DATA SHEET
MOS FIELD EFFECT TRANSISTOR
2SK3113B
SWITCHING
N-CHANNEL POWER MOS FET
DESCRIPTION
The 2SK3113B is N-channel MOS FET device that features a low gate charge and excellent switching
characteristics, and designed for high voltage applications such as switching power supply, AC adapter.
FEATURES
• Low on-state resistance
R
DS(on) = 4.4 Ω MAX. (VGS = 10 V, ID = 1.0 A)
• Low gate charge
G = 7.9 nC TYP. (VDD = 450 V, VGS = 10 V, ID = 2.0 A)
Q
• Gate voltage rating : ±30 V
• Avalanche capability ratings
<R>
ORDERING INFORMATION
PART NUMBER LEAD PLATING PACKING PACKAGE
2SK3113B-S15-AY
2SK3113B(1)-S27-AY
2SK3113B-ZK-E1-AY
2SK3113B-ZK-E2-AY
Note
Note
Note
Note
Pure Sn (Tin)
Tube 70 p/tube TO-251 (MP-3-a) typ. 0.39 g
Tube 75 p/tube
Tape 2500 p/reel TO-252 (MP-3ZK) typ. 0.27 g
Note Pb-free (This product does not contain Pb in external electrode.)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V) VDSS
Gate to Source Voltage (V
Drain Current (DC) (T
Drain Current (pulse)
Total Power Dissipation (T
Total Power Dissipation (T
Channel Temperature T
Storage Temperature T
Single Avalanche Current
Single Avalanche Energy
DS = 0 V) VGSS ±30 V
C = 25°C) ID(DC) ±2.0 A
Note1
C = 25°C) PT1 20 W
A = 25°C)
Note3
Note3
Note2
D(pulse) ±8.0 A
I
T2 1.0 W
P
ch 150 °C
stg –55 to +150 °C
AS 2.0 A
I
AS 2.7 mJ
E
TO-251 (MP-3-b) typ. 0.34 g
600
V
(TO-251)
(TO-252)
Notes 1. PW ≤ 10
μ
s, Duty Cycle ≤ 1%
2. Mounted on glass epoxy board of 40 mm × 40 mm × 1.6 mm
3. Starting T
Document No. D18061EJ3V0DS00 (3rd edition)
Date Published June 2007 NS
Printed in Japan
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
ch = 25°C, VDD = 150 V, RG = 25 Ω, VGS = 20 → 0 V
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
The mark <R> shows major revised points.
2006
2SK3113B
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Zero Gate Voltage Drain Current IDSS VDS = 600 V, VGS = 0 V 100 μA
Gate Leakage Current IGSS VGS = ±30 V, VDS = 0 V ±10 μA
Gate Cut-off Voltage VGS(off) VDS = 10 V, ID = 1 mA 2.5 3.5 V
Forward Transfer Admittance
Drain to Source On-state Resistance
Input Capacitance Ciss VDS = 10 V 290 pF
Output Capacitance Coss VGS = 0 V 75 pF
Reverse Transfer Capacitance Crss f = 1 MHz 7 pF
Turn-on Delay Time td(on) VDD = 150 V, ID = 1.0 A 10.5 ns
Rise Time tr VGS = 10 V 4.8 ns
Turn-off Delay Time td(off) RG = 10 Ω 15.8 ns
Fall Time tf RL = 10 Ω 10.5 ns
Total Gate Charge QG VDD = 450 V 7.9 nC
Gate to Source Charge QGS VGS = 10 V 2.7 nC
Gate to Drain Charge QGD ID = 2.0 A 3.2 nC
Body Diode Forward Voltage
Reverse Recovery Time trr IF = 2.0 A, VGS = 0 V 190 ns
Reverse Recovery Charge Qrr di/dt = 50 A/μs 500 nC
Note Pulsed
TEST CIRCUIT 1 AVALANCHE CAPABILITY
Note
| yfs | VDS = 10 V, ID = 1.0 A 0.5 0.9 S
Note
RDS(on) VGS = 10 V, ID = 1.0 A 3.2 4.4
Note
VF( S-D) IF = 2.0 A, VGS = 0 V 0.8 V
TEST CIRCUIT 2 SWITCHING TIME
Ω
D.U.T.
RG = 25 Ω
PG.
50 Ω
VGS = 20 → 0 V
DSS
BV
I
AS
I
D
DD
V
Starting T
TEST CIRCUIT 3 GATE CHARGE
D.U.T.
IG = 2 mA
PG.
50 Ω
L
V
DD
PG.
V
V
DS
ch
L
R
V
DD
GS
0
μ
τ = 1 s
Duty Cycle ≤ 1%
D.U.T.
V
GS
R
L
V
GS
R
G
Wave Form
V
DD
I
D
Wave Form
τ
10%
0
I
D
10%
0
t
d(on)trtd(off)
90%
t
on
90%
V
GS
90%
I
D
10%
t
f
t
off
2
Data Sheet D18061EJ3V0DS
2SK3113B
TYPICAL CHARACTERISTICS (TA = 25°C)
dT - Percentage of Rated Power - %
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
100
80
60
40
20
0
04020 60 100 14080 120 160
T
ch - Channel Temperature - °C
TOTAL POWER DISSIPATION vs.
CASE TEMPERATURE
40
35
30
25
20
15
10
5
0
0
PT - Total Power Dissipation - W
T
C - Case Temperature - °C
8020 40 60 100 140120 160
ID - Drain Current - A
FORWARD BIAS SAFE OPERATING AREA
100
Tc = 25°C, Single pulse
I
D(pulse)
10
D(DC)
I
1
R
DS(on)
0.1
(at V
Power Dissipation Limited
Limited
GS
= 10 V)
PW = 10 μs
100 μs
1 ms
10 ms
0.01
1 10 100 1000
DS - Drain to Source Voltage - V
V
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
R
= 125°C/W
th(ch-A)
100
R
= 6.25°C/W
10
th(ch-C)
1
0.1
rth(ch-A) - Transient Thermal Resistance - °C/W
0.01
100
μ
1 m 10 m 100 m 1 10 100 1000
Single pulse
PW - Pulse Width – s
Data Sheet D18061EJ3V0DS
3