Nokia 450 RF Block

After Sales Technical Documentation

THF–9 Series Transceivers
Chapter 1
RF Block
Original 49/96
THF–9
After Sales
Technical Documentation

CONTENTS

System Module GP3 4 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Section 4 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External and Internal Connectors 4 – 4. . . . . . . . . . . . . . . . . . . . . . . . . .
Bottom Connector X120 4 – 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UIF connector X130 4 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Signals 4 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Module 4 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Summary 4 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 4 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation 4 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings 4 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics 4 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CTRLU 4 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 4 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CTRLU Internal Signals, Inputs 4 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . .
CTRLU Internal Signals, Outputs 4 – 12. . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description 4 – 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main Components 4 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Controller Ports 4 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWRU 4 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 4 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWRU Internal Signals, Inputs 4 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWRU Internal Signals, Outputs 4 – 18. . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description 4 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram of MUUMI 4 – 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main Components 4 – 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio 4 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main features 4 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 4 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio Internal Signals, Inputs 4 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio Internal Signals, Outputs 4 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin list of NIPA 4 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description 4 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmit (TX) Audio Signal Path 4 – 27. . . . . . . . . . . . . . . . . . . . . . . . . .
Receive (RX) Audio Signal Path 4 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . .
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After Sales
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Technical Documentation
RF Module 4 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 4 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation 4 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Signals and RF/System Block Interface 4 – 31. . . . . . . . . . . . .
Software Compensation Algorithms 4 – 32. . . . . . . . . . . . . . . . . . . . . . . .
RSSI vs. Temperature and Channel 4 – 32. . . . . . . . . . . . . . . . . . . . . . . .
Receiver Automatic Gain Control (AGC) 4 – 32. . . . . . . . . . . . . . . . . . . .
Current Consumption 4 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 4 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver 4 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizers 4 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter 4 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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THF–9
After Sales

System Module GP3

Introduction

GP3 is the baseband/RF module of the THF–9 cellular tranceiver. The GP3 module carries out all the system and RF functions of the tranceiver. The system module GP3 is designed for a handportable phone, that oper­ates in the NMT 450i system.

Technical Section

All functional blocks of the system module are mounted on a single multi layer printed circuit board. The chassis of the radio unit contains separat­ing walls for baseband and RF. All components of the baseband are sur­face mountable. The connections to accessories are fed through the bot­tom connector of the radio unit. The connections to user interface –mod­ule (UIF) are fed through board to board connector. There is no physical connector between RF and baseband.
Technical Documentation

External and Internal Connectors

The system module has two connector, external bottom connector and internal UIF module connector.
Bottom Connector X120
4
Battery connector
3
2
X120
1
4
Charging connector
3
2
Antenna connector
2
1
16
System connector
9 18
1
1
21
X130
UIF module connector
D0000323
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Original 49/96
After Sales
THF–9
Technical Documentation
System Connector
Signal Name Pin Notes
GND 1, 3, 9 Power supply ground. XMIC 2 External audio input from accessories
or handsfree microphone. There is a pulldown resistor to turn the booster on.
M2BUS 5 Serial bidirectional data and control be-
tween the handphone and accessories. A 10k pull–up resistor in HP.
HOOK 6 HOOK–indication. The phone has a
100k pull–up resistor. PHFS 7 Hands–free device power on/off. XEAR 10 External audio output to accessories
or handsfree speaker.
There is a 100k pull–down to turn on
the junction box.
BGND BGND Battery connector BTEMP BTEMP Battery connector, Battery temperature BSI BSI Battery connector VBAT B+ Battery connector VCS 8,16,CH+,
DC+ RFOUT RFOUT To duplex filter RF RF From antenna RFGND RFGND Ground for antenna
Battery charging voltage
Original 49/96
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THF–9
After Sales
RF Block
UIF connector X130
Signal Name Pin Notes
VL3 1 Logic supply voltage 4.75V GND 2, 29 Ground VBAT 3, 30 Battery voltage LIGHTS 4 Backlights on/off UIF(0:3) 5 – 8 Parallel data for LCD driver UIF(4:5) 9 – 10 Lines for keyboard read and LCD con-
troller data LCD_RW 9 LCD Driver read/write selection input LCD_RS 10 LCD Driver register selection input XLCDEN 11 LCD Driver chip select ROW2 12 Line for keyboard read
Technical Documentation
XPWROFF 13 Power off control COL(0:3) 13 – 16 Lines for keyboard write CALL_LED 17 Call led enable MICP 18 Microphone (positive node) MICN 19 Microphone (negative node) EARP 20 Earpiece (positive node) EARN 21 Earpiece (negative node) BUZZER 22 Buzzer control XPWRON 23 Power on control from keyboard ROW0 24 Line for keyboard read LCDCLK 25 Clock signal for display ROW1 26 Line for keyboard read ROW3 27 Line for keyboard read
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Original 49/96
After Sales
bits/s HP
ing con
THF–9
Technical Documentation

Control Signals

Pin /
Conn.
5/system M2BUS
6/system HOOK
7/system PHFS
Line Symbol Min Typ /
Max Description
Nom
0V 0.7V Input low level
2.3V 5.25VInput high level
0V 0.2V 0.35VOutput low level
4.1V 4.5V 5.0V Output high level 0V 0.7V Input low level
2.3V 3.5V Input high level 0V 0.2V 0.4V Output low, power
off
4.1V 4.5V 5.0V Output high, power on
RF Block
Isink<5m ABaud rate 9600
.
Hook
HF de­vice pow­er on/off
8, 16/sys­tem
2/battery BSI
3/battery BTEMP 1.0V A 15k NTC between BTEMP
4/UIF LIGHTS
9–10/UIF UIF(4:5)
VCS
11V 12V 13V Isink < 730mA 730mA800mA870mAUin < 11V
503m V
1.19V 1100mAh NiCd
1.65 V 1500mAh NiMH
0V 0.4V Output low, back-
2.8V 3.3V Output high, back-
0V 0.7V Input low
2.3V 3.6V Input high
500mAh NiMH
and ground in battery pack. A 33k pull–up resistor in HP.
Vibrator control output (AC– controlled)
lights off
lights on
A 100k pull–up resistor in
.
Back­light–
­trol for keymat
Keypad input
5–11/UIF
12/UIF ROW2
Original 49/96
0V 0.4V Output low
2.3V 3.3V Output high 0V 0.7V Input low
2.8V 3.3V Input high
Output for LCD
Keypad input
Page 1 – 7
THF–9
After Sales
RF Block
MinLine SymbolPin /
Conn.
13–16/UIFCOL(0:3) 0V 0.7V Output low Keypad
17/UIF CALL_LED
22/UIF BUZZER
24/UIF ROW0
26/UIF ROW1
0V 0.4V Output low, call led
2.8V 3.3V Output high, call
0V 0.4V Output low, buzzer
2.8V 3.3V Output high, buzz-
0V 0.7V Input low
2.8V 3.3V Input high 0V 0.7V Input low
2.8V 3.3V Input high
Nom
off
led on
on
er off
Technical Documentation
DescriptionMaxTyp /
output
Keypad input
Keypad input
27/UIF ROW3
0V 0.7V Input low
2.8V 3.3V Input high
Keypad input
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Original 49/96
After Sales
THF–9
Technical Documentation

Baseband Module

Introduction

Baseband module controls the internal operation of the phone. It controls the user interface, i.e. LCD driver, keyboard and audio interface functions. The module performs all signalling towards the system and carries out audio–fre­quency signal processing. In addition, it controls the operation of the trans­ceiver and stores tuning data for the phone.

Technical Summary

All functional blocks of the baseband are mounted on a single multi layer printed circuit board. This board contains also RF–parts. The chassis of the radio unit contains separating walls for baseband and RF. All components of the baseband are surface mountable. They are soldered using reflow . The connections to accessories are fed through the bottom connector of the ra­dio unit. The connections to User Interface –module (UIF) are fed through a board to board connector . There is no physical connector between RF and baseband.
RF Block
List of submodules CTRLU Control Unit for the phone
PWRU Power supply AUDIO Audio RX Receiver TX Transmitter SYNT Synthesizer
These blocks are only functional blocks and therefore have no type nor material codes.

Technical Specifications

Modes of Operation
The module has three operating modes: stand–by ,listening and the con­versation mode.
Standby mode:
CPU‘s clock is switched off, only NIPA timer is running to take care bat­tery save timings.
If charger is connected CPU‘s clock doesn‘t go to standby mode.
Original 49/96
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THF–9
After Sales
RF Block
Listening mode:
In the listening mode some blocks of the audio IC (NIPA) are in standby state.
Conversation mode:
In the conversation mode all ICs are active.
Maximum Ratings
Operating ambient temperature range: –25 ... +55 °C. Storage temperature range: –40 ... +85 °C. VBAT max. 8.6 V (TX off) 7.5 V (TX on) VCS max. 11.6 V.
Charging of the batteries is possible only in temperature range +5 ... +45 °C.
Technical Documentation
DC Characteristics
Pin / Conn. Line Symbol Minimum Typical /
Nominal
VCS
VBA T 5.3V 6.0V 8.8V VRF 5.3V 6.0V 8.8V VBAT for RF mod-
VA 3.2V 3.3V 3.42V Imax = 40mA VL 3.2V 3.3V 3.42V Imax = 20mA VL2 3.2V 3.3V 3.42 Imax = 20mA VL3 4.5V 4.75V 5.0V Imax = 180mA VL4 3.8V 4.1V 4.6V Imax = 40mA VREF 3.2V 3.3V 3.42V Imax = 5mA
11.0V 12.0V 13.0V chargers 730mA 800mA 870mA
Maximum Unit / Notes
ule
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Original 49/96
After Sales
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Technical Documentation

CTRLU

Introduction

The Control block controls all phones functions and it includes modem and SIS–processor too.

Technical Specifications

CTRLU Internal Signals, Inputs
Signal Description From
VL2 Logic supply voltage, 3.3V. PWRU VL3 Logic supply voltage, 4.75V. PWRU VL4 Supply voltage for SIS processor. PWRU VREF Reference voltage 3.3V 3%. Max. PWRU XRES Reset line from MUUMI PWRU PWRON Power on signal from MUUMI PWRU VCHARG Charger voltage to A/D converter PWRU VBATSW Battery voltage to A/D converter. VCHARG CLKMCU Clock signal from NIP A. AUDIO NMI No maskable Interrupt reques from NIPA AUDIO XINT Interrupt reques from NIPA. AUDIO HOOK HOOK–indication SYSTEM BTEMP Battery temperature SYSTEM BSI Battery size indication SYSTEM M2BUS Serial interface SYSTEM RFTEMP RF temperature SYNT RSSI Received signal strenght indication RX TXI Transmitter output power level indication TX XPWRON Power buttom from UIF. UIF ROW0 Line for keyboard read. UIF ROW1 Line for keyboard read. UIF ROW2 Line for keyboard read. UIF ROW3 Line for keyboard read. UIF
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