Nokia 6210 Service Bulletin

CONFIDENTIAL 1 (4)

Nokia Mobile Phones Service Bulletin No. SB-005/14.09.00
Technical Support, Europe & Africa

NPE-3

SPECIAL COMPONENT HANDLING

CSP - µBGA pac kages
MicroBGA (CSP) in NPE-3 products are moisture and electrostatic sensitive

components, which need to be handled in a special way. CSP components
soldering needs also special MicroBGA soldering station!!!

When any CSP components is replaced it must first be baked using a high
temperature device container at 125 Celsius for 24 hours prior to assembly. If
baking operation is not performed then the soldering process may not be
successful, and the CSP component might suffer internal stress, and
eventually break down.

Standby for soldering temperature in oven for CSP should be 60° C
continuously. Components should not be baked more than once if using the
high temperature bake of 125° C for 24 hours.

Spare parts stock of CSPs must be stored in a sealed ESD protected
(metallized) plastic bag and handled as electrostatic sensitive components.

They must be stored according to following requirements:
Relative Humidity: 15% - 70% RH0

Temperature: -5°C - +40°C
Sulphur dioxide average 0.3 mg/m3
Sulphured hydrogen average 0.1 mg/m3

CSP components have 12 months shelf life after sealing date in vacuum pack.
Precautions have to be taken when handling the component, like do not touch

the component with bare hands, and always wear a grounded wrist or leg
band.

Affected items (CSP packages) in NPE-3

NPE-3 SB-005

CODE DESCRIPTION
4340597 FLASH 2MX16 115NS 2.7V B3 UBGA48
4340787 SRAM 512KX8 100NS 2.7-3.3 CSP48
4370719 CCONT2I WFD163KG64T/8 LFBGA8X8
4370621 CHAPS V2.0 U423V20G36T LBGA6X6
4370643 Cobba_GJP BGA64
4370667 HAGAR 3 STTZA8HG80T LFBGA80

CONFIDENTIAL 2 (4)

Other packages (TSSOP, TQFP, SOT 23, SOT 323 … etc.)
All Surface Mounted components in NPE-3 must be handled as electrostatic

sensitive components. They must be stored in a sealed ESD protected
(metallized) plastic bag or in Tape and Reel and according to following
requirements:

Relative Humidity: 15% - 70% RH
Temperature: -5°C - +40°C
Sulphur dioxide average 0.3 mg/m3
Sulphured hydrogen average 0.1 mg/m3

Manual Hot Gas Soldering:

Max. air temperature: +270°C
Max. air velocity: 10m/s
Max. exposure time: 30s.

Manual Soldering with Soldering Iron:

Tip diameter: Selected to fit appli cati o n
Max. Tip temperature: +270°C
Max. exposure time: 5s

Do not touch the component directly with soldering iron.
Do not touch the component with bare hands, and always wear a grounded

wrist or leg band.
Affected items (for other packages than CSP packages):

CODE DESCRIPTION
4350223 VCO 3420-3840MHZ
4350219 PW AMP
4511095 SAW TX 900 U/U
4511185 SAW RX 900 U/U
4511129 SAW RX 1800 U/U
4550067 RX/TX Switch
4510261 VCTCXO 26MHz
4210271 GSM LNA transistor
4210275 PCN LNA transistor
4510293 CRYSTAL
4864291 LED
4864301 LED
5409145 SIM CONNECTOR
4850147 LCD-module
5140189 BUZZER+SPRING

NPE-3 SB-005