Nokia 6310 Service Manual 4 npe 4 system audio
Programmes After Market Services
NPE-4 Series Cellular Phones
3 - Audio System
Original ãNokia Corporation. Page 3-1
NPE-4
3 - Audio System PAMS Technical Documentation
Table of Contents
Description Page No.
Introduction ......................................................................................................................................
Abbreviations .................................................................................................................................... 4
Technical overview .......................................................................................................................... 5
Block diagram ............................................................................................................................ 5
Parts list ...................................................................................................................................... 5
DC characteristics .................................................................................................................... 7
Audio function description ............................................................................................................ 7
Audio control ............................................................................................................................. 7
Gain table ................................................................................................................................... 8
Internal audio devices .................................................................................................................... 9
Earpiece ....................................................................................................................................... 9
Earpiece acoustic design ................................................................................................. 10
Earpiece electrical interface .......................................................................................... 12
Microphone ................................................................................................................................ 13
Sketch of microphone acoustic design ....................................................................... 14
Microphone electrical interface .................................................................................... 15
Buzzer .......................................................................................................................................... 16
Buzzer acoustic design .................................................................................................... 17
Buzzer electrical interface ............................................................................................. 18
Vibra specification ................................................................................................................... 19
Vibra electrical interface ................................................................................................. 19
External audio devices .................................................................................................................... 20
Audio accessories ..................................................................................................................... 20
External audio interface ......................................................................................................... 23
External audio interface - electrical interface ................................................................. 23
External audio connector ................................................................................................ 27
External audio signal electrical specification ........................................................... 28
Accessory detection, identification and control .............................................................. 30
Accessory detection .......................................................................................................... 30
Accessory identification .................................................................................................. 30
Accessory control .............................................................................................................31
4
List of Figures
Figure 1 Audio block diagram ................................................................................................. 5
Figure 2 Sketch of earpiece acoustic design ....................................................................... 10
Figure 3 Mechanical assembly of earpiece and vibra ....................................................... 11
Figure 4 Earpiece frequency response - ERP corrected - non DSP corrected ............ 11
Figure 5 DAI receiving frequency response, B4.0 .............................................................. 12
Figure 6 Internal earpiece electrical interface ................................................................... 12
Figure 7 Microphone acoustical design ............................................................................... 14
Figure 8 DAI sending frequency response, B4.0 ................................................................. 14
Figure 9 Internal microphone electrical interface ............................................................ 15
Page 3-2 ãNokia Corporation. Original
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PAMS Technical Documentation 3 - Audio System
Description Page No.
List of Figures (continued)
Figure 10 Sketch of buzzer acoustic design .......................................................................... 17
Figure 11 Mechanical buzzer asssembly ................................................................................ 17
Figure 12 Typical buzzer frequency response ....................................................................... 17
Figure 13 Buzzer driver circuit .................................................................................................. 18
Figure 14 Vibra driver circuit ..................................................................................................... 19
Figure 15 External microphone interface .............................................................................. 24
Figure 16 External earpiece interface ..................................................................................... 26
Figure 17 Sysyem connector - mechanical outline ............................................................. 28
Figure 18 Carkit audio interface. block diagram .................................................................. 32
List of Tables
Table 1 Parts list ....................................................................................................................... 6
Table 2 Supply voltages .......................................................................................................... 7
Table 3 Possible UEM gains for each input and output ................................................. 8
Table 4 Total UEM gain for each input and output in different audio paths ........... 8
Table 5 UEM ear output specification ................................................................................ 13
Table 6 Microphone input specifications ........................................................................... 16
Table 7 Buzzer driver specifications .................................................................................... 18
Table 8 Vibra driver specifications ....................................................................................... 20
Table 9 Vibra output frequency control ............................................................................. 20
Table 10 HDC-9P interface specifications ........................................................................... 21
Table 11 Selected specifications for HDW-1 BT headset ................................................. 21
Table 12 LPS-1 interface specifications ............................................................................... 22
Table 13 Microphone input specifications, external audio ............................................. 25
Table 14 UEM HF output specifications ............................................................................... 26
Table 15 System connector pin assignment ........................................................................ 28
Table 16 HEADINT voltage value table used for accessory identification ................... 30
Original ãNokia Corporation. Page 3-3
NPE-4
3 - Audio System PAMS Technical Documentation
Introduction
This Chapter specifies the Audio hardware for the NPE-4 program.
Abbreviations
UEM Universal Energy Management
UPP Universal Phone Processor
UIF codec User InterFace Codec in UPP
VBAT Main battery voltage
PWM Pulse Width Modulated (signal)
MUX MUltiPlexer
GND Phone ground
LGND GND abbreviation in System connector
SGND Signal ground – reference for microphone
MCU MicroController Unit
PWB Printed Wire Board
ERP Ear Reference Point
MRP Mouth Reference Point
SPL Sound Pressure Level (reference value 20 uPa)
BT BlueTooth
AGC Adaptive Gain Control
DRC Dynamic Range Compressor
ALWE Noise suppressor algorithm
AEC Acoustic Echo Canseler
IMD Insert Moulded Decoration
SCO Syncronous Connection Oriented
LPRF Low Power Radio Frequency (BlueTooth)
PWM Pulse Width Modulated
Page 3-4 ãNokia Corporation. Original
NPE-4
PAMS Technical Documentation 3 - Audio System
Technical overview
Block Diagram
VAD
U-ALWE /
UDRC
Encoder
Decoder
VAD
D-ALWE /
DRC
UPP
UEM
AEC
Mic Equaliser
MICDATA
D
A
0-22.5dB
filter
Anti-alias
0 / 20 dB
MUX
AGC
Speech codec
Sidetone
SC DAC
Ear
Equaliser
EARDATA
A
D
6 dB
-30 - 0dB
MUX
Tone Generator
6 dB
PWM
PWM
DAI4 Mic
FBUS Tx
Vibra Driver
Buzzer Driver
DAI4 Ear
FBUS Rx
SCO Airlink
BT102
LPRF
CBUS
VIBRA
M
BUZZO
Figure 1. Audio Block diagram
HF
Boomer
+8.2 dB
HFCM
HookInt
MBUS
FBUS Tx
FBUS Rx
CARK-91
MIC1P
HP 1
MIC
MIC1N
MIC2P
MIC2N
HP 3
HP 2
MIC3N
MIC3P
HeadInt
LOOPSET
HEADSET /
EARP
EARPIECE
EARN
Original ãNokia Corporation. Page 3-5
NPE-4
3 - Audio System PAMS Technical Documentation
Part List
All involved key parts are listed in the following table. As seen in the table there is only
one vendor for some of the audio and vibration key components.
Table 1: Parts list
NAME OF THE
SUB-MODULE
Buzzer 1 MCC-03ACS STAR 5140209
Earpiece 2 TYPE: WD 00518/32 U
Earpiece 1 LT 201 KIRK Acoustics 5140233
Microphone assy 1 WM-64-HNY-310 MATSUSHITA 5140225
Vibrator 1 KHN4NB1H MATSUSHITA 6800043
Headset HDC 9P NMP
Loopset LPS-1 NMP
Carkit
- Handsfree unit
- Handsfree earpiece
- Microphone
- Handset unit
COMPONENT
DESIGNATION
CODE: 2403 252 08108
CARK-91
- HFU-2
- HFS-12
- HFM-8
- HSU-1
VENDOR
MATERIAL
CODE
PHILIPS Earpiece Systems 5140067
NMP
Bluuetooth Carkit
- Junction box
- Remote control button
- Handsfree earpiece
- Microphone
- Handset unit
Bluetooth headset HDW-1 NMP 0694064
UEM 4370805
UPP 4370815
Boomer LM4890 National semiconductors 4341221
System connector 5469061
CARK-112
- HFW-1
- CUW-2
- HFS-12
- HFM-8
- HSU-1
NMP 0750135
Page 3-6 ãNokia Corporation. Original
NPE-4
PAMS Technical Documentation 3 - Audio System
DC Characteristics
The audio relevant supply voltages are shown in the following table:
Table 2:
Line
Symbol
Vana 2.7 2.78 2.86 V (Mic bias buffer)
VBAT 3.1 (SW)
Vflash1 2.7 2.78 2.86 V (DLR3, HEADINT and HOOKINT pull
Vflash2 2.7 2.78 2.86 V (DLR3)
VIO 1.72 1.8 1.88 V (HOOKINT level shifter)
Minimum TYP. /
Nominal
0,005 80 mA Min. due to regulator stability
3.6 5.1 (SW)
(2.9 (HW))
0.005 70 mA Min. due to regulator stability
0.005 1.5 mA Sleep
0.005 40 mA Min. due to regulator stability
Maximum Unit Notes
(5.4 (HW))
Supply Voltages
V (Buzzer and Vibra driver). Min and
max due to SW cut off.
up)
Audio Function Description
Audio control
The audio control and processing is done by the UEM, which contains the audio codec
and the UPP contains DSP blocks, handling and processing the audio data signals.
The audio block diagram is presented in , page .
The UEM supports three microphone inputs and two earphone outputs. The inputs can be
taken from an internal microphone, a headset microphone or a handsfree-unit / Carkit
microphone. The microphone signals from different sources are connected to separate
inputs at the UEM ASIC. Inputs for the microphone signals are differential type.
MIC1 and EAR in/output are used for the internal microphone input and Earpiece output.
The Headset or handsfree unit / Carkit audio is connected to the MIC2 input / HF (single
ended) output. The MIC3/XEAR is connected to GND and not used in the NPE-4 project.
Input and output selection and gain control is performed inside the UEM ASIC (register
AudioCtrl (Gain and routing) and MicBias (microphone bias selection).
Additional gain is added in the DSP SW. This gain is controled by adaptive algorithms
(AGC, DRC, ALWE and AEC) and set as a function of background noise, signal level and
Original ãNokia Corporation. Page 3-7
NPE-4
3 - Audio System PAMS Technical Documentation
echo canceling.
In case of BT audio the BT accessory and the phone is connected by both an ACL and SCO
air link. ACL is used for connection commands and SCO for the actual audio transmission.
In both cases the BT module (in accessory and phone) receives the audio signal. In the
phone this signal is routed from BT module over LPRF to DSP where it follows the regular
audio path through out the rest of the system. The BT module and MCU is connected by
the CBUS for exchanging low level information.
All BT Gain adjustments are done in the accessory. DSP tuning is done in UPP, completely
as usually.
Gain Table
The possible gain for each input and output is shown in The gain settings are controlled
in the 16 bit AudioCtrlR register. Note * MIC3 only used for test purposes in NPE-4.. Table
4: Total UEM gain for each input and output in different audio paths (modes). contains
the total gain for each input and output in different audio modes.
The gain settings are controlled in the 16 bit AudioCtrlR register.
Table 3:
UEM Pins Gain (dB)
Input / Output Programmable Fixed UEM To ta l
MIC1 0 to 22.5, step 1.5dB 20 20 to 42.5, step 1.5dB
MIC2 0 to 22.5, step 1.5dB 0 or 20 0 to 22.5 or 20 to 42.5, step 1.5dB
MIC3* 0 to 22.5, step 1.5dB 0 or 20 0 to 22.5 or 20 to 42.5, step 1.5dB
HF (single ended) -30 to 0, step 2dB 6 -24 to 6, step 2dB
EAR -30 to 0, step 2dB 6 -24 to 6, step 2dB
Possible UEM gains for each input and output
Note * MIC3 only used for test purposes in NPE-4.
Table 4: Total UEM gain for each input and output in different audio paths (modes)
Gain Table Normal Mode - Gain dB
UEM Signals ¯Handportable Headset Handsfree (Carkit)
INPUTS MIC1 20 to 42.5, step 1.5dB
MIC2 20 to 42.5 step 1.5dB 0 to 22,5 step 1.5dB
MIC3
OUTPUTS EAR -24 to 6, step 2dB
HF -24 to 6, step 2dB -24 to 6, step 2dB
Page 3-8 ãNokia Corporation. Original
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PAMS Technical Documentation 3 - Audio System
Deviations in gain performance:
Transmit gain absolute accuracy: -1.0 / 0.0 dB
Transmit gain variation (temperature, supply): +/- 0,7 dB
Transmit gain variation with frequency (300 – 3000 Hz): +/- 0,5 dB
Transmit gain variation with signal level (> -50 dBm0): +/- 0,5 dB
(<-50 dBm0: +/- 1.2 dB)
Receive gain absolute accuracy: +/- 0,5 dB
Receive gain variation (temperature, supply): +/- 0,7 dB
Receive gain variation with frequency (100 – 3000 Hz): +/- 0,5 dB
Receive gain variation with signal level (> -50 dBm0): +/- 0,5 dB
(<-50 dBm0: +/- 1.2 dB)
DSP Gain:
Initially the DSP gain uplink (Mic) is set to 12 dB and 0 dB downlink. This is done in the
Equaliser.
The AGC controled by the DSP is able to reduce the Uplink gain in the UEM by 18 dB
maximum in steps of 1.5 dB.
The DRC can either attenuate the signal or enhance in it in DSP by up to 10 dB.
Note: Local mode gains are uptimised for production testing and are not the same as in
normal mode.
Internal Audio Devices
NPE-4’s internal audio design is described in the following sections.
Earpiece
Receiver solution is selected to be a Kirk Acoustic earpiece. Earpiece design is leak tolerant with a front protection cover directly on the earpiece component. The Earpiece will
be placed in a moulded rubber gasket which seals the front cavity to the IMD Window.
In front of the earpiece and leakholes a shielding material will be placed to prevent dust
particles to migrate onto the earpiece diaphragm. This material consists of a grid material type Saati PES 120/41 from Tradex (It is the same material as in Nokia 8210).
The earpiece is designed to be approved in type approval by type 3.2, low leak artificial
ear (Ear Simulator Type 4195, Low Leakage). No support for type 1 artificial ear is made
(Ear Simulator Type 4185).
Original ãNokia Corporation. Page 3-9
NPE-4
3 - Audio System PAMS Technical Documentation
Earpiece Acoustic Design
The earpiece is sealed to the front cover (IMD window) with a rubber gasket. The gasket
is fixed inside the A-cover by the vibra motor assembly.
The Earpiece and gasket is designed to seal perfectly against the front cover. There is no
well defined leakage as known from the NPE-3 project. This is done to have a better performance in the frequency area from 2 – 3.4 kHz and to prevent the possibility of an
acoustic feedback loop inside the phone mechanics.
There is no sealing between the earpiece and the PWB.
There are also holes through the PWB to make the design more leak tolerant by using the
volume between PWB and the B-cover.
A-Cover or window contains front and leakage holes. On the inside of the A-cover a dust
shield is placed. This shield covers both front and leakage holes.
Front Holes on A-Cover
Leakage Holes on A_Cover
Shielding material glued to A cover or IMD Window
Leakage Holes on PCB
Back Volume
Leakage Holes on PCB
Figure 2. Sketch of Earpiece Acoustic Design
Earpiece Front Volume
Leakage Between A_ and B_Covers
(Not well defined)
Opening Between
Earpiece and PCB
Page 3-10 ãNokia Corporation. Original
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