Nokia 500, RM-750 Service Manual

Nokia 5 00 (RM-75 0)
L1L2 Service Manual
1
Conf i dent ial | C opy rig ht © 2011 Nokia | All rights reserved
SERVICE MANUAL
Nokia 500
Transce iver characteristics Band
GSM EDGE 850/900/1800/1900 MHz
D isp la y
3,2” nHD capacitive touch TFT color display
Camera
5 megapixel full focus (EDOF) CMOS
Operating System
Connections
WLAN 802.11 b/g
Transceiver with BL-4U battery pack
Ta lk time
Standby
GSM: Up to 7 hours WC D M A:
GSM: Up to 500 hours WC D M A:
Note:
Talk times are dependent on network parameters
Level 1&2
RM-750
WCDMA 850/900/1700/1900/2100 MHz
640x36 0 pixel resolution 16:9 aspect ratio
Symbian Anna
Bluetooth 2.1 Integ rated A-GPS
3.5 mm AV connector
Up to 5 ho urs
Up to 455 hours
and phone settings
Nokia 5 00 (RM-75 0)
L1L2 Service Manual
2
Conf i dent ial | C opy rig ht © 2011 Nokia | A ll rights reserved
Table of contents
1. COPYRIGHT .......................................................................................................................................................................... 4
2. WAR NINGS AND CAUTI ONS ............................................................................................................................................. 5
2.1 WARNINGS................................................................................................................................................................. 5
2.2 CAUTIONS................................................................................................................................................................... 5
3. ESD PROTECTION ............................................................................................................................................................... 6
4. CARE AND MAI NTENAN CE ................................................................................................................................................ 7
5. BATTERY INFORMATION................................................................................................................................................... 8
6. EXPLODED VI EW ................................................................................................................................................................. 9
7. SERVI CE DEVIC ES ................................................................................................................................................................ 10
8. SOFTWARE UPD ATE........................................................................................................................................................... 11
9. DISASSEMBLY I NSTRUCTIONS ......................................................................................................................................... 12
10. ASS E MB LY HI NTS................................................................................................................................................................ 18
11. SOLDER COMPONENTS ...................................................................................................................................................... 19
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