NEC 2SK3358-S, 2SK3358, 2SK3358-Z Datasheet

PRELIMINARY DATA SHEET
MOS FIELD EFFECT TRANSISTOR
SWITCHING
N-CHANNEL POWER MOS FET
INDUSTRIAL USE
DESCRIPTION
The 2SK3358 is N-Channel MOS Field Effect Transistor designed for high current switching applications.
FEATURES
Low on-state resistance
DS(on)1
R
= 30 m MAX. (VGS = 10 V, ID = 28 A)
DS(on)2
R
★ ★
Low C
= 40 m MAX. (VGS = 4.5 V, ID = 20 A)
iss
iss
: C
= 3200 pF TYP.
Built-in gate protection diode
ABSOLUTE MAXIMUM RATI NGS (TA = 25 °C)
Drain to Source Voltage (VGS = 0 V) V Gate to Source Voltage (V Gate to Source Voltage (V
DS
= 0 V) V
DS
= 0 V) V Drain Current (DC) I Drain Current (Pulse)
Total Power Dissipation (T Total Power Dissipation (T
Note1
C
= 25°C) P
A
= 25°C) P Channel Temperature T Storage Temperature T Single Avalanche Current Single Avalanche Energy
Note2
Note2
DSS
GSS(AC)
GSS(DC)
D(DC)
D(pulse)
I
T
T
ch
stg
AS
I
AS
E
ORDERING INFORMATION
PART NUMBER PACKAGE
2SK3358 TO-220AB 2SK3358-S TO-262 2SK3358-Z TO-220SMD
100 V ±20 V
+20, 10 V
±55 A
±165 A
100 W
1.5 W
150 °C
–55 to +150 °C
39 A
152 mJ
(TO-220AB)
(TO-262)
Notes 1.
2.
PW 10 Starting Tch = 25 °C, RG = 25 Ω, VGS = 20 V 0 V
µ
s, Duty cycle 1 %
THERMAL RESISTANCE
Channel to Case R Channel to Ambient R
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. D14322EJ1V0DS00 (1st edition) Date Published April 2000 NS CP(K) Printed in Japan
th(ch-C)
th(ch-A)
The mark
1.25 °C/W
83.3 °C/W
★★★★
shows major revised points.
(TO-220SMD)
©
1999
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
2SK3358
Drain to Source On-state Resi stance R
★ ★
Gate to Source Cut-off Voltage V
Forward Transfer Admittance | yfs |VDS = 10 V, ID = 28 A 17 35 S Drain Leakage Current I Gate to Source Leakage Current I
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Turn-on Delay Time t Rise Time t Turn-off Delay Time t Fall Time t Total Gate Charge Q Gate to Source Charge Q Gate to Drain Charge Q Body Diode Forward Voltage V
Reverse Recovery Time t Reverse Recovery Charge Q
DS(on)1VGS
DS(on)2VGS
R
GS(off)VDS
DSS
GSS
iss
oss
rss
d(on)ID
r
d(off)
f
G
GS
GD
F(S-D)IF
rr
rr
= 10 V, ID = 28 A 20 30 m = 4.5 V, ID = 20 A 28 40 m = 10 V, ID = 250 µA 1.5 2.0 2.5 V
VDS = 100 V, VGS = 0 V 10 VGS = ±20 V, VDS = 0 V VDS = 10 V 3200 pF VGS = 0 V 640 pF f = 1 MHz 360 pF
= 28 A 40 ns
GS(on)
V
= 10 V 300 ns VDD = 50 V 220 ns RG = 10
230 ns ID = 55 A 84 nC VDD = 80 11 nC
GS(on)
V
= 10 V 31 nC
= 55 A, VGS = 0 V 1.0 V
IF = 55 A, VGS = 0 V 160 ns di/dt = 100 A /
s 760 nC
µ
Ω Ω
A
µ
10
±
A
µ
TEST CIRCUIT 1 AVALANCHE CAPABILITY
D.U.T.
L
V
DD
PG.
RG = 25
50
VGS = 20 0 V
BV
DSS
I
AS
V
I
D
V
DD
DS
Starting T
ch
TEST CIRCUIT 3 GATE CHARGE
D.U.T.
PG.
IG = 2 mA
50
R
L
V
DD
TEST CIRCUIT 2 SWITCHING TIME
D.U.T.
L
R
G
PG.
GS
V
0
τ = 1 s Duty Cycle 1 %
R
V
DD
τ
µ
GS
V
Wave Form
I
D
Wave Form
V
GS
10 %
0
90 %
I
D
10 %
0
t
d(on)
r
t
on
t
90 %
V
GS
(on)
90 %
I
D
10 %
t
d(off)
t
f
t
off
2
Preliminary Data Sheet D14322EJ1V0DS00
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