National Semiconductor MM54HC125, MM54HC126, MM74HC125, MM74HC126 Service Manual

MM54HC125/MM74HC125 MM54HC126/MM74HC126 TRI-STATE
Quad Buffers
É
MM54HC125/MM74HC125/MM54HC126/MM74HC126 TRI-STATE Quad Buffers
January 1988
General Description
The MM54HC125/MM74HC125 require the TRI-STATE control input C to be taken high to put the output into the high impedance condition, whereas the MM54HC126/ MM74HC126 require the control input to be low to put the output into high impedance.
All inputs are protected from damage due to static dis­charge by diodes to V
and ground.
CC
Connection Diagrams
Dual-In-Line Package
Features
Y
Typical propagation delay: 13 ns
Y
Wide operating voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 80 mA maximum (74HC)
Y
Fanout of 15 LS-TTL loads
Dual-In-Line Package
Top View
Order Number MM54HC125 or MM74HC125
Truth Tables
Inputs Output
AC
HL H LL L XH Z
TRI-STATEÉis a registered trademark of National Semiconductor Corp.
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Y
TL/F/5308
TL/F/5308– 1
Top View
Order Number MM54HC126 or MM74HC126
Inputs Output
AC
HH H LH L XL Z
Y
TL/F/5308– 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
)
b
0.5 toa7.0V
b
1.5 to V
b
CC
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
35 mA
70 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage 0 V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf) 1000 ns
CC
e
V
4.5V 500 ns
CC
e
V
6.0V 400 ns
CC
Power Dissipation (PD)
(Note 3) 600 mW S.O. Package only 500 mW
Lead Temp. (T
) (Soldering 10 seconds) 260§C
L
DC Electrical Characteristics (Note 4)
Symbol Parameter Conditions V
CC
A
e
T
25§C
Typ Guaranteed Limits
V
Minimum High Level 2.0V 1.5 1.5 1.5 V
IH
Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
V
Maximum Low Level 2.0V 0.5 0.5 0.5 V
IL
Input Voltage** 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
V
Minimum High Level V
OH
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA 2.0V 2.0 1.9 1.9 1.9 V
l
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
Maximum Low Level V
OL
Output Voltage
IL
s
6.0 mA 4.5V 4.2 3.98 3.84 3.7 V
l
s
7.8 mA 6.0V 5.7 5.48 5.34 5.2 V
l
VIHor V
IL
s
20 mA 2.0V 0 0.1 0.1 0.1 V
l
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
OZ
Maximum TRI-STATE V Output Leakage V Current C
I
IN
I
CC
Maximum Input V Current
Maximum Quiescent V Supply Current I
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
I
OZ
**V
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
g
and VILoccur at V
IH
e
IN
OUT
e
n
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
6.0 mA 4.5V 0.2 0.26 0.33 0.4 V
l
s
7.8 mA 6.0V 0.2 0.26 0.33 0.4 V
l
VIHor V
e
VCCor GND
6.0V
IL
g
0.5
Disabled
VCCor GND 6.0V
g
0.1
VCCor GND 6.0V 8.0 80 160 mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC 54HC
eb
T
40 to 85§CT
A
g
5
g
1.0
Min Max Units
V
§
§
Units
b b
40 55
A
eb
55 to 125§C
g
g
CC
a
85
a
125
10 mA
1.0 mA
C C
2
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