NEC V850-SV1 User Manual

Page 1
User’s Manual
IE-703040-MC-EM1
In-circuit Emulator Option Board
Target device
V850/SV1™
Document No. U14337EJ1V0UM00 (1st edition) Date Published August 1999 N CP(K)
1999
1991©
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[MEMO]
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User’s Manual U14337EJ1V0UM00
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V850 Family and V850/SV1 are trademarks of NEC Corporation. Windows is either a trademark or a registered trademark of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. Ethernet is a trademark of Xerox Corporation. UNIX is a registered trademark in the United States and other countries, licensed exclusively through X/Open Company Limited.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or of others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
M7A 98. 8
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Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290
NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
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INTRODUCTION

Target Readers
Purpose
Organization
How to Read This Manual
This manual is intended for users who design and develop application systems using the V850/SV1™.
The purpose of this manual is to describe the proper operation of the IE-703040-MC­EM1 and its basic specifications.
This manual is divided into the following parts.
• Overview
• Names and functions of components
• Cautions
It is assumed that the reader of this manual has general knowledge in the fields of electrical engineering, logic circuits, and microcontrollers. The IE-703040-MC-EM1 is used connected to the IE-703002-MC in-circuit emulator. This manual explains the basic setup procedure and switch settings of the IE­703002-MC when it is connected to the IE-703040-MC-EM1. For the names and functions of parts, and the connection of elements, refer to the
Manual (U11595E)
.
IE-703002-MC User’s
To learn about the basic specifications and operation methods
Read this manual in the order of the
CONTENTS
.
Conventions
Terminology
To learn the operation methods and command functions, etc., of the IE-703002-MC and IE-703040-MC-EM1
Read the user’s manual of the debugger (sold separately) that is used.
Note: Footnote for item marked with
Note
in the text Caution: Information requiring particular attention Remark: Supplementary information Numeral representation: Binary … xxxx or xxxxB
Decimal … xxxx Hexadecimal … xxxxH
Prefix indicating the power of 2 (address space, memory capacity):
10
K (kilo): 2 M (mega): 220 = 1024
= 1024
2
The meanings of terms used in this manual are listed below.
Target device The device that is targeted for emulation. Target system The system (user-built system) that is targeted for debugging. This
includes the target program and user-configured hardware.
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Related Documents
When using this manual, refer to the following manuals. The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such.
{
Documents related to development tools (user’s manuals)
Document Name Document
Number IE-703002-MC U11595E IE-703040-MC-EM1 This manual CA830, CA850 (C Compiler package)
CA850 (C Compiler package) Assembly Language U13828E ID850 (Ver.1.31) (Integrated debugger) Operation Windows-based U13716E ID850 (Ver.2.00 or more)
(Integrated debugger) SM850 (Ver.2.00 or more)
(System simulator)
RD850 (Task debugger) RD850 (Ver.3.0) (Task debugger) Windows-based U13737E RD850 Pro (Ver.3.0) (Task debugger) Windows-based U13916E AZ850 (System performance analyzer) U11181E
Note
Operation Windows-based U13998E C language U13997E Project manager U13996E
Operation Windows-based U14217E
Operation Windows-based U13759E
Basics U13430ERX850 (Real-time OS) Installation U13410E Fundamental U13773ERX850 Pro (Real-time OS) Installation U13774E Windows-based U11158E
For ID850 (Ver. 1.31 only)
Note
6
User’s Manual U14337EJ1V0UM00
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CONTENTS
CHAPTER 1 OVERVIEW.........................................................................................................................11
1.1 Hardware Configuration............................................................................................................................... 11
1.2 Features (When Connected to IE-703002-MC)...........................................................................................12
1.3 Function Specifications (When Connected to IE-703002-MC).................................................................. 12
1.4 System Configuration ..................................................................................................................................13
1.5 Contents in Carton.......................................................................................................................................14
1.6 Connection between IE-703002-MC and IE-703040-MC-EM1................................................................ 16
CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS................................................................19
2.1 Component Names and Functions of IE-703040-MC-EM1........................................................................ 19
2.2 Clock Settings............................................................................................................................................... 21
2.2.1 Main system clock setting ................................................................................................................ 21
2.2.2 Subsystem clock setting................................................................................................................... 22
2.3 Illegal Access Detection ROM Setting........................................................................................................ 23
2.4 CPU Operation Voltage Range Switching Setting..................................................................................... 23
CHAPTER 3 FACTORY SETTINGS........................................................................................................25
CHAPTER 4 CAUTIONS..........................................................................................................................27
4.1 VDD and BVDD of Target System................................................................................................................... 27
4.2 NMI Signal.....................................................................................................................................................28
4.3 VPP Signal......................................................................................................................................................28
4.4 NMI Signal Mask Function........................................................................................................................... 29
4.5 Bus Interface Pin..........................................................................................................................................29
APPENDIX PACKAGE DRAWINGS.........................................................................................................31
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LIST OF FIGURES
Figure No. Title Page
1-1 System Configuration............................................................................................................................................13
1-2 Contents in Carton.................................................................................................................................................14
1-3 Accessories........................................................................................................................................................... 15
1-4 Connection between IE-703002-MC and IE-703040-MC-EM1..............................................................................17
2-1 IE-703040-MC-EM1...............................................................................................................................................19
4-1 Schematic Diagram of Power Supply Acquisition..................................................................................................27
4-2 NMI Signal Flow Path............................................................................................................................................28
4-3 VPP Signal Flow Path.............................................................................................................................................28
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LIST OF TABLES
Table No. Title Page
2-1 Main System Clock Setting ...................................................................................................................................21
2-2 Subsystem Clock Setting ......................................................................................................................................22
2-3 JP1 Setting in IE-703002-MC................................................................................................................................23
2-4 JP3 and JP4 Setting in IE-703002-MC.................................................................................................................. 23
4-1 Bus Interface Pin Operation List............................................................................................................................29
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[MEMO]
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CHAPTER 1 OVERVIEW

The IE-703040-MC-EM1 is an option board for the IE-703002-MC in-circuit emulator. By connecting the IE­703040-MC-EM1 and IE-703002-MC, hardware and software can be debugged efficiently in system development using the V850/SV1.
In this manual, the basic setup procedure and switch settings of the IE-703002-MC when using the IE-703040-MC­EM1 are described. For the names and functions of the parts of the IE-703002-MC, and for the connection of elements, refer to the
IE-703002-MC User’s Manual (U11595E)
.

1.1 Hardware Configuration

Optional hardware
Optional hardware
In-circuit emulator (I E-703002-MC)
Notes 1.
Option board (IE-703040-MC-EM1)
Extension probe (SC-176SD
PC interface board IE-70000-xx-IF-B IE-70000-xx-IF-C IE-70000-PCI-IF IE-70000-CD-IF-A
Network module (IE-70000-MC-SV3)
Power adapter (IE-70000-MC-PS-B)
Note 1
)
By adding this board, the I E -703002-M C can be used as in-circuit emulator for V850/SV1.
Optional hardware
General-purpose extension probe made by TOKYO ELETECH CORPORATION
This board is used to connect the IE-703002-MC to a personal computer. This board is inserted in the ex pansion slot of the personal c om puter.
xx: 98 (for PC-9800 series C bus)
PC (for IBM PC/AT™ or compatibles ISA bus)
IE-70000-PCI-IF: for PCI bus IE-70000-CD-IF-A: for PCM CIA socket
This module is used when a workstation controls the IE -703002-M C v i a Ethernet™.
AC adapter for in-circuit em ul at or m ade by NEC Corporation.
For further information, contact Daimaru Kogyo Co., Ltd Tokyo Electronics Department (TEL +81-3-3820-7112) Osaka Electronics Department (TEL +81-6-6244-6672) Cannot be used for PC98-NX series
2.
Note 2
Note 2
.
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CHAPTER 1 OVERVIEW

1.2 Features (When Connected to IE-703002-MC)

Maximum operating frequency: 20 MHz (at 3.3 to 5.0-V operation)
{
Extremely lightweight and compact
{
Higher equivalence with target device can be achieved by omitting buffer between signal cables.
{
The following pins can be masked.
{
RESET, NMI, WAIT, HLDRQ Two methods of connection to target system:
{
• Pod tip direct connection (For information on the pod, refer to the
• Attach an extension probe (sold separately) to the pod tip for connection The dimensions of the IE-703040-MC-EM1 are as follows.
{
Parameter Value Power consumption (Max. value at 3.3-V supply vol t age) External dimensions
(Refer to
DRAWINGS
Weight 160 g
APPENDIX PACKAGE
)
Height 15 mm Length 194 mm Width 96 mm
0.35 W (at 20-MHz operation frequency )
IE-703002-MC User’s Manual (U11595E)
)
Note
10.35 W when IE-703002-MC connected to IE-703040-MC-EM1
Note

1.3 Function Specifications (When Connected to IE-703002-MC)

Parameter Specification
Emulation memory capac i ty
Coverage memory capacity for execution/pass detection
Coverage memory capacity for memory access detection
Coverage memory capacity for branching entry number counting
Caution Some of the functions may not be supported, depending on the debugger used.
Internal ROM 256 Kbytes External
memory
Internal ROM 256 Kbytes External
memory
External memory 1 Mbyte
Internal ROM 256 Kbytes External
memory
In ROM-less mode 2 Mbytes When using iROM 1 Mbyte
In ROM-less mode 2 Mbytes When using iROM 1 Mbyte
In ROM-less mode 2 Mbytes When using iROM 1 Mbyte
12
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CHAPTER 1 OVERVIEW

1.4 System Configuration

The system configuration when connecting the IE-703002-MC to the IE-703040-MC-EM1 and a personal computer
(PC-9800 series or PC/ATTM (or compatibles)) is shown below.
Figure 1-1. System Configuration
<13>
<2>
<1>
<14>
For PC-9800 series
<12>
<4>
<3>
For PC/AT or compatibles
<5>
<6>
[Magnified drawing: example of use of connector for target connection]
<8>
<9>
<10>
<11>
Remark
<1> Personal computer (PC-9800 series or PC/AT or compatibles) <2> Debugger (sold separately) <3> PC interface board
(IE-70000-98-IF-B/IE-70000-98-IF-C, IE-70000-PC-IF-B/IE-70000-PC-IF-C: sold separately) <4> PC interface cable (included with IE-703002-MC) <5> In-circuit emulator (IE-703002-MC: sold separately) <6> In-circuit emulator option board (IE-703040-MC-EM1) <7> External logic probe (included with IE-703002-MC) <8> Socket for target connection (YQSOCKET176SDN: sold separately) <9> Extension probe (SC-100SD: sold separately) <10> Connector for emulator connection (YQPACK176SD: included) <11> Connector for target connection (NQPACK176SD: included) <12> Power adapter (IE-70000-MC-PS-B : sold separately) <13> AC100-V power cable (sold separately: included with IE-70000-MC-PS-B) <14> AC220-V power cable (sold separately: included with IE-70000-MC-PS-B)
<10>
<11>
<7>
Target system
Target system
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CHAPTER 1 OVERVIEW

1.5 Contents in Carton

The carton of the IE-703040-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag. Make sure that the accessory bag contains this manual and the connector accessories. If there are missing or damaged items, please contact an NEC sales representative or an NEC distributor.
Figure 1-2. Contents in Carton
<1> IE-703040-MC-EM1
<4> Packing list
<3> Guarantee card
<2> Accessory bag
14
<1> IE-703040-MC-EM1 × 1 <2> Accessory bag × 1 <3> Guarantee card × 1 <4> Packing list × 1
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CHAPTER 1 OVERVIEW
Check that the accessory bag contains this manual, an accessory list (× 1), and the following accessories.
(a) Connector for target connection (NQPACK176SD) × 1
(including NQGUIDE × 3, driver × 1)
(b) Connector for emulator connection (YQPACK176SD) × 1
(including YQGUIDE × 4) (c) Crystal oscillator (20-MHz, 8-pin type) (d) Plastic screws × 4
(including nuts and washer × 4) (e) Jumper contact × 1
Figure 1-3. Accessories
(a) Connector for target connection (b) Connector for emulator connection
NQPACK176SD
(Side view)
NQGUIDE Driver
YQPACK176SD
(Side view)
YQGUIDE
(c) Crystal oscillator (d) Plastic screws
(e) Jumper contact
Caution NQPACK176SD is intended for laboratory use such as program development and evaluation.
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CHAPTER 1 OVERVIEW

1.6 Connection between IE-703002-MC and IE-703040-MC-EM1

The procedure for connecting the IE-703002-MC and IE-703040-MC-EM1 is described below.
Caution Connect carefully so as not to break or bend connector pins.
<1> Remove the pod cover (upper and lower) of the IE-703002-MC. <2> Replace the crystal oscillator mounted in the pod of the IE-703002-MC with the crystal oscillator supplied (20
MHz) or an arbitrary oscillator (user’s frequency). <3> Set the PGA socket lever of the IE-703040-MC-EM1 to the OPEN position as shown in Figure 1-4 (b). <4> Connect the IE-703040-MC-EM1 to the PGA socket at the back of the IE-703002-MC pod (refer to Figure 1-4
(c)). When connecting, position the IE-703002-MC and IE-703040-MC-EM1 so that they are horizontal. <5> Set the PGA socket lever of the IE-703040-MC-EM1 to the CLOSE position as shown in Figure 1-4 (b). <6> Set the IE-703002-MC pod jumpers (JP1 to JP4).
Open JP1 and JP3 (Remove the jumper contact and attach the removed jumper contact to one of the jumper
pins to avoid losing it.)
Retain the factory settings of JP2 (pins 1 and 2 shorted, and pins 5 and 6 shorted).
Short pins 2 and 3 of JP4. <7> Fix the IE-703040-MC-EM1 between the IE-703002-MC pod covers (upper and lower) with the plastic screws
(supplied with the IE-703002-MC). <8> Fix the IE-703002-MC pod cover (upper) end with nylon rivets.
Remark
For the JP1 setting, refer to to
2.4 CPU Operation Voltage Range Switch Setting
2.3 Illegal Access Detection ROM Setting
. For JP3 and JP4, refer
.
16
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CHAPTER 1 OVERVIEW
Figure 1-4. Connection between IE-703002-MC and IE-703040-MC-EM1 (1/2)
(a) Overview
Nylon rivets
IE-703002-MC
(b) PGA Socket Lever of IE-703040-MC-EM1
Upper cover
Nut
Washer
IE-703040-MC-EM1
Lower cover
Plastic screw
CLOSE
OPEN
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CHAPTER 1 OVERVIEW
Figure 1-4. Connection between IE-703002-MC and IE-703040-MC-EM1 (2/2)
(c) Connecting part (IE-703040-MC-EM1)
Pin A1 position
18
: Insertion guide : IE-703002-MC insertion area
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS

This chapter describes the names, functions, and switch settings of components in the IE-703040-MC-EM1. For
the details of the pod, jumper, and switch positions, etc., refer to the

2.1 Component Names and Functions of IE-703040-MC-EM1

Figure 2-1. IE-703040-MC-EM1
(a) Top view (b) Bottom view
Direction of pin 1 of connector for target connection
V
1
9
TP12
2
JP6
10
CPLD
PP
LED
1
1
JP5
JP3
JP1
3
717
1
JP4
3
1 JP2
3
V850/SV1
I/O chip
TP5
IE-703002-MC User’s Manual (U11595E)
Direction of pin 1 of connector for target connection
Connector for target connection
.
TP11
PROM
IE-703002-MC connection
Connector for
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS
(1) TEST pins (TP5, TP11, TP12)
These are pins used for testing the analog signals of the standalone emulator.
TP 5: GND
TP 11: GND
TP 12: GND
(2) JP1
This is a pin board for product check. Mount nothing on JP1.
(3) JP2, JP4
These are pin boards for product check. Use and retain the factory settings (pins 2 and 3 shorted) (For details, refer to
2.2 Clock Settings
)
(4) JP3
This is a pin board for supplying the subsystem clock. (For details, refer to
2.2 Clock Settings
)
(5) JP5
This is a jumper for switching the main system clock supply source.
(6) JP6
This is a pin board for product check. Use and retain the factory settings (pins 1 and 2 shorted).
(7) LED
LED for V ON: Voltage is applied to V OFF: Voltage is not applied to V
PP
PP
PP
(8) Connector for IE-703002-MC connection
This is a connector for connecting with the IE-703002-MC.
(9) Connector for target connection
This is a connector for connecting with the target system or the extension probe.
20
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS

2.2 Clock Settings

This section describes the clock settings. For the position of the JP1 and JP2 in the IE-703040-MC-EM1, refer to Figure 2-1. For the jumper switch position in the IE-703002-MC, refer to the
IE-703002-MC User’s Manual (U11595E)

2.2.1 Main system clock setting

Table 2-1. Main System Clock Setting
.
Environment
When using
emulator as
standalone unit
When using
emulator with
target system
Note
The target clock supports only an oscillator (X2 cannot be used because it is not connected in the emulator). Clock input by resonator is not supported.
Clock Supply Method
Internal clock
Internal clock
Target clock
Note
IE-703040-MC-EM1 Setting IE-703002-MC S et tingEmulator Use
JP1 SW1 SW2 JP2
12
12
12
3
3
3
ON
ON
7
8
1
2
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS

2.2.2 Subsystem clock setting

Table 2-2. Subsystem Clock Setting
Environment
When using emulator as standalone unit
When using emulator with target system
Notes 1.
The internal clock does not support the clock input by an oscillator. The target clock supports only an oscillator (XT2 cannot be used because it is not connected in the
2.
emulator). Clock input by oscillator is not supported. To use a subsystem clock frequency other than 32.768 kHz, remove the clock module on JP3 and
3.
mount any oscillator. The specifications of JP3 are as follows.
Target
XT1
Clock Supply Method
Internal clock
Internal clock
Target clock
Note 1
Note 1
Note 2
XT1
V850/SV1
I/O chip
IE-703040-MC-EM1 SettingEmulator Use
JP3
Oscillator mounted (a 32.768-kHz osc illat or is mounted when shipped)
Oscillator mounted (a 32.768-kHz osc illat or is mounted when shipped)
Pins 3 and 4 of JP3 are shorted
Note 3
Note 3
Note 4
12345
JP3
67
XT2
22
Prepare the short pin.
4.
1
GND GNDC1 C2XT1 XT2TG
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CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS

2.3 Illegal Access Detection ROM Setting

If using the IE-703002-MC for an in-circuit emulator for the V850/SV1 by connecting the IE-703040-MC-EM1, set
JP1 of the IE-703002-MC as follows.
Table 2-3. JP1 Setting in IE-703002-MC
JP1 Description
Note
Open
Illegal access detection ROM (mounted on IE-703040-MC-EM 1) f or V850/SV1 is used.
Note
When JP1 is set open, keep the removed jumper contact attached to one pin
JP1
as shown in the drawing on the right.
Jumper contact

2.4 CPU Operation Voltage Range Switching Setting

If using the IE-703002-MC for an in-circuit emulator for the V850/SV1 by connecting the IE-703040-MC-EM1, set
JP3 and JP4 of the IE-703002-MC as follows.
Table 2-4. JP3 and JP4 Setting in IE-703002-MC
JP3, JP4 Description
JP3
(Open)
JP4
The operation voltage range of the IE-703002-MC is to 2 to 3.6 V
1
2
The operation voltage range of the target system is 2 to 4.5 V.
1
(Use this setting s i nce the operation voltage range of the V 850/ SV1 is 2 to 3.6 V.)
2
3
Caution By settings of JP3, JP4 above, when the power supply of the target system is on, the IE-703002-
MC operates at the same voltage as the target system. The IE-703002-MC always operates at 3.3 V when the power supply of the target system is off and using emulator as standalone unit.
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CHAPTER 3 FACTORY SETTINGS

Item Description Remark JP1 JP2
Oscillator not mounted
12
3
Pin board for product check Jumper switch for product check
JP3 Oscillator mounted 32.768-kHz clock supplied for subsystem clock JP4
JP5
JP6
12
12
2
1
3
3
Jumper switch for product check
Internal clock used for main system clock
Jumper switch for product check
10
9
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[MEMO]
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CHAPTER 4 CAUTIONS

4.1 V
DD
and BVDD of Target System
(1) BVDD in the target system is not connected to BVDD in the evaluation chip in the IE-703002-MC.
The IE-703002-MC uses BVDD of the target system for the following purposes:
Power ON/OFF detection of target system
BVDD emulation of target system
(2) When the voltage of the target system is 1 V or higher, the evaluation chip in the emulator operates using the
supply of VDD from the target system. The power consumption is equivalent to that of the V850/SV1.
(3) When the voltage of the target system is lower than 1 V, the emulator recognizes the target system power is off
and operates at 3.3 V.
Figure 4-1. Schematic Diagram of Power Supply Acquisition
Target system
BV
IE-703040-MC-EM1
DD
V850/SV1
I/O chip
IE-703002-MC
Target voltage
emulation
BV
DD
BV
DD
V
DD
Relay
1 V
BV
DD
< 1 V
Evaluation chip
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CHAPTER 4 CAUTIONS

4.2 NMI Signal

The input signal (NMI signal) from the target system is delayed (tpD = 0.25 ns (TYP.)) because it passes through
QS3125 (Q switch) before it is input to the I/O chip of the emulator.
In addition, the DC characteristics change. The input voltage becomes VIH = 2.0 V (MIN.), VIL = 0.8 V (MAX.), and
the input current becomes IIN = ±0.5 µA (MAX.).
Figure 4-2. NMI Signal Flow Path
IE-703040-MC-EM1
Target system
NMI signal
NMI pin
QS3125
I/O chip

4.3 VPP Signal

The VPP signal from the target system is connected to LED via a 330-Ω resistor in the emulator. It is not
connected to the evaluation chip in the emulator.
PP
Signal Flow Path
IE-703040-MC-EM1
330
LED
Evaluation
chip
Target system
Figure 4-3. V
V
PP
signal
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CHAPTER 4 CAUTIONS

4.4 NMI Signal Mask Function

When using the P00/NMI pin in the port mode, do not mask the NMI signal.

4.5 Bus Interface Pin

The operation of the pin for the bus interface differs between the emulator and the target device as follows.
Table 4-1. Bus Interface Pin Operation List (1/2)
(a) During break
Pin Name
Memory Used by
Emulator
FRWRRWRWRWRW
A16 to A21 Hold the last accessed address Active Active AD0 to AD15 Hi-Z Active Active ASTB H Active Active R/W H Active Active DSTB H HActive LBEN H Active Active UBEN H Active Active WAIT Invalid Maskable Maskable HLDRQ Maskable Maskable Maskable HLDAK H or L H or L H or L WRL H HH WRH H HH RD H H
Internal Memory External Memory
Internal
ROM
Internal RAM Internal
Peripheral I/O
Emulation RAM Target System
Note
Note Note
H
Active
Note
Remarks 1.
F: Fetch R: Read W: Write H: High-level output
2.
L: Low-level output Hi-Z: High-impedance
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CHAPTER 4 CAUTIONS
Table 4-1. Bus Interface Pin Operation List (2/2)
(b) During run
Pin
Name
A16 to A21
AD0 to AD15
ASTB H Active Active R/W H Active Active DSTB H H Active LBEN H Active Active UBEN H Active Active WAIT Invalid Maskable Maskable HLDRQ Maskable Maskable Maskable HLDAK H or L H or L H or L WRL H H H WRH H H H RD H H
Internal ROM Internal RAM Internal
FRFRWRWFRWFRW
Hold the last access ed address Active Ac tive
Hi-Z Active Active
Internal Memory External Memory
Emulation RAM Target S ystem
Peripheral I/O
Note
Note Note
H
Active
Note
Remarks 1.
F: Fetch R: Read W: Write H: High-level output
2.
L: Low-level output Hi-Z: High-impedance
30
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APPENDIX PACKAGE DRAWINGS

IE-703002-MC + IE-703040-MC-EM1 (Unit: mm)
481 103166
212
9027
IE-703002-MC
58.8
IE-703040-MC-EM1
194
Top view
Pin 1 direction
Side view
52
Bottom view
14.5
96
User’s Manual U14337EJ1V0UM00
33.0
37.5
Top view
33.0
31
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[MEMO]
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[MEMO]
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[MEMO]
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