These high speed Octal D-Type Flip-Flops utilize advanced
silicon-gate CMOS technology. They possess the high noise
immunity and low power consumption of standard CMOS
integrated circuits, as well as the ability to drive 15 LS-TTL
loads. Due to the large output drive capability and the TRISTATE feature, these devices are ideally suited for interfacing with bus lines in a bus organized system.
These devices are positive edge triggered flip-flops. Data at
the D inputs, meeting the setup and hold time requirements,
are transferred to the Q outputs on positive going transitions
of the CLOCK (CK) input. When a high logic level is applied
to the OUTPUT CONTROL (OC) input, all outputs go to a
high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements.
Connection Diagram
Octal D-Type Flip-Flop
É
Dual-In-Line Package
January 1988
The 54HC/74HC logic family is speed, function, and pinout
compatible with the standard 54LS/74LS logic family. All
inputs are protected from damage due to static discharge by
internal diode clamps to V
TRI-STATEÉis a registered trademark of National Semiconductor Corp
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
ClockDataOutput
L
L
LLXQ
HXXZ
u
u
TL/F/5336
HH
LL
0
high Level, LeLow Level
e
X
don’t Care
e
transition from low-to-high
u
e
Z
high impedance state
e
Q
the level of the output before steady state
0
input conditions were established
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
)
b
0.5 toa7.0V
b
1.5 to V
b
CC
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
35 mA
70 mA
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
Minimum High Level2.0V1.51.51.5V
IH
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
Maximum Low Level2.0V0.50.50.5V
IL
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
Minimum High LevelV
OH
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
Maximum Low LevelV
OL
Output Voltage
IL
s
6.0 mA4.5V4.23.983.843.7V
l
s
7.8 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
OZ
Maximum InputV
Current
Maximum TRI-STATE V
Output LeakageV
Current
I
CC
Maximum QuiescentV
Supply CurrentI
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
I
OZ
**V
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
g
and VILoccur at V
IH
e
IN
e
IN
OUT
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
6.0 mA4.5V0.20.260.330.4V
l
s
7.8 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
VIH,OCeVIH6.0V
e
VCCor GND
g
0.1
g
0.5
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
g
5
MinMaxUnits
V
§
§
Units
b
b
40
55
A
eb
55 to 125§C
g
g
CC
a
85
a
125
1.0mA
10mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
e
5V, T
SymbolParameterConditionsTyp
f
MAX
t
PHL,tPLH
t
PZH,tPZL
t
PHZ,tPLZ
t
S
t
H
t
W
Maximum Operating5035MHz
Frequency
Maximum PropagationC
Delay Clock to Q
Maximum Output EnableR
TimeC
Maximum Output DisableR
TimeC
e
45 pF2032ns
L
e
kX
L
e
45 pF1928ns
L
e
kX1725ns
L
e
5pF
L
Minimum Setup Time20ns
Minimum Hold Time5ns
Minimum Pulse Width916ns
e
A
25§C, t
Guaranteed
e
r
t
f
Limit
e
6ns
Units
AC Electrical Characteristics V
CC
e
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PZH,tPZL
t
PHZ,tPLZ
t
S
t
H
t
W
t
THL,tTLH
tr,t
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum OperatingC
Frequency4.5V302420MHz
Maximum PropagationC
Delay, Clock to QC
Maximum Output EnableR
Time
Maximum Output DisableR
TimeC
Minimum Setup Time2.0V506075ns
Minimum Hold Time2.0V5305ns
Minimum Pulse Width2.0V3080100120ns
Maximum Output RiseC
and Fall Time4.5V7121518ns
Maximum Input Rise and2.0V100010001000ns
f
Fall Time, Clock4.5V500500500ns
Power Dissipation(per flip-flop)
Capacitance (Note 5)OCeV
Maximum Input Capacitance5101010pF
e
50 pF2.0V654MHz
L
e
50 pF2.0V68180225270ns
L
e
150 pF2.0V 110230288345ns
L
e
C
50 pF4.5V22364548ns
L
e
C
150 pF4.5V30465769ns
L
e
C
50 pF6.0V20313946ns
L
e
150 pF6.0V28405060ns
C
L
e
1kX
L
e
50 pF2.0V50150189225ns
C
L
e
150 pF2.0V80200250300ns
C
L
e
C
50 pF4.5V21303745ns
L
e
150 pF4.5V30405060ns
C
L
e
C
50 pF6.0V19263139ns
L
e
C
150 pF6.0V26354453ns
L
e
1kX2.0V50150189225ns
L
e
50 pF4.5V21303745ns
L
e
50 pF2.0V25607590ns
L
CC
e
GND50pF
OC
e
D
2.0–6.0V, C
CC
e
L
e
T
A
50 pF, t
25§C
e
e
t
6 ns (unless otherwise specified)
r
f
74HC54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
TypGuaranteed Limits
6.0V352823MHz
6.0V19263139ns
4.5V91315ns
6.0V91113ns
4.5V555ns
6.0V555ns
4.5V9162024ns
6.0V8141820ns
6.0V6101315ns
6.0V400400400ns
30pF
2
CPDV
faICCVCC, and the no load dynamic current consumption, I
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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