COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
25
IF = 20 mA
20
(mA)
C
15
10
Collector Current I
5
10 mA
5 mA
2 mA
6842010
Collector to Emitter Voltage VCE (V)
100
1250
1 mA
0.5 mA
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
10 000
(nA)
CEO
1 000
VCE = 20 V
100
10
1
Collector to Emitter Dark Current I
–25
40 V
0
Ambient Temperature TA (˚C)
25
50
6
75
100
Data Sheet P14764EJ1V1DS00
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
100
10 mA
5 mA
2 mA
(mA)
C
10
1 mA
1
Collector Current I
0.1
0.00.20.40.60.81.0
Collector Saturation Voltage V
F
= 0.5mA
I
CE(sat)
(V)
PS2815-1,PS2815-4
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.4
1.2
1.0
0.8
0.6
0.4
Normalized to 1.0
at T
A
0.2
Normalized Current Transfer Ratio CTR
0.0
–50
–25
025
Ambient Temperature T
= 25 ˚C,
I
F
= 1 mA, VCE = 5 V
5075
A
(˚C)
SWITCHING TIME vs.
LOAD RESISTANCE
100
I
C
= 2 mA,
CC
= 5 V,
V
CTR = 200 %
µ
10
t
f
t
r
t
d
1
Switching Time t ( s)
t
s
100
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
300
VCE = 5 V,
n = 3
250
200
150
100
50
Current Transfer Ratio CTR (%)
0.021000.11.010
Forward Current I
SWITCHING TIME vs.
LOAD RESISTANCE
1 000
I
F
= 1 mA,
V
CC
= 5 V,
CTR = 200 %
100
µ
10
1
Switching Time t ( s)
F
(mA)
t
f
t
s
t
r
t
d
0.1
0
–5
–10
–15
Normalized Gain Gv
–20
–25
0.1
Remark
The graphs indicate nominal characteristics.
10010
1 k
Load Resistance RL (kΩ)
FREQUENCY RESPONSE
RL = 1 kΩ
300 Ω
1
10
Frequency f (kHz)
1001 000
100 Ω
10 k
0.1
1001k10 k100 k
Load Resistance RL (kΩ)
LONG TERM CTR DEGRADATION
1.2
IF = 1 mA
1.0
0.8
0.6
0.4
CTR (Relative Value)
0.2
0
10
10
2
TA = 25 ˚C
TA = 60 ˚C
3
10
Time (Hr)
10
10
5
4
10
6
Data Sheet P14764EJ1V1DS00
7
TAPING SPECIFICATIONS (in millimeters)
PS2815-1
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
4.0±0.1
1.55±0.1
3.3±0.1
1.75±0.1
7.5±0.1
16.0±0.3
PS2815-1,PS2815-4
2.5±0.1
7.5±0.1
0.3
Tape Direction
PS2815-1-F3PS2815-1-F4
15
50315503155031550315503
Outline and Dimensions (Reel)
R 1.0
2.0±0.5
13.0±0.5
φ
φ
21.0±0.8
50315503155031550315503
15
330
φ
100±5.0
φ
2.5
+2.0
16.4
–0.0
Packing: 3 500 pcs/reel
8
Data Sheet P14764EJ1V1DS00
PS2815-4
PS2815-1,PS2815-4
Outline and Dimensions (Tape)
Tape Direction
2.0±0.1
4.0±0.1
1.55±0.1
PS2815-4-F3PS2815-4-F4
12.0±0.1
1.55±0.1
1.75±0.1
7.5±0.1
16.0±0.3
7.6±0.1
2.5±0.1
10.45±0.1
0.3
Outline and Dimensions (Reel)
R 1.0
Packing: 2 500 pcs/reel
2.0±0.5
13.0±0.5
φ
21.0±0.8
φ
330
φ
100±5.0
φ
2.5
16.4
+2.0
–0.0
Data Sheet P14764EJ1V1DS00
9
PS2815-1,PS2815-4
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature235 °C or below (package surface temperature)
• Time of temperature higher than 210 °C30 seconds or less
• Number of reflowsThree
• FluxRosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Package Surface Temperature T (˚C)
Time (s)
(2) Dip soldering
• Temperature260 °C or below (molten solder temperature)
• Time10 seconds or less
• Number of timesOne
• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet P14764EJ1V1DS00
PS2815-1,PS2815-4
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
Data Sheet P14764EJ1V1DS00
11
PS2815-1,PS2815-4
NEPOC is a trademark of NEC Corporation.
•
The information in this document is current as of May, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.