These high speed octal D-type latches utilize advanced silicon-gate CMOS technology. They possess the high noise
immunity and low power consumption of standard CMOS
integrated circuits, as well as the ability to drive 15 LS-TTL
loads. Due to the large output drive capability and the TRISTATE feature, these devices are ideally suited for interfacing with bus lines in a bus organized system.
When the LATCH ENABLE input is high, the Q outputs will
follow the D inputs. When the LATCH ENABLE goes low,
data at the D inputs will be retained at the outputs until
LATCH ENABLE returns high again. When a high logic level
is applied to the OUTPUT CONTROL input, all outputs go to
a high impedance state, regardless of what signals are pres-
Connection Diagram
Octal D-Type Latch
É
Dual-In-Line Package
January 1988
ent at the other inputs and the state of the storage elements.
The 54HC/74HC logic family is speed, function, and pin-out
compatible with the standard 54LS/74LS logic family. All
inputs are protected from damage due to static discharge by
internal diode clamps to V
and ground.
CC
Features
Y
Typical propagation delay: 18 ns
Y
Wide operating voltage range: 2 to 6 volts
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 80 mA maximum (74 Series)
Y
Output drive capability: 15 LS-TTL loads
MM54HC373/MM74HC373 TRI-STATE Octal D-Type Latch
Top View
Order Number MM54HC373 or MM74HC373
TL/F/5335– 1
Truth Table
OutputLatch
ControlEnableOutput
LHHH
LHLL
LLXQ
HXXZ
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5335
Data
373
0
e
H
high level, Lelow level
e
Q
level of output before steady-state input
0
conditions were established.
e
Z
high impedance
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
)
b
0.5 toa7.0V
b
1.5 to V
CC
b
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
35 mA
70 mA
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics
e
T
25§C
SymbolParameterConditionsV
CC
A
TypGuaranteed Limits
V
Minimum High Level2.0V1.51.51.5V
IH
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
Maximum Low Level2.0V0.50.50.5V
IL
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
Minimum High LevelV
OH
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA2.0V 2.01.91.91.9V
l
4.5V 4.54.44.44.4V
6.0V 6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
Maximum Low LevelV
OL
Output Voltage
IL
s
6.0 mA4.5V 4.2 3.983.843.7V
l
s
7.8 mA6.0V 5.7 5.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
I
Maximum InputV
IN
Current
Maximum TRI-STATE V
OZ
Output LeakageV
Current
I
Maximum QuiescentV
CC
Supply CurrentI
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
designing with this supply. Worst case V
, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
I
CC
**V
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
e
IN
e
IN
OUT
e
IN
OUT
g
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
and VILoccur at V
IH
IL
s
6.0 mA4.5V 0.2 0.260.330.4V
l
s
7.8 mA6.0V 0.2 0.260.330.4V
l
VCCor GND6.0V
VIHor VIL,OCeVIH6.0V
e
VCCor GND
g
0.1
g
0.5
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
g
5
MinMaxUnits
CC
b
b
40
55
eb
A
a
85
a
125
55 to 125§C
g
1.0mA
g
10mA
V
§
§
Units
C
C
2
Page 3
AC Electrical Characteristics V
CC
5V, T
e
A
25§C, t
e
e
t
6ns
r
f
e
SymbolParameterConditionsTypGuaranteed LimitUnits
t
PHL,tPLH
t
PHL,tPLH
t
PZH,tPZL
t
PHZ,tPLZ
t
S
t
H
t
W
Maximum Propagation Delay, Data to QC
Maximum Propagation Delay, LE to QC
Maximum Output Enable TimeR
Maximum Output Disable TimeR
Minimum Set Up Time5ns
Minimum Hold Time10ns
Minimum Pulse Width916ns
e
45 pF1825ns
L
e
45 pF2130ns
L
e
1kX2028ns
L
e
45 pF
C
L
e
1kX1825ns
L
e
5pF
C
L
AC Electrical Characteristics V
CC
e
2.0–6.0V, C
SymbolParameterConditions V
t
PHL,tPLH
t
PHL,tPLH
t
PZH,tPZL
t
PHZ,tPLZ
t
S
t
H
t
W
t
THL,tTLH
C
PD
C
IN
C
OUT
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum PropagationC
Delay, Data to QC
Maximum PropagationC
Delay, LE to QC
Maximum Output EnableR
Time
Maximum Output DisableR
TimeC
Minimum Set Up Time2.0V506075ns
Minimum Hold Time2.0V555ns
Minimum Pulse Width2.0V3080100120ns
Maximum Output RiseC
and Fall Time4.5V7121518ns
Power Dissipation(per latch)
Capacitance (Note 5)OCeV
Maximum Input Capacitance5101010pF
Maximum Output Capacitance15202020pF
e
50 pF2.0V50150188225ns
L
e
150 pF 2.0V80200250300ns
L
e
C
50 pF4.5V22303745ns
L
e
150 pF 4.5V30405060ns
C
L
e
C
50 pF6.0V19263139ns
L
e
150 pF 6.0V26354453ns
C
L
e
50 pF2.0V63175220263ns
L
e
150 pF 2.0V110225280338ns
L
e
C
50 pF4.5V25354452ns
L
e
150 pF 4.5V35455668ns
C
L
e
C
50 pF6.0V21303745ns
L
e
150 pF 6.0V28394959ns
C
L
e
1kX
L
e
50 pF2.0V50150188225ns
C
L
e
150 pF 2.0V80200250300ns
C
L
e
C
50 pF4.5V21303745ns
L
e
150 pF 4.5V30405060ns
C
L
e
C
50 pF6.0V19263139ns
L
e
150 pF 6.0V26354453ns
C
L
e
1kX2.0V50150188225ns
L
e
50 pF4.5V21303745ns
L
e
50 pF2.0V25607590ns
L
CC
e
GND50pF
OC
e
D
CC
e
L
T
A
50 pF, t
e
25§C
e
e
t
6 ns (unless otherwise specified)
r
f
74HC54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
TypGuaranteed Limits
6.0V19263139ns
4.5V91315ns
6.0V91113ns
4.5V555ns
6.0V555ns
4.5V10162024ns
6.0V9141820ns
6.0V6101315ns
30pF
2
CPDV
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Page 4
Physical Dimensions inches (millimeters)
Ceramic Dual-In-Line Package (J)
Order Number MM54HC373J or MM74HC373J
NS Package Number J20A
MM54HC373/MM74HC373 TRI-STATE Octal D-Type Latch
Molded Dual-In-Line Package (N)
Order Number MM74HC373N
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.