ing block creates a da ta with MSB set to '1' and ot hers to '0'. In the D/A converter this
data controls the switches which connect the input referenc e voltage (VrefADC) to the
resistor network. The generated output voltage is compared with the input voltage under
measurement and if the latter is greater, MSB remains '1' else it is set '0'. The following
step is to test the next bit and the next...until LSB is reached. The result is then stored to
ADCR register for UPP to read.

The monitored battery functions a re battery voltage (VBATADC), battery type (BSI) and
battery temperature (BTEMP) indication.

The battery type is recognized through a resistive voltage divider. In phone there is a
100kOhm pull up resistor in the BSI line and the battery has a pull down resistor in the
same line. Depending on the battery type the pull down resistor value is changed. The
battery temperature is measured equivalently but the battery has a NTC pull down resis­tor in the BTEMP line.

KEYB1&2 inputs are used for keyboard scanning purposes. These inputs ar e also routed
internally to the miscellaneous block.

The HEADINT and HOOKINT are external accessory detection inputs used for monitoring
voltage levels in these inputs. They are routed internally from the miscellaneous block
and they are connected to the converter through a 2/1 multiplexer.

The monitored RF functions are PATEMP and VCXOTEMP detection. PA TEMP input is used
for measuring temperature of the RFIC, Hagar. VCXOTEMP is not used in NSM-9DX.

IR Module

The IR interface, when using 2.7 V transceiver, is designed into the UEM. The IR link sup­ports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 1 m. Transmission over
the IR if half-duplex.

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System Module & UI CCS Technical Documentation

The length of the transmitted IR pulse depends on the speed of the transmission. Whe n

230.4 kbit/s or less is used as a transmission speed, pulse length maximum is 1.63 us. If
transmission speed is set to 1.152 Mbit/s the pulse length is 154 ns according to IrDA
specification.

SIM Interface

UEM contains the SIM interface logic level shifting. SIM interface can be programmed to
support 3 V and 1.8 V SIMs. SIM supply voltage is selected by a register in the UEM. It is
only allowed to change the SIM supply voltage when the SIM IF is powered down.

The SIM power up/down sequence is generated in the UEM. This means that the UEM
generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM.
The card detection is taken from the BSI signal, which detects the removal of the battery .
The monitoring of the BSI signal is done by a comparator inside UEM. The co mparator
offset is such that the comparator output does not alter state as long as the battery is
connected. The threshold voltage is calculated from the battery size specifications.

The SIM interface is powered up w hen the SIMCardDet signal indicates "card in". This
signal is derived from the BSI signal.

Table 16: SIM interface

SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V
SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV

The whole SIM interface locates in UPP and UEM.
The SIM interface in the UEM contains power up/down, port gating , card detect, data

receiving, ATR-counter, registers and level shifting buffers logic. The SIM interfa ce is the
electrical interface betwee n the Subscriber Identit y Module Card (SIM C ard) and mobile
phone (via UEM device).

The data communication between the card and the phone is asynchronous half duplex.
The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz. The data baud
rate is SIM card clock frequency divided by 372 (by default), 64, 32 or 16. The protocol
type, that is sup ported, is T=0 (asynchronous half duplex character transmission as
defined in ISO 7816-3).

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Figure 3: UPP & UEM SIM connections.

GND

UPP

SIM

C5 C6 C7

C8

C1 C2 C3

C4

From Battery Type contact

From SIM Card contact

SIMDATA

SIMCLK

SIMRST

VSIM

BSI

SIMCardDet

GND

UEM

SIMIF
register

SIMIO
SIMClk

Data

UEM
digital
logic

SIMIO

SIMClk

Data

UIF Block

UEMInt

CBusDa

CBusEnX

CBusClk

The internal clock frequency from UPP CTSI block is 13 MHz in GSM. Thus to achieve the
minimum starting SIMCardClk rate of 3.25 MHz (as is required by the authentication
procedure and the duty cyc le requirement of betwe en 40% and 60%) then the slow est
possible clock supplied to the SIM has to be in the GSM system cl ock rate of 13/4 MHz.

Buzzer

Buzzer is used for generating alerting tones and melodies to indicate incom ing call. It is
also used for generating warning tones for the user. Buzzer is controlled by PWM (Pulse
Width Modulation) signal generated by the buzzer driver of the UEM. Target SPL is 100dB
(A) at 5 cm.

Internal Microphone

The internal microphone capsule is situated in the bottom connector. Microphone is
omnidirectional. The internal microphone is connected to the UEM microphone input
MIC1P/N. The microphone input is asymmetric and microphone bias is provided by the
UEM MIC1B. The microphone input on the UEM is ESD pr otected. Spring contacts are
used for connecting the microphone to the main PWB.

FM Radio

NSM-9 includes also an integrated FM radio. The FM radio circuitry is implemented using
a highly integrated radio IC, TEA5757.

Very few external components like filters, discriminator and capacitors are needed.
TEA5757 is an integrated AM/FM stereo radio circuit including digital tuning and control

functions. NSM-9 radio is implemented as a super heterodyne FM mono receiver.
FM stage of the TEA5757 incorporates a tuned RF stage, a double balanced mixer, one

pin oscillator and is designed for distributed IF ceramic filters. IF frequency is 10.7 MHz.

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Channel tuning and other controls are controlled by the MCU SW. Reference clock, 75
kHz is generated by the UPP CTSI block.

The FM radio circuitry is controlled through serial bus interface by the MCU SW.
TEA5757 informs MCU when channel is tuned by setting FMTuneX signal to logic “0”.

Figure 4: Microphone connection

UEM

UPP

MIC1B

MIC1N

MIC1P

10pF 100nF

33nF

33nF

2k2

2k2

2k2

00ohm@100MHz

10pF

10pF

UPP (Universal Phone Processor) is the digital ASIC of the baseband. UPP includes 8 MBit
internal RAM, ARM7 Thump 16/32-bit RISC MCU core, LEAD3 16-bit DSP core, ROM for
MCU boot code and all digital control logic.

Main functions of the custom logic are:

1 Interfa ce between system logic and MCU/DSP (BodyIf)
2 Clocking, timing, sleep and interrupt block (CTSI) for system timing control
3 MCU controlled general purpose USART, MBUS USART and general purpose IOs

(PUP).
4 SIM card interface (SIMIf)
5 GSM coder (Coder)
6 GPRS support (GPRSCip)
7 Interfaces for keyboard, LCD and UEM (UIF)
8 Accessory interface for IrDA SIR, IrDA FIR and LPRF (AccIf)

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9 SW programmable RF interface (MFI)
10 Programmable serial interface for Hagar RFIC (SCU)
11 Test interface (TestIf)

Memory Block

For the MCU UPP includes ROM, 2 kbytes, t hat is used mainly for boot code of MCU. To
speed up the MCU operation small 64 byte cache is also integrated as a part of the MCU
memory interface. For program memory 8 Mbit (512 x 16 bit) PDRAM is integrated. RAM
block can also be used as data memory and it is byte addressable. RAM is mainly for MCU
purposes but also DSP has also access to it if needed.

MCU code is stored into external flash memory. Size of the flash is 64 Mbit (4096 x 16
bit) The NSM-9DX baseband supports a burst mode fla sh with multiplexe d address/data
bus. Access to the flash memory is performed as 16-bit acce ss. The flash has Read While
Write (RWW) capabilities which makes the emulation of EE PROM within the flash easy.

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RF Module

The RF module takes care of all RF functions of the engine. RF circuitry is located on one
side (B-side) of the 8 layer PCB. PCB area for the RF circuitry is about 12 cm2. PCB area
for the FM radio is about 5 cm2.

EMC leakage is prevented by using a metal B-shield, which screens the whole RF side
(included FM radio) of the engine. The conduc tive silicone gasket is used between the
PCB and the shield. The metal B-shield is separated to three blocks. The first one includes
the FM radio. The second block includes the PA, antenna switch, LNAs and dual RX SAW.
The third block includes the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters. The
blocks are divided on the basis that the attenuation requi rement between harmon ics of
the transmitter and the VCO signal (including Hagar IC) is high. In order to achieve the
adequate attenuation, a reliable contact be tween the shield and the PCB is important.
The VCO and TX outputs of the Hagar RF IC are located one another as far as possible. In
order to guard against the radiated spurious inside blocks, the RF transmission lines are
made with striplines after PA.

The baseband circuitry is located on the A-side of the board, which is shielded with a
metallized frame and ground plane of the UI-board.

Maximum height inside on B-side is 1.8 mm. Heat generated by the circuitry will be con­ducted out via the PCB ground planes and metallic B-shield.

Figure 5: RF Frequency Plan

869-894
MHz

1930-1990
MHz

f

f

f/4

HAGAR

f

f/2f/4

f

f/2

PLL

3290­3980
MHz

I-signal

I-signalI-signalI-signal
Q-signal

RX

1850-1910
MHz

824-849
MHz

26 MHz

VCTCXO

I-signal

Q-signal

TX

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DC characteristics

Regulators

Transceiver has a multifunction power management IC on baseband section, which con­tains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher for charge
pump.

All regulators can be controlled individually with 2.78 V logic directly or through control
register. In GSM direct controls are used to get fast switching, because regulators a re
used to enable RF-functions.

Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and
VrefRF02 are used as the refere nce voltages f or HAGAR RF-IC , VrefRF01 (1.35V) for bias
reference and VrfeRF02 (1.35V) for RX ADC's reference.

Regulators (except VR2 and VR7) are connected to HAGAR. Different modes are switched
on by the aid of serial bus.

List of the needed supply voltages:

Volt. source Load

VR1A PLL charge pump (4.8 V)
VR2 TX modulator
VR3 VCTCXO + buffer
VR4 HAGAR IC (LNAs+mixer+DTOS)
VR5 HAGAR IC (div+LO-buff+pres caler),
VR6 HAGAR (Vdd_bb)
VR7 VCO
VrefRF01 ref. voltage for HAGAR
VrefRF02 ref. voltage for HA GAR
Vbatt PA

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c

B

System Module & UI CCS Technical Documentation

Figure 6: Power Distribution Diagram

SOURCE

VR1

VR2

VR3

VR4

VR5

4.75 V +/- 3.2 %
10 mA

2.78 V +/- 3 %

100 mA

2.78 V +/- 3 %

20 mA

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

LOAD

Charge pump in HAGAR

TX IQ modulator, power

ontrol opamp in

VCTCXO
VCTCX O buffer in Hagar

GSM 1900 LNA
RX mixer in Hagar
DTOS in Hagar

PLL in Hagar

UEM

VR6

VR7

VrefRF01

VrefRF02

VBATT

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

1.35 v +/- 1.15 %

<100ua

1.35 V +/- 2 %

<100ua

3.2 - 4.5 V

1700 mA (max)

Dividers in Hagar
LO buffers in Hagar
Prescaler in Hagar
Power detector

BsectioninHagar

SHF VCOModule

Ref. volt. for Hagar RX

Ref. volt. for Hagar

PA module

Page 30 ¤Nokia Corporation Issue 1 10/02

NSM-9DX

CCS Technical Documentation System Module & UI

RF characteristics

Table 17: Main R F C h a ra cteristic

Item Values GSM850/1900

Receive frequency range 869...894 MHz / 1930...1990 MHz
Transmit frequency range 824...849 MHz / 1850...1910 MHz
Duplex spacing 45 MHz / 80 MHz
Channel spacing 200 kHz
Number of RF channels 124 / 299
Pow er class 4 (2 W) / 1 (1 W)
Number of power levels 15 / 16

Transmitter characteristics

Table 18: Transmitter characteristics

Item Values GSM850/1900

Type Direct conversion, nonlinear, FDMA/TDMA
LO frequency range 3296...3396 MHz / 3700...3820 MHz
Output power 2 W / 1 W peak
Gain control range min. 30 dB
Maximum phase error (RMS/peak) max 5 deg./20 deg. Peak

Receiver characteristics

Table 19: Receiver characteris tic s

Item Values GSM850/1900

Type Direct conversion, L ine ar, FDMA/TDMA
LO frequencies 3476...3576 MHz / 3860...3980 MHz
Typical 3 dB bandwidth +/- 91 kHz
Sensitivity min. - 102 dBm
Total typical receiver voltage gain (from antenna

to RX ADC)

86 dB

Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs
Typical AGC dynamic range 83 dB
Accurate AGC control range 60 d B
Typical AGC step in LNA 25dB / 35 dB
Usable input dynamic range -102... -10 dBm
RSSI dynamic range -110... -48 dBm
Compensated gain variation in receiving band +/- 1.0 dB

Issue 1 10/02 ¤Nokia Corporation Page 31

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System Module & UI CCS Technical Documentation

Figure 7: RF Block Diagram

850
LNA

1900
LNA

RXI

f/4

f

RXQ

INTERNAL
ANTENNA

DUAL
SAW
FI LTER

ANTENNA SW I TCH MODULE

DUAL
COUPLER

DUAL PA MODULE

Frequency synthesizer s

VCO frequency is locked with PLL into stable frequency source, which is a VCTC XO-mod­ule (voltage controlled temperature compensated cr ystal oscillator). VCTCXO is running
at 26 MHz. Temperature drifting is con trolled with AFC (automatic frequency control)
voltage. VCTCXO is locked into frequency of the b ase station. AFC is genera ted by base­band with a 11 bit conventional DAC. 13MHz VCTCXO can also be used if multislot oper­ations is not needed. If more tha n 1(RX)+1(TX) slot is wanted settling times hav e to be
less than 300us from channel to channel. This can be achieved when the PLL loopband
width is ~35kHz. Noise coming from the loop and noise from dividers (20*logN) increases
rms phase error over 3 degrees which is the max imum for synthesizer.

SHF
VCO

850 TX SAW

BALUN

Vbat t

BALUN

f/2

f

f/4

f

f/2

f

PLL

HAGAR RFI C

SERI AL CT RL BUS

TXC

TXQP
TXQN

TXI P

TXI N

26 Mhz

AFC

Page 32 ¤Nokia Corporation Issue 1 10/02

NSM-9DX

V

LPK

M

f

r

CCS Technical Documentation System Module & UI

Figure 8: Frequency synthesizers

req.

R

f

ref

f_out /

M

PHASE

DET.

CHARGE

PUMP

eference

AFC-controlled

f_out

CO

Kd

vco

M

= A(P+1) + (N-A)P=
=NP+A

PLL is located in HAGAR RF-IC and is controlled via serial RFBus. There is 64/65 (P/P+1)
prescaler, N- and A-divider, reference divider, phase detector and charge pump for the
external loop filter. SHF local signal, generated by a VCO-module (VCO = voltage con­trolled oscillator), is fed through 180deg balanced phase shifter t o prescaler. Prescaler is
a dual modulus divider. Output of the prescaler is fed to N- and A-divider, which produce
the input to phase detector. Phase detector compares this signal to reference signal
(400kHz), which is divided with reference divider from VCTCXO output. Output of the
phase detector is connected into charge pump, w hich charges or discharges integrator
capacitor in the loop filter depending on the phase of the measured frequency compared
to reference frequency.

Loop filter filters out comparison pulses of phase detector and generates DC control volt­age to VCO. Loop filter defines step response of the PLL (settling time) and effects to sta­bility of the loop, that's why integr ator capacitor has a resi stor for phase compensation.
Other filter components are for side band rejectio n. Dividers are control led via ser ial bus.
RFBus Data is for data, RFBusClk is serial clock for the bus and RFBusEna1X is a latch
enable, which stores new data into dividers.

LO-signal is generated by SHF VCO module. VCO has double the frequency in GSM1900
and four times the frequency in GSM850 compared to actual RF channel frequency. LO
signal is divided by two or four in HAGAR, depending on system mode.

Receiver

The receiver is a direct conversion, dual band linear receiver. The received RF-signal from
the antenna is fed via RF-antenna switch module to 1st RX bandpass RF-SAW filters and
MMIC LNAs (low noise amplifier). The RF-antenna switch module contains both upper
band and lower band operation. The LNA amplified signal is fed to 2nd RX bandpass RF-

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SAW filters. Both 2nd RX bandpass RF-SAW filters have un-bal/bal configuration to get
the balanced feed for Hagar.

The discrete LNA have three gain levels. The first one is max. gain, the second one i s
about -35dB(GSM1900) and –25dB(GSM850) below max. gain and the last one are off
state. The gain selection control of the LNA comes from HAGAR IC.

The RX bandpass RF-SAW filters define how good are the blocking characteristics against
spurious signals outside baseband and the protection against spurious responses.

Differential RX signal is amplified and mix ed directly down to BB frequency in HAGAR.
Local signal is generated with external VCO. VCO signal is divided by 2 (GSM1900) or by
4 (GSM850). PLL and dividers are in HAGAR-IC.

From the mixer output to ADC input RX signal is divided into I- and Q-signals. Accurate
phasing is generated in LO dividers. After the mixer DTOS amplifiers convert the differen­tial signals to single ended. DTOS has two gain stages. The first one has constant gain of
12dB and 85kHz cut off frequency. The gain of second stage is controlled with control
signal g10. If g10 is high (1) the gain is 6dB and if g10 is low (0) the gain of the stage is

-4dB.
The active channel filters in HAGAR provides selectivity for channels (-3dB @ +/-91 kHz

typ.). Integrated base band filter is act ive-RC-filter with two off-chip capacitors. Large
RC-time constants needed in the channel sel ect filter of direct conversion receiver are
produced with large off-chip capacitors because the impedance levels could not be
increased due to the noise specifications. Baseband filter consist s of two stages, DTOS
and BIQUAD. DTOS is differential to single-ended converter having 8dB or 18dB gain.
BIQUAD is modified Sallen-Key Biquad.

Integrated resistors and capacito rs are tunable. These are controlled wit h a digital con­trol word. The correct control words that compensate for the process variations of inte­grated resistors and capacitors and of tolerance of off chip capacitors are found with the
calibration circuit.

Next stage in the receiver chain is AGC-am plifier, also integrated into HAGAR. AGC has
digital gain control via serial mode bus. AGC-stage provides gain control range (40 dB,
10 dB steps) for the receiver and also the necessary D C compensation. Additional 10 dB
AGC step is implemented in DTOS stages.

DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus).
DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage
which cause a zero dc-offset. DCN2 set the signal offset to constant value (VrefRF_01

1.35 V). The VrefRF_01 signal is used as a zero level to RX ADCs.

Single ended filtered I/Q-signal is then fed to ADCs in BB. Input level for ADC is 1.45 Vpp
max.

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Rf-temp port is intended to be used for compensation of RX SAW filters thermal behav­ior. These phenomena will have impact to RSSI reporting accuracy. The current informa­tion is -35ppm/C for center frequency drift for all bands. This temperature information is
a voltage over two diodes and diodes are fed with constant current.

Transmitter

Transmitter chain consists of two final frequencies, IQ-modulators for upper and lower
band, a dual power amplifier and a power control loop.

I- and Q-signals are generated by baseband. After post filtering (RC-network) they go
into IQ-modulator in HAGAR. LO-signal for modulator is generated by VCO and is divided
by 2 or by 4 depending on system mode. There are separate outputs, one for GSM850 and
one for GSM1900.

There is an SAW filter before the PA in GSM850 branch to attenuate unwanted signals
and wideband noise from the Hagar IC.

The final amplification is realized with a dual band power amplifie r. It has two different
power chains, one for GSM850 and one for GSM1900. The PA is able to produce over 2 W
(0dBm input level) in GSM850 band and over 1 W (0 dBm input level) in upperband band
into 50 ohm output. The gain control range is over 55 dB to get the desired power levels
and power ramping up and down.

Harmonics generated by the nonlinear PA are filtered out with filtering inside the
antenna switch -module.

Power control circuitry consists of discrete power detector (common for lower and
upperband) and error amplifier in HAGAR. There is a directional coupler connected
between PA output and antenna switch. It is of a dualband type and ha s input and out­puts for both systems. The di rectional coupler takes a sample from the f orward going
power with certain ratio. This signal is rectified in a schottky-diode and it produces a DC­signal after filtering.

The detected voltage is compared in the error-amplifier in HAGAR to TXC- voltage, which

4

is generated by DA-converter in BB. TXC has got a raised c osine form (cos

- function),
which reduces switching transients, when pulsing power up and down. Because dynamic
range of the detector is not wide enough to control the power (actually RF output volt­age) over the whole range, there is a control named TXP to work under detected levels.
Burst is enabled and set to rise with TXP until the output level is high enough, that feed­back loop works. Loop controls the output via the control pin in PA to the desired output
level and burst has got the wa veform of TXC-ramps. Because feedback loops c ould be
unstable, this loop is compensated with a dominating pole. This pole decreases gain o n
higher frequencies to get phase margins high enough. Also this pole filter out the noise
which is coming from TXC line.

Before power ramp the temperature information from detector is stored to Ctemp. This
temperature information is used during the burst to compensate power levels in different
temperatures. TXP signal enables the antenna switch module to TX mode. The power

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System Module & UI CCS Technical Documentation

control loop in HAGAR has two outputs, one for both freq. bands.

AFC function

AFC is used to lock the transceiv ers clock to fre quency of the base sta tion. AFC -voltag e is
generated in BB with 11 bit DA-converter. There is a RC-filter in AFC control line to
reduce the noise from the converter. Settling time requirement for the RC-network
comes from signalling, how often PSW (pur e sine wave) slots occur. They are repeated
after 10 frames. AFC tracks base station frequency continuously, so transceiver has a sta­ble frequency, because changes in VCTCXO-output don't occur so fast (temperature).

Settling time requirement come s also from the start up-time allowed. When the trans­ceiver is in sleep mode and "wa kes" up to r eceiv e mod e, there is only about 5 ms for the
AFC-voltage to settle. Wh en the first burst co mes in system clock ha s to be settled into
+/- 0.1 ppm frequency accuracy. The VCTCXO-module requires also 5 ms to settle into
final frequency. Amplitude rises into full swing in 1... 2 ms, but frequency settling time is
higher so this oscillator must be powered up early enough.

DC-compensation

DC compensation is made during DCN1 and DCN2 operations (contr olled via serial bus).
DCN1 is carried out by charging the large external capacitor s in AGC stages to a vol tage
which cause a zero dc-offset. DCN2 set the signal offset to consta nt value (RXREF 1.35
V). The RXREF signal is used as a zero level to RX ADCs.

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CCS Technical Documentation System Module & UI

UI Board LK5

NSM-9DX consists of separate UI board, named as LK5, which includes contacts for the
keypad domes and LEDs for keypad illumination. UI board is connected to main PWB
through 16 pole board-to-board connector with springs. Signals of the connector are
described in section External and Internal Signals and Connections.

5x4 matrix keyboard is used in NSM-9DX. Key pressing is detected by scanning proce­dure. Keypad signals are connected UPP keyboard interface.

When no key is pressed row inputs are high due to UPP internal pull-up resistors. The
columns are written zero. When key is pressed one row is pulled down and an interrupt is
generated to MCU. After receiving interrupt MCU starts scanning procedure. All columns
are first written high and then one column at the time is writt en down. All other col­umns except one which was written down are set as inputs. Rows are read while column
at the time is written down. If some row is down it indicates that key whic h is at the
cross point of selected column and row was pressed. After detec ting pressed k ey all re g­isters inside the UPP are reset and columns are written back to zero.

LCD & Keypad Illumination

In NSM-9DX pastel blue LEDs are used for LCD and keypad illumination. For LCD illumi­nation four LEDs (on HG9) are used and for keypad six LEDs (on LK5).

Current through LEDs is controlle d by transistor circuitry. External transistor driver cir­cuitry is used as constant current source in order to prevent any change in battery volt­age be seen as changing led brightness. Battery vol tage is changing , for example , during
charging.

Figure 9: Display and keypad illumination circuitry.

4R3 6R8

4K3

VBAT

6K8

470R

Keypad

LEDs are controlled by the UE M P WM outputs. Both LED gro ups ar e co ntrolled by KLight
output of the UEM. Current flo w through the LEDs is set by biasing the transistor and
limiting the current by resistors. Current is set separately to keypad and LCD LEDs.

Issue 1 10/02 ¤Nokia Corporation Page 37

KLIGHT

Display
LEDs

NSM-9DX

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1

System Module & UI CCS Technical Documentation

Internal Speaker

The internal earpiece is a dynamic earpiece with an impedance of 32 ohms. The earpiece
is low impedance one since the sound pressure is to be generat ed using current and not
voltage as the supply voltage is restricted to 2.7 V. The earpiece is driven directly by the
UEM. The ear piece driver in UEM is a bridge amplifier.

Figure 10: Speaker Connection

UEM

EARP

EARN

22R

22R

22pF 22pF

000R@100MHz

000R@100MHz

Page 38 ¤Nokia Corporation Issue 1 10/02

CCS Technica l Documentation

NSM-9DX Series Transceivers

P arts List

Issue 1 10/02 ¤Nokia Corporation

NSM-9DX

Parts List CCS Technical Documentation

Table of Contents

Page No

Parts List of HG9 (EDMS Issue 1.0) ............................................................................. 3

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3

CCS Technical Documentation Parts List

P arts List of HG9 (EDMS Issue 1.0)

Item Code Side X YPart name

B200 4510303 Top R 3 CRYSTAL 32.768KHZ+-20PPM12.5PF
B301 5140211 Top C 3 BUZZER 85DB 3KHZ 3.0V 10.4X8.7X3.1 ~ ~
B302 5140067 Top C 5 SPEAKER+SPRING 103+-3DB 32R D13.2 ~ ~
C100 2320744 Top S 4 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C101 2320536 Top R 6 Chipcap 5% NP0 10p normal,-5%,5%
C102 2320536 Top R 7 Chipcap 5% NP0 10p normal,-5%,5%
C103 2320544 Top R 5 Chipcap 5% NP0 22p normal,-5%,5%
C104 2320548 Top R 2 Chipcap 5% NP0 33p normal,-5%,5%
C105 2320544 Top R 7 Chipcap 5% NP0 22p normal,-5%,5%
C107 2320544 Bottom P 4 Chipcap 5% NP0 22p normal,-5%,5%
C108 2320538 Top R 3 Chipcap 5% NP0 12p normal,-5%,5%
C109 2315201 Bottom O 5 CHIP ARRAY NP0 2X27P K 25V 0405 2x27p normal,-10%,10%
C111 2315205 Top Q 6 CHIP ARRAY X5R 2X1N M 16V 0405 2x1n normal,-20%,20%
C112 2320778 Top R 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C113 2320778 Top R 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C114 2320604 Bottom P 3 Chipcap 5% NP0 18p normal,-5%,5%
C115 2320546 Bottom P 3 Chipcap 5% NP0 27p normal,-5%,5%
C151 2315209 Top O 2 CHIP ARRAY X5R 2X33N M 10V 0405 2x33n normal,-20%,20%
C152 2320546 Top R 7 Chipcap 5% NP0 27p normal,-5%,5%
C153 2315205 Top P 2 CHIP ARRAY X5R 2X1N M 16V 0405 2x1n normal,-10%,10%
C154 2320744 Top O 2 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C155 2315209 Top P 2 CHIP ARRAY X5R 2X33N M 10V 0405 2x33n normal,-20%,20%
C156 2320604 Top R 7 Chipcap 5% NP0 18p normal,-5%,5%
C157 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C158 2320805 Top R 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C160 2315201 Top F 3 CHIP ARRAY NP0 2X27P K 25V 0405 2x27p normal,-10%,10%
C161 2315213 Top R 6 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10%
C163 2315213 Top Q 6 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10%
C165 2320805 Top P 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C166 2320805 Top O 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C168 2320546 Top O 2 Chipcap 5% NP0 27p normal,-5%,5%
C201 2320481 Top R 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C202 2320778 Bottom Q 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C203 2320481 Bottom O 2 CHIPCAP X 5R 1U K 6V3 0603 1u0 normal,-10%,10%
C204 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C205 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C206 2320481 Top Q 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C207 2320481 Top N 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C208 2320481 Top N 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C209 2320536 Top R 3 Chipcap 5% NP0 10p normal,-5%,5%
C210 2320536 Top R 3 Chipcap 5% NP0 10p normal,-5%,5%
C211 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C212 2320481 Top R 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C213 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C214 2320481 Top R 3 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C215 2320481 Top O 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C218 2320805 Top N 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C219 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C221 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C222 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C223 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C224 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C225 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%

alue Description

2.768kHz~

Issue 1 10/02 ¤Nokia Corporation Page 3

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Parts List CCS Technical Documentation

Item Code Side X

C226 2320481 Top N 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C227 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C228 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C229 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C230 2320481 Top P 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C231 2320481 Top N 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C232 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C233 2320481 Top Q 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C234 2320481 Top P 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C235 2320481 Top R 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C236 2320805 Top N 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C237 2320805 Top N 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C238 2320805 Top Q 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C239 2320805 Top N 3 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C240 2315203 Top N 2 CHIP ARRAY X5R 2X10N M 16V 0405 2x10n normal,-20%,20%
C241 2315203 Top N 2 CHIP ARRAY X5R 2X10N M 16V 0405 2x10n normal,-20%,20%
C242 2320805 Top R 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C243 2320481 Bottom P 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C250 2315213 Top P 8 CHIP ARRAY NP0 2X22P K 25V 0405 2x22p normal,-10%,10%
C260 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C261 2320481 Top Q 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C262 2320481 Top Q 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C263 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C264 2320481 Top Q 5 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C265 2320481 Top P 7 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C301 2320125 Top K 6 CHIPCAP X5R 1U K 16V 0603 1u0 normal,-10%,10%
C303 2315211 Bottom G 5 CHIP ARRAY X5R 2X100N Y 10V 0405 2x100n normal,-20%,10%
C306 2320546 Top N 2 Chipcap 5% NP0 27p normal,-5%,5%
C307 2320604 Top N 2 Chipcap 5% NP0 18p normal,-5%,5%
C308 2320778 Top E 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C312 2320544 Top K 5 Chipcap 5% NP0 22p normal,-5%,5%
C319 2320744 Bottom N 2 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C320 2320544 Bottom D 8 Chipcap 5% NP0 22p normal,-5%,5%
C350 2320805 Bottom F 7 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C351 2312243 Bottom F 7 CHIPCAP X5R 4U7 K 6V3 0805 4u7 normal,-10%,10%
C357 2310041 Bottom K 6 CHIPCAP X5R 1U5 K 10V 0805 1u5 normal,-10%,10%
C358 2320520 Bottom J 7 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25p
C359 2320520 Bottom J 7 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25p
C360 2320805 Bottom H 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C361 2320805 Bottom J 8 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C362 2320805 Bottom J 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C363 2320481 Bottom J 8 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C364 2310793 Bottom I 6 CHIPCAP X5R 2U2 K 10V 0805 2u2 normal,-10%,10%
C365 2320481 Bottom H 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C366 2320481 Bottom I 6 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C367 2320805 Bottom J 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C368 2320805 Bottom H 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C369 2320744 Bottom H 7 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C370 2320137 Bottom J 6 CHIPCAP X5R 470N K 10V 0603 470n normal,-10%,10%
C371 2320137 Bottom J 6 CHIPCAP X5R 470N K 10V 0603 470n normal,-10%,10%
C372 2320598 Bottom J 5 Chipcap 5% X7R 3n9 normal,-5%,5%
C373 2320805 Bottom J 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C374 2320744 Bottom G 6 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C375 2320778 Bottom H 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C378 2320805 Top P 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%

art name

alue Description

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CCS Technical Documentation Parts List

Item Code Side X

C389 2320805 Bottom M 6 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C400 2320778 Top N 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C401 2320805 Top N 3 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C402 2320778 Top N 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C403 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C404 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C405 2320778 Top L 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C406 2320778 Top M 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C420 2320560 Bottom H 4 Chipcap 5% NP0 100p normal,-5%,5%
C421 2320560 Top O 5 Chipcap 5% NP0 100p normal,-5%,5%
C422 2320560 Top O 5 Chipcap 5% NP0 100p normal,-5%,5%
C450 2320778 Top N 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C451 2320805 Top N 5 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C454 2320779 Top M 7 CHIPCAP X7R 100N K 16V 0603 100n normal,-10%,10%
C470 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5%
C471 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5%
C472 2320546 Top M 2 Chipcap 5% NP0 27p normal,-5%,5%
C500 2320534 Bottom C 2 Chipcap +-0.25pF NP0 8p2 normal,-0.25pF,0.25pF
C501 2320546 Bottom D 2 Chipcap 5% NP0 27p normal,-5%,5%
C502 2320602 Bottom E 3 Chipcap +-0.25pF NP0 4p7 normal,-0.25pF,0.25pF
C503 2320560 Bottom E 2 Chipcap 5% NP0 100p normal,-5%,5%
C504 2320491 Bottom F 2 CHIPCAP X7R 220N K 10V 0603 220n normal,-10%,10%
C505 2320560 Bottom G 2 Chipcap 5% NP0 100p normal,-5%,5%
C506 2320560 Bottom G 2 Chipcap 5% NP0 100p normal,-5%,5%
C507 2320778 Bottom D 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C508 2320508 Bottom D 3 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF
C509 2320538 Bottom C 3 Chipcap 5% NP0 12p normal,-5%,5%
C549 2320538 Bottom C 2 Chipcap 5% NP0 12p normal,-5%,5%
C550 2320536 Bottom C 3 Chipcap 5% NP0 10p normal,-5%,5%
C551 2320536 Bottom D 3 Chipcap 5% NP0 10p normal,-5%,5%
C552 2320514 Bottom E 3 Chipcap +-0.25pF NP0 1p2 normal,-0.25pF,0.25pF
C553 2320536 Bottom E 3 Chipcap 5% NP0 10p normal,-5%,5%
C554 2320805 Bottom E 4 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C555 2320560 Bottom G 3 Chipcap 5% NP0 100p normal,-5%,5%
C556 2320560 Bottom G 3 Chipcap 5% NP0 100p normal,-5%,5%
C557 2320536 Bottom E 3 Chipcap 5% NP0 10p normal,-5%,5%
C600 2320548 Bottom H 5 Chipcap 5% NP0 33p normal,-5%,5%
C601 2320554 Bottom G 3 Chipcap 5% NP0 56p normal,-5%,5%
C602 2320778 Bottom I 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C603 2320778 Bottom I 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C604 2320536 Bottom I 4 Chipcap 5% NP0 10p normal,-5%,5%
C605 2320805 Bottom I 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C606 2320481 Bottom H 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C608 2320783 Bottom I 3 CHIPCAP X7R 33N K 10V 0402 33n normal,-10%,10%
C609 2320562 Bottom I 3 Chipcap 5% NP0 120p normal,-5%,5%
C610 2320562 Bottom I 3 Chipcap 5% NP0 120p normal,-5%,5%
C611 2320783 Bottom I 3 CHIPCAP X7R 33N K 10V 0402 33n normal,-10%,10%
C612 2320778 Bottom I 2 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C613 2320805 Bottom H 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C614 2320778 Bottom K 3 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C615 2320558 Bottom H 2 Chipcap 5% NP0 82p normal,-5%,5%
C616 2320552 Bottom I 4 Chipcap 5% NP0 47p normal,-5%,5%
C617 2320552 Bottom I 4 Chipcap 5% NP0 47p normal,-5%,5%
C620 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C621 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%

art name

alue Description

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Item Code Side X

C622 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C623 2320481 Bottom I 2 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C624 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5%
C625 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5%
C626 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5%
C627 2314001 Bottom H 2 CHIPCAP NP0 470P J 6V3 0402 470p normal,-5%,5%
C650 2320554 Bottom K 4 Chipcap 5% NP0 56p normal,-5%,5%
C651 2320629 Bottom I 3 CHIPCAP NP0 1P0 B 50V 0402 1p0 normal,-0.1p,0.1p
C652 2320633 Bottom K 4 CHIPCAP NP0 220P J 25V 0402 220p normal,-5%,5%
C653 2310055 Bottom J 4 CHIPCAP NP0 3N9 J 16V 0805 3n9 normal,-5%,5%
C654 2320633 Bottom J 4 CHIPCAP NP0 220P J 25V 0402 220p normal,-5%,5%
C655 2320481 Bottom K 4 CHIPCAP X5R 1U K 6V3 0603 1u0 normal,-10%,10%
C656 2320520 Bottom K 3 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF
C657 2320520 Bottom K 3 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF
C658 2320520 Bottom K 6 Chipcap +-0.25pF NP0 2p2 normal,-0.25pF,0.25pF
C660 2320560 Bottom J 2 Chipcap 5% NP0 100p normal,-5%,5%
C661 2320805 Bottom K 2 CHIPCAP X5R 100N K 10V 0402 100n normal,-10%,10%
C662 2320536 Bottom K 2 Chipcap 5% NP0 10p normal,-5%,5%
C699 2320508 Bottom F 4 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF
C700 2320621 Bottom G 4 CHIPCAP NP0 0P5 C 50V 0402 0p5 normal,-0.25p,0.25p
C701 2320548 Bottom G 4 Chipcap 5% NP0 33p normal,-5%,5%
C702 2320548 Bottom G 4 Chipcap 5% NP0 33p normal,-5%,5%
C703 2320554 Bottom G 4 Chipcap 5% NP0 56p normal,-5%,5%
C705 2320536 Bottom D 4 Chipcap 5% NP0 10p normal,-5%,5%
C706 2320604 Bottom F 3 Chipcap 5% NP0 18p normal,-5%,5%
C707 2320508 Bottom F 3 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF
C708 2611753 Bottom P 7 CHIPTCAP 33U M 16V 6.0X3.2X1.5 33u_16V normal,-20%,20%
C709 2611741 Bottom B 5 CHIPTCAP 4U7 M 10V 2.0X1.3X1.2 4u7_10V normal,-20%,20%
C710 2320778 Bottom B 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C711 2320548 Bottom D 7 Chipcap 5% NP0 33p normal,-5%,5%
C712 2320778 Bottom B 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C716 2320548 Bottom C 4 Chipcap 5% NP0 33p normal,-5%,5%
C717 2320536 Bottom C 3 Chipcap 5% NP0 10p normal,-5%,5%
C718 2320778 Bottom E 5 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C719 2320778 Bottom E 6 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C720 2320534 Bottom F 3 Chipcap +-0.25pF NP0 8p2 normal,-0.25pF,0.25pF
C721 2320548 Bottom F 4 Chipcap 5% NP0 33p normal,-5%,5%
C723 2320744 Bottom G 5 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C725 2320508 Bottom F 4 Chipcap +-0.25pF NP0 1p0 normal,-0.25pF,0.25pF
C726 2320514 Bottom G 4 Chipcap +-0.25pF NP0 1p2 normal,-0.25pF,0.25pF
C727 2320546 Bottom E 6 Chipcap 5% NP0 27p normal,-5%,5%
C729 2320548 Top E 6 Chipcap 5% NP0 33p normal,-5%,5%
C730 2320744 Bottom I 4 Chipcap X7R 10% 50V 0402 1n0 normal,-10%,10%
C733 2320778 Bottom B 4 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C734 2320778 Bottom B 7 Chipcap X7R 10% 16V 0402 10n normal,-10%,10%
C751 2320560 Bottom G 4 Chipcap 5% NP0 100p normal,-5%,5%
C752 2322023 Bottom H 4 CHIPCAP NP0 2N2 J 16V 0603 2n2 normal,-5%,5%
C753 2320538 Bottom D 3 Chipcap 5% NP0 12p normal,-5%,5%
C754 2320538 Bottom D 4 Chipcap 5% NP0 12p normal,-5%,5%
C756 2320546 Bottom D 3 Chipcap 5% NP0 27p normal,-5%,5%
C759 2320546 Bottom D 4 Chipcap 5% NP0 27p normal,-5%,5%
C780 2320548 Bottom C 2 Chipcap 5% NP0 33p normal,-5%,5%
C781 2320548 Bottom B 2 Chipcap 5% NP0 33p normal,-5%,5%
D200 4370841 Top P 4 UEM V6.0 W-DOG ENA TO09L TFBGA168 ~ ~
D400 4370815 Top L 4 UPP8M V1.1 F741987A C05 UBGA144 ~ ~

art name

alue Description

Page 6 ¤Nokia Corporation Issue 1 10/02

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CCS Technical Documentation Parts List

Item Code Side X

D450 4341207 Top N 6 FLASH NMP DCT4 64MBIT 40MHZ 4Mx16 ~
F100 5119019 Top S 5 SM FUSE F 1.5A 32V 0603 ~ ~
G650 4350301 Bottom J 4 VCO 3290-3980MHZ 2.7V 20MA
G660 4510349 Bottom J 2 VCTCXO 26MHZ+-10PPM 2.7V 1.5MA 26MHz ~
L100 3203743 Top R 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805 ~ ~
L101 3645319 Top R 7 CHIP COIL 220N J Q25/100MHZ 0603 220nH normal,-5%,5%
L104 3203801 Top R 6 CHIP BEAD ARRAY 2X1000R 0405
L105 3203725 Top R 7 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L106 3203725 Top R 6 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L107 3203725 Top R 6 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L151 3203801 Top E 3 CHIP BEAD ARRAY 2X1000R 0405
L356 3645327 Bottom J 7 CHIP COIL 72N G Q34/150MHZ 0603 72nH normal,-2%,2%
L357 3645207 Bottom J 7 CHIP COIL 56N G Q38/200MHZ 0603 56nH normal,-2%,2%
L470 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L471 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L472 3203725 Bottom M 3 FERRITE BEAD 0R6 600R/100M 0402 ~ ~
L500 3646091 Bottom E 2 CHIP COIL 6N8 J Q27/800M 0402 6n8H normal,-5%,5%
L501 3646077 Bottom G 2 CHIP COIL 82N J Q17/300M 0402 82nH normal,-5%,5%
L502 3646055 Bottom D 2 CHIP COIL 8N2 J Q28/800MHZ 0402 8n2H normal,-5%,+5%
L503 3646067 Bottom D 2 CHIP COIL 18N J Q29/800M 0402 18nH normal,-5%,5%
L504 3646047 Bottom D 3 CHIP COIL 3N3 +-0N3 Q28/800M 0402 3n3H normal,-0n3,+0n3%
L549 3646055 Bottom C 2 CHIP COIL 8N2 J Q28/800MHZ 0402 8n2H normal,-5%,+5%
L550 3646051 Bottom E 3 CHIP COIL 3N9 +-0N3 Q28/800M0402 3n9H normal,-0n3,+0n3
L551 3646091 Bottom G 3 CHIP COIL 6N8 J Q27/800M 0402 6n8H normal,-5%,5%
L700 3646059 Bottom G 4 CHIP COIL 5N6 +-0N3 Q28/800M 0402 5n6H normal,-0n3,+0n3
L701 3646059 Bottom G 5 CHIP COIL 5N6 +-0N3 Q28/800M 0402 5n6H normal,-0n3,+0n3
L703 3203743 Bottom E 6 FERR.BEAD 0R03 42R/100MHZ 3A 0805 ~ ~
L708 3646051 Bottom G 4 CHIP COIL 3N9 +-0N3 Q28/800M 0402 3n9H normal,-0n3,+0n3
L750 4550197 Bottom C 4 DIR.COULER 850/1800/1900 2.1X1.35 ~ ~
N356 4341023 Bottom I 7 AM/FM RECEIVER TEA5757 LQFP48 ~ ~
N600 4370781 Bottom H 3 HAGAR 5 LFBGA80 ~ ~
N700 435H092 Bottom C 5 PW AMP RF3132 GSM850/1900 3.5V ~ ~
R102 1430804 Top N 8 Resistor 5% 63mW 100k normal,-5%,5%
R152 1430762 Top O 2 Resistor 5% 63mW 2k2 normal,-5%,5%
R154 1430778 Top S 4 Resistor 5% 63mW 10k normal,-5%,5%
R155 1430804 Top Q 6 Resistor 5% 63mW 100k normal,-5%,5%
R156 1620105 Top O 2 RES NETWORK 0W06 2X2k2 J 0404 2x2k2 ~
R157 1620105 Top O 2 RES NETWORK 0W06 2X2k2 J 0404 2x2k2 ~
R159 1825031 Top R 6 VARISTOR ARRAY 2XVWM16V VC50 0405
R161 1825031 Top R 6 VARISTOR ARRAY 2XVWM16V VC50 0405
R164 1620103 Bottom P 2 Chipres Array 0W06 J 0404 2x22R normal,-5%,5%
R165 1620103 Top Q 2 Chipres Array 0W06 J 0404 2x22R normal,-5%,5%
R166 1430137 Top P 2 CHIPRES 0W06 1K0 F 200PPM 0402 1k0 normal,-1%,1%
R167 1430137 Top P 2 CHIPRES 0W06 1K0 F 200PPM 0402 1k0 normal,-1%,1%
R168 1430778 Top R 4 Resistor 5% 63mW 10k normal,-5%,5%
R200 1419003 Top R 4 CHIPRES 0W5 0R22 J 1210 0R22 normal,-5%,5%
R202 1620067 Top N 2 RES NETWORK 0W06 4X100K J 0804 4x100k normal,-5%,5%
R203 1620029 Top N 2 RES NETWORK 0W06 2X4K7 J 0404 2x4k7 normal,-5%,5%
R204 1430778 Top P 7 Resistor 5% 63mW 10k normal,-5%,5%
R301 1430770 Top L 5 Resistor 5% 63mW 4k7 normal,-5%,5%
R304 1430681 Top M 5 CHIPRES 0W06 4R3 J 0402 4R3 normal,-5%,5%
R305 1430744 Top M 5 Resistor 5% 63mW 470R normal,-5%,5%
R306 1825033 Top M 7 CHIP VARISTOR VW14V VC46V 0402 14V/46V ­R307 1430695 Top M 5 CHIPRES 0W06 6R8 J 0402 6R8 normal,-5%,5%
R350 1419009 Bottom F 6 CHIPRES 0W5 4R7 J 1210 4R7 normal,-5%,5%

art name

alue Description

290-3980 ~

x1000R/1-

x1000R/1-

XVWM16normal,-20%,20%
XVWM16normal,-20%,20%

Issue 1 10/02 ¤Nokia Corporation Page 7

NSM-9DX

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Parts List CCS Technical Documentation

Item Code Side X YPart name

R352 1430804 Bottom F 6 Resistor 5% 63mW 100k normal,-5%,5%
R358 1430778 Bottom K 7 Resistor 5% 63mW 10k normal,-5%,5%
R359 1430722 Bottom G 6 Resistor 5% 63mW 68R normal,-5%,5%
R360 1430802 Bottom J 6 Resistor 5% 63mW 82k normal,-5%,5%
R361 1430762 Bottom I 6 Resistor 5% 63mW 2k2 normal,-5%,5%
R362 1430770 Bottom I 5 Resistor 5% 63mW 4k7 normal,-5%,5%
R363 1430778 Bottom H 6 Resistor 5% 63mW 10k normal,-5%,5%
R364 1430804 Bottom I 5 Resistor 5% 63mW 100k normal,-5%,5%
R365 1430778 Bottom H 6 Resistor 5% 63mW 10k normal,-5%,5%
R369 1430796 Bottom G 7 Resistor 5% 63mW 47k normal,-5%,5%
R370 1430796 Bottom K 7 Resistor 5% 63mW 47k normal,-5%,5%
R371 1430778 Bottom H 7 Resistor 5% 63mW 10k normal,-5%,5%
R380 1430796 Bottom H 8 Resistor 5% 63mW 47k normal,-5%,5%
R381 1430804 Bottom J 5 Resistor 5% 63mW 100k normal,-5%,5%
R382 1430796 Bottom G 7 Resistor 5% 63mW 47k normal,-5%,5%
R383 1430796 Bottom H 7 Resistor 5% 63mW 47k normal,-5%,5%
R388 4120071 Bottom O 2 ASIP EMIF03-SIM01 SIM FILTER BGA8 ~ ~
R420 1430726 Bottom H 5 Resistor 5% 63mW 100R normal,-5%,5%
R421 1620019 Top O 5 RES NETWORK 0W06 2X10K J 0404 2x10k normal,-5%,5%
R422 1430268 Top P 6 CHIPRES 0W06 27K F 100PPM 0603 27k normal,-1%,+1%
R450 1430770 Top M 7 Resistor 5% 63mW 4k7 normal,-5%,5%
R500 1430726 Bottom E 2 Resistor 5% 63mW 100R normal,-5%,5%
R501 1430700 Bottom F 2 Resistor 5% 63mW 10R normal,-5%,5%
R502 1430846 Bottom E 2 Resistor 1% 63mW 2k7 normal,-1%,1%
R550 1430746 Bottom E 3 Resistor 5% 63mW 560R normal,-5%,5%
R551 1430700 Bottom E 4 Resistor 5% 63mW 10R normal,-5%,5%
R600 1620081 Bottom I 2 RES NETWORK 0W03 4X22R J 0804 4x22R normal,-5%,5%
R602 1430770 Bottom I 2 Resistor 5% 63mW 4k7 normal,-5%,5%
R603 1430846 Bottom G 3 Resistor 1% 63mW 2k7 normal,-1%,1%
R604 1430770 Bottom H 2 Resistor 5% 63mW 4k7 normal,-5%,5%
R606 1430784 Bottom H 2 Resistor 5% 63mW 15k normal,-5%,5%
R607 1620033 Bottom I 4 RES NETWORK 0W06 2X5K6 J 0404 2x5k6 ~
R608 1620033 Bottom I 4 RES NETWORK 0W06 2X5K6 J 0404 2x5k6 ~
R610 1430700 Bottom I 4 Resistor 5% 63mW 10R normal,-5%,5%
R650 1430770 Bottom K 4 Resistor 5% 63mW 4k7 normal,-5%,5%
R651 1430772 Bottom J 4 Resistor 5% 63mW 5k6 normal,-5%,5%
R652 1430700 Bottom K 4 Resistor 5% 63mW 10R normal,-5%,5%
R660 1430762 Bottom J 2 Resistor 5% 63mW 2k2 normal,-5%,5%
R661 1430774 Bottom K 2 Resistor 5% 63mW 6k8 normal,-5%,5%
R700 1620121 Bottom G 4 RES NETWORK 0W06 2X220R J 0404 2x220R normal,-5%,5%
R701 1620121 Bottom G 4 RES NETWORK 0W06 2X220R J 0404 2x220R normal,-5%,5%
R703 1430714 Bottom E 5 Resistor 5% 63mW 33R normal,-5%,5%
R704 1430718 Bottom E 6 Resistor 5% 63mW 47R normal,-5%,5%
R706 1430693 Bottom G 5 Chipres 0W06 5R6 J 0402 5R6 normal,-5%,5%
R707 1430693 Bottom G 4 Chipres 0W06 5R6 J 0402 5R6 normal,-5%,5%
R722 1620507 Bottom E 5 RES NETWORK 0W04 3DB ATT 0404
R751 1430770 Bottom E 4 Resistor 5% 63mW 4k7 normal,-5%,5%
R752 1430788 Bottom H 4 Resistor 5% 63mW 22k normal,-5%,5%
R753 1430770 Bottom D 4 Resistor 5% 63mW 4k7 normal,-5%,5%
R754 1430726 Bottom D 4 Resistor 5% 63mW 100R normal,-5%,5%
R755 1430718 Bottom D 3 Resistor 5% 63mW 47R normal,-5%,5%
R756 1430770 Bottom H 5 Resistor 5% 63mW 4k7 normal,-5%,5%
R757 1430778 Bottom D 4 Resistor 5% 63mW 10k normal,-5%,5%
R780 1430700 Bottom C 2 Resistor 5% 63mW 10R normal,-5%,5%
R781 1430700 Bottom B 2 Resistor 5% 63mW 10R normal,-5%,5%

alue Description

92R/17R6~

Page 8 ¤Nokia Corporation Issue 1 10/02

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CCS Technical Documentation Parts List

Item Code Side X YPart name

R782 1620515 Bottom E 6 RES NETWORK 0W04 1DB ATT 0404
S300 5200025 Top B 7 SM TACT SW SIDE TRAVEL 0.2MM ~ ~
S301 5200025 Top C 2 SM TACT SW SIDE TRAVEL 0.2MM ~ ~
S302 5200025 Top D 2 SM TACT SW SIDE TRAVEL 0.2MM ~ ~
T650 4550187 Bottom I 3 TRANSF BALUN 3600MHZ+-400MHZ ~ ~
T700 3640431 Bottom F 4 TRANSF BALUN 1920+/-70MHZ 0805 ~ ~
V100 4113721 Top R 4 TVS DI 1PMT16AT3 16V 175W PWRMITE ~ ~
V300 4219937 Top N 5 TRX2 UMT1/PUMT1 P40V100MA SOT363 ~ ~
V301 4219937 Top M 5 TRX2 UMT1/PUMT1 P40V100MA SOT363 ~ ~
V324 4864595 Top K 3 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~
V325 4864595 Top K 7 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~
V326 4864595 Top K 4 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~
V327 4864595 Top K 5 LED CL270PSB72 PASTELBLUE 90' 0603 ~ ~
V329 4110475 Top M 5 SCH DI RB521S-30 200MA 35V SOD523 ~ ~
V350 4219921 Bottom F 5 TR DTC143ZE N RBE4K7/47K 0A1 SC75 ~ ~
V351 4860101 Bottom C 8 IRDA TFDU5102 9.K6-1M152 BABYFACE ~ ~
V356 4110931 Bottom K 7 CAPDIX2 BBY66-05 CT=5.5 FM SOT23 ~ ~
V357 4110931 Bottom K 6 CAPDIX2 BBY66-05 CT=5.5 FM SOT23 ~ ~
V500 4210277 Bottom D 2 TR BGB420 MIRROR ADJ BIAS SOT343 ~ ~
V550 4210261 Bottom D 3 TR BGA428 LNA1.8GHZ 19.5DB SOT363 ~ ~
V750 4110079 Bottom D 4 SCH DIX2 HSMS282C 15V <1PF SOT323 ~ ~
X100 5400181 Bottom R 5 SYS CONN SPR HS/SW+DC+MIC+V.MOTOR ~ ~
X101 5409141 Bottom P 5 SM BATTERY CONN 4POL SPR. 12V 2A ~ ~
X300 5409183 Top I 5 SM LCD CONN 1X8 P2.0 SPR 50V 0.5A ~ ~
X303 5469135 Top L 6 SM CONN 2X8 SPR 50V 0.5A PCB/PCB ~ ~
X386 5409107 Bottom M 4 SM SIM CONN 2X3POL P2.54 H=1.6MM ~ ~
Z260 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z261 3203741 Top R 4 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z262 3203741 Top Q 7 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z263 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z264 3203741 Top R 5 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z265 3203741 Top P 7 FERRITE BEAD 0R5 600R/100MHZ 0603 ~ ~
Z301 4120031 Top M 6 EMI/ESD FILT EMIF10-1K010F1 BGA24 ~ ~
Z356 4550145 Bottom G 7 CER FILT 10.7+-0.03MHZ 3.45X3.1 10.7MHz ~
Z357 4550099 Bottom H 6 CER FILT 10.7+-0.0225MHZ 3.4X2.6 10.7MHz ~
Z358 4550145 Bottom F 7 CER FILT 10.7+-0.03MHZ 3.45X3.1 10.7MHz ~
Z500 4550185 Bottom C 3 ANT.SW 824-894/1850-1990MHZ 6.7X5
Z501 4510357 Bottom G 2 SAW FILT 881.5 +-12.5MHZ/3DB 2.5X2 881.5MHz ~
Z520 4510353 Bottom D 2 SAW FILT 881.5/1960MHZ 3X2.5X0.9
Z551 4511273 Bottom F 3 SAW FILT 1960+-30MHZ/4.0DB 2520 1960MHz ~
Z700 4510351 Bottom F 4 SAW FILT 836.5+-12.5MHZ/2.5DB 836.5MHz ~

alue Description

70R/5R77~

24-894/18~

81.5/1960~

Issue 1 10/02 ¤Nokia Corporation Page 9

NSM-9DX

Parts List CCS Technical Documentation

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Page 10 ¤Nokia Corporation Issue 1 10/02

CCS Technica l Documentation

NSM-9DX Series Transceivers

Product Variants

Issue 1 10/02 ¤Nokia Corporation

NSM-9DX

Product Variants CCSTechnical D ocumentation

Table of Contents

Page No

Transceiver NSM-9DX.................................................................................................. 3

Basic Nokia Modules ...................................................................................................4

Exploded View of Transceiver NSM-9DX .................................................................5

Assembly Parts of NSM-9DX .....................................................................................6

List of Figures

Page No

Fig 1 Transceiver NSM-9DX ..............................................................................................3

Fig 2 Exploded view of NSM-9DX.....................................................................................5

Page 2 ¤Nokia Corporation Issue 1 10/02

NSM-9DX

CCSTechnical Documentation Product Variants

Transceiver NSM-9DX

Figure 1: Transceiver NSM-9DX

The NSM-9DX is a dual band transceiver unit designed for the GSM850/1900 networks.
It is a GSM850/1900 power class 1 (1W) transceiver.

The transceivers main HW parts / features are:

•GPRS

• high resolution B&W display (96 x 65 pixels)

• Jack III style UI with two soft keys

• Integrated IR link & internal data

• Internal vibra

• Integrate d FM radio

• Plug & play HF support

• Plug-in SIM card below the battery of the phone

• Integrated antenna

Note: The Service Manual is intended for use by qualified service personnel only.

Issue 1 10/02 ¤Nokia Corporation Page 3

NSM-9DX

Product Variants CCSTechnical D ocumentation

Basic Nokia Modules

NSM-9DX 6590 Nokia Americas without SIM LOCK beige 0507890

grey 0507889

A-cover assy greyish green DMC04311 9458332

beige DMC04311 9458252
Keypad Latin silver DMC04442 9794062
Battery cover assy greyish green DMC04312 9458327

beige DMC04312 9458254

Transceiver NSM-9DX ATO Module 0507878

• system module HG9 0201836

• UI module LU9 0201817

• mechanics NSM-9 0262794

• SW module NSM-9 0245091

Page 4 ¤Nokia Corporation Issue 1 10/02

NSM-9DX

CCSTechnical Documentation Product Variants

Exploded View of Transceiver NSM-9DX

Figure 2: Explod ed view of NSM-9 D X

I013

I001

I003

I004

I005

I006

I007

I010

I008

I012

I011

I009

I002

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NSM-9DX

Product Variants CCSTechnical D ocumentation

Assembly P arts of NSM-9DX

CIRCUIT REF./
ITEM Q'TY CODE DESCRIPTION VALUE/TYPE

I001 9458332 A-cover assy greyish green DMC04311

9458252 beige DMC04311
I002 9794062 Keypad Latin DMC04442
I003 6 6150051 Screw M1.6X5.5 T6 DMD07562
I004 0201817 UI Module DMC03712
I005 5140067 Speaker + spring
I006 0201836 Radio Module H69
I007 6800055 Vibra Motor assy
I008 5140205 Microphone assy
I009 5400181 System connector
I010 9458435 B-cover assembly DMC04825
I011 9460377 SIM Card Cover (incl. in B-cover assy) DMD06170
I012 0670322 Battery BLB-2 Li-ion
I013 9458254 Battery cover assy Nokia brand, beige DMC03189

9458327 Battery cover assy, greyish green DMC04815

Page 6 ¤Nokia Corporation Issue 1 10/02

CCS Technica l Documentation

NSM-9DX Series Transceivers

Service Software Instructions

& Service Concepts

Issue 1 10/02 ¤Nokia Corporation

NSM-9DX

Service Software Instructions & Service Concepts CCSTechnical Documentation

Table of Contents

Page No

Service Software Instructions ........................................................................................ 3

Phoenix ........................................................................................................................3

Supported Operating Systems ................................................................................... 3

Hardware requirements for using Phoenix................................................................ 3

Introduction............................................................................................................... 4

Setting up Phoenix .................................................................................................... 4

Installing Phoenix...................................................................................................... 4

Uninstalling Phoenix................................................................................................. 5

Data Packages ........................................................................................................... 5

Starting a session....................................................................................................... 5

Service Concepts and Setup Instructions....................................................................... 7

Flash Concept ..............................................................................................................7

Flash Concept - POS (Point-of-Sale) ...........................................................................8

JBV-1 Flash Concept ...................................................................................................9

Jig Concept ................................................................................................................10

CLP-9 Service Concept .............................................................................................11

Parallel Flash Concept ...............................................................................................12

List of Figures

Fig 1 Flash Concept .............................................................................................................7

Fig 2 POS Flash Concept ....................................................................................................8

Fig 3 JBV-1 Flash Concept .................................................................................................9

Fig 4 Jig Concept ................................................................................................................10

Fig 5 CLP-9 Service Concept .............................................................................................11

Fig 6 Parallel Flash Concept ...............................................................................................12

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NSM-9DX

CCSTechnical Documentation ServiceSoftware Instructions& Service

Service Software Instructions

Phoenix

Phoenix is the next generation Service Software and it has been designed to meet the
challenges in servicing modern cellular phones.

The Phoenix program has been built using component architecture. This means that the
actual program is small and most of the program’s functionality is divided into dynami­cally loaded modules or DLLs.

Supported Operating Systems

The Phoenix program can be used in any of the following operating systems:

Windows 95, 98, 2000, ME and NT 4.0 (SP4).

Table 1: Supported O perating Systems

Supported Operating Systems
Windows 95
Windows 98
Windows NT 4.0
Windows 2000

Hardware requirements for using Phoenix

The minimum hardware requirements for using Phoenix are:

Table 2: HW requirements for AMS

Minimum HW requirements for AMS
Processor 233 MHz
RAM 64 MB
Needed disk space 50 - 100 MB

For Windows 2000, the following requirements are recommended:

Table 3: HW requirements for Windows 2000

Recommended HW for Windows 2000
Processor 700 MHz
RAM 512 MB
Needed disk space 50 - 100 MB

Issue 1 10/02 ¤Nokia Corporation Page 3

NSM-9DX

Service Software Instructions & Service Concepts CCSTechnical Documentation

Introduction

This section briefly describes how to install the Phoenix software and includes some
basic information on how to use the program. For more detailed information, please refer
to the Phoenix’s Help -files. Each feature in Phoenix has its own Help function, which
can be activated while running the program.

Press the F1 key or the feature's Help-button to activate a Help -file.

Setting up Phoenix

1 Download the latest rel ease. Please contact your regional After Market Service s

point for information on where to download the latest release.

Download and read the release notes, whic h will have useful information on the

software version you are using.

2 Install Phoenix by executing the phoenix installation package and follow the

instructions on the screen.

Note: In some products the setup may require you to reboot the computer. In
either case, the setup will register Phoenix components. This process can take
several minutes.

3 Download the latest data packages for the products you will be using.

By default, the program files are stored under C:\Program Files\Nokia\Phoenix

The Phoenix program has been built using component architecture. This mea ns
that the actual program is very small and most of the program’s f unctionality i s
divided into dynamically loaded modules (DLLs).

The data packages will create product spe cific directories under the insta llation
directory.

Installing Phoenix

1 Before you start installing the program, check that

• the dongle is attache d to the parallel port. Contact your supervisor in order to
obtain a suitable dongle.

• you have administrator rights (Windows NT or Windows 2000). This is required
in order to be able to install Phoenix.

2 The installation checks that the latest supported dongle driver version is

installed. The dongle driver is installed if there is no previous installa tion of the
dongle driver or if the installed dongle driver is older than the latest supported
version.

3 Reboot your PC before using Phoenix, if you are requested to do so.

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CCSTechnical Documentation ServiceSoftware Instructions& Service

Uninstalling Phoenix

Uninstalling another Phoenix version

1 Make sure that the dongle is attached.
2 Go to the Control Panel and select Add/Remove Programs.
3Select TSS4 Phoenix Release xx.yy.zzz for uninstallation and click Add/Remove.
4Click OK to remove the application

You may be required to reboot your PC after uninstallation.

Note: If you have different product packages installed, the components are unin-

stalled only if they are not included in other product packages.

Data Packages

Data Packages (DP) is a name for a helpful feature in the Phoenix software. This type of
feature provides a flexible way of distributing and installing Phoenix and its data files.

All product-specific data is separated from the pr ogram code and installed separately.
This means that the installation is performed in at least two steps.

Each product will have its own DP. The FPS-8 flashing equipment also has its own pack­age.

Starting a session
Concepts

In the Phoenix context, Product means the cellular phone attached to a PC. More specif­ically, it is a particular type of phone.

Connection means the type of cable used to attach the phone to the port to which the
other end of the cable is attached.

Selecting a connection

The connection defines the cable and the comm unications port that will be used when
connecting to the phone.

1 Active conne ctions are listed in the toolbar’s Connection pull-down menu. You

should make sure that the connection is correct before using the software.
Change it, if necessary.

In case the connection is the wrong one, you need to create a new one.
2Select Settings from the pull-down menu.
3Select Add in the Connection List Dialog and in fill the rele vant fields in the Con-

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Service Software Instructions & Service Concepts CCSTechnical Documentation

nection setup dialog.

Selecting a product

Many of Phoenix’s features are product-specific. It is, therefore, mandatory to choose the
product you will be working on at the beginning of the session.

1Select File - Scan Product (or hold the Ctrl key down and press R). Phoenix will

scan the connected product and load additional menus which ar e designed for
the product. If the product is not supported then an error message will be dis­played and a different Phoenix data package may be required.

2 If you want to manua lly choose the product or if the phone is dead , select File -

Choose Product. You will be presented with a list of available pr oducts.

After the product selection, you will see an addit ional menu item on the main
menu. If you take a look at the available menu items, you will see that their num­ber has increased.

Phoenix environment

You can configure the program’s main toolbar and the product or t ool -specific options
to your liking.

You can control which toolbars are visible by selecting View and Toolbars from the pull­down menu. The visible toolbars are marked with a check.

The rest of the options are product or tool -specific. The tool-specific options are set
using the associated toolbar.

Using components

When working with Phoenix, each task gene rally has its own component that will per ­form the task. The first thing, therefore, is to open the desired component.

Opening a component means that you open a tool window within Phoenix.

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CCSTechnical Documentation ServiceSoftware Instructions& Service

Service Concepts and Setup Instructions

Flash Concept

Figure 1: Flash Concept

7

9

6

8

4

3

2

1

Table 4: Flash Concept

Item Name Type

1 Point of Sales flash loading adapte r F LA-18 0770318
2 Power cable FLC-2 0730185

5

Code

3 Modular Cable XCS-4 0730178
4 Flash prommer box FPS-8 0080321
5 Printer cable, incl. in FPS-8 sales package 073F000
6 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090
7 Software protection key PKD-1 0750018
8 Phoenix S erv i c e Software 8406941

NSM-9DX Flash SW dat a

9 AC charger, incl. in FPS-8 sales package 0680032

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Service Software Instructions & Service Concepts CCSTechnical Documentation

Flash Concept - POS (Point-of-Sale)

Figure 2: POS Flash Concept

4

5

2

3

1

Table 5: POS Flash Concep t

ITEM NAME TYPE CODE

1 Point-of-Sales flash loading adapter FLA-18 0770318
2 Service Cable XCS-1 0730218
3 AC Charger (see General Information) ACP-12
4 POS flash dongle for Americas area FLS-4 0081482
5 Phoenix Service SW 8406941

NSM-9DX Flash SW data

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CCSTechnical Documentation ServiceSoftware Instructions& Service

JBV-1 Flash Concept

Figure 3: JBV-1 Flash Concept

7

9

8

4

3

2

1

6

5

Table 6: JBV-1 Flash Concept

ITEM NAME TYPE CODE

1 Docking station J BV -1 0770298
2 DC power cable PCS-1 0730012
3 Modular cable XCS-8 0730178
4 Flash prommer box FPS-8 0080321
5 Printer cable, incl. in FPS-8 sales package 073F000
6 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090
7 Software protection key PKD-1 0750018
8 Phoenix Service Soft wa re 8406941

NSM-9DX Flash SW data

9 AC charger, incl. in FPS-8 sales package 0680032

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Service Software Instructions & Service Concepts CCSTechnical Documentation

Jig Concept

Figure 4: Jig Concept

5

6

2

1

4

3

Table 7: Jig Concept

ITEM NAME TYPE CODE

1 Module jig MJS-46 0770316
2 DC P o wer Cable PCS-1 0730012
3 RF antenna cable XRF-1 0730085
4 Service MBUS cable DAU-9S 0730108
5 Software protection key PKD-1 0750018
6 Phoenix Service Soft wa re 8406941

NSM-9DX Flash SW data

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CCSTechnical Documentation ServiceSoftware Instructions& Service

CPL-9 Service Concept

Figure 5: CPL-9 Service Co ncept

5

6

2

1

4

3

Table 8: CPL-9 Service Concept

ITEM NAME TYPE CODE

1 Docking station J BV -1 0770298
2 Docking stati o n adapter MJF-6 0770317
3 Coupler CPL-9 0770529
4DC-DC cable SCB-3 0730114
5 RF antenna cable XRF-1 0730085
6 DC power cable PCS-1 0730012
7 Service MBUS cable DAU-9S 0730108
8 Software protection key PKD-1 0750018
9 Phoenix Service Soft wa re 8406941

NSM-9DX Flash SW data

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Service Software Instructions & Service Concepts CCSTechnical Documentation

Parallel Flash Concept

Figure 6: Parallel Flash Concept

Table 9: Parallel Flash Concept

ITEM NAME TYPE CODE

1 Docking stati o n adapter MJF-6 0770317
2 Docking station J BV -1 0770298
3 Modular cable XCS-8 0730178
4 DC power cable PCS-1 0730012
7 D9 - D9 cable, incl. in FPS-8 sales package AXS-4 0730090
8 Printer cable, incl. in FPS-8 sales package 073F000
10 Software protection key PKD-1 0750018
11 Phoenix Service Software 8406941

NSM-9DX Flash SW data

17 Parallel flash prommer FPS-8C 0080396

Page 12 ¤Nokia Corporation Issue 1 10/02

CCS Technica l Documentation

NSM-9DX Series Transceivers

Service T ools

Issue 1 10/02 Nokia Corporation

NSM-9DX

Service Tools CCSTechnical Documentation

Table of Contents

Page No

JBV-1 Docking Station and MJF-6 Adapter ...............................................................4

Product Code............................................................................................................. 4

MJS-46 Module Jig ......................................................................................................6

Product Code............................................................................................................. 6

MJS-47 Soldering Jig ..................................................................................................7

Product Code............................................................................................................. 7

FPS-8 Flash Prommer (Sales Pack) .............................................................................8

Sales Package Code................................................................................................... 8

FPS-8C Parallel Flash Prommer (Sales Pack) .............................................................9

Sales package code.................................................................................................... 9

ACF-8 Universal Power Supply ................................................................................10

Product Code........................................................................................................... 10

FLA-18 POS (Point Of Sale) Flash Loading Adapter ...............................................11

Product Code........................................................................................................... 11

FLC-2 DC Cable ........................................................................................................12

Product Code........................................................................................................... 12

AXS-4 Service Cable .................................................................................................13

Product Code........................................................................................................... 13

XCS-1 Service Cable .................................................................................................14

Product Code........................................................................................................... 14

SW Security Device PKD-1 ......................................................................................15

Product Code........................................................................................................... 15

FLS-4 POS (Point Of Sale) Flash Device (Sales Pack) .............................................16

Product Code........................................................................................................... 16

PCS-1 Power Cable ...................................................................................................17

Product Code........................................................................................................... 17

XRF-1 RF Cable ........................................................................................................18

Product Code........................................................................................................... 18

DAU-9S MBUS Cable ..............................................................................................19

Product Code........................................................................................................... 19

SCB-3 DC Cable ........................................................................................................20

Product Code........................................................................................................... 20

XCS-4 Modular Cable ...............................................................................................21

Product Code........................................................................................................... 21

Printer Cable ..............................................................................................................22

Product Code........................................................................................................... 22

Page No

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CCSTechnical Documentation Service Tools

List of Figures

Page No

Fig 1 View of JBV-1 and MJF-6 together ...........................................................................5

Fig 2 View of MJS-46 .........................................................................................................6

Fig 3 View of MJS-47 .........................................................................................................7

Fig 4 View of FPS-8............................................................................................................8

Fig 5 View of FPS-8C .........................................................................................................9

Fig 6 View of ACF-8...........................................................................................................10

Fig 7 View of FLA-18 .........................................................................................................11

Fig 8 View of FLC-2 ...........................................................................................................12

Fig 9 View of AXS-4...........................................................................................................13

Fig 10 View of XCS-1.........................................................................................................14

Fig 11 View of SW Security Device ...................................................................................15

Fig 12 View of FLS-4..........................................................................................................16

Fig 13 View of PCS-1..........................................................................................................17

Fig 14 View of XRF-1.........................................................................................................18

Fig 15 View of DAU-9S......................................................................................................19

Fig 16 View of SCB-3 .........................................................................................................20

Fig 17 View of XCS-4.........................................................................................................21

Fig 18 View of Printer Cable...............................................................................................22

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Service Tools CCSTechnical Documentation

JBV-1 Docking Station and MJF-6 Adapter

The JBV-1 Docking Station has been designed for calibration and software update use.
The MJF-6 Docking Station Adapter makes signal connections to the phone. JBV-1 and
MJF-6 are used as one unit.

JBV-1 main electric functions are:

• adjustable VBATT calibration voltage, current measurement limit voltage

"VCHAR", current measurement calibration current "ICHAR"

• adjustable ADC calibration voltage via BTEMP and BSI signal

• BTEMP and BSI calibration resistor

• signals from FBUS to the pho ne via parallel jig

• control via FBUS or USB

• Flash OK/FAIL indication

In the calibration mode, the JBV-1 is powered by an external power supply 11 -16V DC.
During flashing, power for the phone can b e taken from the FPS-8 or from an external
power supply 11-16V DC.

The MJF-6’s main electric functions are:

• phone recognizing from BTEMP

• filters of FBUS signals

• SIM CARD reader

Product Code

JBV-1 Docking Station: 0770298
MJF-6 Docking Station Adapter: 0770317

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CCSTechnical Documentation Service Tools

Figure 1: View of JBV-1 and MJF-6 together

CPL-6 RF-Coupler: 0775308
CPL-6isusedwithJBV-1and

MJF-6 for making RF coupler
connection from the phone to
measurement equipment.

CPL-9 RF-Coupler: 0770529
CPL-9 is used with JBV-1 and MJF-6 for making RF coupler connection from the phone

to the measurement equipment.

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Service Tools CCSTechnical Documentation

MJS-46 Module Jig

The MJS-46 Module Jig is used for testing of UI/system/RF-module*.

Product Code

MJS-46 Module Jig: 0770316

Figure 2: View of MJS-46

*Note: The nominal supply voltage for MJS-46 is +8.0 V. The supply voltage must

not exceed +12.0 V (min. 5V). (MJS-46 has overvoltage protection). For f lash­ing with FPS-8, it is possible to bypass the regulator with a jumper. Then the
supply voltage must not exceed 5.2 V.

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CCSTechnical Documentation Service Tools

MJS-47 Soldering J ig

The Soldering Jig MJS-47 is used for soldering and as a rework jig for system module.

Product Code

MJS-47 Module Jig: 0770342

Figure 3: View of MJS-47

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Service Tools CCSTechnical Documentation

FPS-8 Flash Prommer (Sales Pack)

The Flash Prommer FPS-8 is used with e.g. FLA-18 and JBV-1. Power is supplied to FPS-8
from the Universal Power Supply.

The sales pack includes:

• FPS-8 Flash Prommer 0750123

• FPS-8 Activation Sheet 9359289

• Universal Power Supply 0680032

• AXS-4 Service Cable (D9-D9) 0730090

• Printer cable 073F000

Sales Package Code

FPS-8 Flash Prommer: 0080321

Figure 4: View of FPS-8

Page 8 ¤Nokia Corporation Issue 1 10/02

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CCSTechnical Documentation Service Tools

FPS-8C Parallel Flash Prommer (Sales Pack)

The Parallel Flash Prommer FPS-8C is used with MJF-6 and JBV-1. Flash programming
can be done to maximum of 8 phones parallel. FPS-8C consists of eight SF11C program­ming cards. SF11C card is functionally identical to FPS-8.

Sales package code

FPS-8C Parallel Flash Prommer: 0080396

Figure 5: View of FPS-8C

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Service Tools CCSTechnical Documentation

ACF-8 Universal Power Supply

ACF-8 Universal Power Supply is used to power FPS-8. ACF-8 has 6 V DC and 2.1 A out­put.

Product Code

ACF-8 Universal Power Supply: 0680032

Figure 6: View of ACF-8

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CCSTechnical Documentation Service Tools

FLA-18 POS (Point Of Sale) Flash Loading Adapter

The POS Flash Loading Adapter FLA-18 is used in place of the phone's normal battery
during service, to supply a controlled operating voltage.

Product Code

FLA-18 POS Flash Loading Adapter: 0770318

Figure 7: View of FLA-18

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Service Tools CCSTechnical Documentation

FLC-2 DC Cable

The FLC-2 is used to supply a controlled operating voltage.

Product Code

FLC-2 DC Cable: 0730185

Figure 8: View of FLC-2

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CCSTechnical Documentation Service Tools

AXS-4 Service Cable

The AXS-4 D9-D9 Service Cable is used to connect two 9 pin D connectors e.g. between
PC and FPS-8. Cable length is 2 meters.

Product Code

AXS-4 D9-D9 Service Cable: 0730090

Figure 9: View of AXS-4

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Service Tools CCSTechnical Documentation

XCS-1 Service Cable

The XCS-1 Service Cable is used to connect FLS-4 to FLA-18.

Product Code

XCS-1 Service Cable: 0730218

Figure 10: View of XCS-1

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CCSTechnical Documentation Service Tools

SW Security Device PKD-1

SW security device is a piece of hardware enabling the use of the service software when
connected to the parallel (LPT) port of the PC. Without the dongle present it is not possi­ble to use the service software. Printer or any such device can be connected to the PC
through the dongle if needed.

Caution: Make sure that you hav e switched off the PC and the printer before making

connections!

Caution: Do not connect the PKD-1 to the serial port. You may damage your PKD-1.

Product Code

SW Security Device PKD-1: 0750018

Figure 11: View of SW Security Device

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Service Tools CCSTechnical Documentation

FLS-4 POS (Point Of Sale) Flash Device (Sales Pack)

FLS-4 is a dongle and flash device incorporated into one package, developed specifically
for POS use.

Product Code

Sales Pack - Europe/Africa 0081483
Sales Pack -APAC 0081481
Sales Pack -Americas 0081482

Figure 12: View of F LS-4

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CCSTechnical Documentation Service Tools

PCS-1 Power Cable

The PCS-1 Power Cable (DC) is used to connect, for example, JBV-1 to FPS-8.

Product Code

PCS-1 Power Cable: 0730012

Figure 13: View of PCS-1

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Service Tools CCSTechnical Documentation

XRF-1 RF Cable

RF cable XRF-1 is used to connect, for example, the Module Jig MJS-46 to the RF mea­surement equipment.

Product Code

XRF-1 RF Cable: 0 730085

Figure 14: View of XRF-1

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DAU-9S MBUS Cable

The MBUS Cable DAU-9S has a modular connector, and is used with between PC's serial
port and, for example, the Module Jig MJS-46.

Product Code

DAU-9S MBUS Cable: 0730108

Figure 15: View of DAU-9S

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SCB-3 DC Cable

The DC Cable SCB-3 is used to connect, for example, the JBV-1 to the phone.

Product Code

SCB-3 DC Cable: 0730114

Figure 16: View of SCB-3

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XCS-4 Modular Cable

XCS-4 is a shielded cable (one specially shielded conductor) modular cable for flashing
and service purposes.

Product Code

XCS-4 Modular Cable: 0730178

Figure 17: View of XCS-4

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Printer Cable

This cable is used to connect the PC to FPS-8.

Product Code

Printer Cable: 073F000

Figure 18: View of Printer Cable

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