Nokia 6340 Service manual

Customer Care Solutions (CCS)

Technical Documentation

[NMP Part No. 0275580]

NPM-2NX Series Cellular

Phones

NPM-2NX Issue 1: 07/2002

Issue 1 07/02

Customer Care Solutions (CCS)

Technical Documentation

Amendment Record Sheet

Amendment No Date Inserted By Comments

07/02 JoM Issue 1

Issue 1 07/02

Contents:

Customer Care Solutions (CCS)

Technical Documentation

NPM-2NX Overall Manual Contents

Section 1: Foreword Section 2: General Information Section 3: System & UI Module Section 4: Parts List Section 5: Product Variants Section 6: Service Software Instructions & Service Co nc epts Section 7: Service Tools Section 8: Assembly & Disassembly Instructions Section 9: Troubleshooting Instructions Section 10: Accessories Section 11: Car Kit Section 12: Schematic Diagrams

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Customer Care Solutions (CCS)

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins.

While every endeavour has been m ade to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA CORPORATION should be notified in writing.

Please state:

Technical Documentation

IMPORTANT

Title of the Document + Issue Number/Date of publication Latest Amendment Number (if applicable) Page(s) and/or Figure(s) in error

Please send to: Nokia Corporation / Nokia Mobile Phones

PAMS Technical Documentation PO Box 86 FIN-24101 SALO Finland

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Customer Care Solutions (CCS)

Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide for instruc tions relating to operation, care and maintenance including important safety information.

Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLU-

Cautions:

1. Servicing and alignment must be undertaken by qualified personnel only.

2. Ensure all work is carried out at an anti-static workstation and that an anti-

3. Ensure solder, wire, or foreign matter does not ent er the te lephone as dam-

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulators are corre ctly re-fit-

TO CONTAIN PO TENTIALLY EXPLOSIVE ATMOSPHERES E.G., PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS, ETC.

LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

static wrist strap is worn.

age may result.

ted after servicing and alignment. Ensur e all cables and wires are repositioned correctly.

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Customer Care Solutions (CCS)

ESD Protection

Nokia requires that phone repair pla ces have sufficient ESD protection (against static electricity) when servicing cellular phones.

A cellular phone, which is ready for use, can be handled normally wi thout ESD protection. The SIM card and battery can be replaced in normal conditions of use.

To replace the color cover ES D protection must be appli ed, except fo r the phone cover s which can be replaced by the customer.

Technical Documentation

All electronic parts of the phone, including the displa y, are susceptible to ESD. Resistors, too, can be damaged by static electricity discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any ESD Protected Area (EPA).

Every repair action involving opening the phone or handling the phone components must be done under ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an EPA. For more detailed information about ESD protection and EPA, contact your local Nokia

After Market Services representative.

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CCS Technica l Documentation

NPM-2NX Series Transceivers

General Information

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General Information CCS Technical Documentation

Page No

Product Selection ........................................................................................................... 3

Handportables ..............................................................................................................3

Desktop Option ......................................................................................................... 4

Advanced Hands Free Car Installation (CARK-91) Options ......................................5

Product List.................................................................................................................... 6

Technical Specifications ................................................................................................ 7

General Specifications of Transceiver NPM-2NX ......................................................7

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CCS Technical Documentation General Information

Product Selection

Handportables

The NPM-2NX is a multimode radio transceiver unit for 800/1900MHz Time Division Multiple Access (TDMA) and GSM 1900 MHz networks. The transceiver consists of system/RF module, keypad module, LCD module, and assembly parts. The user interface (UI) consists of normal number, talk, soft, and power ke ys in the keymat.

The antenna is internal; antenna connection is provided by spring from PCB to antenna.

Name: Type Code: Material Code:

Transceiver See Product Variants Standard Battery (1000 mAh Li-Ion) BLB-3 0670283 AC Travel Charger (Euro plug) 207-253 Vac ACP-7E 0675144 AC Travel Charger (US plug) 108-132 Vac ACP-7U 0675143 AC Travel Charger (AR plug) 220 Vac ACP-7AR 0675244 Performance Travel Charger Euro plug 90-264 Vac ACP-8E 0675195 Performance Travel Charger US plug 90-264 Vac ACP-8U 0675196 Performance Travel Charger AR plug 220 Vac ACP-8AR 0675248

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Desktop Option

The desktop option allows the user to charge the phone from the mains.

3. ACP-7E

4. ACP-7U

6. ACP-7AR

7. ACP-8E

9. ACP-8U 10. ACP-8AR

Item Name: Type Code: Material Code:

1 Transceiver NPM-2NX See Product Variants 2 Desk stand DCH-8 0675174 3 AC Travel Charger (Euro plug) 207-253 Vac ACP-7E 0675144 4 AC Travel Charger (US plug) 108-132 Vac ACP-7U 0675143 6 AC Travel Charger (AR plug) 220 Vac ACP-7AR 0675244 7 Performance Travel Charger Euro plug 90-264 Vac ACP-8E 0675195 9 Performance Travel Charger US plug 90-264 Vac ACP-8U 0675196 10 Performance Travel Charger AR plug 220 Vac ACP-8AR 0675248

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CCS Technical Documentation General Information

Advanced Hands Free Car Installation (CARK-91) Options

Item Name Type Code Material Code

1 Transceiver (See Product Variants section) 2 Mobile Holder MCC-1 0620043 3 Handsfree Unit HFU-2 0694049 4 Handsfree Microphone HFM-8 0690016 5 Handsfree Speaker HFS-12 0692008 6 Power Cable PCH-4J 0730055 7 Swivel Mount HHS-9 0620037 8 Mounting Plate MKU-1 0620036

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General Information CCS Technical Documentation

Product List

Unit/type: Product code:

Transceiver NPM-2NX See Product Variants Li-Ion Battery BLB-3 1000 mAh 0670283 AC Travel Charger ACP-7E (EUR) 207-253 Vac 0675144 AC Travel Charger ACP-7U (US) 10 8-132 Vac 0675143 AC Travel Charger ACP-7AR (AR) 220 Vac 0675244 Performance Travel Charger ACP-8E (EUR) 90-264 Vac 0675195 Performance Travel Charg e r AC P - 8U (US) 90-264 Vac 0675196 Performance Travel Charger ACP-8AR (AR) 220 Vac 0675248 Extra Battery Charger DDC-1 0675243 DCH-12K Desktop stand

DCH-8D Desktop stand DCH-8 Desktop stand

Mounting Plate MKU-1 0620036 Swivel Mount HHS-9 0620037 Cigarette Lighter Charger LCH-9 0675120 Handsfree Microphone HFM-8 0690016 Headset HDC-9P 0694063 Headset HDE-1 0694076 Phone Adapter (TTY/Headset) HDA-8 0694092 Loopset LPS-1 0272233 Passive Car Holder MBC-1 0700060 Leather case CSL-27 with BCH-12P Beltclip 0720333 Leather Style Case CSL-17 0 72 0271 Data Cable DLR-3P 0730183

0675228 0675256 0675179

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CCS Technical Documentation General Information

Technical Specifications

General Specifications of Transceiver NPM-2NX

Table 1: Specification for TDMA800 + AMPS

Parameter Unit

Cellular system TDMA800 + AMPS RX frequency band 869.01 - 893.97 M Hz TX frequency band 82 4. 01 - 848.97 MHz Output power -5 - +28 dBm / 0.3 mW - 630 mW Number of RF channels 832 Channel spacing 30 kHz

Table 2: Spec ification for TDMA 1900

Parameter Unit

Cellular System TDMA1900 + AMPS RX frequency band 1930.05 - 1989.99 MHz TX frequency band 1850.01 - 1909.95 MHz Output power -5 - +28 dBm / 0.3 mW - 630 mW Number of RF channels 1999 Channel spacing 30 kHz

Table 3: NPM-2NX General Specifications

Parameter Unit

Cellular system GSM 1900 RX frequency band GSM: 1930 ... 1990 MHz TX frequency band GSM: 1850 ... 1910 MHz Output power +0 ...+30 dBm / 1.0 mW ... 1 W Duplex spacing 80 MHz Number of RF channels 299 Channel spacing 200 kHz Number of TX power levels 16 Sensitivity, static channel -102 dBm Frequency error, static channel < 0.1 ppm RMS phase error

Peak phase error

< 5.0 < 20.0

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CCS Technica l Documentation

NPM-2NX Series Transceivers

System Module

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Page No

Abbreviations................................................................................................................. 5

Transceiver NPM-2NX.................................................................................................. 7

Introduction ..................................................................................................................7

Engine Module WG8 ..................................................................................................... 8

Introduction ..................................................................................................................8

UEM ............................................................................................................................8

UEM introduction ..................................................................................................... 8

Blocks........................................................................................................................ 9

RF IF ....................................................................................................................... 10

Charging Control..................................................................................................... 10

DIGITAL IF............................................................................................................ 11

AUDIO CODEC ..................................................................................................... 11

UI DRIVERS........................................................................................................... 11

IR interface.............................................................................................................. 11

AD CONVERTERS................................................................................................ 11

SIM.......................................................................................................................... 11

Technical information............................................................................................. 11

UPP ............................................................................................................................12

Introduction............................................................................................................. 12

Blocks...................................................................................................................... 12

Technical information............................................................................................. 12

Flash memory ............................................................................................................12

Introduction............................................................................................................. 12

Technical information............................................................................................. 12

UIHW ........................................................................................................................13

LCD......................................................................................................................... 13

Audio HW ..................................................................................................................17

Earpiece................................................................................................................... 17

Microphone ............................................................................................................. 18

Buzzer...................................................................................................................... 18

Battery ........................................................................................................................19

Phone battery........................................................................................................... 19

Battery connector .................................................................................................... 20

Accessories Interface .................................................................................................20

System connector .................................................................................................... 20

IR module................................................................................................................ 21

Charger IF ............................................................................................................... 22

Data cable................................................................................................................ 23

Test interfaces ............................................................................................................23

Production test pattern............................................................................................. 23

Other test points ...................................................................................................... 24

EMC ...........................................................................................................................24

General .................................................................................................................... 24

BB component and control/IO line protection........................................................ 25

Transceiver interfaces ................................................................................................27

BB - RF Interface Connections ..................................................................................27

BB Internal connections ............................................................................................30

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UPP Block signals................................................................................................... 36

MEMORY Block Interfaces.................................................................................... 41

IR Block Interfaces.................................................................................................. 42

SIM Block Interfaces .............................................................................................. 42

Audio Interfaces...................................................................................................... 43

Key/Display blocks................................................................................................. 45

Baseband External Connections ................................................................................46

Test Pattern for production tests.............................................................................. 48

General about testing .................................................................................................48

RF Module ................................................................................................................... 50

Introduction ................................................................................................................50

Requirements........................................................................................................... 50

Design...................................................................................................................... 50

Interfaces ....................................................................................................................50

Environmental Specifications ....................................................................................51

Temperature Conditions.......................................................................................... 51

Vibration and Free Fall ........................................................................................... 51

Humidity and Water Resistance.............................................................................. 52

ESD strength ........................................................................................................... 52

Main Technical Specifications ..................................................................................52

RF frequency plan................................................................................................... 52

DC Characteristics................................................................................................... 54

Functional Description ...............................................................................................55

Block diagram......................................................................................................... 55

Receiver................................................................................................................... 56

Frequency Synthesizers........................................................................................... 57

Transmitter.............................................................................................................. 57

Software Compensations......................................................................................... 58

RF Characteristics ......................................................................................................59

Receiver................................................................................................................... 60

Transmitter.............................................................................................................. 61

Synthesizers............................................................................................................. 62

Antenna ................................................................................................................... 63

EMC........................................................................................................................ 63

Radiated spurious emissions, Receiver................................................................... 63

Conducted spurious emissions, Receiver................................................................ 63

Harmonic and spurious emissions, Transmitter, conducted and radiated............... 64

Maintainability ...........................................................................................................64

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List of Figures

Fig 1 NPM-2NX Block Diagram.........................................................................................7

Fig 2 System Block Diagram...............................................................................................8

Fig 3 LCD interface............................................................................................................13

Fig 4 Placement of keys.......................................................................................................14

Fig 5 SIM block...................................................................................................................17

Fig 6 Battery connection diagram........................................................................................19

Fig 7 BLB-3 Battery contacts (BLB-2 has the same interface)...........................................20

Fig 8 System connector........................................................................................................21

Fig 9 IR interface.................................................................................................................22

Fig 10 Top view of production test pattern..........................................................................24

Fig 11 Telescoping pattern between UPP and UEM..........................................................24

Fig 12 Transceiver block naming for interfaces..................................................................27

Fig 13 NPM-2NX Frequency Plan ......................................................................................53

Fig 14 Power Distribution Diagram.....................................................................................54

Fig 15 Block diagram of the NPM-2NX RF module ..........................................................56

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Abbreviations

ADC Analog to Digital Converter ASIC Application Specific Inte grated Circuit BB Baseband COG Chip On Glass ENGINE The Transceiver parts fixed to PWB FBUS Fast asynchronous serial bus FDL Flash Down Loading, programming the phone FLASH memory GSM Global system for mobile communications (Groupe Spêcial Mobile) HW Hardware I & Q In phase and Quadrature components of complex signal IR Infrared. A wireless data/audio transmit medium. IrDA Infrared Data Association JTAG An in-circuit test method, based on the standard IEEE-1149.1 LDO Low Drop Out LED Light Emitting Diode Low Iq mode Low quiescent current mode MBUS A bidirectiona l serial bus NTC Negative Temperature Coefficient. PWB Printed Wiring Board PCM Pulse Code Modulation PDM Pulse Density Modulation PWM Pulse Width Modulation RF Radio Frequency Rx Receiver path

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SIM Subscriber Identity Module SW Software TDMA Time Division Multiple Access Transceiver Transmitter & Receiver, mobile phone Tx Transmitter path UEM Universal Energy Management baseband ASIC. UI User Interface UPP Universal Phone Processor baseband ASIC. US United Stat es (of America) US-AMPS Analog Mobile Phone System used in United States US-DAMPS Digital AMPS, used in US, channel compatible with AMPS

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CCS Technical Documentation S ystem Module

Transceiver NPM-2NX

Introduction

The NPM-2NX is a dual band radio transceiver unit for GAIT (AMPS/TDMA800/ TDMA1900/GSM1900) networks. It is a true 3 V transceiver with internal antenna and vibra.

Mechanical construction resembles Nokia 61XX series and the same accessories can be used. External RF connector is included.

An integrated Infrared link is located on the top of the phone. NPM-2NX has the connection for the small SIM (Subscribe Identity Module) card. The PWB has one-sided SMD and there is no separate User Interfa ce PWB but the key-

board connections are on the non-SMD side of the board.

EXT RF

ANT

Test I/F

Ostrich

SIM

Figure 1: NPM-2NX Block Diagram

LCD DRIVER

✉

☎

Display

Backlight/ Frontlight

System Module WG8

800/1900 MHz

SAFARI_GTE

UEM

RF Converters

Audio

Energy Management

UPP8M

MCU:ARM7

DSP: LEAD3

System Logic

TRANSCEIVER

USER INTERFACE

6 9

EARP

HEADSET

MIC

BUZZER

VIBRA

BATTERY

BTemp

INFRA R E D

Ext. Memory

~ ~

SYSTEM

CONNECTOR

Flash-ROM 64 Mbit

CHARGING

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NPM-2NX

SIMCARD

SIMIF

System Module CCS Technical Documentation

Engine Module WG8

Introduction

This section describes the baseband part of the NPM-2NX transceiver. The BB architecture is similar t o the earlier BB generation. The major difference is the

integration level. Core BB consists of 2 ASICs and flash memory. BB core technical specification The core part of NPM-2NX BB (figure below) consist of 2 ASICs, UEM a n d UPP, and flash

memory. Following sections describe these parts.

Figure 2: Syst em Block Diagram

PA supply

SAFARI GTE

RFIC CTRL

RFCLK

19.44 / 13 MHz

UPP

MEMADDA MEMCONT

FLASH

RF Supplies

RF RX/TX

PURX

RF RX/TX

SLEEPCLOCK

32kHz

CBUS/DBUS

AUDIO

BB Supplies

KLIGHT/ DLIGHT

PWR ON

BASEBAND

EXTERNAL AUDIO

CHARGER CONNECTION MBUS AND FBUS

UEM

EAR

MIC

BUZZER

IBRA

BATTER

System Connector

UEM

UEM introduction

UEM is the Universal Energy Management IC for digital handportable phones. In addition

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to energy management it performs all the baseband mixed-signal functions. Most of UEM pins have 2kV ESD protection and those signals, which are considered to be

exposed more easily to ESD, have 8kV prot ection inside UEM. Such si gnals are all audio signals, headset signals, BSI, Btemp, Fbus and Mbus signals.

Blocks

REGULATORS UEM has 6 regulators for BB power supplies and 7 regulators for RF power supplies. VR1

regulator has 2 outputs VR1a and VR1b. In addition there are 2 current generators IPA1 and IPA2 for biasing purposes.

Bypass capacitor (1uF) is required for each regulator output to ensure stability. Reference voltages f or regulators require ex ternal 1uF capacitors. Vref25RF is reference

voltage for VR2 regulator, Vref25BB is reference voltage for VANA, VFLASH1, VFLASH2, VR1 regulators, Vref278 is reference voltage for VR3, VR4, VR5, VR6, VR7 regulators, VrefRF01 is reference voltage for VIO, VCORE, VSIM regulators and for RF.

Table 1: UEM Regulators

BB RF Current

VANA: 2.78Vtyp 80mAmax VR1a:4.75V 10mAmax

VR1b:4.75V Vflash1: 2.78Vtyp 70mAmax IPA2: 0-5mA Vflash2: 2.78Vtyp

40mAmax VSim: 1.8/3.0V 25mAmax VR3:2.78V 20mA VIO: 1.8Vtyp

150mAmax Vcore: 1.0-1.8V

200mAmax

VR2:2.78V 100mAmax

VR4: 2.78V 50mAmax

VR5: 2.78V 50mAmax

VR6: 2.78V 50mAmax

VR7: 2.78V 45mAmax

IPA1: 0-5mA

VANA regulator supplies internal and external analog circuitry of BB. It is disabled in sleep mode.

Vflash1 regulator supplies LCD, IR-module and di gital par ts of UE M a nd Saf ari_GTE a sic. It is enabled during startup and goes to low Iq-mode in sleep mode.

Vflash2 regulator supplies data cable (DLR-3). It's enabled/disenabled through writing register and default is off.

VIO regulator supplies both external and internal logic circuitries. It is used by LCD, flash and UPP. Regulator goes in low Iq-mode in sleep mode.

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VCORE regulator supplies DSP and Core part o f UPP. Voltage is programmable and startup default is 1.5V. Regulator goes to low Iq-mode in sleep mode.

VSIM regulator supplies SIM card. Voltage is programmable. Regulator goes in to low Iqmode in sleep mode.

VR1 regulator uses two LDOs and a charge pump. Charge pump requires one external 1uF capacitor in Vpump pin and 220nF flying capacitor between pins CCP and CCN. VR1 regulator is used by Safari_GTE RF ASIC.

VR2 regulator is used to supply ex ternal RF parts, lower band up converter, TX power detector module and Safari_GTE. In light load situations VR2 regulator can be set to low Iq-mode.

VR3 regulator supplies VCTCXO and Safari_GTE in RF. It's enabled always when UEM is active. When UEM is in sleep mode VR3 is disabled.

RF IF

VR4 regulator supplies RF parts having l ow noise requirements. In light load situati ons VR4 regulator can be set to low Iq-mode.

VR5 regulator supplies lower band PA. In light load situations VR5 regulator can be set to low Iq-mode.

VR6 regulator supplies higher band PA and TX amplifier. In light load situations VR6 regulator can be set to low Iq-mode.

VR7 regulator supplies UHF VCO and Safari_GTE. In light load situations VR7 regulator can be set to low Iq-mode.

IPA1 and IPA2 are programmable current generators. 27kΩ/1%/100ppm external resistor is used to improve the accuracy of output current. IPA1 is used by lower band PA and IPA2 is used by higher band PA.

The interface between the baseba nd and the RF section is handled also by U EM. It provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the UI section. The UEM supplie s the analog AFC signal to RF section accor ding to the UPP DSP digital control.

Charging Control

The CHACON block of UEM ASIC controls charging. Needed funct ions for charging controls are pwm-controlled ba ttery charging switch, cha rger-monitoring circuitry, battery voltage monitoring circuitry and RTC supply circuitry for backup battery charging (Not used in NPM-2NX). In addition external components a re needed for EMC protection of the charger input to the baseband module.

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DIGITAL IF

Data transmission between the U EM and the UPP is impleme nted using two seri al connections, DBUS (programmable clock) for DSP and CBUS (1.0MHz GSM and 1.08MHz TDMA) for MCU. UEM is a dual voltage circuit, the digital parts are running from 1.8V and the analog parts are running from 2.78V.

AUDIO CODEC

The baseband supports two external microphone inputs and one external earphone output. The inputs can be taken from an internal microphone, a headset microphone or from an external microphone signal source through headset connector. The output for the internal earpiece is a dual ended type outp ut, and the differential output is capable of driving 4Vpp to earpiece with a 60 dB minimum signal to total distortion ratio. Input and output signal source selection and gain control is performed inside the UEM Asic according to control messages from the UPP. A buzzer and an external vibra alert control signals are generated by the UEM with separate PWM outputs.

UI DRIVERS

UEM has dedicated single output drivers for buzzer, vibra, IR, display LEDs and keyboard LEDs. These generate PWM square wave to devices.

IR interface

The IR interface is integrated to UEM and dat a transfer is done via TXD and RXD paths. UEM supports data speeds up to 115.2kbit/s.

IR module integrates a sensitive receiver and a built-in power driver. IR module itself supports speeds from 9.6kbit/s to 1.152Mbit/s. UEM supports speeds up to 115.2 kbit/s. Vflash1 supplies IR module except transmit LED. Transmit LED is supplied from VBAT and maximum current is limited by serial resistor. TXD and RXD lines are connected to UEM and shutdown is controlled by UPP through level-shifter V350.

AD CONVERTERS

There is 11-channel analog to digit al converter in UEM. Some cha nnels of the AD converter aren't used in NPM-2NX (LS, KEYB1-2). The AD converters ar e calibrated in the production line

SIM

The SIM inter fac e is the el ect ric al i nter fac e be tw een th e S ubs crib er I dent ify Mod ule Ca rd (SIM card) and mobile phone (via UEM device). The UEM device contains power up/down, port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers logic for SIM.

Technical information

UEM package is 168-pin CSP package with 150 signal pins, 16 thermal pins and 2 kelvin pins. Package size is 12mm x 12mm with max. thickness of 1.23mm. Solder ball diameter is 0.4mm +-0.05mm and ball pitch is 0.8mm.

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UPP

Introduction

NPM-2NX uses UPPv8M ASIC. The RAM size is 8M. The processor architecture consists of both DSP and MCU processors.

Blocks

UPP is internally partitioned into two main parts: The Processor and Memory System (i.e. Processor cores, Mega -cells, internal memories,

peripherals and external memory interface) is known as the Brain. Brain consists of the blocks: the DSP Subsy stem (DSPSS), the MCU Subsy stem (MCUSS),

the emulation control EMUCtl, the program /data RAM PDRAM and the Brain Peripherals–subsystem (BrainPer).

The NMP custom cellular logic functions. This is known as the Body. Body contains all interfaces and functions needed for interfacing other baseband and RF

parts. Body consists of following sub-blocks: MFI, SCU, CTSI, RxModem, AccIF , UIF, Coder, GPRSCip, BodyIF, SIMIF, PUP and CDMA (Corona).

Technical information

UPP package is 13x13-matrix CSP package with 144 signal pins. Package size is 12mm x 12mm with max. thickness of 1.40mm. Solder ball diameter is 0.5mm +-0.05mm and ball pitch is 0.8mm.

Flash memory

Introduction

NPM-2NX uses 64 Mbit flash as an externa l memory. VIO is used as a power supply for normal in-system operation. An accelerated program/erase operation can be obtained by supplying Vpp of 12 volt to flash device. Memory architecture consists of eight sectors of 8kB and 63 sectors of 64kB each.

The device has two read modes: asynchronous and burst. Burst mode read is utilized i n NPM-2NX except the start-up when asynchronous read is used for a short time.

In burst mode UPP supplies only the initial address and subseque nt addr esses are generated inside flash by the rising edge of Clock (FLSCLK in UPP). After acknowledging the initial address the flash starts to deliver a continuous sequentia l data word str eam. Data stream continues until the end of the mem ory or until the user loads in a new sta rting address or stops the burst in advance.

Technical information

Flash package is a CSP package with 40 signal pins and 4/8 support ba lls. Package max. size is (WxLxH) 10,6mm x 11,0mm x 1.2mm. Solder ball diameter is 0.3mm and ball pitch

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CCS Technical Documentation S ystem Module

is 0.5mm.

UIHW

LCD

Introduction

NPM-2NX uses black/white GD51 96*65 full dot matrix display with COG driver. One vendor - SEIKO SED15B0 - is used in NPM-2NX.

Interface

LCD data, clock, chip select and reset signals come from the UPP. The VIO voltage is supplied to a logic voltage pin and the FLASH1 voltage is used to supply power to the LCD. The LCD uses extra filtering capacitors to filter voltages. The booster capacitor (C302 2u2F) is connected between the booster pin and the Vflash1. The capacitor stores the boosting voltage.

Figure 3: LCD interface

Keyboard

Introduction All signals for the keyboard come from the UPP thr ough the emifilter (Z300). The side

key, which does not go through the emifilter, and the power key signal are connected directly to the UEM. The pressing of t he po wer key is de tecte d so that t he switch pow er

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NPM-2NX

123456789#0*Up

Down

End

Send

S Right

S Left

System Module CCS Technical Documentation

key connects the PWONX of the UEM to the GND and creates an interruption. Side key detection is achieved by connecting the line to t he ground when pressing the side key (volume up or down). The emifilter is the ESD and EMC protection.

The matrix-based keyboard interface consists of a scan column I/O data register and a row of data register. In the keyboard scanning procedure, the MCU perform s access to these registers to find out which key was pressed. Scanning is an interrupt-based procedure, i.e. an interrupt generated when the key is pressed, and then the MCU can start the scanning procedure. The side keys a re also detected in the same way as the other keys, except that there is no metaldome, and the middle pin is directly connected to the ground.

Figure 4: Placement of keys

Power Key

All signals for keyboard come from UPP ASIC except PWRONX line for PWR key whic h is connected directly to UEM. Pressing of PWR ke y grounds PWRONX line and UEM generates an interrupt to UPP which is then recognized as a PWR key press.

Keys

All signals for the keyboard come from the UPP through the emifilter (Z300) except the side key, which will not go through the emifilter, and the power key signal, which is connected directly to the UEM. Pressing of the power key is detected so that the switch of the power connects PWONX of the UEM to the GND and creates an interruption. Side key detection is done by connecting line to ground when pressing the side key (volume up or down). Emifilter is ESD and EMC protection.

The matrix-based keyboard interface consists of scan column I/O data register and of a row data register. In keyboard scanning procedure, MCU performs access to these regis-

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NPM-2NX

CCS Technical Documentation S ystem Module

ters to find out which key was pressed. Scanning is an interrupt procedure, i.e., an interrupt is generated when key is pressed and then the MCU can start the scanning procedure. Side keys are also detected in the same way as other keys except that there is no metaldome, but the middle pin is directly connected to the ground.

Table 2: Matrix of key detection lines

S0 / P00 S1 / P01 S2 / P02 S3 / P03 S4 / P04

R0 / P10 Side key / Vol.

down

R1 / P11 Side key / Vol.

down

R2 / P12 Side key / Vol.

down

R3 / P13 Side key / Vol.

down

R4 / P14 Side key / Vol.

down

R5 / P15 Reserved Side key / Vol. upSide key / Vol. upSide key / Vol. upSide key / Vol.

NC Send End NC

Soft left Up Down Soft right

1 4 7 *

2 5 8 0

3 6 9 #

NC = Not Connected

Lights

Introduction NPM-2NX has 12 LEDs for lighting purposes. 6 of them (V300-V303, V310-V311) are for

display and 6 (V304-V309) for keyboard. LEDs are green light -emitting and SMD through-board-firing.

Interfaces

Display lights are controlled by Dlight signal from UEM. Dlight output is PWM signal which is used to control average current going through LEDs. When battery voltage changes new PWM value is written to the PWM register. This way brightness of the lights remains the same with all battery voltages wit hin range . Freque ncy of the signa l is fixed 128Hz.

Keyboard lights are controlled by Klight signal from the UEM. Klight output is a lso PWM signal and is used similar way as Dlight.

Technical information

Each LED requires hole in PWB where the body of LED locate s in hole and t erminals are soldered on component side of module PWB. LEDs ha ve white plastic body around the diode itself which directs the emitted light better to UI-side. Current for LCD lights is limited by resistor between Vbatt and LEDs. For keyboard lights there are resistors in par-

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NPM-2NX

System Module CCS Technical Documentation

allel.

Vibra

Introduction Vibra is located to D-cover and is connected by spring connectors on the left bottom side

of the engine. Vibra manufacturers for NPM-2NX are Namiki and Ma tsushita.

Interfaces

Vibra is controlled by PWM signal VIBRA from UEM. With this signal it is possible to control both frequency and pulse width of signal. Pulse width is used to control current when battery voltage cha nges. With frequency control it is possible to sea rch optimum frequency to have silent and efficient vibrating.

Table 3: Electrical parameters

Parameter Requirement Unit

Rated DC Voltage 1.3 V Rated speed 9500 ±3000 rpm Rated current 115 ±20 mA Starting current 150 ±20 mA Armature resistant 8.6 ohm Rated DC voltage being able to use 1.2 to 1.7 V Starting DC voltage min. 1.2 V

SIM card reader Introduction

NPM-2NX is supporting SIM card reader. The SIM is located in the bottom of the engine. The SIM card reader is manufactured by Amphenol.

Interface

The SIM card reader is connected by spring connectors on the PWB. EMC/ESD protection is done by ASIP, R388. It is a CSP component. VSIM provides power supply voltage to the SIM card reader. Two spark gaps are put to the no connected pin to provide protection from ESD.

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