MM54HC107/MM74HC107
Dual J-K Flip-Flops with Clear
MM54HC107/MM74HC107 Dual J-K Flip-Flops with Clear
January 1988
General Description
These J-K Flip-Flops utilize advanced silicon-gate CMOS
technology to achieve the high noise immunity and low power dissipation of standard CMOS integrated circuits. These
devices can drive 10 LS-TTL loads.
These flip-flops are edge sensitive to the clock input and
change state on the negative going transition of the clock
pulse. Each one has independent J, K, CLOCK, and CLEAR
inputs and Q and Q
clock and accomplished by a low level on the input.
The 54HC/74HC logic family is functionally as well as pinout compatible with the standard 54LS/74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to V
outputs. CLEAR is independent of the
and ground.
CC
Connection Diagram
Dual-In-Line Package
Features
Y
Typical propagation delay: 16 ns
Y
Wide operating voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 40 mA (74HC series)
Y
High output drive: 10 LS-TTL loads
Truth Table
InputsOutputs
CLRCLKJKQQ
LXXXLH
H
H
H
H
HHXXQ0Q
LLQ0Q0
v
HL H L
v
LH L H
v
HHTOGGLE
v
0
TL/F/5304– 1
Order Number MM54HC107 or MM74HC107
Logic Diagram
TL/F/5304– 3
TL/F/5304– 2
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5304
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temperature (T
)
L
(Soldering 10 seconds)260§C
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V3.983.843.7V
l
s
5.2 mA6.0V5.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V4.04080mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
b
40
55
eb
A
55 to 125§C
g
CC
a
85
a
125
1.0mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
e
5V, T
SymbolParameterConditionsTyp
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
REM
t
s
t
H
t
W
Maximum Operating5030MHz
Frequency
Maximum Propagation1621ns
Delay Clock to Q or Q
Maximum Propagation2126ns
Delay Clear to Q or Q
Minimum Removal Time,1020ns
Clear to Clock
Minimum Setup Time,1420ns
J or K to Clock
Minimum Hold Time
J or K from Clock
Minimum Pulse Width,1016ns
Clock or Clear
e
A
b
30 ns
25§C, C
Guaranteed
e
L
Limit
15 pF, t
e
r
e
t
f
Units
6ns
AC Electrical Characteristics C
e
L
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
REM
t
s
t
H
t
W
t
TLH,tTHL
tr,t
f
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V9543MHz
Frequency4.5V45272118MHz
Maximum Propagation2.0V70126160185ns
Delay Clock to Q or Q
Maximum Propagation2.0V126155194250ns
Delay Clear to Q or Q4.5V25313947ns
Minimum Removal Time2.0V55100125150ns
Clear to Clock4.5V11202530ns
Minimum Setup Time2.0V77100125150ns
J or K to Clock4.5V15202530ns
Minimum Hold Time2.0Vb3000ns
J or K to Clock4.5V
Minimum Pulse Width2.0V5580100120ns
Clear or Clock4.5V11162024ns
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Maximum Input Rise and2.0V100010001000ns
Fall Time4.5V500500500ns
Power Dissipation(per flip-flop)80pF
Capacitance (Note 5)
Maximum Input5101010pF
Capacitance
e
CC
e
t
6 ns (unless otherwise specified)
r
f
e
T
25§C
A
eb
T
A
74HC54HC
40 to 85§CT
A
eb
55 to 125§C
50 pF, t
TypGuaranteed Limits
6.0V53312420MHz
4.5V18253237ns
6.0V16212732ns
6.0V21263240ns
6.0V9172125ns
6.0V13172125ns
b
3000ns
b
6.0V
3000ns
6.0V10141821ns
6.0V7131619ns
6.0V400400400ns
2
e
CPDV
D
faICCVCC, and the no load dynamic current consumption, I
MM54HC107/MM74HC107 Dual J-K Flip-Flops with Clear
LIFE SUPPORT POLICY
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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