NEC UPC2749TB-E3, UPC2749TB, UPC2749T-E3, UPC2749T Datasheet

DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

µµµµ

PC2749TB

3 V, SUPER MINIMOLD SILICON MMIC

WIDEBAND AMPLIFIER

FOR MOBILE COMMUNICATIONS

DESCRIPTION

The µPC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This

IC is packaged in super minimold package which is smaller than conventional minimold.

The µPC2749TB has compatible pin connections and performance to µPC2749T of conventional minimold

version. So, in the case of reducing your system size, µPC2749TB is suitable to replace from µPC2749T.

This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• High-density surface mounting : 6-pin super minimold package

• Supply voltage : V

• Noise figure : NF = 4.0 dB TYP. @ f = 1.9 GHz

• Upper limit operating frequency : f

APPLICATION

• GPS receiver

• Wireless LAN

ORDERING INFORMATION

Part Number Package Marking Supplying Form

µ

PC2749TB-E3 6-pin super minimold C1U Embossed tape 8 mm wide.

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PC2749TB)

µ

CC

= 2.7 to 3.3 V

u

= 2.9 GHz TYP. @ 3 dB down below from gain at f = 0.9 GHz

1, 2, 3 pins face to perforat i on side of the tape.
Qty 3 kp/reel.

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. P13489EJ2V0DS00 (2nd edition)
Date Published May 1999 N CP(K)
Printed in Japan

Caution Electro-static sensitive devices

The mark shows major revised points.

1998, 1999©

PIN CONNECTIONS

(Top View) (Bottom View)

3

µµµµ

PC2749TB

Pin No. Pin Name

1 INPUT

4

4

3

2GND

2

1

PRODUCT LINE-UP (TA = +25°C, VCC = 3.0 V, ZL = ZS = 50

Part No.

PC2749T 6-pin minimold

µ

PC2749TB

µ

Remark

Notice

Typical performance. Please refer to

The package size distinguishes between minimold and super minimold.

f

(GHz)

2.9 –6.0 16 4.0 6.0

C1U

u

5

6

O(sat)

P

(dBm)

5

6

P

G

(dB)

2

1

NF

(dB)

)

ΩΩΩΩ

ELECTRICAL CHARACTERISTICS

CC

I

(mA)

6-pin super minimold

in detail.

SYSTEM APPLICATION EXAMPLE

EXAMPLE OF GPS RECEIVER

3GND
4OUTPUT
5GND
6V

Package Marking

CC

C1U

Pre Amp. Unit RF Unit

RF Amp. Mixer

B.P.F. B.P.F. IF Filter

µµ

LNA

PC2749T/TB PC2749T/TB

VCO

To know the associated products, please refer to each latest data sheet.

IF Amp.

PLL

Loop Filter

2

Data Sheet P13489EJ2V0DS00

PIN EXPLANATION

µµµµ

PC2749TB

Pin

Pin Name

No.

1 INPUT – 0.82 Signal input pin. A internal

4 OUTPUT – 2.87 Signal output pin. A internal

6VCC2.7 to 3.3 – Power supply pin. This pin

2
3
5

GND 0 – Ground pin. This pi n s houl d

Applied
Voltage (V)

Pin
Voltage

Note

(V)

Function and Applications Internal Equivalent Circ ui t

matching circuit, configured
with resistors, enables 50
connection over a wide band.
This pin must be coupled to
signal source with capac i t or
for DC cut.

matching circuit, configured
with resistors, enables 50
connection over a wide band.
This pin must be coupled to
next stage with capaci tor for
DC cut.

should be externally equipped
with bypass capacit y to
minimize ground impedance.

be connected to system
ground with minimum
inductance. Ground pattern
on the board should be
formed as wide as possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.

Ω

6

CC

V

Ω

1

IN

3 5

2

GNDGND

4

OUT

Pin voltage is measured at V

Note

CC

= 3.0 V.

Data Sheet P13489EJ2V0DS00

3

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

µµµµ

PC2749TB

Supply Voltage V
Total Circuit Current I
Power Dissipation P

Operating Ambient Temperature T
Storage Temperature T
Input Power P

CC

CC

stg

TA = +25 °C 4.0 V
TA = +25 °C 15 mA

D

Mounted on doublesided copper clad

A

50 × 50 × 1.6 mm epoxy glass P WB (T

A

in

TA = +25 °C 0 dBm

= +85°C)

40 to +85 °C

−

55 to +150 °C

−

200 mW

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage V
Operating Ambient Temperature T

ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 3.0 V, ZS = ZL = 50

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current I
Power Gain G
Maximum Output Level P
Noise Figure NF f = 1.9 GHz – 4.0 5.5 dB
Upper Limit Operating Frequency f

Isolation ISL f = 1.9 GHz 25 30 – dB
Input Return Loss RL
Output Return Loss RL

CC

A

CC

P

O(sat)

u

out

2.7 3.0 3.3 V
40 +25 +85 °C

−

)

ΩΩΩΩ

No Signal 4.0 6.0 8.0 mA
f = 1.9 GHz 13.0 16.0 18.5 dB
f = 1.9 GHz, Pin = –6 dBm –9.0 –6.0 – dBm

3 dB down below flat gain at

2.5 2.9 – GHz

f = 0.9 GHz

in

f = 1.9 GHz 7 10 – dB
f = 1.9 GHz 9.5 12.5 – dB

STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, VCC = 3.0 V, ZS = ZL = 50

)

ΩΩΩΩ

Parameter Symbol Test Conditions Reference Value Unit

Power Gain G

P

f = 0.9 GHz 14.5 dB
Noise Figure NF f = 0.9 GHz 3.2 dB
3rd Order Intermodulation Distort i on IM

Gain 1 dB Compression Output

P

O(1 dB)

3

out

P

= –20 dBm

1

= 1.900 GHz, f2 = 1.902 GHz

f

–33 dB c

f = 1.9 GHz –12.5 dBm
Level

4

Data Sheet P13489EJ2V0DS00

TEST CIRCUIT

1 000 pF

C

3

µµµµ

PC2749TB

V

CC

6

50Ω

IN

1 000 pF

EXAMPLE OF APPLICATION CIRCUIT

V

CC

1 000 pF

C

3

6

50Ω

IN

1

C

1 000 pF

1

2, 3, 5

1

C

1

4

2

C

50Ω

OUT

1 000 pF

2, 3, 5

1 000 pF

C

5

6

4

4

C

1

4

1 000 pF

2

C

1 000 pF

50Ω

OUT

2, 3, 5

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS

CC

1 000 pF capacitors are recommendable as bypass capacitor for V

pin and coupling capacitors for input/output

pins.

Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be

supplied against VCC fluctuation.

Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.

To get a flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF
capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 πfZs).]

Data Sheet P13489EJ2V0DS00

5

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

AMP-2

Top View

µµµµ

PC2749TB

Mounting Direction

COMPONENT LIST

Value

C 1 000 pF

321

C1U

456

IN OUT

CC

CC

V

C

Notes

1.

30 × 30 × 0.4 mm double sided copper clad polyimide board.

2.

Back side: GND pattern

3.

Solder plated on pattern

4.

: Through holes

For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).

6

Data Sheet P13489EJ2V0DS00

TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C)

CIRCUIT CURRENT vs.

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

10

No signal

8

OPERATING AMBIENT TEMPERATURE

10

8

µµµµ

PC2749TB

No signal

CC = 3.0 V

V

6

CC (mA)

4

Circuit Current I

2

0

01234

Supply Voltage VCC (V) Operating Ambient Temperature TA (°C)

INSERTION POWER GAIN vs. FREQUENCY INSERTION POWER GAIN vs. FREQUENCY

25

20

P (dB)

Insertion Power Gain G

15

10

5

VCC = 3.0 V

VCC = 2.7 V

VCC = 3.3 V

6

4

Circuit Current ICC (mA)

2

0
–60 –40 –20 0 +20 +40 +60 +80 +100

25

20

P (dB)

Insertion Power Gain G

TA = +25 °C

15

10

TA = +85 °C

5

TA = –40 °C

VCC = 3.0 V

0

0.1 0.3 1.0 3.0
Frequency f (GHz)

NOISE FIGURE vs. FREQUENCY

6

VCC = 2.7 V

5

4

3

Noise Figure NF (dB)

2

1

0.1 0.3 1.0 3.0

VCC = 3.0 V

VCC = 3.3 V

Frequency f (GHz)

0

0.1 1.00.3 3.0

Data Sheet P13489EJ2V0DS00

Frequency f (GHz)

7

0

–10

–20

–30

Isolation ISL (dB)

–40

ISOLATION vs. FREQUENCY

INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY

0

–10

(dB)

out

(dB)

in

–20

–30

Output Return Loss RL

Input Return Loss RL

–40

RL

µµµµ

PC2749TB

VCC = 3.0 VVCC = 3.0 V

out

RL

in

–50

0.1 0.3 1.0 3.0
Frequency f (GHz) Frequency f (GHz)

OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER

0

–5

–10

(dBm)

out

f = 1.9 GHz

VCC = 3.0 V

VCC = 3.3 V

VCC = 2.7 V

–15

–20

Output Power P

–25

–30

–40 –35 –30 –25 –20 –15 –10 –5 0

Input Power P

in

(dBm)

SATURATED OUTPUT POWER vs. FREQUENCY

0

Pin = –6 dBm

–5

(dBm)

O (sat)

VCC = 3.3 V

VCC = 3.0 V

–10

VCC = 2.7 V

–15

–20

Saturated Output Power P

–25

0.1 0.3 1.0 3.0
Frequency f (GHz)

–50

0.1 0.3 1.0 3.0

0

VCC = 3.0 V
f = 1.9 GHz

TA = +85 °C

–5

TA = –40 °C

–10

(dBm)

out

TA = –40 °C

TA = +25 °C

–15

TA = +25 °C

–20

Output Power P

TA = +85 °C

–25

–30

–40 –35 –30 –25 –20 –15 –10 –5 0

Input Power Pin (dBm)

THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE

–50
–45

(dBc)

3

–40

f1 = 1.900 GHz

2

= 1.902 GHz

f

VCC = 3.3 V

–35
–30
–25

VCC = 3.0 V

–20
–15

VCC = 2.7 V

–10

–5

Third Order Intermodulation Distortion IM

0

–30 –28 –26 –24 –22 –20 –18 –16 –14 –12 –10

Output Power of Each Tone P

O (each)

(dBm)

8

Data Sheet P13489EJ2V0DS00

S-PARAMETER (TA = +25 °C, VCC = 3.0 V)

S11-FREQUENCY

µµµµ

PC2749TB

S22-FREQUENCY

1.0 G

0.1 G

2.0 G

3.0 G

0.1 G

1.0 G

3.0 G

2.0 G

Data Sheet P13489EJ2V0DS00

9

TYPICAL S-PARAMETER VALUES (TA = +25 °C)

PC2749TB

µ

VCC = 3.0 V, ICC = 6.5 mA

µµµµ

PC2749TB

FREQUENCY

MHz MAG ANG MAG ANG MAG ANG MAG ANG

100.0000 0.021 13.0 4.096 –1.9 0.002 –1.1 0.024 165.8 66.82

200.0000 0.038 –30.5 4.216 –7.8 0.001 75.4 0.033 113.6 129.26

300.0000 0.034 –71.8 4.282 –15.5 0.001 141.5 0.064 96.1 90.16

400.0000 0.052 –120.5 4.403 –21.0 0.002 129.9 0.080 87.9 45.30

500.0000 0.062 –149.9 4.390 –26.6 0.002 134.1 0.103 76.9 57.58

600.0000 0.079 –169.7 4.399 –31.6 0.003 128.3 0.127 68.6 34.08

700.0000 0.097 173.6 4.566 –36.7 0.005 132.9 0.151 60.6 22.08

800.0000 0.116 160.5 4.667 –41.3 0.007 131.5 0.174 53.7 14.70

900.0000 0.134 149.3 4.843 –46.8 0.008 129.3 0.197 44.9 12.29

1000.0000 0.156 138.8 5.016 –52.6 0.009 124.6 0.220 36.1 10.00

1100.0000 0.178 128.5 5.305 –60.3 0.014 131.4 0.240 28.0 6.15

1200.0000 0.195 118.7 5.660 –67.1 0.016 122.5 0.262 17.3 5.13

1300.0000 0.214 108.7 5.835 –76.2 0.020 118.6 0.279 8.6 3.80

1400.0000 0.229 99.5 6.148 –84.5 0.022 114.4 0.287 –2.0 3.23

1500.0000 0.249 89.4 6.364 –93.8 0.025 107.7 0.294 –13.5 2.72

1600.0000 0.259 79.9 6.611 –103.6 0.028 104.3 0.294 –23.6 2.35

1700.0000 0.264 69.8 6.577 –113.5 0.032 96.8 0.283 –33.8 2.09

1800.0000 0.259 60.3 6.549 –123.4 0.034 91.8 0.272 –44.1 1.99

1900.0000 0.248 50.9 6.407 –132.9 0.036 83.3 0.256 –53.8 1.97

2000.0000 0.238 43.6 6.321 –140.8 0.037 78.5 0.234 –61.4 1.99

2100.0000 0.218 35.9 6.046 –148.8 0.038 75.1 0.213 –69.5 2.04

2200.0000 0.204 30.1 5.862 –156.5 0.039 70.4 0.193 –73.8 2.08

2300.0000 0.183 25.3 5.696 –163.2 0.040 68.3 0.174 –79.5 2.15

2400.0000 0.156 21.2 5.430 –170.5 0.041 60.7 0.164 –84.1 2.25

2500.0000 0.140 18.8 5.282 –176.3 0.042 61.6 0.152 –82.1 2.25

2600.0000 0.119 18.7 5.013 177.2 0.040 58.1 0.142 –84.5 2.53

2700.0000 0.095 21.2 4.849 170.9 0.042 55.1 0.146 –85.5 2.46

2800.0000 0.078 30.0 4.596 164.9 0.042 51.9 0.149 –83.9 2.62

2900.0000 0.066 44.5 4.446 158.1 0.042 44.7 0.154 –91.8 2.70

3000.0000 0.070 66.0 4.163 152.3 0.044 41.9 0.171 –92.8 2.73

3100.0000 0.082 78.1 3.966 145.3 0.042 37.1 0.181 –99.6 2.97

11

S

21

S

12

S

22

S

K

10

Data Sheet P13489EJ2V0DS00

PACAGE DIMENSIONS

6 pin super minimold (Unit: mm)

µµµµ

PC2749TB

2.1 ±0.1

1.25 ±0.1

+0.1

0.2

–0

0.65 0.65

1.3

2.0 ±0.2

0.1 MIN.

0.7

0.9 ±0.1

0.15

+0.1
–0

0 to 0.1

Data Sheet P13489EJ2V0DS00

11

µµµµ

PC2749TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Conditions Recommended Condi tion Symbol

Infrared Reflow Package peak temperature: 235 °C or below

Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t: None

VPS Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t: None

Wave Soldering Soldering bath temperature: 260 °C or below

Time: 10 seconds or less
Count: 1, Exposure limi t: None

Partial Heating Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)
Exposure limit: None

After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Note

Note

Note

Note

Note

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

12

Data Sheet P13489EJ2V0DS00

[MEMO]

µµµµ

PC2749TB

Data Sheet P13489EJ2V0DS00

13

[MEMO]

µµµµ

PC2749TB

14

Data Sheet P13489EJ2V0DS00

[MEMO]

µµµµ

PC2749TB

Data Sheet P13489EJ2V0DS00

15

µµµµ

PC2749TB

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8