RH-25 is a handportable dual band TDMA and AMPS DCT-4 generation phone for the
smart classic segment.
The RH-25 Baseband consists of the DCT4 common Baseband chipset having some product-specific blocks of its own, such as pop-port system connector (also unofficially
known as "Tomahawk"), IHF, IrDA, and a color display.
The Baseband engine consists basically of two major ASICs:
•Universal Energy Management IC (UEM), including the analog audio circuits, the
charge control, and the voltage regulators.
•Universal Phone Processor (UPP), containing DSP, MCU, and some internal memory.
Baseband Block Diagram
The system block diagram below shows the main BB functional blocks.
Following voltages are assumed as normal and extreme voltages for the BLD-3 battery
used in RH-25:
•Nominal voltage: 3.6 V
•Lower extreme voltage:3.1 V
•Higher extreme voltage (fast charging):4.4 V
Temperature Conditions
Operational temperature range (all specifications met within this range)
-10°C..+55°C
Functional temperature range (Reduced performance)-30°C..+70°C
Storage temperature range:-30°C..+85°C
Humidity
Relative humidity range is 5...95%.
The Baseband module is not protected against water. Condensed or splashed water may
cause interim or permanent phone malfunction.
Submergence of the phone in water will likely cause permanent damage to the phone.
Frequencies in Baseband
There are several clock frequencies at the baseband part. The following table lists all
available frequencies. The asynchronous and diagnostic busses are not included.
RH-25 supports data connectivity via an infrared link. An IR module is integrated into
the phone, connected to the IR interface of the UPP ASIC.
Energy Management
The energy management of RH-25 is based on BB 4.0 architecture. A semi-fixed battery
(BLD-3) supplies power primarily to UEM ASIC and the RF PA. UEM includes several regulators to supply RF and baseband. It provides the energy management including power
up/down procedure.
Power Supply Modes
The functional behavior of the UEM can be divided into seven different states. Since the
UEM controls the regulated power distribution of the phone, each of these states affects
the general functionality of the phone:
•No supply
•Backup
•Power off
•Reset
•Power on
•Sleep
•Protection
The different states of the UEM are detailed in the sections below.
No Supply
In the NO_SUPPLY mode, the UEM has no supply voltage (VBAT < V
V_BU
tery are either disconnected or both discharged to a low voltage level.
The UEM will recover from NO_SUPPLY into RESET mode if the VBAT voltage level rises
above the V
Backup
In BACK_UP mode the main battery is either disconnected or has a low voltage level
(VBAT < V
and VBACK <
MSTR
). This mode is due to the fact that both the main battery and the backup bat-
COFF-
level by either reconnecting the main battery or charge it to such level.
MSTR+
and VBACK > V_BU
MSTR-
COFF+
).
The regulator VRTC that supplies the real-time clock is disabled in BACK_UP mode.
Instead the unregulated backup battery voltage VBACK supplies the output of the VRTC.
All other regulators are disabled and the phone has no functionality.
The UEM will recover from BACK_UP mode into RESET mode if VBAT rises above V
MSTR+
Power Off
In order for the UEM to be in PWR_OFF mode, it must have supply voltage (VBAT >
V
The regulator VRTC regulator is enabled and supplying the RTC within the UEM. The UEM
will enter RESET mode after a 20 ms delay whenever one of the below listed conditions is
logically true:
•The power button is activated
•Charger connection is detected
•RTC alarm is detected
The UEM will enter PWR_OFF from all other modes except NO_SUPPLY and BACK_UP if
the internal watchdog elapses.
Reset
When the UEM enters RESET mode from PWR_OFF mode, the watchdog is enabled. If the
VBAT fails to rise above the power-up voltage level V
(3.1 V) before the watchdog
COFF+
elapses, the UEM will enter PWR_OFF mode. Otherwise, after a 200 ms delay, the regulator VFLASH1 will be enabled and after an additional delay of 500 µs, the regulators
VANA, VIO, VCORE, and VR3 will be enabled. All other regulators( i.e., VFLASH2, VSIM,
VR1, VR2, and VR4 - VR7) are software controlled and disabled by default. After an additional delay of 20 ms, the UEM enters PWR_ON mode.
Power On
In PWR_ON, the UEM is fully functional in the sense that all internal circuits are powered up or can be by means of software. The UEM will enter PWR_OFF mode if VBAT
drops below V
enter PWR_OFF mode if either of the watchdogs Operational State Machine (approx. 100
µs), Security (32 sec.), or Power Key (4 sec.) elapses or if any of the regulators trigger the
thermal protection circuitry
Sleep
The UEM can be forced into SLEEP mode by the UPP by setting the input SLEEPX low for
more than 60 µs. This state is entered when the external UPP activity is low (phone in
sleep) and thereby lowering the internal current consumption of the UEM. The regulator
VANA is disabled and VR1 - VR7 are either disabled or in low quiescent mode.
From SLEEP the UEM enters PWR_ON if SLEEPX goes high, PWR_OFF mode if watchdog
elapses or BACK_UP mode if VBAT drops below V
Protection Mode
The UEM has two separate protection limits for over temperature conditions: one for the
charging switch and one for the regulators. The temperature circuitry measures the onchip temperature. In case of charging over temperature, the circuit turns the charging
switch off. In case of over temperature in any of the regulators, the UEM powers off.
for a period of time longer than 5 µs. The UEM will furthermore
COOF-
.
MSTR-
Battery BLD-3
RH-25 uses the BLD-3 Li-ion battery with a capacity of 780mAh. BLD-3 is a case-less
battery; the main advantage of a case-less battery type is the overall size, particularly
the thickness and the number of contact terminals.
BLD-3 has a four-pin connector. BSI resistor value is 75Kohm.
Power Distribution
Under normal conditions, the battery powers the baseband module. Individual regulators
located within the UEM regulate the battery voltage VBAT. These regulators supply the
different parts of the phone. Eight regulators are dedicated to the RF module of the
phone, and six to the baseband module.
The regulator VCORE is likewise adjustable and controlled by registers written by the
MCU. VCORE supplies the core of the UPP and can be adjusted on the fly by the MCU if
DSP capacity is inadequate. Higher VCORE supply (1.8 V) results in faster core operations
in the UPP.
Regulators VANA, VFLASH1, and VIO are solely controlled by the UEM and cannot be
enabled or disabled by the MCU. Furthermore, VFLASH1 and VIO are both ON, though in
low quiescent mode when phone is in sleep mode. An output current of 500 µA can be
drawn from the regulators. VIO supplies the UPP, FLASH and LCD, VFLASH1 supplies LCD
and the IrDA module. VANA is supplying analog parts internally in the UEM as well as the
baseband audio circuitry and pull-up resistors on the input of the UEM slow AD converters.
System connector provides a voltage to supply accessories. The white LED's need a higher
voltage supply as the battery can provide in bad condition. Separate external regulators
supply both consumers.
The regulators VR1A, VR1B, VR2 - VR7 and IPA1 - IPA4 are controlled by the DSP via
the DBus. VR4 - VR7 are controlled by the UEM as well and are disabled in sleep regardless of DSP writings.
VBAT/VBATTRF is furthermore distributed, unregulated, to the RF power amplifier, audio
power amplifier and external baseband regulators.
The CHACON module in the UEM controls the charging of the main battery. Furthermore
it contains a 3.2 Vdc regulator for charging of the backup battery and a 1.8 Vdc regulator
supplying the internal real time clock.
1The second current value indicates the maximum possible output current of the
regulator when in low quiescent mode.
2The output voltages are split into two different current categories. The upper part
is the lower range of output current, and the lower part is the higher range of
output current.
3Condition in sleep-mode depends on MCU writings to UEM regulator register
solely.
4Condition in sleep-mode depends on DSP writings to UEM register.
When the accessory regulator, N100, is active, it will turn Vout ON (2.8V) and provide
70mA current.
Audio Circuitry
This section describes the audio-HW inside the Baseband. (External audio components
and acoustics are not considered with the details in this section.)
The main topology comes from other phones using BB4.0 engine, where the audio-HW is
mostly integrated into the UEM-ASIC. The biggest difference is that RH-25 has integrated hands-free (IHF).
RH-25 uses an earpiece, which is also referred to as a PICO speaker. This is a 32 ohm
speaker with the diameter of 8 mm.
Earpiece is fed by the differential signals EARP and EARN from UEM. The signals run
quite directly from UEM to the earpiece, only some passive ands EMC protection components are needed
The external earpiece signals are fed by the HF and HFCM pins.
The level (swing) of earpiece-signals can be adjusted by register values inside UEM. These
signals have a common voltage level of 1.35 V (0.8 V for HF) at UEM pins.
Microphones
An EMC-improved type of microphone is used as internal microphone in RH-25, diameter
of which is 2.2mm.
Internal microphone circuitry is driven single-ended. Microphone needs bias voltage,
which is provided by UEM and is fed through a resistor to the microphone. A resistor is
also needed to the other side of the microphone, (i.e., between microphone and GND), in
order to provide the differential signals to UEM. Audio signals are AC-coupled from the
microphone.
For the external microphone a differential input is used.
MIC1N and MIC1P (audio signals) and MICB1 (bias voltage) are used for the internal
microphone. MIC2N and MIC2P and MICB2 are used for external microphone.
Integrated Hands-free (IHF)
The speaker used for IHF is a 16 mm diameter speaker with 8 Ohm impedance, also
known as a MALT speaker.
IHF circuitry uses differential outputs from UEM.
Depending on the audio mode, the IHF amplifier is driven either from UEM HF / HFCM or
XEAR audio outputs. The IHF audio power amplifier (APA) LM4855 has a bridge-tied-load
(BTL) output in order to get the maximum use of supply voltage. The supply voltage for
driving circuitry of speaker is VBAT, thus the swing across the speaker is (VBAT.
The shutdown of the IHF PA is controlled by UPP using GENIO14.
Audio Accessory Receive Path
In RH-25, the accessory receive path is directly driven from UEM HF / HFCM differential
audio outputs, the output signal complies with the Pop-port accessory interface.
For EMC protection, ferrites are connected in series to the earpiece; for ESD protection,
varistors are used.
Audio Control Signals
The HEADINT signal is needed for recognizing the external device (e.g., headset) connected to the system. The recognition is based on the ACI-pin on the system connector,
which is shorted to ground inside the external device.
The button of the external device generates HOOKINT. This is used to answer or to end a
phone call.
Acoustics
Earpiece Acoustic
RH-25 uses the PICO 8mm earpiece.
This earpiece is mounted into the UI-shield assembly, the sealing of the front volume is
achieved using a foam gasket mounted on the front of the speaker. The UI shield is sealed
using a rubber sealing between UI shield and A-cover to create an acoustic path.
IHF Speaker Acoustics
The MALT speaker is used in RH-25 for integrated hands-free and ringing tone applications.
The IHF speaker is mounted to the IHF enclosure on a foam sealing ring. The IHF enclo-
sure provides the needed back volume for the speaker. The IHF enclosure is closed with
the IHF lid, which is carrying the IHF pins to contact the IHF speaker.
The sealing of the effective acoustic volumes is achieved using ultrasonic welding to
bond the IHF lid and the IHF enclosure permanently.
To provide long-term reliability, additionally the IHF lid is heat stacked to the IHF enclosure. There is a dust membrane mounted inside the acoustic chamber that provides dust
and drop protection.
Due to ultrasonic welding of the IHF enclosure, it cannot be disassembled and, in case of
failure, the C-cover assembly should be replaced as one complete assembly.
Microphone Acoustics
A standard microphone module is used. This module is embedded into a rubber boot and
connected to the RH-25 system module by spring contacts.
The microphone is placed close to the system connector. The sound port of the microphone is located towards the bottom of the phone.
Vibra Motor
A vibrating alerting device is used to generate a vibration signal for an incoming call.
This vibra is located in the bottom section of the phone.
The vibrator is driven by the UEM output VIBRA, and controlled with a PWM signal. The
supply of the vibra is taken from the battery voltage of the phone.
Audio Modes
The following audio configurations can create the audio modes:
•Handportable
•Integrated hands-free
•Headset
•Loop set
•External hands-free
The following audio sources have to be routed according to the active audio mode:
•Speech
•Ringing tones / SMS tones
•Keypad tones
•Error tones / Warning tones
•Game tones
Handportable Mode
In handportable mode, earpiece path and internal microphone path are in use. The audio
sources are routed according to the following table:
In loop set mode, accessory receive path and accessory transmit path are used. RH-25
supports the loop set LPS-4.:
Table 6: Loop set mode audio routing
Audio SourceEarpiece
SpeechXX
Ringing tones, SMS tonesXX
Keypad tonesX
Warning/Error tonesX
Game tonesX
Internal
Microphone
IHF speaker
Accessory
receive path
External Hands-free Audio Mode
In external hands-free mode, accessory receive path and accessory transmit path are
used. RH-25 supports external hands-free accessories:
BHF-1:Basic car hands-free kit
Table 7: External hands-free mode audio routing
Audio SourceEarpiece
SpeechXX
Internal
Microphone
IHF speaker
Accessory
receive path
Accessory
transmit path
Accessory
transmit path
Ringing tones, SMS tonesX
Keypad tonesX
Warning/Error tonesX
Game tonesX
System Connector Interface
System Connector
The system connector in RH-25 is called Pop-Port System Connector (unofficial name:
"Tomahawk"). It is a galvanic interface between phone and accessories.
Compared with previous system connector versions, four new functions are introduced
with the Pop-port system connector interface:
•Accessory Control Interface (ACI)
•Power Out
•Stereo audio output
•Universal Serial Bus (USB).
USB functionality and stereo audio output of the Pop-port are not supported in RH-25.
Pop-port system connector is mechanically and electrically not backward-compatible
with any earlier Nokia accessory interfaces, except the charger connector.
ACI
Vout
Charge
Charge GND
Shielding GND
Fbus TX
Fbus RX
XMIC N
XMIC P
DATA GND
HSEAR_L_P
HSEAR_L_N
HSEAR_R_N
Figure 4: Tomahawk (Pop-port) system connector
Table 8: Tomahawk system connector interface description
Pin #SignalNotes
1VCHARCharger input line
2GNDCharge ground
3ACIInsertion and removal detection/ Serial data bi-
directional 1 kbit/s
4VoutAccessory power supply
5Not used in RH-25
6FBUS_RXSerial data from accessory to phone / 115 kbit/s
7FBUS_TXSerial data from phone to accessory / 115 kbit/s
HSEAR_R_P
Shielding GND
8GNDData ground
9XMIC NNegative audio in signal
10XMIC PPositive audio in signal
11HSEAR_L_NNegative left channel audio out signal
12HSEAR_L_PPositive left channel audio out signal
13HSEAR_R_NNegative right channel audio out signal
14HSEAR_R_PPositive right channel audio out signal
Accessory Control Interface (ACI)
ACI is a point-to-point, master-slave, and bi-directional serial bus. It has three features:
•The insertion and removal detection of an accessory device
•Acting as a data bus, intended mainly for control purposes
•The identification and authentication of accessory type which is connected
The accessories are detected by the HeadInt signal when the plug is inserted.
Normally when no plug is present, the pull-up resistor 100k pulls up the HeadInt signal
to VFLASH1. If the accessory is inserted, the external insertion and removal resistor
works as voltage divider and decreases the voltage level below the threshold Vhead.
The comparator output will be changed to high state causing an interrupt.
If the plug is removed, the voltage level of HeadInt increases again to VFLASH1. This
voltage level is higher than the threshold of the comparator and therefore its output will
be changed to low. This change leads to an interrupt. These HeadInt interrupts initiate
the accessory detection or removal sequence.
If no accessory is inserted / connected, the only active part on the Pop-port interface is
the ACI line.
ACI Accessor
Insertion &
Removal
detection
56
Data
GND
Accessory
Detect
VFLASH1
VFLASH1
4k7
UEM
HookInt
-
Vhea
MBUS
HeadIn
VFLASH1
47R47R
ProdTP7
PHONE
100
ACI
ChargeGND
VBAT
Voltage
en
ulato
Re
UPP
GenIo(0
Figure 5: Principle schematics of ACI accessory and engine
Signal flow on ACI line - ACI-ASIC accessory inserted
1. Accessory is connected (insertion and removal resistor connect to ACI line)
1a) Phone gets HeadInt interrupt after 20ms check that ACI line is still low (<Vhead min)
2. Connect MBUS with HeadInt line (MBUS switch)
2a) If the phone detects a HeadInt interrupt from low to high transition in 20ms time-
frame, then an advanced accessory is connected
3. ACI chip reset (3000- 4000us)
4. Power up delay (50-400us)
5. Start bit (50us)
Vou
ACI
ASIC
VCC
6. Learning sequence (567-1700us)
7. ACI communication
8. MBUS is disconnected from HeadInt line (MBUS switch). After every communication.
9. Accessory is removed (no insertion and removal resistor on ACI line) --> phone gets
HeadInt interrupt from ACI line low to high transition.
9a) If no HeadInt interrupt comes in the next 100ms, the accessory is really removed and
the phone goes in the state "no accessory".
Table 9: Voltage levels
SignalMinTypMaxUnitNotes
V
FLASH1
V
head
Specified val-
2.72.782.86V
1.751.92.05V
MinTypMaxUnit
ues for levels
V
act_detect
0.831.13VVoltage level if MBUS not connected to HeadInt
(MBUS switch open), but ACI accessory is
inserted.
V
V
high
low
2.452.71VVoltage level after MBUS connected to HeadInt
<0.22*VDDV
Signal flow on ACI line - Non ACI-ASIC accessory inserted
V
headInt
V
FLASH1
V
head_min
1
20ms
2
1
a
V
low
3
Mono Headset is
recognized.
3
a
4
a
4
FBUS
Figure 6: Signal flow on ACI Line
1. Accessory is connected (insertion and removal resistor connect to ACI line)
1a) Phone gets HeadInt interrupt after 20ms check that ACI line is still low (<Vhead min)
2. Connect MBUS with HeadInt line (MBUS switch)
3. The 20 ms timer elapsed and no transition has been on HeadInt line
3a) Disconnect MBUS from HeadInt line
4. Accessory is removed. Phone gets HeadInt interrupt from ACI line low to high transition.
4a) If no HeadInt interrupt comes in the next 100ms, the accessory is really removed.
FBUS is an asynchronous data bus with separate TX and RX signals. Default bit rate of
the bus is 115.2 Kbit/s.
FBUS is used as additional communication channel from phone to accessory and vice
versa. There are two types of accessories which it uses:
From HW-point of view, this does not make any difference.
Table 10: FBUS interface
SignalParameterMinTypMaxUnit
FBUS_RXV
FBUX_TXV
IH
V
IL
OH
V
OL
VOUT (Accessory Voltage Regulator)
DCT4 chip set does not provide and power supply for accessories. To enable this, an
external LDO regulator is needed. This regulator is called Accessory Regulator.
The regulator input is connected directly to battery voltage (VBAT) and the output to
VOUT pin at system connector. The regulator is controlled by the GENIO(0) line of UPP.
With this signal, the regulator can be switched on and off.
The regulator can be supply up to150 mA. (Note: this exceeds the Pop-port minimum
requirement.)
VBAT
UPP
GenIO(0)
1.952.783.0Vout
00.20.83
1.952.782.83
00.20.83
Tomahawk
bottom connector
Voltage
regulator
En
LP3985
VOUT
0.9R
DC resistance of ferrite
+ impedance of line and connector
Figure 7: Accessory power supply diagram
Table 11: Accessories power supply
SignalMinNomMaxUnitNote
Vout2.63
2.56
GenIO(0)1.41.88
2.802.88VI = 70mA
Imax = 150mA
0.6VHigh (ON)
0.6
Low (OFF)
The pull-down resistor on the enable input of the regulator is needed because in the
switch-off mode of the phone, the output level of the Genio(0) is not defined. Without
this resistor the output of the regulator can be floating.
RH-25 supports fully differential external audio signals. A headset can be connected to
the Pop-port system connector. However, only Mono audio is supplied to accessories.
HookInt
This signal is used to detect whether a button in accessory is pressed or not. The hook
signal is generated by creating a short circuit (20 ohm) between the headset microphone
signals (XMICP and XMICN). In this case, an LP-filter is needed on the HookInt input to
filter the audio signal.
If no accessory is present, the HookInt signal is pulled up by the UEM resistor.
If an accessory is inserted and the microphone path is biased, the HookInt signal
decreases to 1.9V due to the microphone bias current flowing through the resistor. When
the button is pressed, the microphone signals are connected together, and the HookInt
input will get half of micbias dc value 1.1V. This change in DC level will cause the HookInt comparator output to change state, in this case from 0 to 1.
HookInt comparator reference is selected level is 1.35 V.
Normally micbias and hookint are enabled only when audios are routed to headset.
In order to recognize the Hook signal (button in headset or SyncButton in deskstand),
when the phone is in the sleep mode, it must be done by polling. That means the micbias
and the hookInt signal must be enabled in regular time intervals.
Charging
RH-25 can be charged via a DC-plug or charging pins on the system connector. It supports only 2-wire charging.
Table 12: Voltage levels Hook Int
SignalMinNomMaxUnit
VFLASH12.72.782.86V
MICB22.02.12.25
600
Vhook11.251.351.45V
V
uA
DC-Plug
RH-25 uses a 3.5mm DC-plug. It is possible to use a 3-wire charger, but the PWM inside
these chargers is not supported.
VCHAR Pins of System Connector
The VCHAR and ChargeGND pin are directly connected to the normal charger lines of the
1The phone communicates with the prommer via the production test pattern,
using the following signals:
• FBUSTX (serial data to phone)
• FBUSRX (serial data from phone)
• MBUS (serial clock for FBUSRX)
• VPP (external flashing voltage for speed up flashing)
• The BSI line also is used when initializing flashing (battery connector)
2When the phone is powered (VBAT>3V), the MBUS and FBUSTX lines are pulled
up internally by the phone.
3The prommer sends a command to the UEM, using FBUSRX, to enter the Flash
mode. During the sending of this command, the prommer keeps the BSI line high
and MBUS is used as a serial clock.
4When the Flash mode command is acknowledged, UEM enters the Flash mode
and releases reset (PURX) to MCU.
5After reset is released, UPP checks if there is a request for the Bootstrap code
that resides in the UPP ROM.
6The request for Bootstrap is the MBUS pulled down by the prommer (if the boot-
strap is not requested, the bootstrap code jumps to FLASH SW).
7If the Bootstrap code is requested, UPP enters the Flash mode and sets FBusTX to
‘0’ as an acknowledgement to the prommer. This is an indication that UPP can
run, at least, the fixed Bootstrap code — although it is not able to run the FLASH
code. UPP then sends an UPP ID to the prommer via the FBUSTX line.
8After the prommer has received the UPP ID, it sends a corresponding Secondary
Boot Code to the phone via FBUSRX. The Secondary Boot Code, when run in UPP,
requests UPP to send information to the prommer about the flash type and other
HW-related parameters about the device to be flashed.
9The prommer then sends the Algorithm Code corresponding to the HW parame-
ters, and this algorithm, when run in UPP, takes over handling the MCUSW transfer to Flash.
10 To speed up flashing, 12 volts can be supplied to Vpp (by the prommer).