NEC UPC2775GS-E1, UPC2775GS, UPC2775GR-E1, UPC2775GR Datasheet

DATA SHEET

BIPOLAR ANALOG INTEGRATED CIRCUIT

µ

PC2775GR/GS

FREQUENCY DOWN CONVERTER

FOR VHF-UHF BAND TV/VCR TUNER

DESCRIPTION

The µPC2775GR/GS are Silicon monolithic ICs designed for TV/VCR tuner applications. These ICs consist of
double balanced mixers (DBM), local oscillator, preamplifiers for prescaler operation, IF amplifier, regulator, UHF/
VHF switching circuit, and so on. These one chip ICs cover a wide frequency band from VHF to UHF bands. These

µ

ICs are packaged in a 20 pins SSOP (shrink small outline package;
package; µPC2775GS) suitable for surface mounting. So, these ICs enable to produce economical and physically
small or high-density VHF - UHF tuner and reduce the tuner development time.

PC2775GR) or 20 pins SOP (small outline

FEATURES

• VHF to UHF band operation.

• Low oscillation frequency drift against supply voltage and temperature fluctuation due to balanced type UHF

oscillator.

• These ICs can be used in single ended or differential IF outputs.

• Supply voltage: 9 V

• Packaged in 20 pins SSOP or 20 pins SOP suitable for surface mounting

ORDERING INFORMATION

PART NUMBER PACKAGE PACKAGE STYLE

µ

PC2775GR-E1 20 pin plastic SSOP (225 mil) Embossed tape 12 mm wide, 2.5 k/REEL

Pin 1 indicates pull-out direction of tape

µ

PC2775GS-E1 20 pin plastic SOP (300 mil) Embossed tape 24 mm wide, 2.5 k/REEL

Pin 1 indicates pull-out direction of tape

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.

Document No. P10194EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan

Caution electro-static sensitive device

The mark shows major revised points.

©

1995, 1999

PIN CONFIGURATION (Top View)

1
2
3
4
5
6
7
8
9

10

INTERNAL BLOCK DIAGRAM

20
19
18
17
16
15
14
13
12
11

UOSC COLLECTOR (Tr.1)

1.
UOSC BASE (Tr.2)

2.
UOSC BASE (Tr.1)

3.
UOSC COLLECTOR (Tr.2)

4.
UB

5.
OSC OUTPUT

6.
GND

7.
VHF OSC BASE (Tr.1)

8.
VHF OSC BASE (Tr.2)

9.

10.

VHF OSC COLLECTOR (Tr.1)

11.

IF OUTPUT

12.

IF OUTPUT

13.

VCC

14.

MIXER OUTPUT1

15.

MIXER OUTPUT2

16.

VHF RF INPUT1

17.

VHF RF INPUT2

18.

GND

19.

UHF RF INPUT1

20.

UHF RF INPUT2

µ

PC2775GR/GS

20 19 18 17 16 15 14 13 12 11

U-RF
Pre Amp.

U-OSC U-OSC

12345678910

V-RF
Pre Amp.

MIX.

Buff.

U-PSC

Amp.

V-OSC

Buff.

V-PSC

Amp.

IF Amp.

REG.

V-OSC

2

Data Sheet P10194EJ3V0DS00

PIN EXPLANATION

Pin No.

1

2

3

4

5

6

Symbol

UOSC
collector
(Tr. 1)

UOSC
base (Tr. 2)

UOSC
base (Tr. 1)

UOSC
collector
(Tr. 2)

UB

OSC
output

Pin voltage TYP.
above: V mode (V)
below: U mode (U)

6.90

- - - - - - - - - - - - -

6.25

6.00

- - - - - - - - - - - - -

3.90

6.00

- - - - - - - - - - - - -

3.90

6.90

- - - - - - - - - - - - -

6.25

0.0

- - - - - - - - - - - - -

9.0

5.40

- - - - - - - - - - - - -

5.40

Collector pin of UHF oscillator.
Assemble LC resonator with 2 pin
through capacitor ~ 1 pF to oscillate
with active feedback Loop.

Base pin of UHF oscillator with
balance amplifier. Connected to LC
resonator through feedback capacitor
~ 300 pF.

Base pin of UHF oscillator with
balance amplifier. Connected to LC
resonator through feedback capacitor
~ 300 pF.

Collector pin of UHF oscillator with
balance amplifier. Assemble LC
resonator with 3 pin through capacitor
~ 1 pF to oscillate with active feedback
Loop. Double balanced oscillator with
transistor 1 and transistor 2.

Switching pin for VHF or UHF
operation.
UHF operation = 9.0 V
VHF operation = GND

UHF and VHF oscillator output pin.
In case of F/S tuner application,
connected PLL synthesizer IC’s input
pin.

µ

PC2775GR/GS

Equivalent circuitFunction and Explanation

5

6

2413

REG.



From



OSC



10

7

8

9

GND

VOSC
base (Tr. 1)

VOSC
base (Tr. 2)

VOSC
collector
(Tr. 1)

- - - - - - - - - - - - -

0.0

0.0

3.50

- - - - - - - - - - - - -

5.90

3.50

- - - - - - - - - - - - -

5.90

6.20

- - - - - - - - - - - - -

6.90

VHF and UHF oscillators’ GND pin.

Base pin of VHF oscillator with
balance amplifier.
Grounded through capacitor ~ 10 pF.

Base pin of VHF oscillator with
balance amplifier. Assemble LC
resonator with 10 pin to oscillate with
active feedback Loop.

Base pin of VHF oscillator with
balance amplifier. Connected to LC
resonator through feedback capacitor
~ 3 pF.

Data Sheet P10194EJ3V0DS00

10

8

9

REG.

3

11

11
12

13

12

Symbol

IF
output

Pin voltage TYP.
above: V mode (V)
below: U mode (U)

5.80

- - - - - - - - - - - - -

5.65

Function and Explanation

IF output pins of VHF-UHF band
functions.
Higher output power can be obtained
by connecting registor (ex. 470 Ω) to
the ground.

µ

PC2775GR/GS

Equivalent circuitPin No.

13

14

15

16

17

18

19

20

VCC

MIX
output 1

MIX
output 2

VRF
input
(bypass)

VRF input

GND

URF input
(bypass)

URF input

- - - - - - - - - - - - -

- - - - - - - - - - - - -

9.0

9.0

7.05

6.95

- - - - - - - - - - - - -

7.05

6.95

2.75

- - - - - - - - - - - - -

2.80

- - - - - - - - - - - - -

- - - - - - - - - - - - -

- - - - - - - - - - - - -

- - - - - - - - - - - - -

2.75

2.80
0
0
–

2.65
–

2.65

Power supply for VHF-UHF band
functions.

VHF and UHF MIX output pin.
These pins should be equipped with
tank circuit to adjust frequency.

VRF signal input pin from antenna.

Bypass pin for VHF MIX input.
Grounded through capacitor.

GND pin of MIX, IF amplifier and
regulator.

Bypass pin for UHF MIX input.
Grounded through capacitor.

URF signal input pin from antenna.

15

14

13

From



VHF




OSC

17

19

16

From



UHF




OSC

13

15

14

20

4

Data Sheet P10194EJ3V0DS00

µ

PC2775GR/GS

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)

µ

PC2775GR

PARAMETER SYMBOL RATING UNIT TEST CONDITION
Supply voltage 1 VCC 11.0 V
Supply voltage 2 UB 11.0 V
Power dissipation PD 500 mW TA = 75 °C
Operating temperature range TA –40 to +75 °C
Storage temperature range Tstg –60 to +150 °C

µ

PC2775GS

PARAMETER SYMBOL RATING UNIT TEST CONDITION
Supply voltage 1 VCC 11.0 V
Supply voltage 2 UB 11.0 V
Power dissipation PD 700 mW TA = 80 °C
Operating temperature range TA –40 to +80 °C
Storage temperature range Tstg –60 to +150 °C

Note 1

Note 1

Note 1 Mounted on 50 × 50 × 1.6 mm double copper epoxy glass board.

RECOMMENDED OPERATING RANGE

µ

PC2775GR

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage 1 VCC 8.0 9.0 10.0 V
Supply voltage 2 UB 8.0 9.0 10.0 V
Operating temperature range TA –20 +25 +75 °C

µ

PC2775GS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage 1 VCC 8.0 9.0 10.0 V
Supply voltage 2 UB 8.0 9.0 10.0 V
Operating temperature range TA –20 +25 +80 °C

Data Sheet P10194EJ3V0DS00

5

µ

PC2775GR/GS

ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 9 V, Note 2)

µ

PC2775GR/GS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
Circuit Current 1 (VHF) ICC1 27.0 35.0 44.0 mA no input signal
Circuit Current 2 (UHF) ICC2 28.0 36.0 45.0 mA no input signal
Conversion Gain 1 (VHF(L)) CG1 18.5 22.0 25.5 dB fRF = 55 MHz, Pin = –30 dBm
Conversion Gain 2 (VHF(M)) CG2 18.5 22.0 25.5 dB fRF = 200 MHz, Pin = –30 dBm
Conversion Gain 3 (VHF(H)) CG3 18.5 22.0 25.5 dB f RF = 470 MHz, Pin = –30 dBm
Conversion Gain 4 (UHF(L)) CG4 24.5 28.0 31.5 dB fRF = 470 MHz, Pin = –30 dBm
Conversion Gain 5 (UHF(H)) CG5 24.5 28.0 31.5 dB fRF = 890 MHz, Pin = –30 dBm
Noise Figure 1 (VHF(L)) NF1 – 10.0 13.0 dB f RF = 55 MHz
Noise Figure 2 (VHF(M)) NF2 – 10.0 13.0 dB fRF = 200 MHz
Noise Figure 3 (VHF(H)) NF3 – 10.0 13.0 dB fRF = 470 MHz
Noise Figure 4 (UHF(L)) NF4 – 9.0 12.0 dB fRF = 470 MHz
Noise Figure 5 (UHF(H)) NF5 – 10.0 13.0 dB fRF = 890 MHz
Maximum Output Level 1 (VHF(L))PO(SAT)1 4.0 7.0 – dBm fRF = 55 MHz, Pin = 0 dBm
Maximum Output Level 2 (VHF(M))PO(SAT)2 4.0 7.0 – dBm fRF = 200 MHz, Pin = 0 dBm
Maximum Output Level 3 (VHF(H))PO(SAT)3 4.0 7.0 – dBm fRF = 470 MHz, Pin = 0 dBm
Maximum Output Level 4 (UHF(L))PO(SAT)4 3.5 6.5 – dBm fRF = 470 MHz, Pin = 0 dBm
Maximum Output Level 5 (UHF(H))PO(SAT)5 3.5 6.5 – dBm fRF = 890 MHz, Pin = 0 dBm

Note 3

Note 3

Notes 2 By measurement circuit

3 no resistance of IF output

In case of R = 470 Ω; VHF: 45.2 mA (TYP.), UHF: 46.7 mA (TYP.)

STANDARD CHARACTERISTICS (T

µ

PC2775GR/GS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
1 % Cross-Modulation CM1 – 88.0 – dB

Distortion 1 (VHF(L))
1 % Cross-Modulation CM2 – 88.0 – dB

Distortion 2 (VHF(M))
1 % Cross-Modulation CM3 – 88.0 – dB

Distortion 3 (VHF(H))
1 % Cross-Modulation CM4 – 83.0 – dB

Distortion 4 (UHF(L))
1 % Cross-Modulation CM5 – 83.0 – dB

Distortion 5 (UHF(H))

A = 25 °C, VCC = 9 V)

µ

fRF = 55 MHz, Pin = –30 dBm

µ

fRF = 200 MHz, Pin = –30 dBm

µ

fRF = 470 MHz, Pin = –30 dBm

µ

fRF = 470 MHz, Pin = –30 dBm

µ

fRF = 890 MHz, Pin = –30 dBm

6

Data Sheet P10194EJ3V0DS00

TYPICAL CHARACTERISTICS (TA = 25 °C) - on Measurement Circuit -

q

CC - ICC

V

60

50

40

VHF
no input
signal

R = 470 Ω

60

50

40

UHF
no input
signal

µ

PC2775GR/GS

CC - ICC

V

R = 470 Ω

30

R =

∞

20

ICC – Circuit Current – mA

10

0

024681012

V

CC – Supply Voltage – V

CG - fRF

40

V

CC = 9 V

IF = 45 MHz

f

35

in = –30 dBm

P

30

CG

25
20
15

NF

10

CG – Conversion Gain – dB

NF – Noise Figure – dB

5
0

0 200 400 600 800 1 000

f

RF – RF Frequency – MHz

30

R =

∞

20

ICC – Circuit Current – mA

10

0

024681012

CC – Supply Voltage – V

V

Pin - Pout

10

0

–10

UHF

VHF

–20

V

Pout – Output Power – dBm

–30

CC = 9 V

IF = 45 MHz

f

OSC = –5 dBm

P

–40

–60

–50 –40 –30 –20 –10 0 10

in – Input Power – dBm

P

CM - fRF

100

90

80

70

CM – 1% Cross-Modulation

Distortion – dBc

VCC = 9 V

IF = 45 MHz

f

RF = –30 dBm

P

LOC = –5 dBm

P

60

0 200 400 600 800 1 000

f

RF – RF Frequency – MHz

30

20

10

Vtu – Tuning Voltage – V

0

0 200 400 600 800 1 000

Data Sheet P10194EJ3V0DS00

f

OSC - Vtu

VL VH U

on application
circuit

OSC – OSC Fre

f

uency – MHz

7

MEASUREMENT CIRCUIT

µ

PC2775GR/GS

VRF INURF IN

1 000

1 000

pF

pF

20 19 18 17 16 15 14 13 12 11

U-RF
Pre Amp.

U-OSC U-OSC

10 000
pF

1 000
pF

V-RF
Pre Amp.

MIX.

Buff.

V-OSC

Buff.

CC

V

IF OUT

1 000
pF

1 000
pF

IF Amp.

V-OSC

470

REG.

U-PSC

Amp.

12345678910

1 000pF1 000pF1 000pF1 000

UOSC IN

pF

VHF

UHF

UB

V-PSC

Amp.

1 000
pF

1 000
pF

OSC OUT VOSC IN

1 000
pF

10 000
pF

1 000
pF

8

Data Sheet P10194EJ3V0DS00

APPLICATION CIRCUIT EXAMPLE

µ

PC2775GR/GS

VRF INURF IN

1.2 H

1 000

1 000

pF

pF

20 19 18 17 16 15 14 13 12 11

U-RF
Pre Amp.

U-OSC U-OSC

1 000pF1 000

V-RF
Pre Amp.

MIX.

Buff.

6 pF

pF

V-OSC

Buff.

VCC

IF OUT

1000

µ

1 000
pF

IF Amp.

V-OSC

470 470

pF

50

REG.

1 000
pF

PC2775GR

µ

PC2775GS

µ

U-PSC

Amp.

12345678910

1 pF 3 pF 1 pF

300pF300

47 k

1T

363

Vtu

1234

1 pF 12 pF 1 pF

47 k

12 pF

6 pF

3T

3T

47 k

300pF300

pF

VHF

UB

pF

UHF

1 000
pF

OSC OUT

V-PSC

Amp.

1 000
pF

10 pF

200
pF

3 pF

1T
3631T363

47 k

1 000
pF

3T

5T

0.1 F

0.1 F

µ

µ

47 k

1 000
pF

1 000
pF

Vtu
HB

47 k

LB

2.7 k

Data Sheet P10194EJ3V0DS00

9

PACKAGE DIMENSIONS

20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)

µ

PC2775GR/GS

20

11

110

6.7 ± 0.3

1.8 MAX.

1.5 ± 0.1

detail of lead end

3˚

6.4 ± 0.2

4.4 ± 0.1

+7˚
–3˚

1.0 ± 0.2

0.5 ± 0.2

0.65

0.22

+0.10
–0.05

0.10

0.15

M

0.575 MAX.

0.15

+0.10
–0.05

0.1 ± 0.1

NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.

10

Data Sheet P10194EJ3V0DS00

20 PIN PLASTIC SOP (300 mil) (UNIT: mm)

110

µ

PC2775GR/GS

1120

detail of lead end

+7°

3°

–3°

12.7±0.3

7.7±0.3

1.55±0.1

0.4±0.1

1.27

0.12

0.78 MAX.

M

0.10

0.20

5.6±0.2

0.6±0.2

+0.10
–0.05

0.1±0.1

1.8 MAX.

NOTE

Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.

1.1

Data Sheet P10194EJ3V0DS00

11

µ

PC2775GR/GS

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used or in case soldering is done under

different conditions.

For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR

DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µ

PC2775GR/GS

Soldering process Soldering conditions Symbol

Infrared ray reflow Peak package’s surface temperature: 235 °C or below, IR35-00-2

Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limit

VPS Peak package’s surface temperature: 215 °C or below, VP15-00-2

Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 2, Exposure limit

Partial heating method Terminal temperature: 300 °C or below,

Flow time: 3 seconds or below,
Exposure limit

Note

: None

Note

Note

: None

: None

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 °C and relative humidity at 65 % or less.

Caution Do not apply more than single process at once, except for “Partial heating method”.

12

Data Sheet P10194EJ3V0DS00

[MEMO]

µ

PC2775GR/GS

Data Sheet P10194EJ3V0DS00

13

[MEMO]

µ

PC2775GR/GS

14

Data Sheet P10194EJ3V0DS00

[MEMO]

µ

PC2775GR/GS

Data Sheet P10194EJ3V0DS00

15

µ

PC2775GR/GS

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98.8