查询NE678M04供应商
MEDIUM POWER NPN SILICON
HIGH FREQUENCY TRANSISTOR
FEATURES
• HIGH GAIN BANDWIDTH:
T = 12 GHz
f
• HIGH OUTPUT POWER:
P-1dB = 18 dBm at 1.8 GHz
• HIGH LINEAR GAIN:
G
L
= 13 dB at 1.8 GHz
• NEW LOW PROFILE M04 PACKAGE:
SOT-343 footprint, with a height of only 0.59 mm
Flat lead style for better RF performance
DESCRIPTION
The NE678M04 is fabricated using NEC's HFT3 wafer process. With a transition frequency of 12 GHz, the NE678M04 is
usable in applications from 100 MHz to 3 GHz. The NE678M04
provides P1dB of 18 dBm, even with low voltage and low
current, making this device an excellent choice for the driver
stage for mobile or fixed wireless applications.
The NE678M04 is housed in NEC's new low profile/flat lead
style "M04" package
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER NE678M04
PACKAGE OUTLINE M04
EIAJ3 REGISTRATION NUMBER 2SC5753
2.0±0.1
1.25
2.05±0.1
+0.30
-0.05
1.25±0.1
+0.40
2
R55
0.65
0.65
1
+0.01
+0.30
-0.05
0.59±0.05
PIN CONNECTIONS
1. Emitter
2. Collector
3. Emitter
4. Base
NE678M04
3
0.65
1.30
0.65
4
(leads 1, 3 and ,4)
+0.1
-0.05
+0.11
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX
ICBO Collector Cutoff Current at VCB = 5V, IE = 0 nA 100
IEBO Emitter Cutoff Current at VEB = 1 V, IC = 0 nA 100
DC
hFE DC Current1 Gain at VCE = 3 V, IC = 30 mA 75 120 150
P1dB Output Power at 1 dB compression point at VCE = 2.8 V, ICQ = 10 mA, dBm 18.0
GL Linear Gain at VCE = 2.8 V, IC = 10 mA, f = 1.8 GHz, Pin = -5 dBm dB 13.0
MAG Maximum Available Gain4 at VCE = 3 V, IC = 30 mA, f = 2 GHz dBm 13.5
RF
|S21E|
ηc Collector Efficiency at VCE = 2.8 V, ICQ = 10 mA, f = 1.8 GHz, % 55
NF Noise Figure at VCE = 3 V, IC = 7 mA, f = 2 GHz, ZS = Zopt dB 1.7 2.5
fT Gain Bandwidth at VCE = 3 V, IC = 30 mA, f = 2 GHz GHz 12.0
Cre Reverse Transfer Capacitance2 at VCB = 3 V, IC = 0, f = 1 MHz pF 0.42 0.7
Notes:
1. Pulsed measurement, pulse width ≤ 350 µs, duty cycle ≤ 2 %.
2. Collector to Base capacitance measured by capacitance meter(automatic balance bridge method) when emitter pin is connected to the
guard pin of capacitance meter.
3. Electronic Industrail Association of Japan.
21
|
MAG =
|S
|S12|
4.
f = 1.8 GHz, Pin = 7 dBm
2
Insertion Power Gain at VCE = 3 V, IC = 30 mA, f = 2 GHz dB 8.0 10.5
Pin = 7 dBm
(K ±
2
K - 1
).
California Eastern Laboratories
NE678M04
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25°C)
SYMBOLS PARAMETERS UNITS RATINGS
VCBO Collector to Base Voltage V 9.0
VCEO Collector to Emitter Voltage V 6.0
EBO Emitter to Base Voltage V 2.0
V
IC Collector Current mA 100
P
T Total Power Dissipation
2
mW 205
TJ Junction Temperature °C 150
STG Storage Temperature °C -65 to +150
T
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Mounted on a 1.08cm2 x 1.0 mm thick glass epoxy PCB.
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
300
250
(mW)
out
205
200
150
100
50
Total Power Dissipation P
25 50
0
Ambient Temperature TA (ºC)
Mounted on Glass Epoxy PCB
2
x 1.0 mm (t) )
(1.08 cm
100
75
125 150
ORDERING INFORMATION
PART NUMBER QUANTITY
NE678M04-T2 3k pcs./reel
THERMAL RESISTANCE
SYMBOLS PARAMETERS UNITS RATINGS
Rth j-a Thermal Resistance from °C/W 600
Note:
1. Mounted on a 1.08cm2 x 1.0 mm thick glass epoxy PCB.
(pF)
re
Reverse Transfer Capacitance C
Junction to Ambient
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1
2
0
3
f= 1 MHz
4
Collector to Base Voltage VCB (V)
6
5
vs. COLLECTOR TO EMITTER VOLTAGE
COLLECTOR CURRENT
100
90
80
70
(mA)
C
60
50
40
30
Collector Current I
20
10
0246
700 µA
600 µA
500 µA
400 µA
300 µA
Collector to Emitter Voltage VCE (V)
200 µA
IB =100 µA
DC CURRENT GAIN
vs. COLLECTOR CURRENT
1000
)
FE
100
VCE = 3 V
DC Current Gain (h
10
8
0.1 1
10
100
Collector Current IC (mA)
TYPICAL PERFORMANCE CURVES (TA = 25 °C)
NE678M04
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
15
VCE = 3 V
f = 2 GHz
(GHz)
T
10
5
Gain Bandwidth Product f
0
110100
Collector Current IC (mA)
INSERTION POWER GAIN,
MAG, MSG vs. COLLECTOR CURRENT
25
VCE = 3 V
f = 1 GHz
20
, (dB)
2
|
21e
15
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
, (dB)
2
|
21e
35
30
MSG
25
MAG
VCE = 3 V
I
C
= 30 mA
20
15
10
Insertion Power Gain |S
5
Maximum Stable Power Gain MSG (dB)
0
Maximum Available Power Gain MAG (dB)
0.1
2
|S
21e
|
110
Frequency f (mA)
INSERTION POWER GAIN,
MAG, MSG vs. COLLECTOR CURRENT
25
20
15
VCE = 3 V
f = 2 GHz
MSG
MAG
MSG
2
|S
21e
|
MAG
, (dB)
2
|
21e
10
5
Insertion Power Gain |S
Maximum Stable Power Gain MSG (dB)
0
Maximum Available Power Gain MAG (dB)
110100
Collector Current IC (mA)
INSERTION POWER GAIN,
MAG vs. COLLECTOR CURRENT
25
VCE = 3 V
f = 2.5 GHz
20
, (dB)
2
|
21e
15
MAG
10
2
21e
|
5
|S
Insertion Power Gain |S
0
Maximum Available Power Gain MAG (dB)
Collector Current IC (mA)
10
2
|S
21e
|
5
Insertion Power Gain |S
Maximum Stable Power Gain MSG (dB)
0
Maximum Available Power Gain MAG (dB)
100101
Collector Current IC (mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
8
VCE = 3 V
f = 2 GHz
G
6
a
4
Noise Figure NF (dB)
2
NF
100101
0
110100
16
12
(dB)
a
8
4
Associated Gain G
0
Collector Current IC (mA)