The DS90CF386 receiver converts the four LVDS data
streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
sec bandwidth) back into parallel 28 bits of CMOS/TTL data
(24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL).
Also available is the DS90CF366 that converts the three
LVDS data streams (Up to 1.78 Gbps throughput or 223
Megabytes/sec bandwidth) back into parallel 21 bits of
CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync
and DE). Both Receivers’ outputs are Falling edge strobe. A
Rising edge or Falling edge strobe transmitter (DS90C385/
DS90C365) will interoperate with a Falling edge strobe Receiver without any translation logic.
The DS90CF386 is also offered in a 64 ball, 0.8mm fine pitch
ball grid array (FBGA) package which provides a 44 %
reduction in PCB footprint compared to the 56L TSSOP
package.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n 20 to 85 MHz shift clock support
n Rx power consumption
Grayscale
n Rx Power-down mode
n ESD rating
n Supports VGA, SVGA, XGA and Single Pixel SXGA.
n PLL requires no external components
n Compatible with TIA/EIA-644 LVDS standard
n Low profile 56-lead or 48-lead TSSOP package
n DS90CF386 also available in a 64 ball, 0.8mm fine pitch
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CMOS/TTL Output Voltage−0.3V to (V
LVDS Receiver Input Voltage−0.3V to (V
Junction Temperature+150˚C
DS90CF386/DS90CF366
Storage Temperature−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec for TSSOP)+260˚C
)−0.3V to +4V
CC
CC
CC
+ 0.3V)
+ 0.3V)
DS90CF366MTD15 mW/˚C above +25˚C
Maximum Package Power
Dissipation Capacity
@
25˚C
SLC64A Package:
DS90CF386SLC2.0 W
Package Derating:
DS90CF386SLC10.2 mW/˚C above +25˚C
ESD Rating
(HBM, 1.5 kΩ, 100 pF)
(EIAJ, 0Ω, 200 pF)
Solder Reflow Temperature
(Soldering, 20 sec for FBGA)+220˚C
Maximum Package Power
Dissipation Capacity
@
25˚C
MTD56 (TSSOP) Package:
DS90CF386MTD1.61 W
MTD48 (TSSOP) Package:
DS90CF366MTD1.89 W
Package Derating:
DS90CF386MTD12.4 mW/˚C above +25˚C
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
Operating Free Air
Temperature (T
Receiver Input Range02.4V
Supply Noise Voltage (V
)3.03.33.6V
CC
)−10 +25 +70˚C
A
)100 mV
CC
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
RECEIVER SUPPLY CURRENT
(Figures 2, 3, 4 )f = 65 MHz4360mA
f = 85 MHz4370mA
ICCRZReceiver Supply CurrentPower Down = Low
140400µA
Power DownReceiver Outputs Stay Low during
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except V
and ∆VOD).
OD
= 3.3V and TA= +25C.
CC
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
CLHTCMOS/TTL Low-to-High Transition Time (Figure 4 )2.03.5ns
CHLTCMOS/TTL High-to-Low Transition Time (Figure 4 )1.83.5ns
RSPos0Receiver Input Strobe Position for Bit 0 (Figure 11,
Figure 12 )
RSPos1Receiver Input Strobe Position for Bit 12.172.522.87ns
RSPos2Receiver Input Strobe Position for Bit 23.854.204.55ns
RSPos3Receiver Input Strobe Position for Bit 35.535.886.23ns
RSPos4Receiver Input Strobe Position for Bit 47.217.567.91ns
RSPos5Receiver Input Strobe Position for Bit 58.899.249.59ns
RSPos6Receiver Input Strobe Position for Bit 610.5710.9211.27ns
RCOHRxCLK OUT High Time (Figure 5 )f = 85 MHz4.557ns
RCOLRxCLK OUT Low Time (Figure 5)4.056.5ns
RSRCRxOUT Setup to RxCLK OUT (Figure 5 )2.0ns
RHRCRxOUT Hold to RxCLK OUT (Figure 5 )3.5ns
RCCDRxCLK IN to RxCLK OUT Delay
@
25˚C, VCC= 3.3V (Figure 6 )5.57.09.5ns
RPLLSReceiver Phase Lock Loop Set (Figure 7 )10ms
RPDDReceiver Power Down Delay (Figure 10 )1µs
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min
and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable), and clock jitter (less than 150 ps).
Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 7: Figures 1, 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 8: Recommended pin to signal mapping. Customer may choose to define differently.
10108504
FIGURE 4. DS90CF386/DS90CF366 (Receiver) CMOS/TTL Output Load and Transition Times
10108505
FIGURE 5. DS90CF386/DS90CF366 (Receiver) Setup/Hold and High/Low Times
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