The DS90C387/DS90CF388 transmitter/receiver pair is designed to support dual pixel data transmission between Host
and Flat Panel Display up to QXGA resolutions. The transmitter converts 48 bits (Dual Pixel 24-bit color) of CMOS/TTL
data into 8 LVDS (Low Voltage Differential Signalling) data
streams. Control signals (VSYNC, HSYNC, DE and two
user-defined signals) are sent during blanking intervals. At a
maximum dual pixel rate of 112MHz, LVDS data line speed is
672Mbps, providing a total throughput of 5.38Gbps (672
Megabytes per second). Two other modes are also supported. 24-bit color data (single pixel) can be clocked into the
transmitter at a maximum rate of 170MHz. In this mode, the
transmitter provides single-to-dual pixel conversion, and the
output LVDS clock rate is 85MHz maximum. The third mode
provides inter-operability with FPD-Link devices.
The LDI chipset is improved over prior generations of FPDLink devices and offers higher bandwidth support and longer
cable drive with three areas of enhancement. To increase
bandwidth, the maximum pixel clock rate is increased to 112
(170) MHz and 8 serialized LVDS outputs are provided.
Cable drive is enhanced with a user selectable preemphasis feature that provides additional output current during transitions to counteract cable loading effects. DC balancing on a cycle-to-cycle basis, is also provided to reduce
ISI (Inter-Symbol Interference). With pre-emphasis and DC
balancing, a low distortion eye-pattern is provided at the
receiver end of the cable. A cable deskew capability has
been added to deskew long cables of pair-to-pair skew of up
to +/−1 LVDS data bit time (up to 80 MHz Clock Rate). These
three enhancements allow cables 5+ meters in length to be
driven. This chipset is an ideal means to solve EMI and cable
size problems for high-resolution flat panel applications. It
provides a reliable interface based on LVDS technology that
delivers the bandwidth needed for high-resolution panels
while maximizing bit times, and keeping clock rates low to
reduce EMI and shielding requirements. For more details,
please refer to the “Applications Information” section of this
datasheet.
Features
n Complies with OpenLDI specification for digital display
interfaces
n 32.5 to 112/170MHz clock support for DS90C387, 40 to
112MHz clock support for DS90CF388
n Supports SVGA through QXGA panel resolutions
n Drives long, low cost cables
n Up to 5.38Gbps bandwidth
n Pre-emphasis reduces cable loading effects
n DC Balance data transmission provided by transmitter
reduces ISI distortion
n Cable Deskew of +/−1 LVDS data bit time (up to 80
MHz Clock Rate) of pair-to-pair skew at receiver inputs;
intra-pair skew tolerance of 300ps
n Dual pixel architecture supports interface to GUI and
timing controller; optional single pixel transmitter inputs
support single pixel GUI interface
n Transmitter rejects cycle-to-cycle jitter
n 5V tolerant on data and control input pins
n Programmable transmitter data and control strobe select
(rising or falling edge strobe)
n Backward compatible configuration select with FPD-Link
n Optional second LVDS clock for backward compatibility
w/ FPD-Link
n Support for two additional user-defined control signals in
DC Balanced mode
n Compatible with ANSI/TIA/EIA-644-1995 LVDS Standard
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CMOS/TTL Input Voltage−0.3V to +5.5V
CMOS/TTL Output
Voltage−0.3V to (V
LVDS Receiver Input
Voltage−0.3V to +3.6V
LVDS Driver Output
Voltage−0.3V to +3.6V
LVDS Output Short
CircuitDurationContinuous
Junction Temperature+150˚C
Storage Temperature−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec.)+260˚C
Maximum Package Power Dissipation Capacity
100 TQFP Package:
DS90C3872.8W
DS90CF3882.8W
)−0.3V to +4V
CC
+ 0.3V)
CC
@
25˚C
Package Derating:
DS90C38718.2mW/˚C above +25˚C
DS90CF38818.2mW/˚C above +25˚C
ESD Rating:
DS90C387
(HBM, 1.5kΩ, 100pF)
(EIAJ, 0Ω, 200pF)
>
>
300 V
DS90CF388
(HBM, 1.5kΩ, 100pF)
(EIAJ, 0Ω, 200pF)
>
>
200 V
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
Operating Free Air
Temperature (T
Receiver Input Range02.4V
Supply Noise Voltage (V
)3.03.33.6V
CC
A)
−10 +25+70˚C
)100 mV
CC
6kV
2kV
p-p
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
CMOS/TTL DC SPECIFICATIONS (Tx inputs, Rx outputs, control inputs and outputs)
V
IH
V
IL
V
OH
V
OL
V
CL
I
IN
I
OS
LVDS DRIVER DC SPECIFICATIONS
V
OD
∆V
OD
V
OS
∆V
OS
I
OS
I
OZ
LVDS RECEIVER DC SPECIFICATIONS
V
TH
V
TL
I
IN
High Level Input Voltage2.05.0V
Low Level Input VoltageGND0.8V
High Level Output VoltageIOH= −0.4 mA2.72.9V
I
= −2 mA2.72.85V
OH
Low Level Output VoltageIOL= 2 mA0.10.3V
Input Clamp VoltageICL= −18 mA−0.79−1.5V
Input CurrentVIN= 0.4V, 2.5V or V
V
= GND−150µA
IN
Output Short Circuit CurrentV
= 0V−120mA
OUT
CC
+1.8+15µA
Differential Output VoltageRL= 100Ω250345450mV
Change in VODbetween
35mV
Complimentary Output States
Offset Voltage1.1251.251.375V
Change in VOSbetween
35mV
Complimentary Output States
Output Short Circuit CurrentV
Output TRI-STATE®CurrentPD = 0V, V
= 0V, RL= 100Ω−3.5−10mA
OUT
OUT
=0VorV
±
CC
1
±
10µA
Differential Input High Threshold VCM= +1.2V+100mV
Differential Input Low Threshold−100mV
Input CurrentVIN= +2.4V, VCC= 3.6V
V
= 0V, VCC= 3.6V
IN
±
10µA
±
10µA
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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
TRANSMITTER SUPPLY CURRENT
ICCTWTransmitter Supply Current
Worst Case
DS90C387/DS90CF388
ICCTGTransmitter Supply Current
16 Grayscale
ICCTZTransmitter Supply Current
Power Down
RECEIVER SUPPLY CURRENT
ICCRWReceiver Supply Current
Worst Case
ICCRGReceiver Support Current
16 Grayscale
ICCRZReceiver Supply Current
Power Down
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except V
and ∆VOD).
OD
= 3.3V and TA= +25˚C.
CC
R
= 100Ω,CL=5
L
f = 32.5 MHz91.4140mA
pF,
Worst Case
f = 65 MHz106160mA
Pattern
(Figures 1, 3)
, DUAL=High
f = 85 MHz135183mA
(48-bit RGB),
BAL=High
f = 112 MHz155210mA
(enabled)
= 100Ω,CL=5
R
L
f = 32.5 MHz62.6120mA
pF,
16 Grayscale
f = 65 MHz84.4130mA
Pattern
(Figures 2, 3)
, DUAL=High
f = 85 MHz89.0145mA
(48-bit RGB),
BAL=High
f = 112 MHz94.5155mA
(enabled)
PD = Low
Driver Outputs in TRI-STATE under
Powerdown Mode
C
= 8 pF,
L
f = 40MHz125160mA
Worst Case
Pattern
(Figures 1, 4)
, DUAL (48-bit
RGB), BAL=High
PD = Low
Receiver Outputs stay low
during Powerdown mode.
4.850µA
255300µA
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DS90C387/DS90CF388
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterMinTypMaxUnits
TCITTxCLK IN Transition Time (Figure 5)DUAL=Gnd or Vcc1.02.03.0ns
DUAL=1/2Vcc1.01.51.7ns
TCIPTxCLK IN Period (Figure 6)DUAL=Gnd or Vcc8.928T30.77ns
DUAL=1/2Vcc5.8815.38ns
TCIHTxCLK in High Time (Figure 6)0.35T0.5T0.65Tns
TCILTxCLK in Low Time (Figure 6)0.35T0.5T0.65Tns
TXITTxIN Transition Time1.56.0ns
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterMinTypMaxUnits
LLHTLVDS Low-to-High Transition Time (Figure 3), PRE = 0.75V
(disabled)
LVDS Low-to-High Transition Time (Figure 3), PRE = Vcc (max)0.110.6ns
LHLTLVDS High-to-Low Transition Time (Figure 3), PRE = 0.75V
(disabled)
LVDS High-to-Low Transition Time (Figure 3), PRE = Vcc (max)0.110.7ns
TBITTransmitter Output Bit WidthDUAL=Gnd or Vcc1/7 TCIPns
DUAL=1/2Vcc2/7 TCIPns
TPPOSTransmitter Pulse Positions - Normalizedf = 33 to 70 MHz−2500+250ps
f = 70 to 112 MHz−2000+200ps
TCCSTxOUT Channel to Channel Skew100ps
TSTCTxIN Setup to TxCLK IN (Figure 6)2.7ns
THTCTxIN Hold to TxCLK IN (Figure 6)0ns
TJCCTransmitter Jitter Cycle-to-cycle (Figures
14, 15) (Note 5), DUAL=Vcc
TPLLSTransmitter Phase Lock Loop Set (Figure 8)10ms
TPDDTransmitter Powerdown Delay (Figure 10)100ns
f = 112 MHz85100ps
f = 85 MHz6075ps
f = 65 MHz7080ps
f = 56 MHz100120ps
f = 32.5 MHz75110ps
0.140.7ns
0.160.8ns
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterMinTypMaxUnits
CLHTCMOS/TTL Low-to-High Transition Time (Figure 4), Rx data out1.522.0ns
CMOS/TTL Low-to-High Transition Time (Figure 4), Rx clock out0.51.0ns
CHLTCMOS/TTL High-to-Low Transition Time (Figure 4), Rx data out1.72.0ns
CMOS/TTL High-to-Low Transition Time (Figure 4), Rx clock out0.51.0ns
RCOPRxCLK OUT Period (Figure 7)8.928T25ns
RCOHRxCLK OUT High Time (Figure 7)(Note 4)f = 112 MHz3.5ns
f = 85 MHz4.5ns
RCOLRxCLK OUT Low Time (Figure 7)(Note 4)f = 112 MHz3.5ns
f = 85 MHz4.5ns
RSRCRxOUT Setup to RxCLK OUT (Figure 7)(Note 4)f = 112 MHz2.4ns
f = 85 MHz3.0ns
RHRCRxOUT Hold to RxCLK OUT (Figure 7)(Note 4)f = 112 MHz3.4ns
f = 85 MHz4.75ns
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Receiver Switching Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterMinTypMaxUnits
RPLLSReceiver Phase Lock Loop Set (Figure 9)10ms
RPDDReceiver Powerdown Delay (Figure 11)1µs
Chipset RSKM Characteristics
DS90C387/DS90CF388
Over recommended operating supply and temperature ranges unless otherwise specified.(Notes 4, 8). See Applications Information section for more details on this parameter and how to apply it.
SymbolParameterMinTypMaxUnits
RSKMReceiver Skew Margin without
Deskew in non-DC Balance Mode,
(Figure 12), (Note 6)
RSKMReceiver Skew Margin without
Deskew in DC Balance Mode,
(Figure 12), (Note 6)
RSKMDReceiver Skew Margin with Deskew
in DC Balance, (Figure 13),
(Note 7)
RDRReceiver Deskew Rangef = 80 MHz
RDSSReceiver Deskew Step Sizef = 80 MHz0.3 TBITns
Note 4: The Minimum and Maximum Limits are based on statistical analysis of the device performance over voltage and temperature ranges. This parameter is
functionally tested on Automatic Test Equipment (ATE). ATE is limited to 85MHz. A sample of characterization parts have been bench tested to verify functional
performance.
Note 5: The limits are based on bench characterization of the device’s jitter response over the power supply voltage range. Output clock jitter is measured with a
cycle-to-cycle jitter of
in the clock edge from most graphics VGA chips currently available. This parameter is used when calculating system margin as described in AN-1059.
Note 6: Receiver Skew Margin (RSKM) is defined as the valid data sampling region at the receiver inputs. This margin takes into account transmitter output pulse
positions (min and max) and the receiver input setup and hold time (internal data sampling window - RSPOS). This margin allows for LVDS interconnect skew,
inter-symbol interference (both dependent on type/length of cable) and clock jitter.
RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle, TJCC) + ISI (if any). See Applications Information section for more details.
Note 7: Receiver Skew Margin with Deskew (RSKMD) is defined as the valid data sampling region at the receiver inputs. The DESKEW function will constrain the
receiver’s sampling strobes to the middle half of the LVDS bit and removes (adjusts for) fixed interconnect skew. This margin (RSKMD) allows for inter-symbol
interference (dependent on type/length of cable), Transmitter Pulse Position (TPPOS) variance, and LVDS clock jitter (TJCC).
RSKMD ≥ ISI + TPPOS(variance) + source clock jitter (cycle to cycle). See Applications Information section for more details.
Note 8: Typical values for RSKM and RSKMD are applicable for fixed V
T
points).
A
±
3ns applied to the input clock signal while data inputs are switching (see figures 15 and 16).A jitter event of 3ns, represents worse case jump
f = 112 MHz170ps
f = 100 MHz170240ps
f = 85MHz300350ps
f = 66MHz300350ps
f = 112 MHz170ps
f = 100 MHz170200ps
f = 85 MHz250300ps
f = 66 MHz250300ps
f = 50MHz100350ps
f = 40MHz94530ps
f=40to80
0.25TBITps
MHz
±
1TBIT
and TAfor the Transmitter and Receiver (both are assumed to be at the same VCCand
CC
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AC Timing Diagrams
DS90C387/DS90CF388
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FIGURE 1. “Worst Case” Test Pattern
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FIGURE 2. “16 Grayscale” Test Pattern (Notes 9, 10, 11)
Note 9: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 10: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 11: Figures 1, 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
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AC Timing Diagrams (Continued)
DS90C387/DS90CF388
FIGURE 4. DS90CF388 (Receiver) CMOS/TTL Output Load and Transition Times
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FIGURE 3. DS90C387 (Transmitter) LVDS Output Load and Transition Times
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FIGURE 5. DS90C387 (Transmitter) Input Clock Transition Time
FIGURE 6. DS90C387 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
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10007315
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