PC2762TB, µPC2763TB and µPC2771TB are silicon monolithic integrated circuits designed as amplifier for
µ
mobile communications. Each of the ICs is packaged in super minimold package which is smaller than conventional
minimold. The µPC2762TB, µPC2763TB and µPC2771TB have compatible pin connections and performance to
PC2762T, µPC2763T and µPC2771T of conventional minimold version. So, in the case of reducing your system
µ
size, µPC2762TB, µPC2763TB and µPC2771TB are suitable to replace from µPC2762T, µPC2763T and µPC2771T.
These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
The package size distinguishes between minimold and super minimold.
2
Data Sheet P12710EJ2V0DS00
SYSTEM APPLICATION EXAMPLE
Digital cellular telephone
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
RX
PLL
SW
TX
PA
The insertion point is different due to the specifications of conjunct devices.
Note
For conjunction with your devices, refer to the data sheets to confirm their conbination.
µ
PC2762TB
or
PC2763TB
µ
PC2771TB
µ
÷N
0 °
Phase
shifter
90 °
DEMO
PLL
I
Q
I
Q
Data Sheet P12710EJ2V0DS00
3
PIN EXPLANATION
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
Pin
Pin Name
No.
1INPUT–1.31
4OUTPUTVoltage
6VCC2.7 to 3.3–Power supply pin, which biases
2
3
5
GND0–Ground pin. This pi n should be
Applied
Voltage
(V)
as same
CC
as V
through
external
inductor
Pin
Voltage
Note
(V)
1.01
0.97
–Signal output pi n. The inductor
Function and ApplicationsInternal Equivalent Circ ui t
Signal input pin. A internal
matching circuit, configured with
resistors, enables 50
connection over a wide band.
A multi-feedback ci rcuit is
designed to cancel the
deviations of h
This pin must be coupled to
signal source with capac i t or for
DC cut.
must be attached between V
and output pins to supply
current to the internal output
transistors.
the internal input transis tor.
This pin should be externally
equipped with bypass capaci t or
to minimize its i m pedance.
connected to system ground
with minimum inductanc e.
Ground pattern on the board
should be formed as wide as
possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
Ω
FE
and resistance.
6
4
CC
1
*
3
GNDGND
µ
* PC2762TB does not have
this capacitance.
5
2
Pin voltage is measured at V
Note
4
CC
= 3.0 V. Above: µPC2762TB, Center: µPC2763TB, Below: µPC2771TB.
Data Sheet P12710EJ2V0DS00
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditions
µµµµ
PC2762TB,
µµµµ
PC2763TB,
PC2762TB
µ
PC2763TB
µ
Ratings
µµµµ
PC2771TB
PC2771TB
µ
Unit
Supply VoltageV
Total Circuit CurrentI
Power DissipationP
Operating Ambient
Temperature
Storage TemperatureT
Input PowerP
CC
CC
T
stg
TA = +25 °C, pin 4 and 63.6V
TA = +25 °C7077.7mA
D
Mounted on double copper clad
50 × 50 × 1.6 mm epoxy glass P WB
A
= +85 °C
T
A
in
TA = +25 °C+10+13dBm
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolMIN.TYP.MAX.UnitRemark
Supply VoltageV
Operating Ambient
Temperature
Operating Frequencyf
CC
A
T
opt
2.73.03.3VSame voltage should be applied to pin
4 and 6.
40+25+85°C
−
0.8
−
1.9GHzOnly for µPC2771TB
200mW
40 to +85
−
55 to +150
−
−
C
°
C
°
Data Sheet P12710EJ2V0DS00
5
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = V
PC2762TB,
µµµµ
ParameterS ymbolTest Conditions
Circuit CurrentI
Power GainG
Noise FigureNFf = 0.9 GHz
Upper Limit Operating
Frequency
IsolationISLf = 0.9 GHz
Input Return LossRL
Output Return LossRL
1 dB Gain Compression Output Level
PC2763TB
µµµµ
O (1 dB)
P
CC
f
P
u
in
out
No signal
f = 0.9 GHz
f = 1.9 GHz
f = 1.9 GHz
3 dB down below
from gain at
f = 0.1 GHz
f = 1.9 GHz
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
f = 1.9 GHz
out
= 3.0 V, ZL = ZS = 50
PC2762TB
µ
MIN.TYP.MAX.MIN.TYP.MAX.
26.535.0
−
11
11.51315.51617.5
−
−
2.72.9
22
20
6.0
5.5
8.0
9.0
+5.5
+4.5
11.0
12.0
+8.0
+7.0
6.5
7.0
27
25
9.0
8.5
8.0
9.0
−
−
−
−
−
−
−
−
−
)
ΩΩΩΩ
PC2763TB
µ
27.035.0mA
−
18
18
−
−
2.32.7
25
24
8.0
8.0
5.0
6.0
+7.0
+4.0
11.0
11.0
+9.5
+6.5
20
21
5.5
5.5
30
29
7.0
9.0
23
24
7.0
7.5
−
−
−
−
−
−
−
−
−
Unit
dB
dB
GHz
dB
dB
dB
dBm
PC2771TB
µµµµ
ParameterS ymbolTest Conditions
O (1 dB)
P
O (sat)
P
CC
f
No signal
P
f = 0.9 GHz
f = 1.5 GHz
f = 1.5 GHz
u
3 dB down below from gain at f = 0.1 GHz1.82.2
f = 1.5 GHz
in
f = 0.9 GHz
f = 1.5 GHz
out
f = 0.9 GHz
f = 1.5 GHz
f = 0.9 GHz
f = 1.5 GHz
f = 0.9 GHz
f = 1.5 GHz
Circuit CurrentI
Power GainG
Noise FigureNFf = 0.9 GHz
Upper Limit Operating
Frequency
IsolationISLf = 0.9 GHz
Input Return LossRL
Output Return LossRL
1 dB Gain CompresSion Output Level
Saturated Output
Power Level
PC2771TB
µ
MIN.TYP.MAX.
36.045.0mA
−
19
18
−
−
25
25
10
10
6.5
5.5
+9.0
+7.0
−
−
21
21
6.0
6.0
30
30
14
14
9.0
8.5
+11.5
+9.5
+12.5
+11
24
24
7.5
7.5
−
−
−
−
−
−
−
−
−
−
−
Unit
dB
dB
GHz
dB
dB
dB
dBm
dBm
6
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, VCC = V
PC2762TB,
µµµµ
Saturated
Output Power
Level
Adjacent channel
power
Third order
intermodulation
distortionPO
PC2771TB
µµµµ
PC2763TB
µµµµ
P
O (sat)
adj
P
3
IM
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
/4 QPSK wave
π
PO = +4 dBm
2 sine wave input.
Output of each tone
(each)
= +4 dBm
Note
f = ±50 kHz
∆
f = ±100 kHz
∆
f1 = 0.900 GHz
2
= 0.902 GHz
f
1
f
= 1.900 GHz
2
= 1.902 GHz
f
PC2762TB
µ
MIN.TYP.MAX.MIN.TYP.MAX.
+9.0
−
+8.5
−
64
−
−
64
−
−
−−16−−−27−
−−10−−−14−
out
= 3.0 V, ZL = ZS = 50
Reference
PC2763TBParameterSymbolTest Conditions
µ
−
−
−
−
+11.0
−
−
−
−
+8.0
61
−
62
−
)
ΩΩΩΩ
Unit
dBm
−
−
dBc
−
−
dBc
dBc
Adjacent channel
power 1
Adjacent channel
power 2
Third order
intermodulation
distortionP
π/4 DQPSK modulated wave input, data rate 42 kbps, Filter roll off
Note
adj
P
1f = 0.9 GHz
/4 QPSK wave
π
PO = +7 dBm
adj
P
2f = 1.5 GHz
/4 QPSK wave
π
PO = +7 dBm
3
IM
2 sine wave input.
Output of each tone
O
(each)
Note
Note
= +7 dBm
f = ±50 kHz
∆
f = ±100 kHz
∆
f = ±50 kHz
∆
f = ±100 kHz
∆
f1 = 0.900 GHz
2
= 0.902 GHz
f
1
f
= 1.500 GHz
2
= 1.502 GHz
f
α
= 0.5, PN 9
Reference
PC2771TBParameterSymbolTest Conditions
µ
MIN.TYP.MAX.
−
−
−
−
−−18−
−−12−
61
−
−
−
−
72
59
71
−
−
−
−
Unit
dBc
dBc
dBc
dBc
Data Sheet P12710EJ2V0DS00
7
TEST CIRCUIT
1 000 pF
3
C
µµµµ
PC2762TB,
V
CC
µµµµ
PC2763TB,
µµµµ
PC2771TB
1
C
1 000 pF
6
1
2, 3, 5
4
L
C
2
1 000 pF
50 Ω50 Ω
OUTIN
COMPONENTS OF TEST CIRCUITEXAMPLE OF ACTUAL APPLICATION COMPONENTS
FOR MEASURING ELECTRICAL
CHARACTERISTICS
TypeValueTypeValueOperating Frequency
2
C1, C
3
C
LBias Tee1 000 nH10 nH2.0 GHz or hi gher
Bias Tee1 000 pFC1 to C3Chip capacitor1 000 pF100 MHz or higher
Capacitor1 000 pFLChip induc t or100 nH100 MHz or higher
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port-impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
For above reason, select an inductance of 100 Ω or over impedance in the operating frequency. The gain is a
peak in the operating frequency band, and suppressed at lower frequencies.
The recommendable inductance can be chosen from example of actual application components list as shown
above.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias
can be supplied against Vcc fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2πRfc).
8
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Top View
321
→
C1Z
456
Mounting direction
(Marking is an example for PC2762TB)
INOUT
CC
µµµµ
PC2763TB,
AMP-2
L
CC
V
C
µµµµ
PC2771TB
COMPONENT LIST
Value
C1 000 pF
LExample: 10 nH
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25
PC2762TB
−
µ
−
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
No signal
40
(mA)
CC
30
20
Circuit Current I
10
0
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
20
1234
Supply Voltage VCC (V)Operating Ambient Temperature TA (°C)
50
No signal
CC
V
40
(mA)Insertion Power Gain G
CC
30
20
Circuit Current I
10
0
–60
INSERTION POWER GAIN vs. FREQUENCY
18
C)
°°°°
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
= 3.0 V
–40 –200+20 +40 +60 +80 +100
18
16
(dB)
P
G
P
14
12
10
10
8
8
NF
6
6
Noise Figure NF (dB)
Insertion Power Gain G
4
4
2
2
0
–10
–20
VCC = 3.3 V
VCC = 2.7 V
ISOLATION vs. FREQUENCY
VCC = 3.0 V
VCC = 3.3 V
VCC = 3.0 V
1.03.00.30.1
Frequency f (GHz)
VCC = 2.7 V
V
CC
= 3.0 V
(dB)
P
(dB)
in
16
TA = +85 °C
14
12
TA = –40 °C
10
8
0.1
Frequency f (GHz)
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
0
RL
–10
(dB)
out
–20
1.03.00.3
in
RL
TA = +25 °C
V
CC
= 3.0 V
VCC = 3.0 V
out
10
Isolation ISL (dB)
–30
–40
0.10.3
–30
Output Return Loss RL
Input Return Loss RL
1.03.0
Frequency f (GHz)Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
–40
0.30.1
1.03.0
PC2762TB
−
µ
+15
+10
µµµµ
PC2762TB,
µµµµ
PC2763TB,
−
OUTPUT POWER vs. INPUT POWEROUTPUT POWER vs. INPUT POWER
+15
+10
f = 0.9 GHz
CC = 3.0 V
V
TA = +25 °C
f = 0.9 GHz
VCC = 3.3 V
VCC = 3.0 V
µµµµ
PC2771TB
TA = +85 °C
+5
Output Power Pout (dBm)Output Power Pout (dBm)
–5
–10
+15
+10
+5
–5
+5
VCC = 2.7 V
0
–20
0
–15–10–50+5
Input Power Pin (dBm)Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWEROUTPUT POWER vs. INPUT POWER
f = 1.9 GHz
VCC = 3.3 V
VCC = 3.0 V
VCC = 2.7 V
0
Output Power Pout (dBm)
–5
–10
–20–15+5
+15
f = 1.9 GHz
CC = 3.0 V
V
+10
out (dBm)
+5
0
Output Power P
–5
–10–50
TA = +25 °C
TA = –40 °C
TA = +85 °C
TA = –40 °C
–10
–20–15+5
SATURATED OUTPUT POWER vs.
+13
+11
+9
+7
+5
Saturated Output Power PO (sat) (dBm)
+3
FREQUENCY
0.1
–10–50
Input Power P
VCC = 3.3 V
VCC = 3.0 V
VCC = 2.7 V
0.3
Frequency f (GHz)
in (dBm)
Pin = +3 dBm
1.03.0
–10
–20–15+5
SATURATED OUTPUT POWER vs.
+13
+11
O (sat) (dBm)
+9
+7
+5
Saturated Output Power P
+3
FREQUENCY
TA = +25 °C
TA = –40 °C
0.1
–10–50
Input Power P
0.3
Frequency f (GHz)
in (dBm)
TA = +85 °C
P
in = +3 dBm
1.03.0
Data Sheet P12710EJ2V0DS00
11
PC2762TB
−
µ
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
−
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
–20
–10
Third Order Intermodulation Distortion IM
0
–15
Output Power of Each Tone P
VCC = 2.7 V
–10–50+5+10
f1 = 0.900 GHz
2
= 0.902 GHz
f
VCC = 3.3 V
VCC = 3.0 V
O (each)
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
VCC = 2.7 V
–20
–10
Third Order Intermodulation Distortion IM
0
–15
(dBm)Output Power of Each Tone P
–10–50+5+10
f
f
VCC = 3.3 V
1
= 1.900 GHz
2
= 1.902 GHz
VCC = 3.0 V
O (each)
(dBm)
12
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
S-PARAMETER (TA = +25
PC2762TB
−
µ
11
S
-FREQUENCY
−
C, VCC = V
°°°°
out
= 3.0 V)
0.1 G
2.0 G
3.0 G
S22-FREQUENCY
3.0 G
0.1G
2.0 G
1.0 G
Data Sheet P12710EJ2V0DS00
13
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25
PC2762TB
µ
VCC = V
out
= 3.0 V, ICC = 29 mA
FREQUENCYS
MHzMAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
100.00000.338
200.00000.346
300.00000.348
400.00000.340
500.00000.329
600.00000.324
700.00000.341
800.00000.359
900.00000.378
1000.00000.375
1100.00000.363
1200.00000.353
1300.00000.357
1400.00000.377
1500.00000.402
1600.00000.414
1700.00000.426
1800.00000.434
1900.00000.448
2000.00000.463
2100.00000.483
2200.00000.492
2300.00000.492
2400.00000.486
2500.00000.489
2600.00000.500
2700.00000.511
2800.00000.511
2900.00000.494
3000.00000.465
3100.00000.441
11
1.34.560
−
2.04.581
−
1.24.616
−
1.94.661
−
3.14.689
−
6.24.726
−
8.14.844
−
7.64.927
−
6.55.057
−
5.15.179
−
5.25.306
−
6.75.400
−
8.85.567
−
11.75.706
−
12.75.820
−
13.25.987
−
13.66.081
−
16.16.182
−
19.06.229
−
21.76.328
−
23.96.382
−
25.86.431
−
29.76.424
−
34.66.329
−
40.46.146
−
44.65.997
−
48.55.822
−
50.45.693
−
52.95.553
−
55.95.334
−
60.65.157
−
C)
°°°°
21
S
3.40.0391.00.310
−
7.60.0392.70.311
−
11.30.0396.80.302
−
15.80.0408.10.296
−
19.50.04011.60.290
−
23.60.04113.70.292
−
27.40.04215.80.291
−
31.50.04318.10.292
−
35.80.04419.30.284
−
41.00.04520.30.280
−
45.90.04722.10.285
−
51.00.04723.70.288
−
56.50.04826.10.288
−
61.70.04924.50.285
−
68.00.05226.70.282
−
73.70.05226.80.285
−
80.10.05529.00.288
−
86.70.05628.20.291
−
93.20.05728.50.286
−
99.70.05728.00.282
−
106.70.05828.50.282
−
113.80.05829.00.282
−
121.20.06030.10.278
−
128.80.06030.20.268
−
136.10.06231.10.260
−
143.10.06132.10.251
−
149.90.06431.40.248
−
157.00.06634.00.237
−
163.00.06533.80.222
−
169.50.06535.50.203
−
175.50.06635.50.189
−
12
S
22
S
5.52.23
−
9.52.20
−
12.32.20
−
16.22.18
−
20.22.20
−
24.12.12
−
26.22.01
−
28.31.90
−
30.91.77
−
35.31.72
−
40.01.64
−
43.41.62
−
45.71.54
−
47.91.44
−
52.81.32
−
58.11.27
−
62.01.18
−
66.11.14
−
70.41.09
−
76.21.07
−
81.51.01
−
86.90.99
−
91.70.99
−
98.41.01
−
104.51.02
−
111.31.05
−
116.71.03
−
121.51.04
−
128.31.11
−
134.51.20
−
141.11.27
−
K
14
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25
PC2763TB
−
µ
−
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
50
No signal
40
40
30
30
20
20
Circuit Current ICC (mA)
10
10
0
0
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
24
24
22
22
G
20
20
P (dB)
18
18
16
16
1234
1234
Supply Voltage VCC (V)Operating Ambient Temperature TA (°C)
VCC = 3.3
VCC = 3.3 V
P
VCC = 3.0
VCC = 3.0 V
VCC = 2.7
VCC = 2.7 V
50
50
40
40
30
30
20
20
Circuit Current ICC (mA)
10
10
0
0
–60
–60
INSERTION POWER GAIN vs. FREQUENCY
24
24
22
22
20
20
P (dB)
TA = +25 °C
TA = +25 °C
18
18
16
16
C)
°°°°
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
No signal
CC = 3.0 V
V
–40 –20+20 +40+100
–40 –20
TA = +85 °C
TA = +85 °C
0
0+80+60
TA = +25 °C
TA = +25 °C
TA = –40 °C
TA = –40 °C
TA = –40 °C
TA = –40 °C
TA = +85 °C
TA = +85 °C
7
7
14
14
12
12
6
10
10
5
5
Insertion Power Gain G
8
4
Noise Figure NF (dB)
8
3
3
6
6
0.1
0.1
0
0
–10
–10
–20
–20
–30
–30
Isolation ISL (dB)
–40
–40
–50
–50
0.1
0.1
VCC = 3.3
VCC = 3.3 V
NF
NF
VCC = 2.7
VCC = 3.0
VCC = 3.0 V
0.3
0.3
Frequency f (GHz)
ISOLATION vs. FREQUENCY
0.31.03.0
0.31.03.0
Frequency f (GHz)
VCC = 2.7 V
1.03.0
1.03.0
VCC = 3.0 V
14
14
12
12
10
10
Insertion Power Gain G
8
8
6
6
0.1
0.1
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
0
0
–10
–10
in (dB)
–20
–20
–30
–30
Input Return Loss RL
Output Return Loss RLout (dB)
–40
–40
0.1
0.1
0.3
0.3
Frequency f (GHz)
RLo
RLout
0.3
0.3
Frequency f (GHz)
VCC = 3.0 V
1.03.0
1.03.0
VCC = 3.0 V
RLin
1.0
1.0
3.0
3.0
Data Sheet P12710EJ2V0DS00
15
PC2763TB
−
µ
+15
+10
µµµµ
PC2762TB,
µµµµ
PC2763TB,
−
OUTPUT POWER vs. INPUT POWEROUTPUT POWER vs. INPUT POWER
f = 0.9 GHz
VCC = 3.3 V
+15
+10
f = 0.9 GHz
CC = 3.0 V
V
TA = +85 °C
µµµµ
PC2771TB
+5
VCC = 2.7 V
0
Output Power Pout (dBm)Output Power Pout (dBm)
–5
–10
–25–20–15–10–50
Input Power Pin (dBm)Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWEROUTPUT POWER vs. INPUT POWER
+15
f = 1.9 GHz
+10
VCC = 2.7 V
+5
0
–5
VCC = 3.3 V
VCC = 3.0 V
VCC = 3.0 V
+5
TA = –40 °C
0
Output Power Pout (dBm)
–5
–10
–25
+15
f = 1.9 GHz
CC = 3.0 V
V
+10
+5
0
–5
TA = –40 °C
TA = +25 °C
out (dBm)
Output Power P
TA = –40 °C
TA = +25 °C
TA = +85 °C
–20–15–10–50
TA = +85 °C
TA = +25 °C
TA = –40 °C
TA = +85 °C
–10
–25–20–15–10–50
in (dBm)
P
in = –3 dBm
VCC = 3.3 V
VCC = 2.7 V
1.03.0
+15
+13
+11
+9
+7
+5
Saturated Output Power PO (sat) (dBm)
+3
Input Power P
SATURATED OUTPUT POWER vs.
FREQUENCY
VCC = 3.0 V
0.1
0.3
Frequency f (GHz)
–10
–25–20–15–10–50
Input Power P
SATURATED OUTPUT POWER vs.
TA = –40 °C
0.1
FREQUENCY
TA = +85 °C
TA = +25 °C
0.3
Frequency f (GHz)
+15
+13
O (sat) (dBm)
+11
+9
+7
+5
Saturated Output Power P
+3
in (dBm)
in = –3 dBm
P
1.03.0
16
Data Sheet P12710EJ2V0DS00
PC2763TB
−
µ
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
−
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
–20
–10
Third Order Intermodulation Distortion IM
0
–15
Output Power of Each Tone P
VCC = 2.7 V
–10–50+5+10
f
1
= 0.900 GHz
2
= 0.902 GHz
f
VCC = 3.3 V
VCC = 3.0 V
O (each)
(dBm)Output Power of Each Tone P
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
–20
–10
Third Order Intermodulation Distortion IM
0
–15–10–50+5+10
VCC = 2.7 V
f
1
= 1.900 GHz
2
= 1.902 GHz
f
VCC = 3.3 V
VCC = 3.0 V
O (each)
(dBm)
Data Sheet P12710EJ2V0DS00
17
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
S-PARAMETER (TA = +25
PC2763TB
−
µ
11
S
-FREQUENCY
−
C, VCC = V
°°°°
out
= 3.0 V)
3.0 G
0.1 G
1.0 G
2.0 G
S22-FREQUENCY
3.0 G
0.1 G
2.0 G
1.0 G
18
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25
PC2763TB
µ
VCC = V
out
= 3.0 V, ICC = 28 mA
FREQUENCYS
MHzMAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
100.00000.231
200.00000.242
300.00000.2502.710.464
400.00000.2452.810.655
500.00000.2422.010.863
600.00000.241
700.00000.263
800.00000.291
900.00000.316
1000.00000.322
1100.00000.318
1200.00000.309
1300.00000.322
1400.00000.344
1500.00000.371
1600.00000.380
1700.00000.388
1800.00000.378
1900.00000.378
2000.00000.375
2100.00000.369
2200.00000.351
2300.00000.331
2400.00000.306
2500.00000.300
2600.00000.294
2700.00000.290
2800.00000.270
2900.00000.248
3000.00000.219
3100.00000.198
11
1.410.210
−
0.210.305
−
2.211.093
−
5.311.544
−
5.611.843
−
5.112.291
−
4.012.676
−
5.413.066
−
9.013.311
−
14.213.661
−
20.613.845
−
23.713.824
−
27.513.890
−
30.613.634
−
36.413.236
−
42.112.724
−
46.612.290
−
50.511.707
−
53.811.130
−
59.810.524
−
66.49.824
−
73.19.152
−
75.88.583
−
77.18.029176.20.03546.30.299
−
77.77.610170.60.03747.70.288
−
78.77.240166.10.03951.10.270
−
82.36.827161.20.03953.60.253
−
88.76.516156.90.04055.10.244
−
C)
°°°°
21
S
3.80.0232.40.406
−
8.50.0237.80.412
−
12.90.0249.30.407
−
18.20.02413.40.407
−
22.80.02616.10.405
−
28.10.02719.90.414
−
33.20.02822.30.419
−
39.00.02922.50.424
−
45.10.02923.90.424
−
52.40.03025.60.425
−
59.80.03124.10.438
−
67.30.03127.00.442
−
75.80.03328.80.441
−
83.90.03328.50.434
−
93.00.03530.10.435
−
101.50.03528.10.439
−
110.50.03629.20.439
−
119.60.03529.90.428
−
127.90.03530.90.411
−
136.10.03532.90.393
−
144.00.03533.00.385
−
151.70.03635.70.373
−
159.10.03636.80.359
−
165.90.03438.70.336
−
172.30.03540.10.321
−
178.20.03443.80.306
−
12
S
22
S
4.11.68
−
7.51.66
−
9.91.58
−
13.91.55
−
17.61.44
−
21.61.37
−
24.61.25
−
27.71.16
−
31.91.09
−
37.11.02
−
42.50.96
−
47.80.96
−
51.20.90
−
56.00.87
−
62.20.82
−
68.90.80
−
74.60.78
−
81.30.84
−
87.00.89
−
93.40.94
−
99.60.99
−
104.91.06
−
110.31.13
−
117.51.31
−
123.31.41
−
129.41.55
−
133.91.58
−
138.61.63
−
143.61.67
−
150.11.79
−
156.21.88
−
K
Data Sheet P12710EJ2V0DS00
19
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25
PC2771TB
µ
−
−
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
No signal
40
(mA)
CC
30
20
Circuit Current I
10
0
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
24
VCC = 2.7 V
22
20
(dB)
P
VCC = 3.3 V
18
16
14
7
6
12
Insertion Power Gain G
5
10
4
Noise Figure NF (dB)
3
–10
VCC = 3.3 V
8
6
0.1
0
50
40
(mA)
CC
30
20
Circuit Current I
10
123
Supply Voltage VCC (V)Operating Ambient Temperature TA (°C)
VCC = 3.0 V
G
P
VCC = 3.0 V
NF
ISOLATION vs. FREQUENCY
VCC = 2.7 V
0.31.03.0
Frequency f (GHz)
VCC = 3.3 V
VCC = 3.0 V
VCC = 2.7 V
VCC = 3.0 VVCC = 3.0 V
4
0
–60 –40 –20+20 +40 +60 +80
INSERTION POWER GAIN vs. FREQUENCY
24
22
(dB)
P
20
18
Insertion Power Gain G
16
VCC = 3.0 V
14
0.1
0
(dB)
–10
(dB)
out
in
C)
°°°°
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
No signal
CC
= 3.0 V
V
0+100
TA = +25 °C
0.31.03.0
Frequency f (GHz)
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
RL
out
TA = –40 °C
TA = +85 °C
20
–20
Isolation ISL (dB)
–30
–40
0.1
0.31.03.0
Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
–20
–30
Input Return Loss RL
Outpur Return Loss RL
–40
0.1
RL
0.3
Frequency f (GHz)
in
1.03.0
PC2771TB
−
µ
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
−
OUTPUT POWER vs. INPUT POWER
+15
f = 0.9 GHz
+10
(dBm)Output Power P
out
+5
Output Power P
0
–5
+15
+10
(dBm)
+5
out
0
–20–15–10
–25–5
OUTPUT POWER vs. INPUT POWEROUTPUT POWER vs. INPUT POWER
f = 1.5 GHz
V
CC
VCC = 3.0 V
Input Power Pin (dBm)Input Power Pin (dBm)
VCC = 3.3 V
= 3.3 V
VCC = 2.7 V
VCC = 2.7 V
VCC = 3.0 V
OUTPUT POWER vs. INPUT POWER
+15
f = 0.9 GHz
CC
= 3.0 V
V
+10
(dBm)
out
+5
TA = +25 °C
Output Power P
0
TA = +85 °C
0
–5
+15
+10
(dBm)
out
+5
–20–15–100–25–5
f = 1.5 GHz
CC
= 3.0 V
V
TA = +25 °C
TA = +85 °C
TA = –40 °C
TA = +25 °C
TA = –40 °C
TA = +85 °C
TA = +25 °C
TA = –40 °C
–5
–10
+15
+10
(dBm)
+5
out
0
Output Power P
–5
–10
–20–15–10
–25–5
Input Power P
OUTPUT POWER vs. INPUT POWER
f = 1.9 GHz
–20–15–10
–25–5
VCC = 3.3 V
VCC = 2.7 V
Input Power Pin (dBm)
in
(dBm)
VCC = 3.0 V
Output Power P
0
TA = –40 °C
TA = +85 °C
0
0
–5
+15
+10
(dBm)
out
+5
0
Output Power P
–5
–10
–20–15–100–25–5
in
Input Power P
OUTPUT POWER vs. INPUT POWER
f = 1.9 GHz
CC
= 3.0 V
V
TA = +25 ˚C
–20–15–100–25–5
Input Power Pin (dBm)
(dBm)
TA = +85 ˚C
TA = –40 ˚C
Data Sheet P12710EJ2V0DS00
21
PC2771TB
−
µ
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
−
SATURATED OUTPUT POWER vs.
FREQUENCY
+17
Pin = –3 dBm
+15
(dBm)Third Order Intermodulation Distortion IM
O (sat)
+13
VCC = 3.0 V
+11
+9
+7
Saturated Output Power P
+5
0.1
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
VCC = 2.7 V
0.33.0
Frequency f (GHz)Frequency f (GHz)
VCC = 2.7 V
VCC = 3.3 V
1.0
1
= 0.900 GHz
f
f
2
= 0.902 GHz
VCC = 3.3 V
VCC = 3.0 V
SATURATED OUTPUT POWER vs.
FREQUENCY
+17
in
= –3 dBm
+15
(dBm)
O (sat)
+13
+11
+9
+7
Saturated Output Power P
+5
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
–60
(dBc)
3
–50
–40
–30
TA= +25 °C
TA= –40 °C
VCC = 2.7 V
P
TA= +85 °C
1.00.10.33.0
f
1
= 1.500 GHz
2
= 1.502 GHz
f
VCC = 3.3 V
VCC = 3.0 V
–20
–10
0
–15+5
Output Power of Each Tone P
–5+10
0–10
–20
–10
0
Third Order Intermodulation Distortion IM
–15
O (each)
(dBm)Output Power of Each Tone P
–50–10
O (each)
+5
(dBm)
+10
22
Data Sheet P12710EJ2V0DS00
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
S-PARAMETER (TA = +25
PC2771TB
−
µ
11
S
-FREQUENCY
−
C, VCC = V
°°°°
out
= 3.0 V)
0.1 G
3.0 G
2.0 G
S22-FREQUENCY
3.0 G
0.1G
2.0 G
Data Sheet P12710EJ2V0DS00
23
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25
PC2771TB
µ
VCC = V
out
= 3.0 V, ICC = 35 mA
FREQUENCYS
MHzMAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
100.00000.04519.710.570
200.00000.05737.010.638
300.00000.07541.310.775
400.00000.09043.311.004
500.00000.10542.211.275
600.00000.11840.211.586
700.00000.13834.912.041
800.00000.16332.512.367
900.00000.18629.412.844
1000.00000.20226.313.300
1100.00000.21921.713.771
1200.00000.23315.414.082
1300.00000.2528.414.365
1400.00000.267
1500.00000.285
1600.00000.293
1700.00000.304
1800.00000.290
1900.00000.285
2000.00000.273
2100.00000.267
2200.00000.254
2300.00000.237
2400.00000.221
2500.00000.212
2600.00000.208
2700.00000.202
2800.00000.190
2900.00000.178
3000.00000.154
3100.00000.147
11
0.114.336
−
6.814.142
−
13.913.929
−
20.913.428
−
28.112.722
−
35.311.966
−
41.811.232
−
47.410.500
−
51.69.815
−
57.19.168
−
61.18.570
−
68.87.967
−
72.27.507174.90.04350.80.314
−
74.17.004170.00.04553.70.309
−
76.36.667164.70.04754.20.303
−
76.76.336160.70.05157.70.292
−
82.36.003155.60.05156.50.287
−
88.05.772151.30.05459.30.279
−
C)
°°°°
21
S
4.70.0280.80.327
−
9.50.0285.00.325
−
14.10.0298.60.323
−
19.40.03011.10.326
−
24.40.03014.90.331
−
30.00.03115.80.342
−
35.90.03119.80.350
−
42.10.03220.10.359
−
48.80.03223.20.361
−
56.60.03223.90.371
−
64.60.03324.90.389
−
73.50.03326.60.400
−
83.20.03628.80.405
−
92.60.03630.00.402
−
102.40.03632.00.406
−
112.00.03731.60.413
−
121.60.03932.50.414
−
131.00.03834.70.401
−
139.60.03836.10.387
−
147.50.03837.40.378
−
154.80.03939.10.366
−
161.70.04041.40.356
−
168.00.04143.70.342
−
173.70.04148.30.325
−
179.70.04248.30.322
−
12
S
22
S
6.21.65
−
11.51.63
−
16.21.58
−
20.91.49
−
26.41.45
−
32.01.37
−
37.31.29
−
42.81.20
−
49.41.15
−
56.11.11
−
62.51.03
−
69.30.99
−
75.40.92
−
83.60.91
−
91.60.90
−
99.30.89
−
105.80.88
−
113.70.96
−
120.81.03
−
127.61.09
−
133.11.14
−
138.01.20
−
142.81.28
−
148.31.37
−
152.61.44
−
156.71.49
−
160.11.53
−
164.01.56
−
167.81.55
−
172.81.62
−
176.41.61
−
K
24
Data Sheet P12710EJ2V0DS00
PACKAGE DIMENSIONS
6 pin super minimold (Unit: mm)
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
2.1 ±0.1
1.25 ±0.1
0.2
+0.1
–0
0.650.65
1.3
2.0 ±0.2
0.1 MIN.
0.7
0.9 ±0.1
0.15
+0.1
–0
0 to 0.1
Data Sheet P12710EJ2V0DS00
25
µµµµ
PC2762TB,
µµµµ
PC2763TB,
µµµµ
PC2771TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering MethodSoldering ConditionsRecommended Condition Sy m bol
Infrared ReflowPackage peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t: None
VPSPackage peak temperature: 215 ° C or bel ow
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t: None
Wave SolderingSoldering bat h t em perature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limi t: None
Partial HeatingPin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Note
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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