Nokia 6560 Service Manual 9rh25sys
CCS Technical Documentation
RH-25 Series Transceivers
System Module
Issue 1 10/2003 Confidential ©Nokia Corporation
RH-25
System Module CCS Technical Documentation
Contents
Page No
Introduction.................................................................................................................... 4
BB Hardware Characteristics ......................................................................................4
Technical Summary .....................................................................................................4
Functional Description .................................................................................................5
Modes of Operation................................................................................................... 5
RH-25 BB Functional Blocks ......................................................................................6
UEM and UPP........................................................................................................... 7
Battery....................................................................................................................... 8
Charger Detection ................................................................................................... 11
Charger Interface Protection ................................................................................... 11
LED Driver Circuit.................................................................................................. 12
LCD Display ........................................................................................................... 13
RF Interface Block.................................................................................................. 14
Combo Memory Module......................................................................................... 14
Combo Memory Interface....................................................................................... 14
SRAM Memory Description................................................................................... 14
Flash Memory Description...................................................................................... 14
Flash Architecture................................................................................................... 15
Keyboard (UI Module)............................................................................................ 15
Keyboard ESD Protection....................................................................................... 15
Internal Audio ......................................................................................................... 15
External Audio Connector....................................................................................... 17
External Microphone Connection ........................................................................... 18
External Earphone Connection................................................................................ 18
IrDa Interface .......................................................................................................... 19
Vibra........................................................................................................................ 19
FM Radio................................................................................................................. 19
System Connector (Tomahawk).............................................................................. 20
PWB Strategy ............................................................................................................21
PWB Construction................................................................................................... 21
PWB Immunity ....................................................................................................... 22
Keyboard................................................................................................................. 22
Audio Lines............................................................................................................. 22
Microphone Lines ................................................................................................... 22
EAR Lines............................................................................................................... 23
Charger Lines.......................................................................................................... 23
HEADINT............................................................................................................... 23
Battery Supply Filtering.......................................................................................... 23
System Connector ................................................................................................... 23
Mechanical Shielding.............................................................................................. 23
EMC Strategy ............................................................................................................23
Test Interfaces ............................................................................................................24
Production / After Sales Interface........................................................................... 24
Flash Interface......................................................................................................... 25
FBUS Interface........................................................................................................ 25
BB_RF Interface Connections ...................................................................................26
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RF Functional Description .........................................................................................29
Block diagram......................................................................................................... 29
Circuit Diagrams and PWB Layout ........................................................................ 30
Receiver................................................................................................................... 30
Frequency Synthesizers........................................................................................... 31
Transmitter.............................................................................................................. 31
Antenna ................................................................................................................... 34
Software Compensations ...........................................................................................34
RF frequency plan................................................................................................... 34
DC Characteristics................................................................................................... 36
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RH-25
System Module CCS Technical Documentation
Introduction
This document describes the system module for the RH-25 transceiver. The baseband
module includes the baseband engine chipset, the UI components, and the acoustic components. RH-25 is a hand-portable dual band TDMA 850/1900 with AMPS. It has been
designed using DCT4 generation baseband (UEM/UPP) and RF (TACO) module. The baseband module has been developed as part of the DCT4 common Baseband. RH-25 contains some baseband features that are new to the America's TDMA market. These
features include stereo FM receiver (offered as an accessory) and a MIDI (polyphonic
ringing tones). The battery for RH-25 is the BLD-3 with a nominal capacity of 780 mAh.
BB Hardware Characteristics
• Hi-Resolution (128x128) illuminated color display
• Active LCD pixel area: width 27.6mm X height 27.6mm
• ESD-proof keymat, with five individual keys for multiple key pressing
• Support for internal semi-fixed battery (Janette type BLD-3)
• Audio amplifier and SALT speaker for MIDI support
• Ringing volume 100dB @ 5cm (MIDI tones through SALT speaker)
• Stereo FM receiver as an accessory
• IrDa port/interface
• Internal vibra
• Supports voice dial activation via headset button
• Six white LEDs for keymat on UI board and two for LCD backlight in LCD module
• 6-layer PWB, SMD with components on both sides of PWB
Technical Summary
The baseband module is implemented using two main ASICs — the Universal Energy
Management (UEM) and the Universal Phone Processor (UPP). For detailed information
on these two ASICs, see the following documents: UEM ASIC Specification, UPP8M_V1
ASIC Specification. The baseband module also contains an audio amplifier for MIDI support and a 64-Mbit Flash/ 4-Mbit SRAM combo IC. EMC shielding is implemented using a
metallized plastic frame. On the other side, the engine is shielded with PWB ground
openings. Heat generated by the circuitry will be conducted out via the PWB ground
planes. The RH-25 transceiver module is implemented on six layer FR-4 material PWB.
Figure 1 shows a high level BB block diagram for RH-25 phone.
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CCS Technical Documentation System Module
LCD
Passive color STN
color display
Led Driver
Keyboard &
display
illumination
ACO RF Module
Combo Memory
64Mbit
Flash/4Mbit SRAM
Keyboard
UEM
Ext Audio
UPP
(UI Module)
Connector
IrDa
Battery
1.8V
ibra
Accessory
Regulator
2.8V 70mA
Charger
jack
Functional Description
Modes of Operation
The RH-25 baseband engine has five different operating modes:
1 No supply
2Acting Dead
3Active
Audio Amp
IHF
DC
Figure 1: RH-25 baseband block diagram
System connector
Tomahawk
4 Sleep
5 Charging
No Supply Mode
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the disconnection of main battery or low battery voltage level. The phone will exit from
NO_SUPPLY mode when a sufficient battery voltage level is detected. The battery voltage
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System Module CCS Technical Documentation
can rise either by connecting a new battery with VBAT > VMSTR+, or by connecting
charger and charging the battery voltage to above VMSTR+.
Acting DEAD Mode
If the phone powered off when the charger is connected, the phone is powered on and
enters a state called Acting Dead. In this mode, no RF circuitry is powered up. To the user,
the phone acts as if it is switched off. The phone issues a battery-charging alert and/or
shows a battery charging indication on the display to acknowledge to the user that the
battery is being charged.
Active Mode
In active mode, the phone is in normal operation, scanning for channels, listening to a
base station, transmitting and processing information. There are several sub-states in the
active mode depending on if the phone is in burst reception, burst transmission, etc. In
active mode, SW controls the RF regulators by writing the correct values into the UEM
control registers. VR1A/B can be enabled or disabled. VR2 can be enabled or disabled.
VR4 - VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is
always enabled in active mode.
Sleep Mode
The phone enters Sleep mode when both MCU and DSP are in stand-by mode. Both processors control sleep. When the SLEEPX low signal is detected, the UEM enters SLEEP
mode. In this mode, the VCORE, VIO and VFLASH1 regulators are put into low quiescent
current mode. All RF regulators — with the exception of VR2 and VR3 — are disabled in
sleep mode. When the SLEEPX is set high and is detected by the UEM, the phone enters
ACTIVE mode and all functions are activated. Sleep mode is exited either by the expiration of a sleep clock counter in the UEM, or by some external interrupt generated by a
charger connection, key press, or headset connection among other things. While in sleep
mode, the main oscillator is shut down and the baseband section uses the 32 kHz sleep
clock oscillator as its reference.
Charging Mode
Charging can be performed in parallel with any other operating mode. The Battery Size
Indicator (BSI) resistor inside the battery pack indicates the battery type/size. The resistor
value corresponds to a specific battery capacity and technology. The UEM's AD converters, under UPP software control, measure the battery voltage, temperature, size, and current. The charging control circuitry (CHACON) inside the UEM controls the charging
current delivered from the charger to the battery. The battery voltage rise is limited by
turning the UEM switch off when the battery voltage has reached VBATLim (programmable charging cut-off limits 3.6V / 5.0V / 5.25V). Measuring the voltage drop across a
0.22Ohm resistor monitors charging current.
RH-25 BB Functional Blocks
RH-25 BB functional blocks are listed below:
• UEM and UPP
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• Battery
• LED Driver
• LCD Display
• RF (TACO) IF Block
• Memory Module
• Keyboard (UI module)
• External Audio Connector
• IrDa Interface
• Vibra
• FM Radio
• System Connector (Tomahawk)
• PWB Strategy
• EMC Strategy
• Test Interface
UEM and UPP
The UEM contains a series of voltage regulators to supply both the baseband module and
the RF module. Both the RF and Baseband modules are supplied with regulated voltages
of 2.78 V and 1.8 V. The UEM contains six linear LDO (low drop-out) regulators for Baseband and seven regulators for RF circuitry. RF regulator VR1 uses two LDOs and a charge
pump. VR1 regulator is used by TACO RF module. The core of the UPP is supplied with a
programmable voltage of 1.0 V, 1.3 V, 1.5 V, or 1.8 V. It should be noted that with UEMK,
VCORE supply voltage is set to 1.5 V. UEMC will support VCORE voltage below 1.5V.
The UPP operates from a 19.44MHz clock generated in the RF ASIC TACO. The DSP and
MCU both contain phase locked loop (PLL) clock multipliers, which can multiply the system frequency by factors from 0.25 to 31. The actual execution speed is limited by the
memory configuration and process size (Max. DSP speed for C035 is ~ 200MHz).
The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator.
The 32768 Hz clock is used by UPP as the sleep clock.
The communication between the UEM and the UPP is done via the bi-directional serial
busses, CBUS and DBus. The CBUS is controlled by the MCU and operates at a speed of
1.08 MHz. The DBus is controlled by the DSP and operates at a speed of 13 MHz. Both
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processors are located in the UPP.
The interface between baseband and RF is implemented in the UEM and UPP ASIC. The
UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths. It also provides A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEM supplies the analog signals to RF
section according to the UPP DSP digital control. The RF ASIC, TACO, is controlled via the
UPP RFBUS serial interface. There are also separate signals for PDM coded audio. Digital
speech processing is handled by the DSP inside the UPP ASIC. The UEM is a dual voltage
circuit with the digital parts running from the baseband supply (1.8V) and the analog
parts running from the analog supply of 2.78V. The input battery voltage (VBAT) is also
used directly by some UEM blocks.
The baseband supports both internal and external microphone inputs as well as speaker
outputs. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP. Keypad tones, DTMF, and other audio tones
are generated and encoded by the UPP and transmitted to the UEM for decoding. RH-25
has two external serial control interfaces: FBUS and MBUS provided by UEM. These busses can be accessed only through production test patterns.
Battery
RH-25 uses UPP8Mv2.4 and UEMK, with provision to use UEMC and future releases of
UPP as it becomes necessary. UEMC requires some software changes.
BLD-3 Li-ion (inbox battery) is used as main power source for RH-25. No other battery
packs are planned to be used. BLD-3 has the capacity of 780 mAh.
Table 1: BLD-3 characteristics
Description Value
Nominal discharge cut-off voltage 3.1V
Nominal battery voltage 3.7V
Nominal charging voltage 4.2V
Maximum charger output current 850mA
Minimum charger output current 200mA
Cell pack impedance -20 ... 0
Cell pack impedance 0 ... +20
Cell pack impedance +20 ...+60
o
o
C
C
o
C
180mΩ max
150mΩ max
130mΩ max
Cell pack impedance +60 ...+80
o
C
250mΩ max
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CCS Technical Documentation System Module
Table 2: Pin numbering of battery pack
Signal name Pin number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the
battery pack)
BTEMP 3 Battery temperature measurement (measured by ntc
resistor inside pack)
GND 4 Negative/common battery terminal
ge
Char
4(GND)
3(BTEMP)
Figure 2: Battery pack contacts
2(BSI)
GND
The BSI fixed resistor value indicates type and default capacity of a battery. NTC-resistor
measures the battery temperature.
Temperature and capacity information is needed for charge control. These resistors are
connected to BSI and BTEMP pins of battery connector. Phone has 100 kW pull-up resistors for these lines so that they can be read by A/D inputs in the phone. It should be
o
noted that the phone software will shut the phone off if it senses temperature of 38
C or
higher on BTEMP line for safety reasons.
Table 3: BSI resistor values
Parameter Min Typ Max Unit Notes
Battery size indicator resistor BSI 75 kΩ Battery size indicator (BLD-3)
Tolerance “1%
NTC thermistor BTEMP 47
4000
kΩ
K
Battery temperature indicator (NTC pulldown) 47kΩ“5%
o
@ 25
C
Beta value (B).
Tolerance “5%, 25
o
C / 85 oC
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System Module CCS Technical Documentation
VBATT
BTEMP
Supply Voltage Regulation
The UEM ASIC controls supply voltage regulation. There are six separate regulators used
by baseband block. For more detailed description about the regulator parameters see the
document UEM ASIC Specification.
Charging
RH-25 baseband supports the NMP charger interface specified in the document Janette
Charger interface, SW control is specified in EM SW Specification, ISA EM Core SW
Project. The UEM ASIC controls charging, and external components are used to provide
EMC, reverse polarity, and transient protection of the charger input to the baseband
module. The charger connection is through the system connector interface. Both 2- and
3-wire type chargers are supported. The operation of the charging circuit has been specified to limit the power dissipation across the charge switch and to ensure safe operation
in all modes.
BSI
EMC
Figure 3: Interconnection diagram
Li-Ion
Overcharge /
Overdischarge
protection
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UEM
CHAR
VCHARin
Over
Temp.
Detection
WatchDog
VCHARout
Switch
Driver
Ctrl
Logic
Comp
Vmstr
Current
Sensing/
Limit
+
-
VBATT
VBATTlim
VBATT
Charger Detection
Connecting a charger creates voltage on the VCHAR input to the UEM. When the VCHAR
input voltage level rises above the VCHDET+ threshold, the UEM starts the charging process. VCHARDET signal is generated to indicate the presence of the charger for the SW.
Energy Management (EM) SW controls the charger identification and acceptance.
The charger recognition is initiated when the EM SW receives a "charger connected"
interrupt. The algorithm basically consists of the following three steps:
1 Check that the charger output (voltage and current) is within safety limits.
2 Identify the charger.
3 Check that the charger is within the charger window.
If the charger is identified and accepted, the appropriate charging algorithm is initiated.
Charger Interface Protection
In order to ensure safe operation with all chargers and in mis-use situations, charger
Figure 4: UEM charging circuitry
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RH-25
System Module CCS Technical Documentation
interface is protected using transient voltage suppressor (TVS) and 1.5A fuse. The TVS
device used in RH-25 is rated for 16V@175W.
Figure 5: Charger interface TVS characteristics
Breakdown voltage (VBR) 17.8Vmin (at IT 1.0mA)
Reverse standoff voltage (VR) 1 6V
Max reverse leakage current at VR (IR)5uA
Max peak impulse current (Ipp) 7A (at Ta=25*C, current waveform: 10/1000us)
Max clamping voltage at Ipp (Vc) 26V
LED Driver Circuit
In RH-25, white LEDs are used for LCD and keypad lighting. Two LED are used for LCD
lighting and six for keyboard. A step-up DC-DC converter (TK11851) is used as white LED
driver.
The display LEDs are driven in serial mode to achieve stable backlight quality. This means
that constant current flow through LCD LEDs. Serial resistance Rlcd is used to define the
proper current. The feedback signal, FB, is used to control the current. Driver will increase
or decrease the output voltage for LEDs to keep the current stable.
Keyboard LEDs are driven in 2-serial/3 parallel modes. Serial resistance R is used to limit
the current through LEDs. The feedback signal, FB, is not used to control the current.
Driver is controlled by the UEM via DLIGHT output. This signal is connected to driver ENpin (on/off). It is possible to control the LED brightness by PWM to achieve smooth on/off
operation.
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