Netgear AXM751 Data Sheet

10GBASE-SR XFP
Optical Transceiver

AXM751

350 E. Plumeria Drive
San Jose, CA 95134-1911 USA
1-888-NETGEAR (638-4327)
E-mail: [e-mail]
www.NETGEAR.com

AXM751

10GBASE-SR XFP Optical Transceiver

FEATURES

 RoHS compliant

 850nm Vertical Cavity Surface Emitting Laser

(VCSEL) light source

 Standard LC duplex fiber-optic connector

 Compliant with XFP MSA

2

 I

C for integrated Digital Optical Monitoring

 Power consumption <1.37 W

 User friendly Plug-and-play style "Hot Swap"

 Small footprint which enables high board

density

 XFI high speed I/O electrical interface

 Integrated signal conditioner to extend

200mm FR4 PCB trace signaling

Description

The AXM751 is a hot pluggable 10Gbps

small form factor transceiver module integrated

with the high performance 850nm VCSEL

transmitter, high sensitivity PIN receiver and

signal conditioner for 10Gbps applications. It is

compliant with the INF-8077i XFP Multi-source

Agreement (MSA).

The AXM751 is designed to be compliant

with INF-8077i XFP Multi-source Agreement

(MSA) with five digital monitoring functions:

Temperature, Vcc, Tx optical power, TX laser

bias current and RX received optical power.

Application

 10G LAN switch

 10G Ethernet switch/router

 10G Fiber channel

 SAN applications

1 Revision: S3.0

Ambient Humidity

AXM751

1. Absolute Maximum Ratings

Parameter Symbol Min Typ Max Units Notes

Storage Temperature TS -40 85 °C

Storage Ambient Humidity

+5V Power Supply V

+3.3V Power Supply V

HA 5 90 %

0 6.0 V

CC5

0 3.6 V

CC3

2. Recommended Operating Conditions

Parameter Symbol Min Typ Max Units Notes

Operating Ambient
Temperature

T

0 70 °C

A

HA 5 85 % [1]
+3.3V Power Supply V
+5V Power Supply V

+3.3V Supply Current I
+5V Supply Current I

3.135 3.3 3.465 V

CC3

4.75 5 5.25 V

CC5

270 350 mA

VCC3

10 30 mA

VCC5

Total Power Dissipation PD 1.37 W

Differential TX Data Input TD+ - TD- 150 500 1000 mVp-p

[2,3]

Differential RX Data Output RD+ - RD- 500 650 800 mVp-p

Notes:

1. Non-condensing

2. The data rate of input data is 10.3125Gb/s

3. Input voltage swing (differential) measured peak-to-peak

4. Output voltage swing (differential) measured peak-to-peak

[4]

ASIC / SerDes

XFP

10Gbps optical signal 10Gbps XFI electrical signal 10Gbps XFI electrical signal

Application Block Diagram

2 Revision: S3.0

XFP

ASIC / SerDes

Average Output Power

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

3. Optical Transmitter Characteristics

(TA=0 ºC to 70 ºC)

AXM751

Parameter Symbol

Data Rate R 10.3125 Gb/s
Signaling speed variation from
nominal

P
Wavelength
Spectral Width RMS 0.45 nm
Transmitter OFF Output Power P
Extinction Ratio ER 3.0 dB
Optical Modulaion Amplitude OMA Compliant with Minimum OMA relation table dBm
Relative Intensity Noise
Optical Return Loss Tolerance

Transmitter eye mask definition
{X1, X2, X3, Y1, Y2, Y3}

-5 -1.8 dBm

avg

λ

off

RIN12OMA

ORLT

Min Typ Max Units Notes

±100

840 860 nm

-30 dBm

-128
12

{0.25, 0.40, 0.45, 0.25, 0.28, 0.40}

Transmitter eye mask definition

ppm

dB/Hz

dB

Minimum optical modulation amplitude (dBm) relation table

Center

Wavelength

Up to

0.05 to

0.1 to

RMS Specrtal width (nm)

0.15 to

0.2 to

0.25 to

0.3 to

0.35 to

(nm)

840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8

842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9

844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9

846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9

848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0

850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0

852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1

854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1

856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1

858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2

Triple tradeoff curve

3 Revision: S3.0

0.4 to

12

10

−

AXM751

4. Optical Receive Characteristics

Parameter Symbol Min Typ Max Units Notes

Signaling speed (nominal) Ts 10.3125 Gb/s
Signaling speed variation from
nominal
Center Wavelength
Overload PO -1 dBm
Receiver sensitivity in OMA RSO -11.1 dBm [1]
LOS De-assert LOSD -13 dBm
LOS Assert LOSA -30 dBm [2]

LOS Hysteresis

Receiver Reflectance
Stressed Receive sensitivity
OMA

Notes:

1. Measured by reference TX with 4.75dB extinction ratio at

2. When LOS asserted, the data output is Low-level (fixed)

3. When the terminal is viewed from the optical path, the reflection toward the optical path of the optical
signal with a central wavelength of 840nm to 860nm transmitted to terminal.

LOS

(TA=0 ºC to 70 ºC)

λ

–LOS

D

840 860 nm

0.5

A

BER

±100

-12

-7.5

ppm

dB
dB

dBm

[3]

5. XFI Module Receiver Output Jitter Specifications at C’

Parameter – C’ Symbol Min Typ Max Units Notes

4 Revision: S3.0

Deterministic Jitter DJ 0.18 UI (p-p) [1]

Total Jitter TJ 0.34 UI (p-p) [1]

X1 0.17 UI

Eye Mask

Notes:

1. Includes jitter transferred from the optical receiver during any valid operational input condition.

XFI Module Receiver Differential Output Compliance Mask

X2 0.42 UI
Y1 170 mV
Y2 425 mV

AXM751

XFI Termination and AC Coupling

5 Revision: S3.0

6. Pin Description

AXM751

XFP Host Board Connector Pad Layout (Top View)

Recommended Host Board Supply Filtering Network

6 Revision: S3.0

11

13

14

15

17

20

27

28

Module Electrical Pin Function Definition

AXM751

Pin

1 GND Module Ground [1]

2 VEE5 Optional -5.2V Power Supply --Not Required

3 LVTTL-I Mod_DeSel

4 LVTTL-O Interrupt Bar

5 LVTTL-I TX_DIS Transmitter Disable; Turns off transmitter laser output

6 VCC5 +5V Power Supply

7 GND Module Ground [1]

8 VCC3 +3.3V Power Supply

9 VCC3 +3.3V Power Supply

10 LVTTL-I/O SCL 2-Wire Serial Interface Clock [2]

12 LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the Module [2]

16

18

19

21

22

23

24

25

26

29

30

Notes:

1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.

2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board.

Logic Symbol Name/Description Note

Module De-select; When held low allows module to respond to

2-wire serial interface

Interrupt Bar; Indicates presence of an important condition

which can be read over the 2-wire serial interface

LVTTL-I/O SDA 2-Wire Serial Interface Data Line [2]

LVTTL-O Mod_NR Module Not Ready; Indicating Module Operational Fault [2]

LVTTL-O RX_LOS Receiver Loss Of Signal Indicator [2]

GND Module Ground [1]

GND Module Ground [1]

CML-O RD- Receiver Inverted Data Output

CML-O RD+ Receiver Non-Inverted Data Output

GND Module Ground [1]

VCC2 +1.8V Power Supply --Not Required

Power down; When high, requires the module to limit power

LVTTL-I P_Down/RST

VCC2 +1.8V Power Supply --Not Required

GND Module Ground [1]

PECL-I RefCLK-

PECL-I RefCLK+

GND Module Ground [1]

GND Module Ground [1]

CML-I TD- Transmitter Inverted Data Input

CML-I TD+ Transmitter Non-Inverted Data Input

GND Module Ground [1]

consumption to 1.5W or below. 2-Wire serial interface must be

functional in the low power mode.

Reference Clock Non-Inverted Input, AC coupled on the host board,

Not required

Reference Clock Inverted Input, AC coupled on the host board,

Not required

7 Revision: S3.0

[2]

AXM751

7. Low Speed Electrical Hardware Pins

In addition to the 2-wire serial interface the XFP module has the following low speed pins for control and status:

‧ Mod_NR

‧ Mod_DeSel

‧ Interrupt

‧ TX_DIS

‧ Mod_ABS

‧ RX_Los

‧ P_Down/RST.

1 MOD_NR

The Mod_NR is an output pin that when High, indicates that the module has detected a condition that renders

transmitter and or receiver data invalid, shall consist of logical OR of the following signals:

‧ Transmit Signal Conditioner Loss of Lock

‧ Transmitter Laser Fault

‧ Receiver Signal Conditioner Loss of Lock

2 MOD_DESEL

The Mod_DeSel is an input pin. When held Low by the host, the module responds to 2-wire serial communication

commands. The Mod_DeSel allows the use of multiple XFP modules on a single 2-wire interface bus.

When the Mod_DeSel pin is “High”, the module shall not respond to or acknowledge any 2-wire interface

communication from the host. Mod_DeSel pin must be pulled to VCC3 in the module.

In order to avoid conflicts, the host system shall not attempt 2-wire interface communications within the Mod_DeSel

assert time after any XFP modules are deselected. Similarly, the host must wait at least for the period of the

Mod_DeSel deassert time before communicating with the newly selected module. The assertion and de-assertion

periods of different modules may overlap as long as the above timing requirements are met.

3 INTERRUPT

Interrupt is an output pin. When “Low”, indicates possible module operational fault or a status critical to the host

system. The Interrupt pin is an open collector output and must be pulled up to Host_Vcc the host board.

4 TX_DIS

TX_DIS is an input pin. When TX_DIS is asserted High, the XFP module transmitter output must be turned off. The

TX_DIS pin must be pulled up to VCC3 in the XFP module.

5 MOD_ABS

Mod_ABS is pulled up to Host_Vcc on the host board and grounded in the XFP module. Mod_ABS is then asserted

“High” when the XFP module is physically absent from a host slot.

6 RX_LOS

The RX_LOS when High indicates insufficient optical power for reliable signal reception. The RX_LOS pin is an open

collector output and must be pulled up to Host_Vcc on the host board.

8 Revision: S3.0

AXM751

7 P_DOWN/RST

This is a multifunction pin for module Power Down and Reset. The P_Down/RST pin must be pulled up to VCC3 in the

XFP module.

7.1 POWER DOWN FUNCTION

The P_Down pin, when held High by the host, places the module in the standby (Low Power) mode with a maximum

power dissipation of 1.5W.

7.2 RESET FUNCTION

The negative edge of P_Down/RST signal initiates a complete module reset.

9 Revision: S3.0

8. Memory Map of Management Interface

AXM751

The lower memory table (Byte 0~127) is for digital diagnostics and control functions. Besides, it has

been allocated three upper memory tables for serial ID, user writable and vendor specific functions. The

detail definition of memory content is listed as following table.

10 Revision: S3.0

AXM751

9. EEPROM Serial ID Memory Contents (2-Wire Address A0h)

Address Hex ASCII Address Hex ASCII Address Hex ASCII

128 06 171 37 7 214 DC
129 10 172 35 5 215 DC
130 07 173 31 1 216 DC
131 80 174 20 217 DC
132 00 175 20 218 DC
133 00 176 20 219 DC
134 00 177 20 220 08
135 00 178 20 221 60
136 00 179 20 222 67
137 00 180 20 223 Note 4
138 00 181 20 224 VS Note 5
139 90 182 20 225 VS
140 64 183 20 226 VS
141 68 184 41 227 VS
142 00 185 20 228 VS
143 96 186 42 3 229 VS
144 52 187 68 230 VS
145 21 188 07 231 VS
146 00 189 D0 232 VS
147 00 190 46 233 VS
148 4E N 191 Note 1 234 VS
149 45 E 192 44 235 VS
150 54 T 193 82 236 VS
151 47 G 194 03 237 VS
152 45 E 195 00 238 VS
153 41 A 196 SN Note 2 239 VS
154 52 R 197 SN 240 VS
155 20 198 SN 241 VS
156 20 199 SN 242 VS
157 20 200 SN 243 VS
158 20 201 SN 244 VS
159 20 202 SN 245 VS
160 20 203 SN 246 VS
161 20 204 SN 247 VS
162 20 205 SN 248 VS
163 20 206 SN 249 VS
164 C1 207 SN 250 VS
165 00 208 SN 251 VS
166 00 209 SN 252 VS
167 00 210 SN 253 VS
168 41 A 211 SN 254 VS
169 58 X 212 DC Note 3 255 VS
170 4D M 213 DC

Notes:

1) CC_BASE : Check code for Base ID Fields (address 120~190)

2) Vendor SN (address 196–211)

3) Date Code (address 212–219)

CC_EXT : Check code for Extended ID Fields (address 192~222)

4)

5) Address 224~255 is reserved for vendor specific EEPROM

11 Revision: S3.0

10. Digital Diagnostic Monitoring Interface

Alarm and Warning Thresholds (2-Wire Address A0h)

AXM751

Address

01 1
02–03 2
04–05 2
06–07 2
08–09 2
10–17 8
18–19 2
20–21 2
22–23 2
24–25 2
26–27 2
28–29 2
30–31 2
32–33 2
34–35 2
36–37 2
38–39 2
40–41 2
42–43 2
44–45 2
46–47 2
48–49 2
50–51 2
52–53 2
54–55 2
56–57 2

96 1

97 1
98–99 10

100
101
102
103
104
105
106
107
108
109

#

Bytes

1
1
1
1
1
1
1
1
1
1

Name Value (Dec.) Unit

Signal Conditioner Control
Temp High Alarm 85
Temp Low Alarm -10
Temp High Warning 80
Temp Low Warning -5
Reserved
Bias High Alarm
Bias Low Alarm
Bias High Warning
Bias Low Warning
TX Power High Alarm
TX Power Low Alarm
TX Power High Warning
TX Power Low Warning
RX Power High Alarm
RX Power Low Alarm
RX Power High Warning
RX Power Low Warning
AUX 1 High Alarm
AUX 1 Low Alarm
AUX 1 High Warning
AUX 1 Low Warning
AUX 2 High Alarm
AUX 2 Low Alarm
AUX 2 High Warning
AUX 2 Low Warning
Temperature MSB
Temperature LSB
Reserved
TX Bias MSB
TX Bias LSB
TX Power MSB
TX Power LSB
RX Power MSB
RX Power LSB
AUX 1 MSB(5V)
AUX 1 LSB (5V)
AUX 2 LSB (3.3V)
AUX 2 LSB (3.3V)

Notes:

1) P: Operating optical power of transmitter at room temperature

Iop+10 mA

Iop-5 mA

Iop+7 mA

Iop-3 mA

P+3
P –3
P +2
P –2

0

-13.1

-1

-11.1

5.5

4.5

5.3

4.7

3.6

3.0

3.5

3.1

℃

mA

dBm

dBm

Volt

Volt

12 Revision: S3.0

General State/ Control Bits

Byte Bit Name Description

1 0
1 1
1 2

1 4-7
110 7 Tx Disable State Digital state of the Tx disable input pin
110 6 Optional Soft TX Disable Read/ Write bit that allow software disable of laser
110 5 MOD_NR State Digital state of Module Not Ready
110 4 P-Down State Digital state Power Down
110 3

110 2

110 1 LOS Digital state of the LOS output pin.
110 0 Data_Not_Ready Digital state of Data_Not_Ready
111 7
111 6
111 5
111 4
111 3

119–122

123–126

127 All

Signal Conditioner Control
XFI Loopback
Lineside Loopback
Data Rate Control

Soft P_Down

_____________

Interrupt

TX_NR State
TX_Fault State
TX_CDR not Locked
RX_NR State
RX_CDR not Locked
New Password Entry

All

Password Entry

All

Table Select

Default value of this bit is 0
XFI loopback enable when this bit set to 1
Not Implement
Default setting is 10.3Gbps

Software Power Down
Interrupt Bar State

Digital state of Tx Not Ready State
Digital state of Tx Fault State
Digital state of Tx CDR not Locked
Digital state of Rx Not Ready
Digital state of Rx CDR not Locked
Location for Entry of New Optional Password
Location for Entry of Optional Password
Entry Location for Table Select Byte

AXM751

Optional Set of Alarm and Warning

Byte Bit Name Description

80 7 Temp High Alarm Set when internal temperature exceeds high alarm level
80 6 Temp Low Alarm Set when internal temperature is below low alarm level
80 5 Reserved
80 4 Reserved
80 3 Tx Bias High Alarm Set when Tx Bias current exceeds high alarm level
80 2 Tx Bias Low Alarm Set when Tx Bias current is below low alarm level
80 1 Tx Power High Alarm Set when Tx output power exceeds high alarm level
80 0 Tx Power Low Alarm Set when Tx output power is below low alarm level
81 7 Rx Power High Alarm Set when received power exceeds high alarm level
81 6 Rx Power Low Alarm Set when received power is below low alarm level
81 5 AUX1 High Alarm Set when internal 5V supply voltage exceeds high alarm level
81 4 AUX1 Low Alarm Set when internal 5V supply voltage is below low alarm level

81 3 AUX2 High Alarm

81 2 AUX2 Low Alarm

81 1 Reserved
81 0 Reserved
82 7 Temp High Warning Set when internal temperature exceeds high warning level
82 6 Temp Low Warning Set when internal temperature is below low warning level
82 5 Reserved
82 4 Reserved
82 3 Tx Bias High Warning Set when Tx Bias current exceeds high warning level
82 2 Tx Bias Low Warning Set when Tx Bias current is below low warning level
82 1 Tx Power High Warning Set when Tx output power exceeds high warning level
82 0 Tx Power Low Warning Set when Tx output power is below low warning level

Set when internal 3.3V supply voltage exceeds high alarm
level
Set when internal 3.3V supply voltage is below low alarm
level

13 Revision: S3.0

83 7 Rx Power High Warning Set when received power exceeds high warning level
83 6 Rx Power Low Warning Set when received power is below low warning level

83 5 AUX1 High Warning

83 4 AUX1 Low Warning

83 3 AUX2 High Warning

83 2 AUX2 Low Warning

83 1 Reserved
83 0 Reserved

Set when internal 5V supply voltage exceeds high warning
level
Set when internal 5V supply voltage is below low warning
level
Set when internal 3.3V supply voltage exceeds high warning
level
Set when internal 3.3V supply voltage is below low warning
level

AXM751

14 Revision: S3.0

11. Mechanical Outline Dimensions

Transmitter Wavelength / Application Latch Color Identifier

850nm / SR

AXM751

Beige

Complies with

AXM751

Multi Mode/850nm 10Gbps

10GBase-SR

21 CFR 1040.10

and 1040.11

Made in Taiwan

272-10563-01

R

15 Revision: S3.0

AXM751

12. Regulatory Compliance

Feature Test Method Reference Performance

Electrostatic Discharge

(ESD) to the Electrical

Pins

(ESD) to the Duplex LC

Receptacle

Radio Frequency

Electromagnetic Field

Immunity

Electromagnetic

Interference (EMI)

Laser Eye Safety

Component Recognition

Human Body Model

(HBM)

Machine Model (MM)

Contact Discharge IEC/EN 61000-4-2 Electrostatic Discharge

Air Discharge

IEC/EN 61000-4-3

FCC Part 15 Class B

FDA/CDRH

TUV

TUV

UL/CSA

MIL-STD-883E Method 3015.7

EIA-JESD22-A114

EIA-JESD22-A115

IEC/EN 61000-4-2

EN 55022 Class B

(CISPR 22A)

FDA 21CFR 1040.10, 1040.11

IEC/EN 60825-1

IEC/EN 60825-2

IEC/EN 60950

UL 60950

(1) Satisfied with

electrical

characteristics of

product spec.

(2) No physical damage

CDRH File # 0420993

TUV Certificate #

R50067719

UL File # E239394

16 Revision: S3.0

Appendix A. Document Revision

AXM751

Version No.

S0 2006-04-25 Preliminary datasheet for RoHS version
S1 2006-06-16 Update product label and safety description

S2 2006-08-25

S3 2007-09-27 1.Change the label dimension

Date Description

1. Update Digital Diagnostic Memory Map contents

2. Update module characteristics and Latch Color

17 Revision: S3.0

© 2008 NETGEAR, Inc. NETGEAR, the NETGEAR Logo, NETGEAR Digital Entertainer Logo, Connect with Innovation,
FrontView, IntelliFi, PowerShift, ProSafe, RAIDar, RAIDiator, X-RAID, RangeMax, ReadyNAS and Smart Wizard are trademarks of
NETGEAR, Inc. in the United States and/or other countries. Other brand names mentioned herein are for identification purposes
only and may be trademarks of their respective holder(s). Information is subject to change without notice. All rights reserved.
D-AXM751-0