Datasheet NM93C06LZ, C46LZ, C56LZ, C66LZ Datasheet (National Semiconductor)

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NM93C06LZ/C46LZ/C56LZ/C66LZ 256-/1024-/2048-/4096-Bit Serial EEPROM with Zero Power and Extended Voltage (2.7V to 5.5V) (MICROWIRE
Bus Interface)
September 1996
NM93C06LZ/C46LZ/C56LZ/C66LZ 256-/1024-/2048-/4096-Bit Serial EEPROM with Zero Power
and Extended Voltage (2.7V to 5.5V) (MICROWIRE Bus Interface)
General Description
The NM93C06LZ/C46LZ/C56LZ/C66LZ devices are 256/ 1024/2048/4096 bits respectively, of CMOS non-volatile electrically erasable memory divided into 16/64/128/256 16-bit registers. They are fabricated using National Semi­conductor’s floating-gate CMOS process for high reliability and low power consumption. These memory devices are available in both SO and TSSOP packages for small space considerations.
The serial interface that operates these EEPROMs is MI­CROWIRE compatible for simple interface to standard mi­crocontrollers and microprocessors. There are 7 instruc­tions that control these devices: Read, Erase/Write Enable, Erase, Erase All, Write, Write All, and Erase/Write Disable. The ready/busy status is available on the DO pin to indicate the completion of a programming cycle.
Block Diagram
Features
Y
Less than 1.0 mA standby current
Y
2.7V–5.5V operation in all modes
Y
Typical active current of 100 mA
Y
Direct write: no erase before program
Y
Reliable CMOS floating gate technology
Y
MICROWIRE compatible serial I/O
Y
Self-timed programming cycle
Y
Device status indication during programming mode
Y
40 years data retention
Y
Endurance: 106data changes
Y
Packages available: 8-pin SO, 8-pin DIP, 8-pin TSSOP
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
TM
MICROWIRE
C
1996 National Semiconductor Corporation RRD-B30M96/Printed in U. S. A.
is a trademark of National Semiconductor Corporation.
TL/D/11778
TL/D/11778– 1
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Connection Diagram
Dual-in-Line Package (N)
8-Pin SO (M8) and 8-Pin TSSOP (MT8)
Top View
See NS Package Number
N08E and M08A
Ordering Information
Pin Description
CS Chip Select
SK Serial Data Clock
DI Serial Data Input
TL/D/11778– 2
Commercial Temperature Range (0§Ctoa70§C)
Order Number
NM93C06LZN/NM93C46LZN
NM93C56LZN/NM93C66LZN NM93C06LZM8/NM93C46LZM8 NM93C56LZM8/NM93C66LZM8
NM93C06LZMT8/NM93C46LZMT8 NM93C56LZMT8/NM93C66LZMT8
Extended Temperature Range (b40§Ctoa85§C)
Order Number
NM93C06LZEN/NM93C46LZEN NM93C56LZEN/NM93C66LZEN
NM93C06LZEM8/NM93C46LZEM8
NM93C56LZEM8/NM93C66LZEM8 NM93C06LZEMT8/NM93C46LZEMT8 NM93C56LZEMT8/NM93C66LZEMT8
DO Serial Data Output
GND Ground
V
CC
Pin Names
Power Supply
Automotive Temperature Range (b40§Ctoa125§C)
Order Number
NM93C06LZVN/NM93C46LZVN
NM93C56LZVN/NM93C66LZVN NM93C06LZVM8/NM93C46LZVM8 NM93C56LZVM8/NM93C66LZVM8
NM93C06LZVMT8/NM93C46LZVMT8 NM93C56LZVMT8/NM93C66LZVMT8
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LOW VOLTAGE (2.7Vs4.5V) SPECIFICATIONS
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Ambient Storage Temperature
All Input or Output Voltage
with Respect to Ground V
Lead Temperature (Soldering, 10 sec.)
b
65§Ctoa150§C
a
1tob0.3V
CC
a
300§C
Operating Conditions
Ambient Operating Temperature
NM93C06LZ/46LZ/56LZ/66LZ 0 NM93C06LZE/46LZE/56LZE/66LZE NM93C06LZV/46LZV/56LZV/66LZV
Power Supply (V
) Range 2.7V to 4.5V
CC
Ctoa70§C
§
b
40§Ctoa85§C
b
40§Ctoa125§C
ESD Rating 2000V
DC and AC Electrical Characteristics
Symbol Parameter Part Number Conditions Min Max Units
I
CC1
I
CC3
I
IL
I
OL
V
IL2
V
IH2
V
OL2
V
OH2
f
SK
t
SKH
t
SKL
t
SKS
t
CS
t
CSS
t
DH
t
DIS
t
CSH
t
DIH
t
PD1
t
PD0
t
SV
t
DF
t
WP
Operating Current NM93C06/46/56/66LZ CSeVIH,SKe250 kHz 1 CMOS Input Levels NM93C06/46/56/66LZE/V 1
Standby Current NM93C06/46/56/66LZ CSe0V 1
NM93C06/46/56/66LZE/V 1
Input Leakage NM93C06/46/56/66LZ V
NM93C06/46/56/66LZE/V
Output Leakage NM93C06/46/56/66LZ V
NM93C06/46/56/66LZE/V
Input Low Voltage 2VsV
Input High Voltage 2VsV
Output Low Voltage I
Output High Voltage I
e
0V to V
OL
OH
IN
IN
e
e
eb
CC
0V to V
CC
s
4.5V
CC
s
4.5V 0.8 V
CC
b
100
b
100
b
0.1 0.15 V
CCVCC
a
a
10 mA 0.2 V
10 mA 0.9 V
CC
100
100
SK Clock Frequency NM93C06/46/56/66LZ 0 250
NM93C06/46/56/66LZE/V 0 250
SK High Time NM93C06/46/56/66LZ (Note 2) 1
NM93C06/46/56/66LZE/V 1
SK Low Time NM93C06/46/56/66LZ (Note 2) 1
NM93C06/46/56/66LZE/V 1
SK Setup Time NM93C06/46/56/66LZ Relative to CS 50
NM93C06/46/56/66LZE/V 50
Minimum CS Low Time NM93C06/46/56/66LZ (Note 3) 1
NM93C06/46/56/66LZE/V 1
CS Setup Time NM93C06/46/56/66LZ Relative to SK 0.2
NM93C06/46/56/66LZE/V 0.2
mA
mA
CC
a
1V
kHz
nA
nA
ms
ms
ms
ms
ms
DO Hold Time Relative to SK 70 ns
DI Setup Time NM93C06/46/56/66LZ Relative to SK 0.4
NM93C06/46/56/66LZE/V 0.4
ms
CS Hold Time Relative to SK 0 ms
DI Hold Time Relative to SK 0.4 ms
Output Delay to ‘‘1’’ NM93C06/46/56/66LZ AC Test 2
NM93C06/46/56/66LZE/V 2
Output Delay to ‘‘0’’ NM93C06/46/56/66LZ AC Test 2
NM93C06/46/56/66LZE/V 2
CS to Status Valid NM93C06/46/56/66LZ AC Test 1
NM93C06/46/56/66LZE/V 1
CS to DO NM93C06/46/56/66LZ AC Test 0.4 in TRI-STATE
É
NM93C06/46/56/66LZE/V CSeV
Write Cycle Time NM93C06/46/56/66LZ V
IL
e
2.7V 15 ms
CC
0.4
ms
ms
ms
ms
V
V
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STANDARD VOLTAGE (4.5VsV
s
5.5V) SPECIFICATIONS
CC
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Ambient Storage Temperature
All Input or Output Voltage
with Respect to Ground V
Lead Temperature (Soldering, 10 sec.)
b
65§Ctoa150§C
a
1tob0.3V
CC
a
300§C
Operating Conditions
Ambient Operating Temperature
NM93C06LZ/46LZ/56LZ/66LZ 0 NM93C06LZE/46LZE/56LZE/66LZE NM93C06LZV/46LZV/56LZV/66LZV
Power Supply (V
) Range 4.5V to 5.5V
CC
Ctoa70§C
§
b
40§Ctoa85§C
b
40§Ctoa125§C
ESD Rating 2000V
s
DC and AC Electrical Characteristics: 4.5V
s
V
5.5V
CC
Symbol Parameter Part Number Conditions Min Max Units
I
CC1
I
CC2
I
CC3
I
IL
I
OL
V
IL
V
IH
V
OL1
V
OH1
V
OL2
V
OH2
f
SK
t
SKH
t
SKL
t
CS
t
CSS
t
DH
Operating Current NM93C06/46/56/66LZ CSeVIH,SKe1 MHz 2 CMOS Input Levels NM93C06/46/56/66LZE/V SK
e
1 MHz 2
Operating Current NM93C06/46/56/66LZ CSeVIH,SKe1 MHz 3 TTL Input Levels NM93C06/46/56/66LZE/V 3
Standby Current NM93C06/46/56/66LZ CSe0V 50
NM93C06/46/56/66LZE/V 50
Input Leakage NM93C06/46/56/66LZ V
NM93C06/46/56/66LZE/V
Output Leakage NM93C06/46/56/66LZ V
NM93C06/46/56/66LZE/V
e
0V to V
IN
e
IN
0V to V
CC
CC
Input Low Voltage
Input High Voltage 2 V
Output Low Voltage NM93C06/46/56/66LZ I
NM93C06/46/56/66LZE/V I
Output High Voltage I
Output Low Voltage NM93C06/46/56/66LZ I
NM93C06/46/56/66LZE/V
Output High Voltage I
e
2.1 mA 0.4
OL
e
2.1 mA 0.4
OH
eb
400 mA 2.4 V
OL
e
10 mA
OL
eb
10 mA 0.9 V
OH
b
2.5 2.5
b
10 10
b
2.5 2.5
b
10 10
b
0.1 0.8 V
CC
0.2
CC
SK Clock Frequency NM93C06/46/56/66LZ 0 1
NM93C06/46/56/66LZE/V 0 1
mA
mA
mA
nA
nA
a
1V
MHz
SK High Time NM93C06/46/56/66LZ 250
NM93C06/46/56/66LZE/V 300
SK Low Time NM93C06/46/56/66LZ 250
NM93C06/46/56/66LZE/V 250
Minimum CS Low Time NM93C06/46/56/66LZ (Note 3) 250
NM93C06/46/56/66LZE/V 250
CS Setup Time NM93C06/46/56/66LZ Relative to SK 50
NM93C06/46/56/66LZE/V 50
DO Hold Time Relative to SK 70 ns
V
V
V
ns
ns
ns
ns
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STANDARD VOLTAGE (4.5VsV
s
5.5V) SPECIFICATIONS (Continued)
CC
DC and AC Electrical Characteristics V
e
5.0Vg10% unless otherwise specified (Continued)
CC
Symbol Parameter Part Number Conditions Min Max Units
t
t
t
t
t
t
t
t
DIS
CSH
DIH
PD1
PD0
SV
DF
WP
DI Setup Time NM93C06/46/56/66LZ Relative to SK 100
NM93C06/46/56/66LZE/V 200
ns
CS Hold Time Relative to SK 0 ns
DI Hold Time Relative to SK 20 ns
Output Delay to ‘‘1’’ NM93C06/46/56/66LZ AC Test 500
NM93C06/46/56/66LZE/V 500
Output Delay to ‘‘0’’ NM93C06/46/56/66LZ AC Test 500
NM93C06/46/56/66LZE/V 500
CS to Status Valid NM93C06/46/56/66LZ AC Test 500
NM93C06/46/56/66LZE/V 500
CS to DO in TRI-STATE NM93C06/46/56/66LZ AC Test 100
NM93C06/46/56/66LZE/V CSeV
IL
100
ns
ns
ns
ns
Write Cycle Time 10 ms
AC Test Conditions
Output Load: 1 TTL Gate and C
VCCRange AC Test Conditions
4.5VkV
k
5.5V Input Pulse Levels 0.8V and 2.0V
CC
Timing Measurement Level (V Timing Measurement Level (V (TTL Load Condition:
2.7VkV
e
I
2.1 mA, I
OL
k
4.5V Input Pulse Levels 0.3V and 0.8 V
CC
Timing Measurement Level (VIL/VIH) 0.4V and 1.6V
OH
eb
Timing Measurement Level (V (CMOS Load Condition:
e
I
10 mA, I
OL
OH
eb
L
0.4 mA)
10 mA)
e
100 pF
) 0.9V and 1.9V
IL/VIH
OL/VOH
OL/VOH
) 0.8V and 2.0V
CC
) 0.8V and 1.6V
Capacitance T
e
25§C, fe1 MHz
A
Symbol Test Max Units
C
OUT
C
IN
Note 1: Stress above those listed under ‘‘Absolute Maximum Ratings’’ may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: Minimum V These are regarded as test mode commands and are only guaranteed to V
Note 3: CS must be brought low for a minimum of 1 t
CC
Output Capacitance 5 pF
Input Capacitance 5 pF
requirements: All functional modes are guaranteed to full operation at V
between consecutive instruction cycles.
CS
t
2.5V.
CC
t
2V except the bulk programming op-codes ERAL and WRAL.
CC
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Functional Description
The NM93C06/C46/C56/C66LZ devices have 7 instruc­tions as described below. Note that the MSB of any instruc­tion is a ‘‘1’’ and is viewed as a start bit in the interface sequence. For the C06LZ and C46LZ the next 8 bits carry the op code and the 6-bit address for register selection. For the C56LZ and C66LZ the next 10 bits carry the op code and the 8-bit address for register selection.
Read (READ): The READ instruction outputs serial data on the DO pin. After the READ instruction is received, the in­struction and address are decoded, followed by data trans­fer from the selected memory register into a serial-out shift register. A dummy bit (logical 0) precedes the 16-bit data output string. Output data changes are initiated by a low to high transition of the SK clock.
Erase/Write Enable (EWEN): When V part, it powers up in the Erase/Write Disable (EWDS) state. Therefore, all programming modes must be preceded by an Erase/Write Enable (EWEN) instruction. Once an Erase/ Write Enable instruction is executed, programming remains enabled until an Erase/Write Disable (EWDS) instruction is executed or until V
Erase (ERASE): The ERASE instruction will program all bits in the specified register to the logical ‘‘1’’ state. CS is brought low following the loading of the last address bit. This falling edge of the CS pin initiates the self-timed pro­gramming cycle.
The DO pin indicates the READY/BUSY status of the chip.
e
DO
logical ‘‘0’’ indicates that programming is still in prog­ress. DO address specified in the instruction, has been erased, and the part is ready for another instruction.
e
is removed from the part.
CC
logical ‘‘1’’ indicates that the register, at the
is applied to the
CC
Write (WRITE): The WRITE instruction is followed by 16 bits of data to be written into the specified address. After the last bit of data is put on the data-in (DI) pin, CS must be brought low before the next rising edge of the SK clock. This falling edge of CS initiates the self-timed programming cycle. The DO pin indicates the READY/BUSY status of the chip if CS is brought high after a minimum of 250 ns (t
e
DO
logical 0 indicates that programming is still in prog­ress. DO specified in the instruction has been written with the data pattern specified in the instruction and the part is ready for another instruction.
Erase All (ERAL): The ERAL instruction will simultaneously program all registers in the memory array and set each bit to the logical ‘‘1’’ state. The Erase All cycle is identical to the ERASE cycle except for the different op code. As in the ERASE mode, the DO pin indicates the READY/BUSY status of the chip. The ERASE ALL instruction is not re­quired, see note below.
Write All (WRAL): The WRAL instruction will simultaneous­ly program all registers with the data pattern specified in the instruction. As in the WRITE mode, the DO pin indicates the READY/BUSY status of the chip.
Erase/Write Disable (EWDS): To protect against acciden­tal data disturb, the (EWDS) instruction disables all pro­gramming modes and should follow all programming opera­tions. Execution of a READ instruction is independent of both the EWEN and EWDS instructions.
Note: The NM93C06/C46/C56/C66LZ devices do not require an ‘‘ERASE’’
e
1 indicates that the register at the address
or ‘‘ERASE ALL’’ prior to the ‘‘WRITE’’ or ‘‘WRITE ALL’’ instructions.
CS
).
Instruction Set for the NM93C06LZ and NM93C46LZ
Instruction SB Op Code Address Data Comments
READ 1 10 A5– A0 Read data stored in memory, at specified address
EWEN 1 00 11XXXX Write enable must precede all programming modes
EWDS 1 11 A5 – A0 Erase register A5, A4, A3, A2, A1, A0
WRITE 1 01 A5 – A0 D15 – D0 Writes register
ERAL 1 00 10XXXX Erases all registers
WRAL 1 00 01XXXX D15– D0 Writes all registers
EWDS 1 00 00XXXX Disables all programming instructions
Instruction Set for the NM93C56LZ and NM93C66LZ
Instruction SB Op Code Address Data Comments
READ 1 10 A7– A0 Read data stored in memory, at specified address
EWEN 1 00 11XXXXXX Write enable must precede all programming modes
EWDS 1 11 A7–A0 Erase selected register
ERAL 1 00 10XXXXXX Erases all registers
WRITE 1 01 A7–A0 D15 – D0 Write register if address is unprotected
WRAL 1 00 01XXXXXX D15– D0 Writes all registers
EWDS 1 00 00XXXXXX Disables all programming instructions
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Timing Diagrams
Synchronous Data Timing
²
t
is not needed if DIeVILwhen CS is going active (HIGH).
SKS
*Address bits A5 and A4 become ‘‘don’t care’’ for NM93C06LZ.
Address bit A7 becomes a ‘‘don’t care’’ for NM93C56LZ.
TL/D/11778– 3
READ
TL/D/11778– 4
EWEN
*The NM93C56LZ and NM93C66LZ require a minimum of 11 clock cycles. The NM93C06LZ and NM93C46LZ require a minimum of 9 clock cycles.
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TL/D/11778– 5
Timing Diagrams (Continued)
EWDS
*The NM93C56LZ and NM93C66LZ require a minimum of 11 clock cycles. The NM93C06LZ and NM93C46LZ require a minimum of 9 clock cycles.
WRITE
*Address bits A5 and A4 become ‘‘don’t care’’ for NM93C06LZ.
Address bit A7 becomes a ‘‘don’t care’’ for NM93C56LZ.
WRAL
TL/D/11778– 6
TL/D/11778– 7
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TL/D/11778– 8
Timing Diagrams (Continued)
ERASE
*Address bits A5 and A4 become ‘‘don’t care’’ for NM93C06LZ.
Address bit A7 becomes a ‘‘don’t care’’ for NM93C56LZ.
TL/D/11778– 9
ERAL
TL/D/11778– 10
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Physical Dimensions inches (millimeters) unless otherwise noted
Molded Small Out-Line Package (M8)
NS Package Number M08A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Note: Unless otherwise specified
1. Reference JEDEC Registration M0-153, Variation AA, Dated 7/93
8-Pin Molded TSSOP, JEDEC (MT8)
NS Package Number MTC08
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead Molded Dual-In-Line Package (N)
NS Package Number N08E
and Extended Voltage (2.7V to 5.5V) (MICROWIRE Bus Interface)
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NM93C06LZ/C46LZ/C56LZ/C66LZ 256-/1024-/2048-/4096-Bit Serial EEPROM with Zero Power
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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