Nokia 6510 Service manual

Programs After Market Services (PAMS)

Technical Documentation





NMP Part No.0275557

NPM–9

SERIES CELLULAR

PHONES

– NOKIA 6510 –

NPM–9 issue 1: 02/2002

Copyright 2001. Nokia Corporation. All Rights Reserved.

NPM–9

Foreword

PAMS Technical Documentation

AMENDMENT RECORD SHEET

Amendment Date Inserted By Comments

02/2002 OJuntunen First issue.

Page 2

 Nokia Corporation.

Issue 1 02/2002

PAMS Technical Documentation

SERIES CELLULAR PHONES

SERVICE MANUAL

CONTENTS:

1. Foreword

2. General Information

3. System & UI Module

4. Part lists

5. Product Variants

NPM–9

Foreword

NPM–9

6. Service Software & Concepts

7. Service Tools

8. Disassembly Instructions

9. Troubleshooting Instructions

10. Accessories (Non–serviceable)

11. CARK132 Installation Guide

12. Schematic Diagrams

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 Nokia Corporation.

Page 3

NPM–9

Foreword

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will
be included with service bulletins.

While every endeavour has been made to ensure the accuracy of this document,
some errors may exist. If any errors are found by the reader, NOKIA Corporation
should be notified in writing.

Please state:

Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error

PAMS Technical Documentation

IMPORTANT

Please send to: Nokia Corporation

NMP
PAMS Technical Documentation
PO Box 86
24101 SALO
Finland

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Issue 1 02/2002

PAMS Technical Documentation

Warnings and Cautions

Please refer to the phone’s user guide for instructions relating to operation,
care and maintenance including important safety information. Note also the
following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES
FITTED WITH ELECTRONIC ENGINE MANAGEMENT
SYSTEMS AND ANTI–SKID BRAKING SYSTEMS. UNDER
CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE
VEHICLE DEALER/MANUFACTURER TO DETERMINE THE
IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF
ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED
IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE
ATMOSPHERES EG PETROL STATIONS (SERVICE STATIONS),
BLASTING AREAS ETC.

NPM–9

Foreword

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT,

Cautions:

1. Servicing and alignment must be undertaken by qualified

2. Ensure all work is carried out at an anti–static workstation and that

3. Ensure solder, wire, or foreign matter does not enter the telephone

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulators are

INCLUDING CELLULAR TELEPHONES, MAY INTERFERE WITH
THE FUNCTIONALITY OF INADEQUATELY PROTECTED
MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE
ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.

personnel only.

an anti–static wrist strap is worn.

as damage may result.

correctly re–fitted after servicing and alignment. Ensure all cables
and wires are repositioned correctly.

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 Nokia Corporation.

Page 5

NPM–9

Foreword

ESD Protection

Nokia requires that phone repair places have sufficient ESD protection
(against static electricity) when servicing cellular phones.

A cellular phone, which is ready for use, can be handled normally without
ESD protection. The SIM card and battery can be replaced in normal
conditions of use.

To replace the color cover ESD protection must be applied, except for the
phone covers which can be replaced by the customer.

All electronic parts of the phone , including the display, are susceptible to
ESD. Resistors, too, can be damaged by static electricity discharge.

PAMS Technical Documentation

All ESD sensitive parts must be packed in metallized protective bags during
shipping and handling outside any ESD Protected Area (EPA).

Every repair action involving opening the phone or handling the phone
components must be done under ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an
EPA.

For more detailed information about ESD protection and EPA, contact your
local Nokia After Market Services representative.

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Issue 1 02/2002

PAMS Technical Documentation

NPM–9 Series Transceivers

General Information

Issue 1 02/2002  Nokia Corporation

NPM–9
General Information

PAMS Technical Documentation

CONTENTS

The Product 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Handportable 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Desktop Option 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Full Car Kit CARK132 Option 5. . . . . . . . . . . . . . . . . . . . . . . . . .

Product and Module List 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General Specifications of Transceiver NPM–9 7. . . . . . . . . . . . . .

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Issue 1 02/2002

PAMS Technical Documentation

The Product

The NPM–9 is a dual band handportable mobile telephone for the
E–GSM 900 and GSM1800 networks. It is both GSM900 phase 2 power
class 4 transceiver (2W) and GSM1800 power class 1 (1W) transceiver.

The main transceiver features are:
– Integrated FM radio – Full graphic display

– GPRS – Integrated IR link & internal data
– Internal vibra – Plug & play HF support
– Plug–in SIM card below the back cover of the phone
– Back mounted antenna (no connection for external antenna)
– Jack style UI with two soft keys

Handportable

NPM–9

General Information

2.

HDD–1

1.

NPM–9

3.

ACP–7E

Item Name: Type code:

4.

ACP–7C
ACP–7U

5.

ACP–7H
ACP–7X

6.

ACP–7A

1. Transceiver See Product Variants
Standard battery Li–ion BLB–2

2. Headset HDD–1

3. Standard Charger

(Euro plug) 207–253 Vac ACP–7E

4. Standard Charger (US plug) 108–132 Vac ACP–7U
Standard Charger (US plug) 198–242 Vac ACP–7C

5. Standard Charger (UK plug) 207–253 Vac ACP–7X
Standard Charger

6. Standard Charger

Issue 1 02/2002

(UK plug) 180–220 Vac ACP–7H
(Australia) 216–264 Vac ACP–7A

 Nokia Corporation

Page 3

NPM–9
General Information

Desktop Option

The desktop option allows the user to charge the phone from the mains.
Besides these optional chargers also ACP–7 can be used.

1.

NPM–9

ACP–8E

3.

ACP–8K

PAMS Technical Documentation

ACP–8X

4.

5.

ACP–8U
ACP–8C

DCD–1

2.

6.

Item Name: Type code:

1. Transceiver See Product Variants

2. Desk Stand DCD–1

3. Travel Charger

Euro plug 90–264 Vac ACP–8E

Travel Charger Korea plug 90–264 Vac ACP–8K

4. Travel Charger UK plug 90–264 Vac ACP–8X

5. Travel Charger

US plug 90–264 Vac ACP–8U

Travel Charger China plug 90–264 Vac ACP–8C

6. Travel Charger Australia plug 90–264 Vac ACP–8A

ACP–8A

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Issue 1 02/2002

PAMS Technical Documentation

Full Car Kit CARK132 Option

The CARK132 includes the following parts:

Advanced Active Car Holder MCC–5
Advanced HF Unit HFU–5
Power Cable PCH–4J
Mounting Plate MKU–1
Swivel Mount HHS–9
HF Microphone HFM–8
HF Speaker HFS–12

NPM–9

General Information

HHS-9

AMD–2

HFS–12

MCC-5

MKU–1

HFU-5

PCH-4J

HFM-8

Please, note that the items enclosed in broken-line (phone & antenna) are not sup­plied with CARK132. The external antenna AMD–2 is recommended.

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Page 5

NPM–9
General Information

Product and Module List

Unit/type:
NPM–9 Transceiver
BLB–2 Standard Battery Li–ion
ACP–7E Standard Charger (EUR) 207–253 Vac
ACP–7U Standard Charger (US) 108–132 Vac
ACP–7C Standard Charger (US) 198–242 Vac
ACP–7X Standard Charger (UK) 207–253 Vac
ACP–7H Standard Charger (UK) 180–220 Vac
ACP–7A Standard Charger (AUS) 216–264 Vac
ACP–8E Travel Charger (EUR) 90–264 Vac
ACP–8K Travel Charger (Korea) 90–264 Vac
ACP–8X Travel Charger (UK) 90–264 Vac

PAMS Technical Documentation

ACP–8U Travel Charger (US) 90–264 Vac
ACP–8C Travel Charger (China) 90–264 Vac
ACP–8A Travel Charger (Australia) 90–264 Vac
LCH–9 Mobile Charger
PPH–1 Plug–in HF Car Kit
MBD–10 Mobile Holder
MKU–1 Mounting Plate
HHS–9 Swivel Mount
DCD–1 Desktop Stand
DDC–1 Battery Charging Stand
HFM–8 HF Microphone
HDD–1 Headset
HDC–5 Headset
HDE–2 Headset
HDB–5 Boom Headset
LPS–3 Loopset

Page 6

HFU–5 Advanced HF Unit
MCC–5 Advanced Active Car Holder
PCH–4J Power Cable
HFS–12 HF Speaker

 Nokia Corporation

Issue 1 02/2002

PAMS Technical Documentation

General Information

General Specifications of Transceiver NPM–9

Parameter Unit

Cellular system GSM900 and GSM1800
RX frequency band EGSM: 925 ... 935 MHz

GSM900 935 ... 960 MHz
GSM1800 1805 ... 1880 MHz

TX frequency band EGSM 880 ... 890 MHz

GSM900 890 ... 915 MHz
GSM1800 1710 ... 1785 MHz

Output power GSM900 * +5 ...+33 dBm / 3.2 mW ... 2 W

GSM1800 +0 ...+30 dBm / 1.0 mW ... 1 W
Duplex spacing GSM900 * 45 MHz GSM1800 95 MHz
Number of RF channels EGSM 50

GSM900 124

GSM1800 374
Channel spacing 200 kHz

NPM–9

Number of TX power levels GSM900 * 15 GSM1800 16
Sensitivity, static channel GSM900: –102 dBm

GSM1800: –102 dBm (norm. cond. only)
Frequency error, static channel < 0.1 ppm
RMS phase error < 5.0
Peak phase error < 20.0

*) applies also to EGSM

o

o

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NPM–9
General Information

PAMS Technical Documentation

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PAMS Technical Documentation

NPM–9 Series Transceivers

System Module & UI

Issue 1 02/2002  Nokia Corporation

NPM–9
System Module & UI

PAMS Technical Documentation

CONTENTS

Transceiver NPM–9 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Modules 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operation Modes 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interconnection Diagram 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Module LA5 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Baseband Module 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Block Diagram 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Summary 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Characteristics 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Regulators and Supply Voltage Ranges 9. . . . . . . . . . . . .

External and Internal Signals and Connections 10. . . . . . . . .

Internal Signals and Connections 10. . . . . . . . . . . . . . . . . . . . .

FM Radio Interface 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal microphone 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal speaker 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AC and DC Characteristics of RF–BB voltage supplies 12

AC and DC Characteristics of RF–BB digital signals 13. .

AC and DC Characteristics of RF–BB analogue signals 14

External Signals and Connections 15. . . . . . . . . . . . . . . . . . . .

UI (board–to–board) connector 15. . . . . . . . . . . . . . . . . . . .

LCD connector 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC connector 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Headset connector 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM connector 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modes of Operation 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply Voltage Regulation 20. . . . . . . . . . . . . . . . . . . . . . . . . .

Battery 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up and Reset 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A/D Channels 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FM Radio 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IR Module 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Backup Battery 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM Interface 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Buzzer 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Microphone 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UPP 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Memory Block 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Module 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Frequency Plan 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC characteristics 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Regulators 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution Diagram 30. . . . . . . . . . . . . . . . . . . . . . . . . .

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Issue 1 02/2002

NPM–9

PAMS Technical Documentation

RF characteristics 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter characteristics 31. . . . . . . . . . . . . . . . . . . . . . . .

Receiver characteristics 31. . . . . . . . . . . . . . . . . . . . . . . . . .

RF Block Diagram 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Frequency synthesizers 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AFC function 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC–compensation 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UI Board LU9 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LCD & Keypad Illumination 37. . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Speaker 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Schematic Diagrams (at the back of the binder): LA5 layout 01 and LU9 layout 11

RF & BB (Version 0.0 Edit 2) for layout version 01 A–1. . . . . . . . . .

RF (Version 2.0 Edit 2) for layout version 01 A–2. . . . . . . . . . . . . . .

System Module & UI

BB Connections (Version 0.0 Edit 4) for layout version 01 A–3. . . .

System Connector (Version 1.3 Edit 162) for layout version 01 A–4

Audio Interface (Version 1.3 Edit 1) for layout version 01 A–5. . . .

UEM of BB (Version 2.0 Edit 1) for layout version 01 A–6. . . . . . . . .

Light Filtering (Version 2.0 Edit ) for layout version 01 A–7. . . . . .

Display and Keyboard Interface (Version 1.3 Edit 212) for layout version 01A–8
Infrared Module (Version 2.0 Edit 38) for layout version 01 A–9. .

FM Radio (Version 1.3 Edit 110) for layout version 01 A–10. . . . . . .

SIM Reader (Version 1.3 Edit 48) for layout version 01 A–11. . . . . .

UPP and decoupling capacitors (Version 2.0 Edit 91) for layout version 01A–12
Discrete capacitors for UPP (Version 1.3 Edit 10) for layout version 01 A–13
GSM RF – BB Interface (Version 1.3 Edit 35) for layout version 01 A–14

Flash Memory (Version 2.0 Edit 35) for layout version 01 A–15. . . .

Discrete capacitors for memory without VFlash1 (V. 1.3 Edit 10) layout 01A–16
Test pattern – 5 pin (Version 2.0 Edit 12) for layout version 01 A–17

Layout Diagram of LA5 – Top (Version 01) A–18. . . . . . . . . . . . . . . . .

Layout Diagram of LA5 – Bottom (Version 01) A–18. . . . . . . . . . . . . .

Testpoints of LA5 – Top (Version xx) A–19. . . . . . . . . . . . . . . . . . . . . . .

Testpoints of LA5 – Bottom (Version 01) A–19. . . . . . . . . . . . . . . . . . .

UI Board – LU9 for version 11 A–20. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Layout Diagram – LU9 for version 11 A–21. . . . . . . . . . . . . . . . . . . . . .

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NPM–9
System Module & UI

PAMS Technical Documentation

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PAMS Technical Documentation

Transceiver NPM–9

Introduction

The NPM–9 is a dual band radio transceiver unit for the E–GSM900 and

GSM1800 networks. GSM power class is 4 and GSM1800 power class is

1. It is a true 3 V transceiver, with an internal antenna and vibra.

The NPM–9 phone includes integrated FM radio. Radio is used as a nor-

mal mono receiver. FM radio is highly integrated. Only few external com-

ponents are needed. Headset is used as an antenna for radio.

The transceiver has a full graphic display and the user interface is based

on a Jack style UI with two soft keys.

An internal antenna is used, there is no connection to an external anten-

na.

The transceiver has a low leakage tolerant earpiece and an omnidirec-

tional microphone, providing an excellent audio quality. The transceiver

supports a full rate, an enhanced full rate and a half rate speech decod-

ing.

NPM–9

System Module & UI

An integrated IR link provides a connection between two NPM–9 trans-

ceivers or a transceiver and a PC (internal data), or a transceiver and a

printer.

The small SIM ( Subscriber Identity Module ) card is located under the

battery. SIM interface supports both 1.8V and 3V SIM cards.

Electrical Modules

The radio module consists of Radio Frequency (RF) and baseband (BB).

User Interface (UI) contains display, keyboard, IR link, vibra, HF/HS con-

nector and audio parts. UI is divided into radio PWB LA5 and UI PWB

LU9. FM radio is located on the main PWB.

The electrical part of the keyboard is located in separate UI PWB named

LU9. LU9 is connected to radio PWB through spring connectors.

The System blocks provide the MCU, DSP, external memory interface

and digital control functions in UPP ASIC (Universal Phone Processor).

Power supply circuitry, charging, audio processing and RF control hard-

ware are in UEM ASIC (Universal Energy Management).

The purpose of the RF block is to receive and demodulate the radio fre-

quency signal from the base station and to transmit a modulated RF sig-

nal to the base station.

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Page 5

NPM–9
System Module & UI

Operation Modes

The transceiver has six different operation modes:

– power off mode – idle mode

– active mode – charge mode

– local mode – test mode

In the power off mode circuits are powered down and only sleep clock is

running.

In the idle mode only the circuits needed for power up are supplied.

In the active mode all the circuits are supplied with power although some

parts might be in the idle state part of the time.

The charge mode is effective in parallel with all previous modes. The

charge mode itself consists of two different states, i.e. the fast charge and

the maintenance mode.

The local and test modes are used for alignment and testing.

PAMS Technical Documentation

Interconnection Diagram

Keyboard
module

SIM Battery

Radio

Module

LA5

Antenna

Display

Charger

Page 6

MIC

IR Link

 Nokia Corporation

Earpiece

HF

+

FM antenna

Issue 1 02/2002

PAMS Technical Documentation

System Module LA5

Baseband Module

The baseband architecture supports a power saving function called ”sleep

mode”. This sleep mode shuts off the VCTCXO, which is used as system

clock source for both RF and baseband. During the sleep mode the sys-

tem runs from a 32 kHz crystal. The phone is waken up by a timer run-

ning from this 32 kHz clock supply. The sleep time is determined by net-

work parameters. Sleep mode is entered when both the MCU and the

DSP are in standby mode and the normal VCTCXO clock is switched off.

NPM–9 supports both three and two wire type of Nokia chargers. Three

wire chargers are treated like two wire ones. There is not separate PWM

output for controlling charger but it is connected to GND inside the bottom

connector. Charging is controlled by UEM ASIC (Universal Energy Man-

agement) and EM SW running in the UPP (Universal Phone Processor).

NPM–9

System Module & UI

BLB–2 Li–ion battery is used as main power source for the phone.

Block Diagram

TX/RX SIGNALS

PWR

IR

FM
radio

UI

Digital Control

UPP

FLASH MEMORY

RF SUPPLIES

UEM

BB SUPPLIES

RAM

PA SUPPL Y

32kHz
CLK

SLEEP CLOCK

SIM

VBAT

13MHz
CLK

SYSTEM CLOCK

BATTERY

BASEBAND

UPP ASIC (Universal Phone Processor) provides the MCU, DSP, external

memory interface and digital control functions. UEM ASIC (Universal En-

ergy Management) contains power supply circuitry, charging, audio proc-

essing and RF control hardware.

Issue 1 02/2002

EXT. AUDIO

HS–connector

Charger
connector

 Nokia Corporation

Page 7

NPM–9
System Module & UI

Technical Summary

Baseband is running from power rails 2.8V analog voltage and 1.8V I/O

voltage. UPP core voltage Vcore can be lowered down to 1.0V, 1.3V and

1.5V. UEM includes 6 linear LDO (low drop–out) regulators for baseband

and 7 regulators for RF. It also includes 4 current sources for biasing pur-

poses and internal usage. UEM also includes SIM interface which has

supports both 1.8V and 3V SIM cards.

Note: 5V SIM cards are no longer supported by NPM–9 baseband.

A real time clock function is integrated into the UEM which utilizes the

same 32kHz clock supply as the sleep clock. A backup power supply is

provided for the RTC which keeps the real time clock running when the

main battery is removed. The backup power supply is a rechargeable sur-

face mounted capacitor. The backup time with the capacitor is 30 minutes

minimum.

The analog interface between the baseband and the RF section is han-

dled by a UEM ASIC. UEM provides A/D and D/A conversion of the in–

phase and quadrature receive and transmit signal paths and also A/D and

D/A conversions of received and transmitted audio signals to and from

the user interface. The UEM supplies the analog TXC and AFC signals to

RF section according to the UPP DSP digital control. Data transmission

between the UEM and the UPP is implemented using two serial busses,

DBUS for DSP and CBUS for MCU. RF ASIC, Hagar, is controlled

through UPP RFBUS serial interface. There is also separate signals for

PDM coded audio. Digital speech processing is handled by the DSP in-

side UPP ASIC. UEM is a dual voltage circuit, the digital parts are running

from the baseband supply 1.8V and the analog parts are running from the

analog supply 2.78V also VBAT is directly used by some blocks.

PAMS Technical Documentation

The baseband supports both internal and external microphone inputs and

speaker outputs. UEM also includes third microphone input which is used

in NPM–9 for FM radio. Input and output signal source selection and gain

control is done by the UEM according to control messages from the UPP.

Keypad tones, DTMF, and other audio tones are generated and encoded

by the UPP and transmitted to the UEM for decoding. A buzzer and exter-

nal vibra alert control signals are generated by the UEM with separate

PWM outputs.

NPM–9 has two external serial control interfaces: FBUS and MBUS.

These busses can be accessed only through production test pattern.

EMC shielding for baseband is implemented using a metallized plastic

frame and UI PWB ground plane. On the other side the engine is shielded

with PWB grounding. Heat generated by the circuitry will be conducted

out via the PWB ground planes.

NPM–9 radio module is implemented to 8 layer PWB. UI module is divid-

ed between main PWB LA5 and separate UI PWB LU9.

Page 8

 Nokia Corporation

Issue 1 02/2002

PAMS Technical Documentation

DC Characteristics

Regulators and Supply Voltage Ranges
Battery Voltage Range

Signal Min Nom Max Note

NPM–9

System Module & UI

VBAT 3.1V 3.6V 4.2V (charging

high limit voltage)

BB Regulators

Signal Min Nom Max Note

VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I

VFLASH2 2.70V 2.78V 2.86V I
VSIM 1.745V

2.91V

1.8V

3.0V

1.855V

3.09V

VIO 1.72V 1.8V 1.88V I

VCORE 1.0V

1.235V

1.425V

1.710V

1.053V

1.3V

1.5V

1.8V

1.106V

1.365V

1.575V

1.890V

RF Regulators

3.1V SW cut off

= 80mA

max

= 70mA

max

I

= 1.5mA

Sleep

= 40mA

max

I

= 25mA

max

I

= 0.5mA

Sleep

= 150mA

max

I

= 0.5mA

Sleep

I

= 200mA

max

I

= 0.2mA

Sleep

Default value =

1.5V

Signal Min Nom Max Note

VR1A 4.6V 4.75V 4.9V I
VR2 2.70V

3.20V

2.78V

3.3V

2.86V

3.40V
VR3 2.70V 2.78V 2.86V I
VR4 2.70V 2.78V 2.86V I

VR5 2.70V 2.78V 2.86V I

VR6 2.70V 2.78V 2.86V I

VR7 2.70V 2.78V 2.86V I

max

I

max

max
max

I

Sleep
max

I

Sleep
max

I

Sleep
max

= 10mA
= 100mA

= 20mA
= 50mA

= 0.1mA

= 50mA

= 0.1mA

= 50mA

= 0.1mA

= 45mA

Issue 1 02/2002

 Nokia Corporation

Page 9

NPM–9
System Module & UI

PAMS Technical Documentation

External and Internal Signals and Connections

This section describes the external and internal electrical connection and
interface levels on the baseband. The electrical interface specifications
are collected into tables that covers a connector or a defined interface.

Internal Signals and Connections

FM Radio Interface

BB Signal FM Radio

Signal

VFLASH2

GenIO(3) FMClk

GenIO(8) FMWrEn

Vcc1 2.7V 2.78V 2.86V max. Icc1

Vcc2 2.7V 2.78V 2.86V max. Icc2

VDD 2.7V 2.78V 2.86V max. IDD

Min Nom Max Condition Note

19mA

800uA

3mA

1.4V
0

30ppm Stability

1.4V
0V

20µs t

1.8V 1.88V

0.4V

75581 kHz Frequency In GSM

2 µs t

1.8V 1.88V

0.4V

High
Low

rise

High
Low

wd

Reference
clock for FM
radio module

rise / fall time

FMWrEn

before rising
edge of

FMCtrlClk

(write opera­tion)

high

GenIO(11) FMCtrlClk

Page 10

1.4V
0

50 ms t

1.8V 1.88V

0.4V
1 µs tr / t

 Nokia Corporation

High
Low

start

max. 300kHz

f

rise / fall time

FMCtrlClk

delay after
switching on
the VFLASH2
(oscillator run­ning)

Issue 1 02/2002

PAMS Technical Documentation

out ut

NPM–9

System Module & UI

BB Signal

Signal

GenIO(12) FMCtrlDa

1.4V
0

10 µs t

1.5 µs t

GenIO(27) FMTuneX 1.4V

0

1.8V 1.88V

0.4V
14us t

1.8V 1.88V

0.4V

High
Low

da

shift

hold

High
Low

NoteConditionMaxNomMinFM Radio

Bidirectional

shift register
available after
”search
ready”

data available
after

FMCtrlClk

ris­ing edge (read
operation)

FMCtrlDa

sta-

bile after

FMCtrlClk

ris­ing edge
(write opera­tion)

from FM mod­ule to UPP
(FMCtrlClk =
’1’)

MIC3P FMAudio

228mV

pp

326mV

pp

460mV

pp

50dB S/N

2% Harmonic

Internal microphone

Signal Min Nom Max Condition Note

MICP

200mV

pp

2.0 V 2.1 V 2.25 V DC

MICN 2.0V 2.1V 2.25V DC

Internal speaker

Signal Min Nom Max Condition Note

EARP

0.75V 0.8V

EARN

0.75V 0.8V

2.0 V

0.85V

2.0 V

0.85V

pp

pp

distortion

AC

AC
DC

AC
DC

2.2kΩ to
MIC1B

Differential

p

(V

= 4.0

diff

Vpp)

Issue 1 02/2002

 Nokia Corporation

Page 11

NPM–9

04V

tracks and ferrites

f

CO

Current

2 10

mA

tu

tuning

Su

Su ly for TX

VLO

buffers, rescaler

System Module & UI

PAMS Technical Documentation

AC and DC Characteristics of RF–BB voltage supplies

Signal

name

VBAT Battery P A & UEM

VR1A UEM VCP

VR2 UEM VRF_TX

VR3 UEM VCTCXO

From To Parameter Min Typ Max Unit Function

Voltage 2.95 3.6 4.2 V

Current 2000 mA

Current drawn by
PA when ”off”

Voltage 4.6 4.75 4.9 V

Noise density 240 nVrms/

Voltage 2.70 2.78 2.86 V
Current 65 100 mA
Noise density

f=100Hz
f>300Hz

Voltage 2.70 2.78 2.86 V

0.8 2 uA

sqrt(Hz)

120 nVrms/

sqrt(Hz)

Battery supply .
Cut–off level of
regulators is 3.
Losses in pwb
tracks and ferrites
are taken account to
minimum battery
voltage level.

Supply for varactor

or UHF V

ning.

.

Supply for part of
transmit strip.

pply for TX

I/Q–modulators.

Supply for VCTCXO

.

VR4 UEM VRF_RX

VR5 UEM VDIG,

VPRE,
VL

VR6 UEM VBB

Current 1 20 mA
Noise density 240 nVrms/

sqrt(Hz)

Voltage 2.70 2.78 2.86 V

Current 50 mA

Noise density
f = 6 Hz

f = 60 Hz
f  600Hz

Voltage 2.70 2.78 2.86 V
Current 50 mA
Noise density

BW=100Hz...
100kHZ

Voltage 2.70 2.78 2.86 V
Current 50 mA
Noise density

BW=100Hz...
100kHz

5500

240 nVrms/

240 nVrms/

550

55

nVrms/
sqrt(Hz)

sqrt(Hz)

sqrt(Hz)

Supply for Hagar

RX; preamp., mixer,

DTOS
Noise density

decades 20dB/dec
from 6Hz to 600Hz.
From f >600Hz
maximum noise
density

RMS

/√Hz.

l

r

,

55nV
Supply for Hagar

PLL; dividers, LO–

ffr pr

Supply for Hagar
BB and LNA

Page 12

 Nokia Corporation

Issue 1 02/2002

PAMS Technical Documentation

CO

for RF–IC

density is

some digita

some digital arts of

Signal name

FromToParameter

Fun

ter
DC

ng?

name

VR7 UEM UHF VCO

System Module & UI

Voltage 2.70 2.78 2.86 V
Current 30 mA

NPM–9

FunctionUnitMaxTypMinParameterToFromSignal

Supply for UHF
V

VrefRF01 UEM VREF_RX

VrefRF02 UEM VB_EXT

Noise density
100Hz<f<2kHz
2kHz<f<10kHz
10kHz<f<30kHz
30kHz<f<90kHz
90kHz<f<3MHz

Voltage 1.334 1.35 1.366 V
Current 100 uA
Temp Coef –65 +65 uV/C

Noise density
BW=600Hz...

100kHz Note
Voltage 1.323 1.35 1.377 V

Current 100 uA
Temp Coef –65 +65 uV/C

Noise density
BW=100Hz...
100kHz

70

nVrms/

55

sqrt(Hz)
35
30
30

60 nVrms/

sqrt(Hz)

350 nVrms/

sqrt(Hz)

Voltage Reference

.

Note: Below
600Hz noise

allowed to
increase 20
dB/oct

Supply for RF–BB
digital interface and

l parts of

RF.

AC and DC Characteristics of RF–BB digital signals

Min Typ Max Unit

TXP
(RFGenOut3)

UPP PA &

RF–IC

”1” 1.38 1.88 V

”0” 0 0.4 V

Load Resistance 10 220 kohm

Load Capacitance 20 pF

Timing Accuracy 1/4 symbol

Input Characteristics

c-

tion

Tran
smit
ter
pow
er
amp
lifier
ena
ble /

N2
timi

??

Issue 1 02/2002

 Nokia Corporation

Page 13

NPM–9

ena

ena

data

data

d

cloc

cloc
(G

)

ag

Hag
circuits, AC

circuits, AC

System Module & UI

PAMS Technical Documentation

RFBusEna1X UPP RF–IC

RFBusData UPP RF–IC

RFBusClk UPP RF–IC

ParameterToFromSignal name

UnitMaxTypMin

”1” 1.38 1.88 V
”0” 0 0.4 V
Current 50 uA
Load resistance 10 220 kohm
Load capacitance 20 pF
”1” 1.38 1.88 V
”0” 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz
”1” 1.38 1.88 V
”0” 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz

Fun

c-

tion

RFb
us

ble

RFb
us

;

rea

/writ
e

RFb
us

k

RESET

ENIO6

UPP RF–IC

”1” 1.38 1.85 V
”0” 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 kohm
Timing accuracy 1/4 symbol

Res
et to
H
ar

AC and DC Characteristics of RF–BB analogue signals

Signal name From To Parameter Min Typ Max Unit Function

VCTCXO VCTCXO UPP

VCTCXOGnd VCTXO UPP DC Level 0 V Ground for

Signal amplitude 0.2 0.8 2.0 Vpp
Input Impedance 10 kohm
Input Capacitance 10 pF
Harmonic Content –8 dBc
Clear signal

window (no glitch)
Duty Cycle 40 60 %

200 mVpp

High stability clock
signal for the logic

coupled. Distorted
sine wave eg.
sawtooth.

reference clock

RXI/RXQ RF–IC UEM

Page 14

 Nokia Corporation

Differential voltage
swing (static)

DC level 1.3 1.35 1.4 V
I/Q amplitude

missmatch
I/Q phase

missmatch

1.35 1.4 1.45 Vpp

0.2 dB

–5 5 deg

Issue 1 02/2002

RX baseband
signal.

PAMS Technical Documentation

Programmable

voltage

opa

oam G1

NPM–9

System Module & UI

FunctionUnitMaxTypMinParameterToFromSignal name

TXIP / TXIN UEM RF–IC

TXQP /
TXQN

AFC UEM VCTCXO

Aux_DAC
(TxC)

UEM RF–IC Same spec as for TXIP / TXIN Differential

UEM RF

Differential voltage
swing (static)

DC level 1.17 1.20 1.23 V
Source

Impedance

Voltage Min
Max

Resolution 11 bits
Load resistance

and capacitance
Step settling time 0.2 ms
Voltage Min

Max 2.4
Source

Impedance
Resolution 10 bits

2.23 2.48 Vpp

200 ohm

0.0

2.4

1

0.1

V

2.6

kohm

100

nF

0.1 V

200 ohm

Programmable
voltage swing.

common mode

.

Between
TXIP–TXIN

quadrature phase
TX baseband
signal for the RF
modulator

Automatic
frequency control
signal for
VCTCXO

Transmitter power
control

Noise density
BW=100Hz...
100kHz

Temp Coef –65 +65 uV/C

RFTemp RF UEM

Vbase RF UEM Voltage 2.7 V Detected voltage

Voltage at –20oC 1,57
Voltage at +25oC 1,7
Voltage at +60oC 1,79

800 nVrms/

sqrt(Hz)

V Temperature

NOTE; Assumed
power control

mp G=1

sensor of RF.

from PA power
level sensing unit

External Signals and Connections

UI (board–to–board) connector

Pin Signal Min Nom Max Condition Note

1 SLOWAD(2) 1.5V

0.1V

2 VBAT 3.0V 3.6V 4.2V Battery voltage

3 ROW(4) 0.7xVIO

0

2.7V

1.0V

1.8V

0.3xVIO

Flip closed
Flip open

High
Low

used for flip
identification

for leds
Keyboard ma-

trix row 4

Issue 1 02/2002

 Nokia Corporation

Page 15

NPM–9
System Module & UI

PAMS Technical Documentation

NoteConditionMaxNomMinSignalPin

4 ROW(3) 0.7xVIO

0

5 COL(2) 0.7xVIO

0

6 ROW(2) 0.7xVIO

0

7 COL(1) 0.7xVIO

0

8 ROW(0) 0.7xVIO

0

9 KLIGHT VBAT

10 ROW(1) 0.7xVIO

0

11 COL(3) 0.7xVIO

0

12 COL(4) 0.7xVIO

0
13 GND 0V
14 GND 0V
15 GND 0V

VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO

0.3xVBAT
VIO

0.3xVIO
VIO

0.3xVIO
VIO

0.3xVIO

High
Low

High
Low

High
Low

High
Low

High
Low

LED off
LED on

High
Low

High
Low

High
Low

Keyboard ma­trix row 3

Keyboard ma­trix column 2

Keyboard ma­trix row 2

Keyboard ma­trix column 1

Keyboard ma­trix row 0

two colour led
control

Keyboard ma­trix row 1

Keyboard ma­trix column 3

Keyboard ma­trix column 4

16 GND 0V

LCD connector

Pin Signal Min Nom Max Condition Note

1 XRES

2 XCS

3 GND 0V
4 SDA

0.8*VIO
0
100ns t

0.8*VIO
0
130ns t

130ns t

300ns t

0.8*VIO
0

0.7*VIO
0
100ns t

100ns t

VIO

0.22*VIO

VIO

0.22*VIO

VIO

0.22*VIO
VIO

0.3*VIO

Logic ’1’
Logic ’0’

rw

Logic ’1’
Logic ’0’

css

csh

csw

Logic ’1’
Logic ’0’
Logic ’1’
Logic ’0’

sds
sdh

Reset
Active low

Reset active
Chip select

Active low
XCS low before

SCLK rising
edge

XCS low after
SCLK rising
edge

XCS high pulse
width

Serial data
(driver input)

Serial data
(driver output)

Data setup time
Data hold time

Page 16

 Nokia Corporation

Issue 1 02/2002