NATIONAL SEMICONDUCTOR TP3067V-X, TP3067WM, TP3067V, TP3067N Datasheet

TL/H/5070
TP3064, TP3067 ‘‘Enhanced’’ Serial Interface CMOS CODEC/Filter COMBO
October 1991
TP3064, TP3067 ‘‘Enhanced’’ Serial Interface CMOS CODEC/Filter COMBO
É
General Description
Figure 1
, and a serial PCM interface. The devices are fabricated using National’s advanced dou­ble-poly CMOS process (microCMOS).
Similar to the TP305X family, these devices feature an addi­tional Receive Power Amplifier to provide push-pull bal­anced output drive capability. The receive gain can be ad­justed by means of two external resistors for an output level of up to
g
6.6V across a balanced 600X load.
Also included is an Analog Loopback switch and a TS
X
out-
put.
See also AN-370, ‘‘Techniques for Designing with CODEC/ Filter COMBO Circuits.’’
COMBOÉand TRI-STATEÉare registered trademarks of National Semiconductor Corpora­tion.
Features
Y
Complete CODEC and filtering system including: Ð Transmit high-pass and low-pass filtering Ð Receive low-pass filter with sin x/x correction Ð Active RC noise filters Ð m-law or A-law compatible COder and DECoder Ð Internal precision voltage reference Ð Serial I/O interface Ð Internal auto-zero circuitry Ð Receive push-pull power amplifiers
Y
m-lawÐTP3064
Y
A-lawÐTP3067
Y
Designed for D3/D4 and CCITT applications
Y
g
5V operation
Y
Low operating powerÐtypically 70 mW
Y
Power-down standby modeÐtypically 3 mW
Y
Automatic power-down
Y
TTL or CMOS compatible digital interfaces
Y
Maximizes line interface card circuit density
Block Diagram
TL/H/5070– 1
FIGURE 1
C
1995 National Semiconductor Corporation RRD-B30M115/Printed in U. S. A.
Connection Diagrams
Dual-In-Line Package
TL/H/5070– 2
Top View
Plastic Chip Carrier
TL/H/5070– 6
Top View
Order Number TP3064J or TP3067J
See NS Package J20A
Order Number TP3064WM or TP3067WM
See NS Package M20B
Order Number TP3064N or TP3067N
See NS Package N20A
Order Number TP3064V or TP3067V
See NS Package V20A
Pin Description
Symbol Function
VPO
a
The non-inverted output of the receive power amplifier.
GNDA Analog ground. All signals are referenced to
this pin.
VPO
b
The inverted output of the receive power
amplifier. VPI Inverting input to the receive power amplifier. VF
R
O Analog output of the receive filter.
V
CC
Positive power supply pin. V
CC
ea
5Vg5%.
FS
R
Receive frame sync pulse which enables
BCLK
R
to shift PCM data into DR.FSRis an
8 kHz pulse train. See
Figures 2
and3for
timing details. D
R
Receive data input. PCM data is shifted into
D
R
following the FSRleading edge.
BCLK
R
/ The bit clock which shifts data into DRafter
the FS
R
leading edge. May vary from 64 kHz
CLKSEL
to 2.048 MHz. Alternatively, may be a logic
input which selects either
1.536 MHz/1.544 MHz or 2.048 MHz for
master clock in synchronous mode and
BCLK
X
is used for both transmit and receive
directions (see Table I). MCLK
R
/ Receive master clock. Must be 1.536 MHz,
1.544 MHz or 2.048 MHz. May be
PDN
asynchronous with MCLK
X
, but should be
synchronous with MCLK
X
for best
performance. When MCLK
R
is connected
continuously low, MCLK
X
is selected for all
internal timing. When MCLK
R
is connected continuously high, the device is powered down.
Symbol Function
MCLK
X
Transmit master clock. Must be 1.536 MHz,
1.544 MHz or 2.048 MHz. May be asynchronous with MCLK
R
. Best performance is realized from synchronous operation.
BCLK
X
The bit clock which shifts out the PCM data on D
X
. May vary from 64 kHz to 2.048 MHz,
but must be synchronous with MCLK
X
.
D
X
The TRI-STATEÉPCM data output which is enabled by FS
X
.
FS
X
Transmit frame sync pulse input which enables BCLK
X
to shift out the PCM data on
D
X
.FSXis an 8 kHz pulse train, see
Figures 2
and3for timing details.
TS
X
Open drain output which pulses low during the encoder time slot.
ANLB Analog Loopback control input. Must be set
to logic ‘0’ for normal operation. When pulled to logic ‘1’, the transmit filter input is disconnected from the output of the transmit preamplifier and connected to the VPO
a
output of the receive power amplifier.
GS
X
Analog output of the transmit input amplifier. Used to externally set gain.
VF
X
I
b
Inverting input of the transmit input amplifier.
VF
X
I
a
Non-inverting input of the transmit input amplifier.
V
BB
Negative power supply pin. V
BB
eb
5Vg5%.
2
Functional Description
POWER-UP
When power is first applied, power-on reset circuitry initializ­es the COMBO
TM
and places it into a power-down state. All
non-essential circuits are deactivated and the D
X
,VFRO,
VPO
b
and VPOaoutputs are put in high impedance states. To power-up the device, a logical low level or clock must be applied to the MCLK
R
/PDN pin
and
FSXand/or FSRpulses must be present. Thus, 2 power-down control modes are available. The first is to pull the MCLK
R
/PDN pin high; the
alternative is to hold both FS
X
and FSRinputs continuously lowÐthe device will power-down approximately 2 ms after the last FS
X
or FSRpulse. Power-up will occur on the first
FS
X
or FSRpulse. The TRI-STATE PCM data output, DX,
will remain in the high impedance state until the second FS
X
pulse.
SYNCHRONOUS OPERATION
For synchronous operation, the same master clock and bit clock should be used for both the transmit and receive di­rections. In this mode, a clock must be applied to MCLK
X
and the MCLKR/PDN pin can be used as a power-down control. A low level on MCLK
R
/PDN powers up the device and a high level powers down the device. In either case, MCLK
X
will be selected as the master clock for both the transmit and receive circuits. A bit clock must also be ap­plied to BCLK
X
and the BCLKR/CLKSEL can be used to select the proper internal divider for a master clock of 1.536 MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame.
With a fixed level on the BCLK
R
/CLKSEL pin, BLCKXwill be selected as the bit clock for both the transmit and receive directions. Table I indicates the frequencies of operation which can be selected, depending on the state of BCLK
R
/
CLKSEL. In this synchronous mode, the bit clock, BCLK
X
, may be from 64 kHz to 2.048 MHz, but must be synchro­nous with MCLK
X
.
Each FSXpulse begins the encoding cycle and the PCM data from the previous encode cycle is shifted out of the enabled D
X
output on the positive edge of BCLKX. After 8
bit clock periods, the TRI-STATE D
X
output is returned to a
high impedance state. With an FS
R
pulse, PCM data is
latched via the D
R
input on the negative edge of BCLKX(or
BCLK
R
if running). FSXand FSRmust be synchronous with
MCLK
X/R
.
TABLE I. Selection of Master Clock Frequencies
Master Clock
BCLK
R
/CLKSEL
Frequency Selected
TP3067 TP3064
Clocked 2.048 MHz 1.536 MHz or
1.544 MHz
0 1.536 MHz or 2.048 MHz
1.544 MHz
1 2.048 MHz 1.536 MHz or
1.544 MHz
ASYNCHRONOUS OPERATION
For asynchronous operation, separate transmit and receive clocks may be applied. MCLK
X
and MCLKRmust be 2.048 MHz for the TP3067, or 1.536 MHZ, 1.544 MHz for the TP3064, and need not be synchronous. For best transmis-
sion performance, however, MCLK
R
should be synchronous
with MCLK
X
, which is easily achieved by applying only static
logic levels to the MCLK
R
/PDN pin. This will automatically
connect MCLK
X
to all internal MCLKRfunctions (see Pin Description). For 1.544 MHz operation, the device automati­cally compensates for the 193rd clock pulse each frame. FS
X
starts each encoding cycle and must be synchronous
with MCLK
X
and BCLKX.FSRstarts each decoding cycle
and must be synchronous with BCLK
R
. BCLKRmust be a clock, the logic levels shown in Table I are not valid in asyn­chronous mode. BCLK
X
and BCLKRmay operate from 64
kHz to 2.048 MHz.
SHORT FRAME SYNC OPERATION
The COMBO can utilize either a short frame sync pulse (the same as the TP3020/21 CODECs) or a long frame sync pulse. Upon power initialization, the device assumes a short frame mode. In this mode, both frame sync pulses, FS
X
and
FS
R
, must be one bit clock period long, with timing relation-
ships specified in
Figure 2
. With FSXhigh during a falling
edge of BCLK
X
, the next rising edge of BCLKXenables the
D
X
TRI-STATE output buffer, which will output the sign bit. The following seven rising edges clock out the remaining seven bits, and the next falling edge disables the D
X
output.
With FS
R
high during a falling edge of BCLKR(BCLKXin
synchronous mode), the next falling edge of BCLK
R
latches in the sign bit. The following seven falling edges latch in the seven remaining bits. All devices may utilize the short frame sync pulse in synchronous or asynchronous operating mode.
LONG FRAME SYNC OPERATION
To use the long (TP5116A/56 CODECs) frame mode, both the frame sync pulses, FS
X
and FSR, must be three or more
bit clock periods long, with timing relationships specified in
Figure 3
. Based on the transmit frame sync, FSX, the COM­BO will sense whether short or long frame sync pulses are being used. For 64 kHz operation, the frame sync pulse must be kept low for a minimum of 160 ns. The D
X
TRI-
STATE output buffer is enabled with the rising edge of FS
X
or the rising edge of BCLKX, whichever comes later, and the first bit clocked out is the sign bit. The following seven BCLK
X
rising edges clock out the remaining seven bits. The
D
X
output is disabled by the falling BCLKXedge following
the eighth rising edge, or by FS
X
going low, whichever comes later. A rising edge on the receive frame sync pulse, FS
R
, will cause the PCM data at DRto be latched in on the
next eight falling edges of BCLK
R
(BCLKXin synchronous mode). All devices may utilize the long frame sync pulse in synchronous or asynchronous mode.
TRANSMIT SECTION
The transmit section input is an operational amplifier with provision for gain adjustment using two external resistors, see
Figure 4
. The low noise and wide bandwidth allow gains in excess of 20 dB across the audio passband to be real­ized. The op amp drives a unity-gain filter consisting of RC active pre-filter, followed by an eighth order switched-ca­pacitor bandpass filter clocked at 256 kHz. The output of this filter directly drives the encoder sample-and-hold circuit. The A/D is of companding type according to m-law (TP3064) or A-law (TP3067) coding conventions. A preci­sion voltage reference is trimmed in manufacturing to pro­vide an input overload (t
MAX
) of nominally 2.5V peak (see
3
Functional Description (Continued)
table of Transmission Characteristics). The FS
X
frame sync pulse controls the sampling of the filter output, and then the successive-approximation encoding cycle begins. The 8-bit code is then loaded into a buffer and shifted out through D
X
at the next FSXpulse. The total encoding delay will be ap­proximately 165 ms (due to the transmit filter) plus 125 ms (due to encoding delay), which totals 290 ms. Any offset voltage due to the filters or comparator is cancelled by sign bit integration.
RECEIVE SECTION
The receive section consists of an expanding DAC which drives a fifth order switched-capacitor low pass filter clocked at 256 kHz. The decoder is A-law (TP3067) or m-law (TP3064) and the 5th order low pass filter corrects for the sin x/x attenuation due to the 8 kHz sample/hold. The filter is then followed by a 2nd order RC active post-filter with its output at VF
R
O. The receive section is unity-gain, but gain can be added by using the power amplifiers. Upon the occurrence of FS
R
, the data at the DRinput is clocked in
on the falling edge of the next eight BCLK
R
(BCLKX) peri-
ods. At the end of the decoder time slot, the decoding cycle begins, and 10 ms later the decoder DAC output is updated. The total decoder delay isE10 ms (decoder update) plus 110 ms (filter delay) plus 62.5 ms((/2 frame), which gives approximately 180 ms.
RECEIVE POWER AMPLIFIERS
Two inverting mode power amplifiers are provided for direct­ly driving a matched line interface transformer. The gain of the first power amplifier can be adjusted to boost the
g
2.5V
peak output signal from the receive filter up to
g
3.3V peak
into an unbalanced 300X load, or
g
4.0V into an unbal­anced 15 kX load. The second power amplifier is internally connected in unity-gain inverting mode to give 6 dB of signal gain for balanced loads.
S
2:1 turns ratio, as shown in
Figure 4
. A total peak power of 15.6 dBm can be delivered to the load plus termination.
ENCODING FORMAT AT D
X
OUTPUT
TP3064
TP3067
m-Law
A-Law
(Includes Even Bit Inversion)
V
IN
ea
Full-Scale 1 000000010101010
V
IN
e
0V 1 111111111010101
Ð0 111111101010101
V
IN
eb
Full-Scale 0 000000000101010
4
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
V
CC
to GNDA 7V
VBBto GNDA
b
7V
Voltage at any Analog Input
or Output V
CC
a
0.3V to V
BB
b
0.3V
Voltage at any Digital Input
or Output V
CC
a
0.3V to GNDAb0.3V
Operating Temperature Range
b
25§Ctoa125§C
Storage Temperature Range
b
65§Ctoa150§C
Lead Temp. (Soldering, 10 sec.) 300§C
ESD (Human Body Model) J 1000V
ESD (Human Body Model) N 1500V
Latch-Up Immunity 100 mA on Any Pin
Electrical Characteristics Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
e
a
5.0Vg5%, V
BB
eb
5.0Vg5%; T
A
e
0§Cto70§C by correlation with 100% electrical testing at T
A
e
25§C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GNDA. Typicals specified at V
CC
ea
5.0V, V
BB
eb
5.0V, T
A
e
25§C.
Symbol Parameter Conditions Min Typ Max Units
POWER DISSIPATION (ALL DEVICES)
ICC0 Power-Down Current (Note) 0.5 1.5 mA
IBB0 Power-Down Current (Note) 0.05 0.3 mA
ICC1 Active Current VPIe0V; VFRO, VPOaand VPObunloaded 7.0 10.0 mA
IBB1 Active Current VPIe0V; VFRO, VPOaand VPObunloaded 7.0 10.0 mA
DIGITAL INTERFACE
V
IL
Input Low Voltage 0.6 V
V
IH
Input High Voltage 2.2 V
V
OL
Output Low Voltage DX,I
L
e
3.2 mA 0.4 V
TS
X,IL
e
3.2 mA, Open Drain 0.4 V
V
OH
Output High Voltage DX,I
H
eb
3.2 mA 2.4 V
I
IL
Input Low Current GNDAsV
IN
s
VIL, All Digital Inputs
b
10 10 mA
I
IH
Input High Current V
IH
s
V
IN
s
V
CC
b
10 10 mA
I
OZ
Output Current in High Impedance DX, GNDAsV
O
s
V
CC
b
10 10 mA
State (TRI-STATE)
Note: I
CC0
and I
BB0
are measured after first achieving a power-up state.
5
Electrical Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
ea
5.0Vg5%, V
BB
eb
5.0Vg5%; T
A
e
0§Cto70§C by correlation with 100% electrical testing at T
A
e
25§C. All other limits are assured by correlation with other
production tests and/or product design and characterization. All signals referenced to GNDA. Typicals specified at V
CC
e
a
5.0V, V
BB
eb
5.0V, T
A
e
25§C.
Symbol Parameter Conditions Min Typ Max Units
ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (ALL DEVICES)
IIXA Input Leakage Current
b
2.5VsV
s
a
2.5V, VFXIaor VFXI
b
b
200 200 nA
RIXA Input Resistance
b
2.5VsV
s
a
2.5V, VFXIaor VFXI
b
10 MX
ROXA Output Resistance Closed Loop, Unity Gain 1 3 X
RLXA Load Resistance GS
X
10 kX
CLXA Load Capacitance GS
X
50 pF
VOXA Output Dynamic Range GSX,R
L
t
10 kX
b
2.8
a
2.8 V
AVXA Voltage Gain VFXIato GS
X
5000 V/V
FUXA Unity-Gain Bandwidth 1 2 MHz
VOSXA Offset Voltage
b
20 20 mV
VCMXA Common-Mode Voltage CMRRXAl60 dB
b
2.5 2.5 V
CMRRXA Common-Mode Rejection Ratio DC Test 60 dB
PSRRXA Power Supply Rejection Ratio DC Test 60 dB
ANALOG INTERFACE WITH RECEIVE FILTER (ALL DEVICES)
RORF Output Resistance Pin VFRO13X
R
L
RF Load Resistance VFRO
e
g
2.5V 10 kX
CLRF Load Capacitance Connect from VFRO to GNDA 25 pF
VOSRO Output DC Offset Voltage Measure from VFRO to GNDA
b
200 200 mV
ANALOG INTERFACE WITH POWER AMPLIFIERS (ALL DEVICES)
IPI Input Leakage Current
b
1.0VsVPIs1.0V
b
100 100 nA
RIPI Input Resistance
b
1.0VsVPIs1.0V 10 MX
VIOS Input Offset Voltage
b
25 25 mV
ROP Output Resistance Inverting Unity-Gain at 1 X
VPO
a
or VPO
b
F
C
Unity-Gain Bandwidth Open Loop (VPOb) 400 kHz
CLP Load Capacitance 100 pF
GA
P
a
Gain from VPObto VPO
a
R
L
e
600X VPOato VPO
b
b
1 V/V
Level at VPO
b
e
1.77 Vrms
PSRR
P
Power Supply Rejection of VPObConnected to VPI V
CC
or V
BB
0 kHzb4 kHz 60 dB 4 kHz
b
50 kHz 36 dB
RLP Load Resistance Connect from VPOato VPO
b
600 X
6
Loading...
+ 12 hidden pages