MM54HC237/MM74HC237
3-to-8 Line Decoder With Address Latches
General Description
These devices utilize advanced silicon-gate CMOS technology, to implement a three-to-eight line decoder with latches
on the three address inputs. When GL
high, the address present at the select inputs (A, B and C) is
stored in the latches. As long as GL
dress changes will be recognized. Output enable controls,
G1 and G2
the select or latch-enable inputs. All of the outputs are low
unless G1 is high and G2
ed for the implementation of glitch-free decoders in storedaddress applications in bus oriented systems.
, control the state of the outputs independently of
is low. The ’HC237 is ideally suit-
goes from low to
remains high no ad-
The 54HC/74HC logic family is speed, function and pin-out
compatible with the standard 54LS/74LS logic family. All
inputs are protected from damage due to static discharge by
diodes to V
and ground.
CC
Features
Y
Typical propagation delay: 20 ns
Y
Wide supply range: 2– 6V
Y
Latched inputs for easy interfacing
Y
Fanout of 10 LS-TTL loads
MM54HC237/MM74HC237 3-to-8 Line Decoder With Address Latches
Output corresponding to stored
address, L; all others, H
OUTPUTS
TL/F/5326– 1
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5326
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temperature
(T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
designing with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
CC
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
e
IN
e
IN
OUT
g
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
and VILoccur at V
IH
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
b
40
55
eb
A
55 to 125§C
g
CC
a
85
a
125
1.0mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
5V, T
e
A
25§C, C
e
L
15 pF, t
e
SymbolParameterConditions Typ
t
PLH
t
PLH
t
PLH
t
PHL
t
PLH
t
PHL
t
S
t
H
t
W
Maximum Propagation Delay A, B or C to any Y Output2041ns
Maximum Propagation Delay A, B or C to any Y Output1632ns
Maximum Propagation GL to any Y Output2244ns
Maximum Propagation Delay GL to any Y Output1733ns
Maximum Propagation Delay G1 or G2 to Output1635ns
Maximum Propagation Delay G1 or G2 to Output1425ns
Minimum Set Up Time at A, B and C Inputs1020ns
Minimum Hold Time at A, B and C Inputs
Minimum Pulse Width of Enabling Pulse at GL916ns
e
e
t
6ns
r
f
Guaranteed
Limit
b
30 ns
Units
AC Electrical Characteristics C
e
L
50 pF, t
SymbolParameterConditions V
t
PLH
t
PLH
t
PLH
t
PHL
t
PLH
t
PHL
t
S
t
H
t
W
t
TLH,tTHL
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Propagation2.0V 100235296350ns
Delay, A, B or C to any Y Output4.5V24475970ns
Maximum Propagation2.0V80185233276ns
Delay, A, B or C to any Y Output4.5V19374755ns
Maximum Propagation2.0V 125250315373ns
GL to any Y Output4.5V25506375ns
Maximum Propagation Delay2.0V95190239283ns
GL
to any Y Output4.5V19384875ns
Maximum Propagation2.0V 100200252298ns
Delay, G1 or G
2 to Output4.5V20405060ns
Maximum Propagation2.0V73145183216ns
Delay G1 or G
2 to Output4.5V15293743ns
Minimum Set Up Time2.0V100125150ns
at A, B and C Inputs4.5V202530ns
Minimum Hold Time2.0V000ns
at A, B and C Inputs4.5V000ns
Minimum Pulse Width2.0V3080100120ns
of Enabling Pulse at GL
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Power Dissipation75pF
Capacitance (Note 5)
Maximum Input5101010pF
Capacitance
e
D
e
e
t
6 ns (unless otherwise specified)
r
CC
f
e
T
25§C
A
74HC54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
TypGuaranteed Limits
6.0V20405060ns
6.0V17314047ns
6.0V20435463ns
6.0V16324148ns
6.0V17344351ns
6.0V12253137ns
6.0V172125ns
6.0V000ns
4.5V10162024ns
6.0V9141820ns
6.0V7131619ns
2
CPDV
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Page 4
Functional Block Diagram
Typical Application
TL/F/5326– 2
6-Line to 64-Line Decoder with Input Address Storage
MM54HC237/MM74HC237 3-to-8 Line Decoder With Address Latches
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SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
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failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
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