National Semiconductor DS90CF383 Technical data

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DS90CF383
+3.3V LVDS Transmitter 24-Bit Flat Panel Display (FPD)
Link—65 MHz

DS90CF383 +3.3V LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link—65 MHz

January 2000

General Description

The DS90CF383 transmitter converts 28 bits of CMOS/TTL
data into four LVDS (Low Voltage Differential Signaling) data
streams. A phase-locked transmit clock is transmitted in par­allel with the data streams over a fifthLVDS link. Every cycle
of the transmit clock 28 bits of input data are sampled and
transmitted. At a transmit clock frequency of 65 MHz, 24 bits
of RGB data and 3 bits of LCD timing and control data
(FPLINE, FPFRAME, DRDY) are transmitted at arate of 455
Mbps per LVDS data channel. Using a 65 MHz clock, the
data throughputs is 227 Mbytes/sec.

This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.

Block Diagram

DS90CF383

Features

n 20 to 65 MHz shift clock support
n Single 3.3V supply
n Chipset (Tx + Rx) power consumption
n Power-down mode (
n Single pixel per clock XGA (1024x768) ready
n Supports VGA, SVGA, XGA and higher addressability.
n Up to 227 Megabytes/sec bandwidth
n Up to 1.8 Gbps throughput
n Narrow bus reduces cable size and cost
n 290 mV swing LVDS devices for low EMI
n PLL requires no external components
n Low profile 56-lead TSSOP package
n Falling edge data strobe Transmitter
n Compatible with TIA/EIA-644 LVDS standard
n ESD rating
n Operating Temperature: −40˚C to +85˚C

>

7kV

<

0.5 mW total)

<

250 mW (typ)

DS100033-1

Order Number DS90CF383MTD

See NS Package Number MTD56

TRI-STATE®is a registered trademark of National Semiconductor Corporation.

© 2000 National Semiconductor Corporation DS100033 www.national.com

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National SemiconductorSales Office/
Distributors for availability and specifications.

DS90CF383

Supply Voltage (V
CMOS/TTL Input Voltage −0.3V to (V
LVDS Driver Output Voltage −0.3V to (V
LVDS Output Short Circuit

Duration Continuous
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature

(Soldering, 4 sec) +260˚C
Maximum Package Power Dissipation Capacity

MTD56 (TSSOP) Package:

DS90CF383 1.63 W

) −0.3V to +4V

CC

CC
CC

@

+ 0.3V)
+ 0.3V)

25˚C

Package Derating:

DS90CF383 12.5 mW/˚C above +25˚C

ESD Rating

(HBM, 1.5 kΩ, 100 pF)

Recommended Operating
Conditions

Supply Voltage (V

) 3.0 3.3 3.6 V

CC

Operating Free Air

Temperature (T

) −40 +25 +85 ˚C

A

Receiver Input Range 0 2.4 V
Supply Noise Voltage (V

Min Nom Max Units

) 100 mV

CC

Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units

CMOS/TTL DC SPECIFICATIONS

V

IH

V

IL

V

OH

V

OL

V

CL

I

IN

I

OS

LVDS DC SPECIFICATIONS

V

OD

∆V

V

OS

∆V

I

OS

I

OZ

V

TH

V

TL

I

IN

TRANSMITTER SUPPLY CURRENT

ICCTW Transmitter Supply Current

ICCTG Transmitter Supply Current

ICCTZ Transmitter Supply Current

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

High Level Input Voltage 2.0 V
Low Level Input Voltage GND 0.8 V
High Level Output Voltage IOH= −0.4 mA 2.7 3.3 V
Low Level Output Voltage IOL= 2 mA 0.1 0.3 V
Input Clamp Voltage ICL= −18 mA −0.79 −1.5 V
Input Current VIN=VCC, GND, 2.5V or 0.4V
Output Short Circuit Current V

= 0V −60 −120 mA

OUT

±

5.1±10 µA

Differential Output Voltage RL= 100Ω 250 345 450 mV
Change in VODbetween

OD

complimentary output states
Offset Voltage (Note 4) 1.125 1.25 1.375 V
Change in VOSbetween

OS

complimentary output states
Output Short Circuit Current V
Output TRI-STATE®Current Power Down = 0V,

= 0V, RL= 100Ω −3.5 −5 mA

OUT

V

OUT

=0VorV

CC

±

1

Differential Input High Threshold VCM= +1.2V +100 mV
Differential Input Low Threshold −100 mV
Input Current VIN= +2.4V, VCC= 3.6V

V

= 0V, VCC= 3.6V

IN

R

Worst Case

16 Grayscale

Power Down

= 100Ω,

L

= 5 pF,

C

L

Worst Case Pattern

(Figures 1, 3)

R

= 100Ω,

L

= 5 pF,

C

L

16 Grayscale Pattern

(Figures 2, 3)

Power Down = Low
Driver Outputs in TRI-STATE®under

f = 32.5 MHz 31 45 mA
f = 37.5 MHz 32 50 mA
f = 65 MHz 42 55 mA
f = 32.5 MHz 23 35 mA
f = 37.5 MHz 28 40 mA
f = 65 MHz 31 45 mA

10 55 µA

Power Down Mode

CC

35 mV

35 mV

±

10 µA

±

10 µA

±

10 µA

>

7kV

PP

V

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Electrical Characteristics (Continued)

Note 2: Typical values are given for VCC= 3.3V and TA= +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwisespeci-

fied (except V
Note 4: V

and ∆VOD).

OD

previously referred as VCM.

OS

Transmitter Switching Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified

Symbol Parameter Min Typ Max Units

(Figure 4 )

(Figure 3 )
(Figure 3 )

(Figure 5 )

(Figure 12 )

f = 65 MHz −0.4 0 0.3 ps

LLHT LVDS Low-to-High Transition Time
LHLT LVDS High-to-Low Transition Time
TCIT TxCLK IN Transition Time
TCCS TxOUT Channel-to-Channel Skew
TPPos0 Transmitter Output Pulse Position for Bit 0
TPPos1 Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11.0 11.3 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns
TCIP TxCLK IN Period
TCIH TxCLK IN High Time
TCIL TxCLK IN Low Time
TSTC TxIN Setup to TxCLK IN
THTC TxIN Hold to TxCLK IN
TCCD TxCLK IN to TxCLK OUT Delay 25˚C, V
TPLLS Transmitter Phase Lock Loop Set
TPDD Transmitter Power Down Delay

(Figure 6)

(Figure 6)

(Figure 6)

(Figure 6)

(Figure 6)

(Figure 11)

CC

(Figure 8 )

= 3.3V

0.35T 0.5T 0.65T ns

0.35T 0.5T 0.65T ns

f = 65 MHz 2.5 ns

(Figure 7 )

0.75 1.5 ns

0.75 1.5 ns
5ns

250 ps

15 T 50 ns

0ns
3 5.5 ns

10 ms

100 ns

DS90CF383

AC Timing Diagrams

DS100033-4

FIGURE 1. “Worst Case” Test Pattern

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AC Timing Diagrams (Continued)

DS90CF383

DS100033-5

FIGURE 2. “16 Grayscale” Test Pattern (Notes 5, 6, 7, 8)

Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed

to produce groups of 16 vertical stripes across the display.

Note 7:

Figures 1, 2

Note 8: Recommended pin to signal mapping. Customer may choose to define differently.

show a falling edge data strobe (TxCLK IN/RxCLK OUT).

DS100033-6

FIGURE 3. DS90CF383 (Transmitter) LVDS Output Load and Transition Times

DS100033-8

FIGURE 4. DS90CF383 (Transmitter) Input Clock Transition Time

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AC Timing Diagrams (Continued)

DS90CF383

Measurements at V
TCCS measured between earliest and latest LVDS edges
TxCLK Differential Low→High Edge

=0V

diff

FIGURE 5. DS90CF383 (Transmitter) Channel-to-Channel Skew

FIGURE 6. DS90CF383 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)

FIGURE 7. DS90CF383 (Transmitter) Clock In to Clock Out Delay

DS100033-9

DS100033-10

DS100033-12

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AC Timing Diagrams (Continued)

DS90CF383

FIGURE 8. DS90CF383 (Transmitter) Phase Lock Loop Set Time

DS100033-14

DS100033-16

FIGURE 9. Seven Bits of LVDS in Once Clock Cycle

FIGURE 10. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs

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DS100033-17

AC Timing Diagrams (Continued)

FIGURE 11. Transmitter Power Down Delay

DS90CF383

DS100033-18

DS100033-26

FIGURE 12. Transmitter LVDS Output Pulse Position Measurement

DS90CF383 Pin Description—FPD Link Transmitter

Pin Name I/O No. Description

TxIN I 28 TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE,

TxOUT+ O 4 Positive LVDS differentiaI data output.
TxOUT− O 4 Negative LVDS differential data output.
FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT− O 1 Negative LVDS differential clock output.
PWR DOWN

V

CC

I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at

I 4 Power supply pins for TTL inputs.

FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).

power down.

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DS90CF383 Pin Description—FPD Link Transmitter (Continued)

Pin Name I/O No. Description

GND I 4 Ground pins for TTL inputs.

DS90CF383

PLL V

CC

I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS V

CC

I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.

Applications Information

The DS90CF383 and DS90CF384 are backward compatible
with the existing 5V FPD Link transmitter/receiver pair
(DS90CF583 and DS90CF584). To upgrade from a 5V to a

3.3V system the following must be addressed:

1. Change 5V power supply to 3.3V. Provide this supply to
the V

, LVDS VCCand PLLVCCof both the transmitter

CC

and receiver devices. This change may enable the re­moval of a 5V supply from the system, and power may
be supplied from an existing 3V power source.

2. The DS90CF383 transmitter input and control inputs ac­cept 3.3V TTL/CMOS levels. They are not 5V tolerant.

Pin Diagram

DS90CF383

Application

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DS100033-23

DS100033-3

Physical Dimensions inches (millimeters) unless otherwise noted

DS90CF383 +3.3V LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link—65 MHz

56-Lead Molded Thin Shrink Small Outline Package, JEDEC

Order Number DS90CF383MTD

NS Package Number MTD56

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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
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COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

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whose failure to perform when properly used in
accordance with instructions for use provided in the

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support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.

labeling, can be reasonably expected to result in a
significant injury to the user.

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